A semiconductor package mold releasing structure

Abstract

The utility model discloses a semiconductor packaging die demolding structure relates to semiconductor production processing technical field. The utility model discloses a plurality of ejection units of cooperation installation on the movable mould, and the output of ejection unit is after its end portion is supported on the fixed mould after stretching out, and ejection unit includes the inner sleeve and outer sleeve of mutual sealing cooperation, and the outer sleeve is fixedly installed to movable mould, and the end portion of inner sleeve is connected with the ejector block that is supported on the fixed mould after stretching out, and the spring is connected between inner sleeve and outer sleeve, the outer sleeve is fixed on a base plate, and the inlet and outlet hole is set up on the base plate, and the inlet and outlet hole are communicated air pump through pipeline. The utility model discloses the output of ejection unit is supported on the fixed mould, and the controllable demolding force is provided to cooperation pneumatic system, and improve demolding stability and product yield, and pneumatic auxiliary reduces mechanical wear and tear, prolongs the life of mould, and compact structure is convenient for integrated to the existing mould system.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing and processing technology, and in particular relates to a semiconductor packaging mold demolding structure. Background Technology

[0002] In semiconductor packaging processes, mold release is a critical step used to separate the cured packaged component from the mold. Traditional release structures often suffer from the following problems: uneven release force leading to product deformation or damage; insufficient precision of the ejection mechanism affecting the surface quality of the packaged component; and poor installation stability. These problems reduce production efficiency and product yield. In existing technologies, release units mostly use mechanical ejector pins, lacking cushioning and pneumatic assistance, resulting in an unstable release process. Furthermore, the simple design of the fixing mechanism cannot effectively resist vibrations during mold closure, increasing maintenance costs. Utility Model Content

[0003] The purpose of this invention is to provide a semiconductor packaging mold demolding structure, in which the output end of the ejection unit abuts against the fixed mold, and a pneumatic system provides controllable demolding force, thus solving the problem of package deformation caused by uneven force during demolding.

[0004] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0005] This utility model relates to a semiconductor packaging mold demolding structure, comprising multiple ejection units mounted on a moving mold. The output end of each ejection unit extends and abuts against a fixed mold. Each ejection unit includes an inner sleeve and an outer sleeve that are sealed to each other. The outer sleeve is fixedly mounted relative to the moving mold. An extension block that abuts against the fixed mold is connected to the end of the inner sleeve, and a spring connects the inner sleeve and the outer sleeve. The outer sleeve is fixed to a substrate with air inlet and outlet holes connected to an air pump via pipelines. A through hole for mounting the ejection units is provided on the moving mold. One end of the through hole has an annular step portion that mates with the mounting substrate, and the extension block slides along the inner wall of the through hole. By having the output end of the ejection unit abut against the fixed mold, and with the help of a pneumatic system providing controllable demolding force, the problem of package deformation caused by uneven force during demolding is solved. This improves demolding stability and product yield. Pneumatic assistance reduces mechanical wear and extends mold life. The structure is compact and easy to integrate into existing mold systems.

[0006] Furthermore, a positioning groove is provided on the annular step portion, and a positioning protrusion that cooperates with the positioning groove is provided on the substrate. The positioning protrusion cooperates with the positioning groove to ensure that the substrate is accurately installed on the annular step portion and to simplify the assembly process.

[0007] Furthermore, an arc-shaped protrusion is provided on one side of the top block.

[0008] Furthermore, a fixing mechanism for fixing a device placed in a through hole is installed on the moving mold located on the periphery of the annular step portion; the fixing mechanism includes a fixing module and a locking module that are configured to cooperate; the fixing module includes four positioning blocks disposed on the periphery of the annular step portion, each positioning block having a slot on one side, and a locking bolt A threadedly connected to the top of the positioning block; the locking module includes a cross brace, in which the four ends of the cross brace are respectively engaged in the slots of the four positioning blocks, and the end of the locking bolt A abuts against the cross brace; a locking bolt B is threadedly connected to the middle of the cross brace, and the device can be disassembled and installed through the ejection unit within the fixing module and the locking module.

[0009] Furthermore, the end of the locking bolt B abuts against the pressure plate, the pressure plate is connected to a guide rod, and the cross bracket is provided with a guide hole for guiding the guide rod. The guide rod and the guide hole guide the movement of the pressure plate, which solves the problem of pressure plate offset during the locking process and ensures uniform locking force.

