A semiconductor package structure capable of reducing the overall thickness of the package

Abstract

The utility model discloses a kind of semiconductor packaging structures capable of reducing the overall thickness of packaging, it relates to the field of semiconductor packaging, including first substrate, semiconductor element and second substrate, characterized by: the first substrate top end is fixedly connected with fixed column, the semiconductor element is attached to the first substrate top end in flip-chip mode, and semiconductor element edge two sides are sleeved on fixed column, and fixed column protrudes semiconductor element, in the superposition packaging scene of multiple groups of semiconductor element and substrate, fixed column can be used as positioning reference, ensure that the strict parallel relationship between second substrate and semiconductor element, first substrate, avoid the component inclination caused by inaccurate positioning in traditional superposition packaging;The elimination of component inclination can prevent the additional increase of encapsulation glue thickness due to uneven gap in packaging process, ensure the consistency of overall thickness after superposition packaging.

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