Intelligent heat dissipation device for electromechanical equipment

Abstract

The utility model discloses an electromechanical equipment intelligence heat abstractor relates to electromechanical equipment technical field. This electromechanical equipment intelligence heat abstractor, including heat dissipation casing, the heat dissipation casing rear side fixedly connected with heat conduction silica gel pad, the heat conduction silica gel pad is used for closely adhering electromechanical equipment heat abstractor, the heat dissipation casing rear side right upper corner fixedly connected with the sensor support that is L type flaky and sets up, sensor support and heat dissipation casing joint, sensor support away from heat dissipation casing one end fixedly connected with temperature sensor, temperature sensor one end is close to heat conduction silica gel pad, and the other end fixedly connected with wire connector. This electromechanical equipment intelligence heat abstractor, display screen visual interface real -time display temperature, speed parameter such as rotation, need not professional tool to grasp equipment state, the heat dissipation fan is fixed through M screw symmetry, and dismantles replacement, and the buzzer and display screen double early warning, so the overall structure modularization design, no complex wiring.

Description

Technical Field

[0001] This utility model relates to the field of electromechanical equipment technology, and in particular to an intelligent heat dissipation device for electromechanical equipment. Background Technology

[0002] In industrial production and daily life, the stable operation of electromechanical equipment is inseparable from efficient heat dissipation. When the equipment is running, the internal electronic components such as chips and capacitors will continuously generate heat. If the heat cannot be dissipated in time, it will cause the equipment temperature to rise. This can reduce operating efficiency and shorten service life, or even cause component burnout, equipment shutdown, or even safety accidents.

[0003] However, the traditional heat dissipation devices for electromechanical equipment in the industry generally have design flaws and are difficult to meet the requirements of efficient, intelligent and adaptable heat dissipation. The specific technical pain point is that the constant speed fan does not care about the temperature of the electromechanical equipment, and the equipment overheats due to insufficient heat dissipation power at high temperatures. Fixed heat sinks rely solely on natural convection for heat dissipation, and their heat dissipation efficiency is greatly affected by ambient temperature, making them unable to meet the heat dissipation requirements of high-power electromechanical equipment. In addition, some devices lack airflow guidance structures, and the airflow generated by the fan is dispersed and cannot be accurately applied to the high-temperature areas of the equipment, further reducing the heat dissipation effect. This causes the electromechanical equipment to be in a high-temperature critical state for a long time. Traditional heat dissipation devices are generally not equipped with temperature detection components, making it difficult to detect in time and easily missing the best time for intervention. Utility Model Content

[0004] The purpose of this utility model is to at least solve one of the technical problems existing in the prior art, and to provide an intelligent heat dissipation device for electromechanical equipment that can solve the above-mentioned problems.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an intelligent heat dissipation device for electromechanical equipment, comprising a heat dissipation shell, wherein a thermally conductive silicone pad is fixedly connected to the rear side of the heat dissipation shell, and the thermally conductive silicone pad is used to tightly adhere to the heat dissipation surface of the electromechanical equipment; An L-shaped sensor bracket is fixedly connected to the upper right corner of the rear side of the heat sink housing. The sensor bracket is snapped into the heat sink housing. A temperature sensor is fixedly connected to the end of the sensor bracket away from the heat sink housing. One end of the temperature sensor is close to the thermally conductive silicone pad, and the other end is fixedly connected to a wire connector.

[0006] Preferably, a display screen mounting slot is provided on the side of the heat dissipation housing away from the thermally conductive silicone pad, and a display screen is fixedly connected inside the display screen mounting slot; The display screen mounting slot is provided with heat dissipation holes around its perimeter. The heat dissipation holes are honeycomb-shaped circular through holes with smooth, burr-free walls that penetrate the front of the heat dissipation housing.

[0007] Preferably, a power interface is fixedly connected to one side of the heat sink housing. The power interface is a cylindrical DC interface with pin contacts inside and reverse connection protection. The heat dissipation shell is fixedly connected to two sides of a set of hinges, and the hinges are fixed to the two sides of the heat dissipation shell respectively, with each pair of hinges being staggered vertically.

[0008] Preferably, a connecting body is fixedly connected to the end of the hinge away from the heat dissipation housing, and a telescopic mounting bracket is fixedly connected to the end of the connecting body away from the hinge. The telescopic mounting bracket consists of two aluminum alloy rods and an adjusting sleeve, and has telescopic and locking functions. An adjusting knob is fixedly connected to the surface of the telescopic mounting bracket near the heat dissipation shell, and an anti-slip suction cup is fixedly connected to the end away from the heat dissipation shell.

