A semiconductor test handler blocking mechanism
Patent Information
- Application Number
- CN202521660627.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-06
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-08-06
AI Technical Summary
[0005]本实用新型的目的是解决现有技术中存在当利用测试分选机对半导体进行测试分选时,难以对半导体进行阻挡限量分批次检测,不利于半导体多样化检测,从而降低传统测试分选机测试效率的缺点,而提出的一种半导体测试分选机阻挡机构
[0021] In this invention, when a blocking device is used to test and sort semiconductors, the pin is pulled out along the fixing hole and the limiting hole. The first spring rebounds and drives the baffle to move upward along the moving groove. Then, the position of the baffle is adjusted by sliding along the support column. When the baffle is adjusted to be above the conveying mechanism, the pin is inserted along the limiting hole and the fixing hole above the support column. The conveying mechanism is opened and the semiconductor to be tested is conveyed. After being conveyed to the test line, the pin is pulled out along the fixing hole and the limiting hole. Then, the position of the baffle is adjusted by sliding along the support column. After the baffle is adjusted to a position that can block the semiconductor to be tested from entering the test sorting machine, the rubber pads distributed at one end of the baffle can reduce the impact damage between the semiconductor to be tested and the baffle during the conveying. Then, the pin is inserted back along the limiting hole and the fixing hole above the support column.
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Figure CN224687360U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of test sorting machine technology, and in particular to a blocking mechanism for a semiconductor test sorting machine. Background Technology
[0002] The test sorting machine is an automated equipment that integrates automatic detection, performance testing, classification and sorting. It uses sensors, vision systems, and measurement and control software to quickly detect the physical properties, electrical properties, and appearance quality of materials, and automatically classifies the materials into qualified, unqualified, or different grade feeding ports according to preset standards.
[0003] Existing technologies, such as the utility model with publication number CN220821482U, disclose a semiconductor testing and sorting machine. Its technical solution includes: a testing platform; a mounting frame fixedly installed on one side of the top of the testing platform; an electric slide rail fixedly installed on the top of the mounting frame; an analysis lens slidably installed above the electric slide rail; a quality inspection platform fixedly installed on the other side of the mounting frame; a rotating disk rotatably installed on the top of the quality inspection platform; and a lifting controller fixedly installed on the other side of the quality inspection platform. This utility model, through the combination of various structures, enables the sorting machine to perform visual inspection before semiconductor sorting, and simultaneously recycle semiconductors that fail to meet visual standards, reducing the inflow of semiconductors with appearance quality problems into the market. Furthermore, this sorting machine is equipped with an adjustable testing seat, capable of testing semiconductors of different models and specifications, making it more convenient for operators.
[0004] The above-mentioned issues have the following drawbacks: when using a test sorting machine to test and sort semiconductors, it is difficult to perform limited batch testing of semiconductors, which is not conducive to the diversified testing of semiconductors and thus reduces the testing efficiency of traditional test sorting machines. Utility Model Content
[0005] The purpose of this invention is to address the shortcomings of existing technologies, such as the difficulty in blocking and limiting the batch testing of semiconductors when using a test sorting machine, which is not conducive to the diversified testing of semiconductors and thus reduces the testing efficiency of traditional test sorting machines. Therefore, this invention proposes a blocking mechanism for a semiconductor test sorting machine.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: a blocking mechanism for a semiconductor testing and sorting machine, comprising a testing and sorting machine, a control panel fixedly connected to one end of the testing and sorting machine, a conveying mechanism fixedly connected to one side of the testing and sorting machine, an output port opened on the other side of the testing and sorting machine, a blocking device provided on the upper surface of the conveying mechanism, the blocking device comprising a support column, the lower surface of the support column fixedly connected to the conveying mechanism, a moving groove opened inside the conveying mechanism corresponding to the support column, a baffle slidably connected inside the moving groove, a guide rod fixedly connected to the upper surface of the baffle, the arc surface of the guide rod slidably connected to the support column, a limiting plate fixedly connected to the upper surface of the support column, a fixing hole opened inside the limiting plate, a plurality of limiting holes opened inside the guide rod, and a pin engaging with the fixing hole in one of the limiting holes.
