A new high-speed test mechanism for 0BB
CN224698288UActive Publication Date: 2026-08-28FOLUNGWIN AUTOMATIC EQUIP CO LTD
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Patent Information
- Application Number
- CN202521659891.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-05
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-08-05
AI Technical Summary
Technical Problem
现有的硅片中,正面具有主栅线,主栅线会对太阳能电池的表面进行遮挡,影响电池片对光的吸收,进而影响发电效率,后续新型的硅片中,正面主栅线进行取消,形成0BB硅片,生产过程中对0BB硅片的质量需要进行检测,常规的IV检测中,结构较为复杂,检测用的PCB需要粘贴在调整台上,操作不便利
Benefits of technology
[0011]本实用新型的有益效果为:提供一种0BB的新型高速测试机构,该0BB的新型高速测试机构通过相机拍照后,转盘将上吸附的硅片转移至PCB真空支撑板的上方,在PCB真空支撑板调整位置后升起PCB对准硅片的下表面进行IV检测,上下吸附硅片提高硅片的稳定性,保证了IV检测的顺利进行。
✦ Generated by Eureka AI based on patent content.
Smart Images

Figure CN224698288U_ABST
Abstract
The utility model discloses a novel high -speed test mechanism of 0BB, including bottom plate and install the carousel and IV detection subassembly on bottom plate, the outside shaping of carousel has four stations, and both sides of every station all are installed with adsorption subassembly, and one side of IV detection subassembly installs detection camera, and the front end of IV detection subassembly is installed with XYT adjusting platform, and both sides of XYT adjusting platform all are provided with vertical adjusting seat, and the installation board is connected between two vertical adjusting seats, and the support seat is installed on the installation board, and the PCB vacuum support board is locked on the support seat. This novel high -speed test mechanism of 0BB is transferred to the top of PCB vacuum support board by carousel after the photograph of camera, and the lower surface of silicon wafer is detected after the rise of PCB in the position adjustment of PCB vacuum support board, and the stability of silicon wafer is improved by the adsorption of silicon wafer, and the smooth operation of IV detection is guaranteed.
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