[0009] Preferably, a control motherboard is fixedly connected to the rear side inside the heat sink housing. The surface of the control motherboard is printed with copper foil circuits. An MCU chip is fixedly connected to the center of the side of the control motherboard away from the heat sink housing, and PWM speed control modules are fixedly connected to both sides.

[0010] Preferably, a set of cooling fans is fixedly connected to both sides of the heat sink housing corresponding to the positions of the PWM speed control module. The cooling fans are symmetrically fixed to both sides of the mounting cavity inside the heat sink housing by a set of M screws. The air inlet of the cooling fan faces the side of the heat sink housing, and the air outlet faces the thermally conductive silicone pad on the back of the heat sink housing. It is also electrically connected to the PWM speed control module via wires.

[0011] Preferably, an air guide shroud is fixedly connected to the outer side of the heat dissipation housing at the position corresponding to the air inlet end of the heat dissipation fan. The air guide shroud is detachably fixed by a buckle and is set in a trumpet shape. A buzzer alarm is fixedly connected to the side of the control motherboard away from the heat sink. The buzzer alarm has a sound hole on the top and two pins on the bottom that are soldered to the control motherboard.

[0012] Preferably, a shielded wire connection terminal is fixedly connected to one side of the control motherboard near the temperature sensor, and an external wiring hole is provided on the inner side of the heat sink housing corresponding to the shielded wire connection terminal and the wire connector; the temperature sensor is electrically connected to the control motherboard through the wire connector and the shielded wire connection terminal, and each component is connected by wires to achieve power supply and signal transmission.

[0013] Compared with the prior art, the beneficial effects of this utility model are: 1. This electromechanical equipment features an intelligent heat dissipation device. Thermally conductive silicone pads are tightly fitted to the equipment's heat dissipation surface to prevent localized overheating. The diameter and distribution of the honeycomb-shaped heat dissipation holes have been optimized. The power interface has reverse connection protection. The copper foil circuitry on the control motherboard surface enhances conductivity and corrosion resistance. All components are made of durable materials, representing a slight improvement over traditional plastic heat dissipation devices. The display screen provides a visual interface that shows real-time parameters such as temperature and speed, allowing users to monitor the equipment status without specialized tools. The cooling fans are symmetrically fixed with M-screws for easy disassembly and replacement. A dual warning system—a buzzer alarm and a display screen—ensures a modular overall design with no complex wiring.

[0014] 2. The intelligent heat dissipation device of this electromechanical equipment is energy-saving at low temperatures and highly efficient at high temperatures, avoiding the drawbacks of traditional constant-speed fans that consume a lot of energy at low temperatures and are insufficient at high temperatures. The cooling fan, together with the air guide shroud and honeycomb heat dissipation holes, improves the airflow utilization rate. The temperature sensor is close to the thermally conductive silicone pad and combined with the shielded wire anti-interference design. The over-temperature alarm threshold is linked with the buzzer alarm, and the display screen displays the fault information at the same time to prevent the equipment from being damaged by high temperature. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments: Figure 1 This is a schematic diagram of an intelligent heat dissipation device for electromechanical equipment according to the present invention; Figure 2 This is a schematic diagram of an intelligent heat dissipation device for electromechanical equipment according to the present invention; Figure 3 This is a schematic diagram of an intelligent heat dissipation device for electromechanical equipment according to the present invention; Figure 4 This is a schematic diagram of an intelligent heat dissipation device for electromechanical equipment according to the present invention.

[0016] Reference numerals: 1. Thermal conductive silicone pad; 2. Heat sink housing; 3. Telescopic mounting bracket; 4. Adjustment knob; 5. Anti-slip suction cup; 6. Air guide cover; 7. Power interface; 8. Sensor bracket; 9. Temperature sensor; 10. Hinge; 11. Display screen; 12. Heat dissipation hole; 13. Mounting slot; 14. Cooling fan; 15. PWM speed control module; 16. MCU chip; 17. Buzzer alarm; 18. Control motherboard; 19. Shielded wire connection terminal; 20. Connector; 21. External wiring hole; 22. Wire connector. Detailed Implementation

[0017] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0018] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] In the description of this utility model, terms such as greater than, less than, and exceeding are understood to exclude the stated number, while terms such as above, below, and within are understood to include the stated number. The use of terms like "first" and "second" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the quantity or sequence of the indicated technical features.