[0007] The effect achieved by the above components is to restrict the entry and exit of the semiconductor to be tested on the conveying mechanism by using a baffle.
[0008] Preferably, the arc surface of the guide rod is fitted with a first spring, and the two ends of the first spring are fixedly connected to the support column and the baffle, respectively.
[0009] The effect achieved by the above components is to quickly pull back the downward-pressed baffle by utilizing the characteristic of the first spring contracting after being stretched.
[0010] Preferably, a rubber pad is fixedly connected to one end of the baffle, and the rubber pad has high elasticity.
[0011] The effect achieved by the above components is to reduce friction between the semiconductor to be tested and the baffle during transport.
[0012] Preferably, a receiving device is provided on one side of the test sorting machine. The receiving device includes a base plate, one side of which is fixedly connected to the test sorting machine. Two sliding grooves are opened inside the base plate, and a slider is slidably connected inside the sliding groove. A material bin is fixedly connected to the upper surface of the slider.
[0013] The effect achieved by the above components is to collect, detect, and sort the semiconductors.
[0014] Preferably, a second spring is fixedly connected inside the hopper, and a tray is fixedly connected to one end of the second spring.
[0015] The aforementioned components achieve the effect of buffering and collecting semiconductors inside the hopper.
[0016] Preferably, a handle is fixedly connected to one end of the hopper, and the handle has a "U" shaped cross-section.
[0017] The effect achieved by the above components is to facilitate the movement of the hopper.
[0018] Preferably, a fixing plate is fixedly connected to one end of the hopper, and a pin is internally engaged with the fixing plate at a position corresponding to the bottom plate.
[0019] The effect achieved by the above components is to fix the hopper and reduce hopper shaking.
[0020] In summary, the beneficial effects of this utility model are as follows:
[0021] In this invention, when a blocking device is used to test and sort semiconductors, the pin is pulled out along the fixing hole and the limiting hole. The first spring rebounds and drives the baffle to move upward along the moving groove. Then, the position of the baffle is adjusted by sliding along the support column. When the baffle is adjusted to be above the conveying mechanism, the pin is inserted along the limiting hole and the fixing hole above the support column. The conveying mechanism is opened and the semiconductor to be tested is conveyed. After being conveyed to the test line, the pin is pulled out along the fixing hole and the limiting hole. Then, the position of the baffle is adjusted by sliding along the support column. After the baffle is adjusted to a position that can block the semiconductor to be tested from entering the test sorting machine, the rubber pads distributed at one end of the baffle can reduce the impact damage between the semiconductor to be tested and the baffle during the conveying. Then, the pin is inserted back along the limiting hole and the fixing hole above the support column.
[0022] In this invention, when the semiconductor testing is completed and a receiving device is needed, the slider slides into the groove on the base plate, and the slider slides in, causing the hopper to slide into the base plate. Once the hopper is in place, the pin is inserted into the fixing plate and the base plate to fix the hopper to the base plate and reduce hopper movement. Then, the output plate of the output port is placed into the hopper to receive the tested semiconductor. The second spring and tray in the hopper can buffer the semiconductor falling into the hopper and reduce damage to the semiconductor. After the hopper is filled, the pin that fixes the hopper to the base plate is pulled out, the handle is pulled, the handle moves the hopper, the filled hopper is removed, and a new hopper is loaded. Attached Figure Description
[0023] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0024] Figure 2 This utility model Figure 1 Schematic diagram of the three-dimensional structure on the back;
[0025] Figure 3 This is a schematic diagram of the blocking device structure of this utility model;
[0026] Figure 4 This is a schematic diagram of the material receiving device of this utility model;
[0027] Legend: 1. Test sorting machine; 2. Control panel; 3. Conveying mechanism; 4. Blocking device; 401. Support column; 402. Moving groove; 403. Baffle; 404. Rubber pad; 405. First spring; 406. Guide rod; 407. Limiting plate; 408. Pin; 409. Fixing hole; 410. Limiting hole; 5. Receiving device; 51. Base plate; 52. Slide chute; 53. Sliding block; 54. Hopper; 55. Handle; 56. Tray; 57. Second spring; 58. Fixing plate; 59. Pin; 6. Output port. Detailed Implementation
[0028] Reference Figure 1 As shown, this utility model provides a technical solution: a blocking mechanism for a semiconductor test sorting machine, including a test sorting machine 1, a control panel 2 fixedly connected to one end of the test sorting machine 1, a conveying mechanism 3 fixedly connected to one side of the test sorting machine 1, an output port 6 opened on the other side of the test sorting machine 1, a blocking device 4 provided on the upper surface of the conveying mechanism 3, and a receiving device 5 provided on one side of the test sorting machine 1.