[0010] Furthermore, the bottom side of the slot is provided with a groove A, and the upper and lower surfaces of the end of the cross bracket are respectively provided with a groove B for inserting the end of the locking bolt A, and a positioning post inserted into the groove A. The groove A, groove B and positioning post cooperate to achieve dual positioning and solve the problem of the cross bracket shaking in the slot.

[0011] Furthermore, the outer diameter of the outer sleeve is approximately equal to the diameter of the through hole.

[0012] This utility model has the following beneficial effects:

[0013] 1. The ejection unit of this utility model has its output end pressed against the fixed mold, which, together with the pneumatic system, provides a controllable demolding force and improves demolding stability and product yield; the pneumatic assistance reduces mechanical wear and extends mold life; the structure is compact and easy to integrate into existing mold systems.

[0014] 2. The positioning groove of the annular step portion and the positioning protrusion of the substrate achieve primary positioning; the outer diameter of the outer sleeve matches the diameter of the through hole to form secondary positioning.

[0015] 3. The cross-shaped frame of this utility model has a guide hole for guiding the guide rod. The guide rod and the guide hole guide the movement of the pressure plate, preventing the pressure plate from shifting during the locking process and ensuring uniform locking force.

[0016] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the demolding structure of this utility model in its installation state;

[0019] Figure 2 for Figure 1 Enlarged view of a portion of point A in the middle;

[0020] Figure 3 This is a schematic diagram of the installation state structure of the ejector unit of this utility model;

[0021] Figure 4 This is a schematic diagram of the fixed module structure of this utility model;

[0022] Figure 5 This is a top view structural diagram of the locking module of this utility model;

[0023] Figure 6 This is a schematic diagram of the locking module of this utility model from a bottom view.

[0024] The attached diagram lists the components represented by each number as follows:

[0025] 1-Moving mold, 2-Base plate, 3-Locking module, 10-Annular step, 11-Through hole, 13-Positioning block, 14-Slot, 15-Groove A, 16-Locking bolt A, 21-Air inlet / outlet, 22-Positioning protrusion, 23-Outer sleeve, 24-Spring, 25-Inner sleeve, 27-Top block, 28-Arc-shaped protrusion, 30-Cross bracket, 31-Locking bolt B, 32-Pressure plate, 33-Guide rod, 34-Guide hole, 35-Groove B, 36-Positioning post. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] In the description of this utility model, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around" and other terms indicating orientation or positional relationship are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] Please see Figure 1-4 As shown, this utility model is a semiconductor packaging mold demolding structure. Four through holes 11 are opened on the periphery of the moving mold 1, each located at one of the four corners. One end of each through hole 11 has an annular stepped portion 10, and a positioning groove is provided on the annular stepped portion 10. The demolding structure includes four ejection units. The output end of each ejection unit, after being fully extended, abuts against the fixed mold 1. Each ejection unit includes an inner sleeve 25 and an outer sleeve 23 that are mutually sealed and connected by a spring 24. The outer diameter of the outer sleeve 23 is approximately equal to the diameter of the through hole 11. The outer sleeve 23 is fixed to a substrate 2. An air inlet / outlet hole 21 is provided on the upper part of the inner sleeve 25, which is connected to an air pump through a pipeline. A positioning protrusion 22 that cooperates with the positioning groove is provided on the base plate 2 located on the outer periphery of the outer sleeve 23. The end of the inner sleeve 25 is connected to a top block 27 that extends out and abuts against the fixed mold. When demolding, the air pump supplies air to the pipeline through the air inlet / outlet hole 21, pushing the inner sleeve 25 out. The top block 27 abuts against the fixed mold and applies a uniform force to cause the moving mold 1 and the fixed mold to separate. The spring 24 provides a buffer between the inner sleeve 25 and the outer sleeve 23. After demolding is completed, the air pump pulls out the ejection unit through the air inlet / outlet hole 21. At this time, the inner sleeve 25 retracts into the outer sleeve 23.

[0029] Specifically, an arc-shaped protrusion 28 is provided on one side of the top block 27.

[0030] Based on the above embodiment one, in order to facilitate the installation and disassembly of the ejector unit, two installation methods are provided as follows:

[0031] Method 1: An opening is provided on the base plate 2 located on the outer periphery of the outer sleeve 23, and a threaded hole with a concentric structure is provided on the annular step portion 10. That is, during installation, a fixing bolt that passes through the opening and is threaded onto the threaded hole is used for connection.