[0020] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0021] Please see Figure 1-4 This utility model provides a technical solution: an intelligent heat dissipation device for electromechanical equipment includes a heat dissipation shell 2. The heat dissipation shell 2 serves as the core load-bearing structure of the device, providing a stable installation space for all heat dissipation components. Its sealed design can protect internal components from external dust and moisture corrosion, extending the overall service life of the device. A thermally conductive silicone pad 1 is fixedly connected to the rear side of the heat dissipation shell 2. The thermally conductive silicone pad 1 is tightly attached to the heat dissipation surface of the electromechanical equipment, eliminating gaps to enhance heat conduction. This close-fitting design can directly shorten the heat transfer path and avoid the thermal resistance formed by air gaps that hinders heat diffusion. Compared with traditional non-closed heat dissipation, the heat conduction efficiency is improved. The thermally conductive silicone pad 1 is made of methyl vinyl silicone rubber as the base material and filled with inorganic non-metallic thermally conductive fillers such as alumina, aluminum nitride, and boron nitride. Based on this material, it can fill the microscopic gaps between the heating element and the heat dissipation component, converting the air thermal resistance into the material thermal resistance, and efficiently transferring heat. This allows heat to be quickly conducted from the heating surface of the electromechanical equipment to the heat dissipation shell 2, preventing heat from accumulating inside the equipment. It can also block current conduction due to its insulation properties, preventing short circuits and solving the safety hazard of leakage caused by metal thermally conductive components. It is suitable for various electromechanical equipment scenarios that require insulation protection.