[0029] The specific setup and function of the blocking device 4 and the receiving device 5 will be explained below.
[0030] Reference Figure 3 As shown in this embodiment: the blocking device 4 includes a support column 401, the lower surface of which is fixedly connected to the conveying mechanism 3. The conveying mechanism 3 has a moving groove 402 corresponding to the support column 401. A baffle 403 is slidably connected inside the moving groove 402. A guide rod 406 is fixedly connected to the upper surface of the baffle 403. The arc surface of the guide rod 406 is slidably connected to the support column 401. A limiting plate 407 is fixedly connected to the upper surface of the support column 401. A fixing hole 409 is formed inside the limiting plate 407. Several limiting holes 410 are formed inside the guide rod 406. A pin 408 is engaged with the fixing hole 409 in one of the limiting holes 410. The effect achieved by the above components is to restrict the entry and exit of the semiconductor to be tested on the conveying mechanism 3 by using the baffle 403. A first spring 405 is fitted onto the arc surface of the guide rod 406. The two ends of the first spring 405 are fixedly connected to the support column 401 and the baffle 403, respectively. The purpose of this component is to quickly pull back the depressed baffle 403 by utilizing the stretching and contraction characteristics of the first spring 405. A rubber pad 404 is fixedly connected to one end of the baffle 403. The rubber pad 404 has high elasticity. The purpose of this component is to reduce friction between the semiconductor to be tested and the baffle 403 during transport.
[0031] Reference Figure 2 and Figure 4As shown in this embodiment: the receiving device 5 includes a base plate 51, one side of which is fixedly connected to the testing and sorting machine 1. Two grooves 52 are formed inside the base plate 51, and a slider 53 is slidably connected inside the grooves 52. A hopper 54 is fixedly connected to the upper surface of the slider 53. The effect of these components is to collect the semiconductors that have been tested and sorted. A second spring 57 is fixedly connected inside the hopper 54, and a tray 56 is fixedly connected to one end of the second spring 57. The effect of these components is to buffer the semiconductors collected inside the hopper 54. A handle 55 is fixedly connected to one end of the hopper 54. The handle 55 has a U-shaped cross-section. The effect of these components is to facilitate the movement of the hopper 54. A fixing plate 58 is fixedly connected to one end of the hopper 54. A pin 59 is engaged inside the fixing plate 58 at a position corresponding to that of the base plate 51. The effect of these components is to fix the hopper 54 and reduce its shaking.
[0032] Working principle: When the semiconductor needs to be tested and sorted using the blocking device 4, the pin 408 is pulled out along the fixing hole 409 and the limiting hole 410. The first spring 405 rebounds and drives the baffle 403 to move upward along the moving groove 402. Then, the position of the baffle 403 is adjusted by sliding along the support column. When the baffle 403 is adjusted above the conveying mechanism 3, the pin 408 is inserted along the limiting hole 410 and the fixing hole 409 above the support column 401, opening the conveying mechanism 3 and conveying the semiconductor to be tested. After the semiconductor is delivered to the test line, the pin 408 is pulled out along the fixing hole 409 and the limiting hole 410. Then, the position of the baffle 403 is adjusted by sliding along the support column. After the baffle 403 is adjusted to a position that can block the semiconductor to be tested from entering the test sorting machine 1, the rubber pad 404 distributed at one end of the baffle 403 can reduce the impact damage between the semiconductor to be tested and the baffle 403 during the transmission. Then, the pin 408 is inserted back along the limiting hole 410 and the fixing hole 409 above the support column 401.