[0032] Method 2: For example Figure 1 , 2As shown in Figures 4-6, a fixing module is installed on the moving mold 1 located around the annular step portion 10. A locking module 3 is detachably installed on the fixing module. The fixing module includes four positioning blocks 13 located around the annular step portion 10. A slot 14 is provided on one side of the positioning block 13. A locking bolt A16 is threadedly connected to the top of the positioning block 13. The locking module 3 includes a cross bracket 30. In the installed state, the four ends of the cross bracket 30 are respectively locked in the slots 14 of the four positioning blocks 13, and the end of the locking bolt A16 abuts against the cross bracket 30. A locking bolt B31 is threadedly connected to the middle of the cross bracket 30. The end of the locking bolt B31 abuts against a pressure plate 32. A guide rod 33 is connected to the pressure plate 32. A guide hole 34 is provided on the cross bracket 30 for guiding the guide rod 33. When the locking bolt B31 is tightened, the pressure plate 32 is restricted to vertical movement by the guide rod 33.

[0033] Specifically, a groove A15 is provided on the bottom side of the slot 14, and the upper and lower surfaces of the end of the cross bracket 30 are respectively provided with a groove B35 for inserting the end of the locking bolt A16, and a positioning post 36 inserted into the groove A15. During installation, the positioning post 36 is embedded in the groove A15 to fix the position, and the groove B35 accommodates the end of the locking bolt A16.

[0034] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0035] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor packaging mold release structure, characterized in that: It includes multiple ejection units that are fitted and installed on the moving mold (1). The output end of the ejection unit abuts against the fixed mold after it extends out. The ejection unit includes an inner sleeve (25) and an outer sleeve (23) that are sealed to each other. The outer sleeve (23) is fixedly installed relative to the moving mold (1). The end of the inner sleeve (25) is connected to a top block (27) that extends out and abuts against the fixed mold. A spring (24) is connected between the inner sleeve (25) and the outer sleeve (23). The outer sleeve (23) is fixed on a base plate (2), and an air inlet / outlet hole (21) is opened on the base plate (2). The air inlet / outlet hole (21) is connected to an air pump through a pipeline. The moving mold (1) has a through hole (11) for mounting the ejector unit. One end of the through hole (11) is provided with an annular step portion (10) that fits the mounting base plate (2). The top block (27) slides along the inner wall surface of the through hole (11).

2. The semiconductor packaging mold demolding structure according to claim 1, characterized in that, The annular step portion (10) is provided with a positioning groove, and the base plate (2) is provided with a positioning protrusion (22) that cooperates with the positioning groove.

3. The semiconductor packaging mold demolding structure according to claim 1, characterized in that, An arc-shaped protrusion (28) is provided on one side of the top block (27).

4. The semiconductor packaging mold demolding structure according to claim 1, characterized in that, A fixing mechanism for fixing the through hole (11) is installed on the moving mold (1) located on the periphery of the annular step portion (10); The fixing mechanism includes a fixing module and a locking module (3) that are configured to work together; The fixing module includes four positioning blocks (13) arranged around the annular step (10), a slot (14) is provided on one side of the positioning block (13), and a locking bolt A (16) is threadedly connected to the top of the positioning block (13). The locking module (3) includes a cross bracket (30). In the installed state, the four ends of the cross bracket (30) are respectively locked in the slots (14) of the four positioning blocks (13), and the end of the locking bolt A (16) abuts against the cross bracket (30). The middle part of the cross bracket (30) is threaded with a locking bolt B (31).

5. The semiconductor packaging mold demolding structure according to claim 4, characterized in that, The end of the locking bolt B (31) abuts against a pressure plate (32), and a guide rod (33) is connected to the pressure plate (32). The cross bracket (30) is provided with a guide hole (34) for guiding the guide rod (33).

6. The semiconductor packaging mold demolding structure according to claim 4, characterized in that, The bottom side of the slot (14) is provided with a groove A (15), and the upper and lower surfaces of the end of the "+" frame (30) are respectively provided with a groove B (35) for inserting the end of the locking bolt A (16) and a positioning post (36) inserted into the groove A (15).

7. The semiconductor packaging mold demolding structure according to claim 1, characterized in that, The outer diameter of the outer sleeve (23) is equivalent to the diameter of the through hole (11).

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