An MCU IR logic control circuit
Patent Information
- Application Number
- CN202521461512.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-11
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-07-11
AI Technical Summary
然而，此方案存在明显的缺陷：由于依赖I 2C总线进行通讯，当I 2C通讯出现异常时，如总线干扰、信号衰减或MCU与主芯片之间的同步问题，可能导致遥控器指令无法正确传输至主芯片，进而引发遥控器无作用或指令错乱等问题，严重影响用户体验
[0020]本实用新型与现有技术相比的有益效果是：通过红外接收模块将接收到的电信号精准分配为MCU_IR信号和IRIN信号，其中MCU模块仅负责处理开机指令，而其他操作指令(如音量调节、频道切换等)直接通过传输至主芯片模块解析处理，这种设计完全避免了传统方案中MCU与主芯片通过I2C总线进行复杂通讯的过程，从根本上消除了因I2C通讯异常(如总线干扰、信号衰减)导致的遥控器指令丢失或延迟问题，确保了红外遥控的即时性和准确性；另外，在待机或休眠状态下，主芯片模块直接接收待机指令后，向MCU模块发送低电平信号，即可触发MCU模块对主芯片模块的断电休眠操作，此过程中，主芯片模块无需持续供电以维持红外信号接收，从而将待机功耗降至最低水平，相较于传统方案中主芯片需全程供电导致的功耗浪费，可有效延长便携式投影仪等电池供电设备的续航时间，满足欧盟的ErP等能效认证标准要求。
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Figure CN224696401U_ABST
Abstract
Claims
1. An MCU IR logic control circuit, characterized in that, include: The system comprises an infrared receiving module, an MCU module, and a main chip module. The infrared receiving module receives infrared signals emitted by the remote control and converts them into electrical signals. It then distributes these electrical signals into an MCU_IR signal and an IRIN signal. The MCU_IR signal is sent to the MCU module, and the IRIN signal is sent to the main chip module. When the MCU module receives a power-on signal, it sends a power-on command to the main chip module to perform a power-on operation. When the main chip module receives a standby or sleep command, it notifies the MCU module to enter the corresponding state, enabling the MCU module to perform a power-off sleep operation on the main chip module. The main chip module receives and processes other infrared operation commands besides the power-on signal via the IRIN signal.
2. The MCU IR logic control circuit according to claim 1, characterized in that, The infrared receiving module includes an infrared receiver head DKE03, resistors R1 and R2, diodes D3 and D4. Pin 3 of the infrared receiver head DKE03 is connected to resistor R1, pin 1 of the infrared receiver head DKE03 is connected to resistor R2, one end of diode D3 is connected to resistor R2, and the other end is connected to the MCU module. One end of diode D4 is connected to resistor R2, and the other end is connected to the main chip module.
3. The MCU IR logic control circuit according to claim 2, characterized in that, A capacitor C1 is also connected between pin 3 of the infrared receiver head DKE03 and the resistor R1, and the capacitor C1 is grounded.
4. The MCU IR logic control circuit according to claim 2, characterized in that, A capacitor C2 is also connected between the resistor R2, the diode D3, and the diode D4, and the capacitor C2 is grounded.
5. The MCU IR logic control circuit according to claim 4, characterized in that, A resistor R3 is also connected between the resistor R2, the capacitor C2, the diode D3, and the diode D4.
6. The MCU IR logic control circuit according to claim 5, characterized in that, The MCU module includes MCU U1, pin 15 of MCU U1 is connected to diode D3, and pin 14 of MCU U1 is connected to the main chip module.
7. The MCU IR logic control circuit according to claim 6, characterized in that, The main chip module includes a main chip U2, with pin G18 of the main chip U2 connected to pin 14 of the MCU U1, and pin Y8 of the main chip U2 connected to the diode D4.
8. The MCU IR logic control circuit according to claim 2, characterized in that, The infrared receiver head DKE03 is model number LF0038AHT2L.
9. The MCU IR logic control circuit according to claim 6, characterized in that, The MCU U1 is model AT89C51.
10. The MCU IR logic control circuit according to claim 7, characterized in that, The main chip U2 is model HI 3751V352.