[0022] A sensor bracket 8 is fixedly connected to the upper right corner of the rear side of the heat sink housing 2. The sensor bracket 8 is set in an L-shaped plate and is snapped into the heat sink housing 2. The L-shaped structure can flexibly adjust the installation angle to ensure that the temperature sensor 9 can be accurately aligned with the heat-generating area. The snap-fit ​​design facilitates the disassembly and maintenance of the sensor bracket 8 and reduces the difficulty of later maintenance. The end of the sensor bracket 8 away from the heat sink housing 2 is fixedly connected to the temperature sensor 9. The temperature sensor 9 model includes the single-bus digital temperature sensor DS18B20, which collects the temperature changes of target objects such as heating elements of electromechanical equipment and inside the cabinet in real time, converts the physical quantity of temperature into an electrical signal, provides raw data for heat dissipation control, and enables the heat dissipation intensity to be accurately matched with the heat dissipation requirements of the equipment. One end of the temperature sensor 9 is close to the thermal conductive silicone pad 1, which can directly monitor the conduction temperature of the thermal conductive silicone pad 1 and indirectly reflect the core heat dissipation of the electromechanical equipment. The heat dissipation housing 2 has a display screen mounting slot 13 on the side away from the thermal conductive silicone pad 1. The display screen 11 is fixedly connected inside the display screen mounting slot 13. The display screen 11 is a resistive touch screen that can display the core operating data of the heat dissipation device in real time. The operator can intuitively grasp the working status of the device. The operator can intuitively grasp the working status of the device without disassembling the equipment. The touch design also supports quick parameter adjustment. Compared with button operation, the parameter setting efficiency is improved. The display mounting slot 13 has heat dissipation holes 12 around its perimeter. The heat dissipation holes 12 are honeycomb-shaped circular through holes with smooth, burr-free walls that penetrate the front of the heat dissipation shell 2. This effectively prevents foreign objects from entering while ensuring ventilation efficiency. The honeycomb structure ensures ventilation efficiency and effectively prevents external dust and debris from entering the device. The smooth hole walls prevent excessive noise from being generated when airflow passes through, reducing noise pollution during equipment operation. A power interface 7 is fixedly connected to one side of the heat sink 2. The power interface 7 is a DC power interface. The power interface 7 is cylindrical and has pin contacts inside. It has reverse connection protection. The reverse connection protection design can prevent the control motherboard 18, heat sink 14 and other components from burning out due to reverse connection of the positive and negative terminals of the power supply, and reduce equipment damage caused by installation errors. The cylindrical structure makes it easy to quickly plug in and unplug the power plug. Hinges 10 are fixedly connected to both sides of the heat dissipation housing 2. There are four sets of hinges 10, which are fixed to both sides of the heat dissipation housing 2 and are staggered vertically in pairs. The staggered vertical distribution of hinges 10 allows the telescopic mounting bracket 3 to be adjusted at multiple angles to adapt to the installation requirements of different positions of electromechanical equipment. Compared with symmetrically distributed hinges, the installation flexibility is improved. The hinge 10 is fixedly connected to a connector 20 at the end away from the heat sink housing 2. The connector 20 is fixedly connected to a telescopic mounting bracket 3 at the end away from the hinge 10. The telescopic mounting bracket 3 consists of two aluminum alloy rods and an adjusting sleeve, and has telescopic and locking functions. The aluminum alloy rods are lightweight and have strong load-bearing capacity, which can reduce the overall weight of the device while ensuring installation stability. The telescopic function can adapt to electromechanical equipment of different thicknesses and sizes, eliminating the need to customize mounting brackets for specific equipment and reducing equipment adaptation costs. An adjustment knob 4 is fixedly connected to the surface of the telescopic mounting bracket 3 near the heat dissipation housing 2. By rotating the adjustment knob 4, the telescopic length can be quickly locked or unlocked. The operation is convenient and the locking is firm, preventing the telescopic mounting bracket 3 from sliding on its own when the equipment vibrates. An anti-slip suction cup 5 is fixedly connected to the end of the telescopic mounting bracket 3 away from the heat dissipation housing 2. The anti-slip suction cup 5 is an industrial-grade silicone anti-slip suction cup that provides stable fixation and firmly adsorbs the heat dissipation device to the designated installation position of the electromechanical equipment. This prevents the heat dissipation device from shifting due to vibration during equipment operation and ensures that the heat dissipation component and the heat-generating element always maintain effective contact, thus ensuring heat dissipation efficiency. Compared with traditional screw fixing, suction cup fixing does not require drilling holes on the equipment surface, avoiding damage to the equipment shell. At the same time, it can cope with uneven equipment surfaces. The suction force can resist the vibration during equipment operation, ensuring that the heat dissipation component and the heat-generating element always maintain effective contact, thus improving the stability of heat dissipation efficiency. A control motherboard 18 is fixedly connected to the rear side inside the heat sink 2. The control motherboard 18 is a PLC embedded control motherboard 18. The PLC embedded design gives the control motherboard 18 strong anti-interference ability and can work stably in the complex electromagnetic environment of electromechanical equipment. The copper foil circuit improves the signal transmission speed and stability and reduces the control lag caused by data delay. The copper foil circuit is printed on the surface of the control motherboard 18 to receive and process data, collect the signals fed back by the sensors in real time, and integrate the operating status data of each component of the heat sink to provide a basis for subsequent control decisions. An MCU chip 16 is fixedly connected to the center of the side of the control motherboard 18 away from the heat sink 2. The MCU chip 16 is a PIC series chip that can receive the signals transmitted by the temperature sensor and the temperature and humidity sensor in real time, quickly process and analyze the collected temperature data and component operating status data, determine the current heat dissipation requirements, and provide a basis for control decisions. PWM speed control modules 15 are fixedly connected to both sides of the control motherboard 18. The PWM speed control module 15 can receive control commands from the control motherboard or MCU chip 16, convert the commands into stable PWM signals, and transmit them to the heat dissipation components. By changing the duty cycle of the PWM signal, the speed or operating power can be smoothly adjusted to ensure that the heat dissipation intensity is accurately matched with the real-time temperature requirements of the electromechanical equipment, and avoid excessive heat dissipation causing energy waste or insufficient heat dissipation causing the equipment to overheat. Cooling fans 14 are fixedly connected to the PWM speed control module 15 on both sides inside the heat sink 2. There are two sets of cooling fans 14, which are symmetrically fixed to both sides of the mounting cavity inside the heat sink 2 by four sets of M2 screws. The symmetrical installation can make the airflow evenly distributed inside the housing, avoiding local heat dissipation dead corners. The M2 screw fixing method is firm and easy to disassemble and replace the fans. The airflow design of the cooling fan 14 with its air inlet facing the side of the heat sink 2 and its air outlet facing the thermally conductive silicone pad 1 on the back of the heat sink 2 allows outside cold air to enter through the side and blow directly onto the thermally conductive silicone pad 1 and the heat-generating components inside the heat sink 2, so that the heat is quickly carried away. Compared with the reverse airflow, the heat dissipation efficiency is improved. The cooling fan 14 is electrically connected to the PWM speed control module 15 on the control motherboard 18 via wires. It can receive speed control signals and adjust the speed in real time according to temperature changes, thus avoiding high noise and high energy consumption caused by the fan always running at high speed. An air guide shroud 6 is fixedly connected to the outer side of the heat sink housing 2 at the air inlet of the cooling fan 14. The air guide shroud is detachable and fixed by clips, and is flared. The flared structure can expand the air intake area and increase the air intake volume. The clip design makes it easy to remove and clean the air guide shroud 6, avoiding dust blockage that affects air intake efficiency. A buzzer alarm 17 is fixedly connected to the side of the control motherboard 18 away from the heat sink 2. The top of the buzzer alarm has a sound hole, and the bottom has two pins that are soldered to the control motherboard. When the temperature sensor 9 detects that the temperature of the electromechanical equipment exceeds the preset threshold, or when the cooling fan 14 or the PWM speed control module 15 malfunctions, the MCU chip 16 will trigger the buzzer alarm 17 to sound an alarm, so as to promptly remind the operator to check the problem and avoid damage to the equipment due to overheating or component failure. A shielded wire connection terminal 19 is fixedly connected to one side of the control motherboard 18 near the temperature sensor 9. An external wiring hole 21 is provided on the inside of the heat sink 2 corresponding to the shielded wire connection terminal 19 and the wire connector 22. The shielded wire connection terminal 19 can reduce the influence of external electromagnetic interference on the temperature signal transmission and ensure accurate temperature data. The external wiring hole 21 provides a neat wiring channel for the wiring connection, avoids the wiring from being messy and tangled in the housing, reduces the risk of short circuit, and facilitates the later wiring maintenance. Working Principle: This intelligent heat dissipation device for electromechanical equipment achieves efficient and safe heat dissipation through a closed-loop process of installation and fixation, temperature monitoring, data processing, heat dissipation execution, abnormal warning, and shutdown reset. Specifically, the operator first adjusts the device size using the telescopic mounting bracket 3, and then uses the anti-slip suction cup 5 at the end to attach the device to the designated position on the electromechanical equipment, which can be fixed without drilling. Then, the angle of the heat dissipation shell 2 is adjusted by the hinge 10 to ensure that the thermally conductive silicone pad 1 is tightly attached to the heat dissipation surface of the electromechanical equipment to reduce thermal resistance. Subsequently, power is supplied through the DC power interface 7. The reverse connection protection function of the power interface 7 prevents component damage. After power is supplied, the control motherboard 18 automatically initializes, the MCU chip 16 starts self-test, and after the core components are detected to be normal, the device enters the standby state, and the display screen 11 displays the standby state.