[0033] In this invention, when the semiconductor testing is completed and the receiving device 5 is needed, the slider 53 slides into the groove 52 on the base plate 51. The slider 53 slides in, causing the hopper 54 to slide onto the base plate 51. The hopper 54 slides onto the base plate 51, and then the pin 408 is inserted into the fixing plate 58 and the base plate 51 to fix the hopper 54 onto the base plate 51 to reduce the movement of the hopper 54. Then, the discharge plate of the output port 6 is placed into the hopper 54 to receive the semiconductor that has been tested. The second spring 57 and the tray 56 in the hopper 54 can buffer the semiconductor that falls into the hopper 54 to reduce the damage to the semiconductor. After the hopper 54 is filled, the pin 408 that fixes the hopper 54 onto the base plate 51 is pulled out, and the handle 55 is pulled. The handle 55 moves the hopper 54, removes the filled hopper 54, and then loads a new hopper 54.
[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
Claims
1. A blocking mechanism for a semiconductor test sorting machine, comprising a test sorting machine (1), characterized in that: A control panel (2) is fixedly connected to one end of the test sorting machine (1). A conveying mechanism (3) is fixedly connected to one side of the test sorting machine (1). An output port (6) is opened on the other side of the test sorting machine (1). A blocking device (4) is provided on the upper surface of the conveying mechanism (3). The blocking device (4) includes a support column (401). The lower surface of the support column (401) is fixedly connected to the conveying mechanism (3). A moving groove (402) is opened inside the conveying mechanism (3) corresponding to the support column (401). (402) An internal slidable baffle (403) is connected to the baffle (403), and a guide rod (406) is fixedly connected to the upper surface of the baffle (403). The arc surface of the guide rod (406) is slidably connected to the support column (401). A limiting plate (407) is fixedly connected to the upper surface of the support column (401). A fixing hole (409) is formed inside the limiting plate (407). Several limiting holes (410) are formed inside the guide rod (406). A pin (408) is engaged with one of the limiting holes (410) and the fixing hole (409).
2. The blocking mechanism of a semiconductor testing and sorting machine according to claim 1, characterized in that: The guide rod (406) has a first spring (405) fitted on its arc surface. The two ends of the first spring (405) are fixedly connected to the support column (401) and the baffle (403) respectively.
3. The blocking mechanism of a semiconductor testing and sorting machine according to claim 1, characterized in that: A rubber pad (404) is fixedly connected to one end of the baffle (403), and the rubber pad (404) has high elasticity.
4. The blocking mechanism of a semiconductor testing and sorting machine according to claim 1, characterized in that: The test sorting machine (1) is provided with a receiving device (5) on one side. The receiving device (5) includes a base plate (51). One side of the base plate (51) is fixedly connected to the test sorting machine (1). Two sliding grooves (52) are opened inside the base plate (51). A slider (53) is slidably connected inside the sliding groove (52). A hopper (54) is fixedly connected to the upper surface of the slider (53).
5. The blocking mechanism of a semiconductor testing and sorting machine according to claim 4, characterized in that: A second spring (57) is fixedly connected inside the hopper (54), and a tray (56) is fixedly connected to one end of the second spring (57).
6. The blocking mechanism of a semiconductor testing and sorting machine according to claim 4, characterized in that: A handle (55) is fixedly connected to one end of the hopper (54), and the handle (55) has a "U" shaped cross section.
7. The blocking mechanism of a semiconductor testing and sorting machine according to claim 4, characterized in that: One end of the hopper (54) is fixedly connected to a fixing plate (58), and a pin (59) is engaged inside the fixing plate (58) at a position corresponding to the bottom plate (51).
Citation Information
Patent Citations
Semiconductor test sorting machine
CN220821482U