[0023] During device operation, the temperature sensor 9 on the L-shaped sensor bracket 8 continuously collects data. Because it is close to the thermally conductive silicone pad 1, it can accurately reflect the heating status of the core of the electromechanical equipment. After converting the physical quantity of temperature into an electrical signal, it is transmitted to the control motherboard 18 through the wire connector 22 and the shielded wire connection end 19. The shielded wire connection end 19 reduces electromagnetic interference to ensure data accuracy, and the external wiring hole 21 neatly routes the wires to avoid signal abnormalities.

[0024] After receiving the signal, the control motherboard 18 transmits it to the MCU chip 16 via the copper foil circuit. The MCU chip 16 analyzes the temperature data in real time and compares it with the preset temperature threshold. After determining the heat dissipation requirement, it sends the corresponding PWM signal to the PWM speed control module 15. The PWM speed control module 15 converts the instruction into a stable signal and transmits it to the cooling fan 14. The symmetrically installed cooling fan 14 forms a side air intake and blows directly towards the heat-generating area. Outside cold air enters through the horn-shaped air guide shroud 6 and blows it onto the thermally conductive silicone pad 1 and internal components to remove heat. At the same time, the honeycomb heat dissipation holes 12 cooperate to form air convection, exhaust hot air, block dust, and reduce noise.

[0025] When the temperature exceeds the warning threshold or a component malfunctions, the MCU chip 16 immediately triggers the buzzer alarm 17 to issue a warning. The display screen 11 displays real-time temperature, fan status, and other core data. Operators can intuitively grasp the situation and adjust parameters through the touch screen. When the electromechanical equipment stops operating or the heat dissipation requirement disappears, the MCU chip 16 sends a shutdown command, the cooling fan 14 gradually stops rotating, the control motherboard 18 records the operating data and displays the shutdown status on the display screen 11. After disconnecting the power, the operator can adjust the telescopic mounting bracket 3 or remove the suction cup 5 to prepare for the next use.

[0026] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An intelligent heat dissipation device for electromechanical equipment, comprising a heat dissipation shell (2), characterized in that: A thermally conductive silicone pad (1) is fixedly connected to the rear side of the heat dissipation housing (2). The thermally conductive silicone pad (1) is used to tightly fit the heat dissipation surface of the electromechanical equipment. A sensor bracket (8) in the shape of an L-shaped sheet is fixedly connected to the upper right corner of the rear side of the heat sink housing (2). The sensor bracket (8) is snapped into the heat sink housing (2). A temperature sensor (9) is fixedly connected to one end of the sensor bracket (8) away from the heat sink housing (2). One end of the temperature sensor (9) is close to the thermal conductive silicone pad (1), and the other end is fixedly connected to a wire connector (22). The heat dissipation housing (2) has a display screen mounting slot (13) on the side away from the thermal conductive silicone pad (1), and a display screen (11) is fixedly connected inside the display screen mounting slot (13). A power interface (7) is fixedly connected to one side of the heat sink housing (2). The power interface (7) is a cylindrical DC interface with pin contacts inside and reverse connection protection function. The display screen mounting slot (13) is provided with heat dissipation holes (12) around its perimeter.

2. The intelligent heat dissipation device for electromechanical equipment according to claim 1, characterized in that: The heat dissipation hole (12) is a honeycomb-shaped circular through hole with smooth, burr-free walls that penetrate the front of the heat dissipation housing (2).

3. The intelligent heat dissipation device for electromechanical equipment according to claim 2, characterized in that: The heat dissipation shell (2) has a total of 4 sets of hinges (10) fixedly connected to both sides. The hinges (10) are fixed to both sides of the heat dissipation shell (2) and each pair of sets is staggered vertically.

4. The intelligent heat dissipation device for electromechanical equipment according to claim 3, characterized in that: The hinge (10) is fixedly connected to a connector (20) at one end away from the heat sink (2), and a telescopic mounting bracket (3) is fixedly connected to the other end of the connector (20) away from the hinge (10). An adjustment knob (4) is fixedly connected to the surface of the telescopic mounting bracket (3) near the heat sink housing (2), and an anti-slip suction cup (5) is fixedly connected to the end away from the heat sink housing (2).

5. The intelligent heat dissipation device for electromechanical equipment according to claim 4, characterized in that: The control motherboard (18) is fixedly connected to the rear side inside the heat sink (2). The surface of the control motherboard (18) is printed with copper foil circuit. The center of the control motherboard (18) away from the heat sink (2) is fixedly connected to an MCU chip (16), and the two sides are fixedly connected to PWM speed control modules (15).

6. The intelligent heat dissipation device for electromechanical equipment according to claim 5, characterized in that: Two sets of cooling fans (14) are fixedly connected to the positions of the PWM speed control module (15) on both sides inside the heat sink housing (2). The cooling fans (14) are symmetrically fixed to both sides of the mounting cavity inside the heat sink housing (2) by four sets of M2 screws. The air inlet of the cooling fan (14) faces the side of the heat sink housing (2), and the air outlet faces the thermally conductive silicone pad (1) on the back of the heat sink housing (2). It is electrically connected to the PWM speed control module (15) through a wire.

7. The intelligent heat dissipation device for electromechanical equipment according to claim 6, characterized in that: An air guide shroud (6) is fixedly connected to the outer side of the heat dissipation housing (2) at the position corresponding to the air inlet of the heat dissipation fan (14). The air guide shroud (6) is set in a trumpet shape. A buzzer alarm (17) is fixedly connected to the side of the control motherboard (18) away from the heat sink (2). The buzzer alarm (17) has a sound hole on the top and two pins on the bottom that are soldered to the control motherboard (18).

8. The intelligent heat dissipation device for electromechanical equipment according to claim 7, characterized in that: A shielded wire connection end (19) is fixedly connected to one side of the control motherboard (18) near the temperature sensor (9). An external wiring hole (21) is provided on the inner side of the heat sink (2) at the position corresponding to the shielded wire connection end (19) and the wire connector (22). The temperature sensor (9) is electrically connected to the control motherboard (18) through the wire connector (22) and the shielded wire connection end (19). Each component is connected by wires to realize power supply and signal transmission.

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