Conductive electrodes, dimming diaphragm and dimming glass

Abstract

This utility model discloses a conductive electrode, a dimming film, and a dimming glass. The conductive electrode includes: a flexible circuit board comprising a first cover layer, a second cover layer, and an intermediate conductive layer sandwiched between the first and second cover layers. The intermediate conductive layer has a conductive input section, a circuit section, and a conductive output section. A conductive bonding structure is also included, wherein the conductive output section is bonded and fixed to the electrode mounting area via the conductive bonding structure. The upper surface of the conductive output section is electrically connected to the electrode mounting area via the conductive bonding structure, and the lower surface of the conductive output section is also electrically connected to the electrode mounting area via the conductive bonding structure, or the lower surface of the conductive output section is bonded and electrically connected to the electrode mounting area. In this utility model, any surface of the conductive output section is conductive. The conductive bonding structure electrically connects the upper surface of the conductive output section to the electrode mounting area, effectively improving the peel resistance of the conductive output section and the conductive electrode, and the stability of the electrical connection between the conductive electrode and the electrode mounting area.

Description

Technical Field

[0001] This utility model relates to the field of electronic light control structure technology, and in particular, to a conductive electrode, a dimming film, and a dimming glass. Background Technology

[0002] Currently, most dimming films in smart glass use FPC (Flexible Printed Circuit) as electrodes to achieve dimming functionality. Dimming films are typically formed by sputtering a transparent indium tin oxide (ITO) conductive film onto a PET substrate. Low-temperature silver paste is then used to heat-bond the gold fingers (conductive terminals for external electrical communication) of the flexible circuit board to the conductive film coating, forming the complete conductive electrode of the dimming film. However, due to differences in the coefficients of thermal expansion between the conductive electrode, the substrate of the dimming film, and the gold fingers of the flexible circuit board; the high baking temperature and long time required for silver paste thermosetting; and factors affecting the processing, production, handling, and transportation of the dimming film, the conductive electrode is prone to peeling from the conductive film coating and / or the gold fingers of the flexible circuit board. This results in poor electrical contact, preventing stable and effective current transmission to the conductive film coating of the dimming film, thus causing the dimming function of the film to fail. Utility Model Content

[0003] The purpose of this invention is to provide a conductive electrode, a dimming film, and a dimming glass to solve the technical problem that the conductive electrode is prone to peeling off from the conductive film coating and / or the gold fingers of the flexible circuit board.

[0004] The above-mentioned objectives of this utility model can be achieved by the following technical solutions:

[0005] This utility model provides a conductive electrode, comprising: a flexible circuit board including a first cover layer, a second cover layer, and an intermediate conductive layer sandwiched between the first cover layer and the second cover layer, the intermediate conductive layer having a conductive input portion, a circuit portion, and a conductive output portion; and a conductive bonding structure, wherein the conductive output portion is bonded and fixed to an electrode mounting area through the conductive bonding structure; wherein the upper surface of the conductive output portion is electrically connected to the electrode mounting area through the conductive bonding structure, and the lower surface of the conductive output portion is electrically connected to the electrode mounting area through the conductive bonding structure, or the lower surface of the conductive output portion is bonded and electrically connected to the electrode mounting area.

[0006] In an embodiment of this utility model, the conductive output part further has a side surface connecting its upper and lower surfaces, and the side surface of the conductive output part is electrically connected to the electrode mounting area through the conductive bonding structure.

[0007] In an embodiment of this utility model, the upper surface of the conductive output portion is provided with a plurality of upper grooves spaced apart, and the conductive bonding structure has a plurality of upper embedded bonding conductive portions embedded in the plurality of upper grooves; and / or the lower surface of the conductive output portion is provided with a plurality of lower grooves spaced apart, and the conductive bonding structure has a plurality of lower embedded bonding conductive portions embedded in the plurality of lower grooves.

[0008] In this embodiment of the invention, the conductive output portion is provided with a plurality of connection channels at intervals, the connection channels are provided through the upper surface and the lower surface of the conductive output portion, and the conductive bonding structure has a plurality of connecting and bonding conductive portions embedded in the plurality of connection channels.

[0009] In an embodiment of this utility model, the conductive bonding structure includes an upper conductive bonding layer, the upper conductive bonding layer having a first conductive bonding segment and two second conductive bonding segments, the first conductive bonding segment being located between the two second conductive bonding segments, the first conductive bonding segment being bonded and fixed to the upper surface of the conductive output portion and being electrically connected to the conductive output portion, and the two second conductive bonding segments being bonded and fixed to the electrode mounting area and being electrically connected to the electrode mounting area.

[0010] In embodiments of this utility model, the upper conductive adhesive layer is a single-sided conductive adhesive strip, and the conductive adhesive layer of the single-sided conductive adhesive strip is disposed with the conductive adhesive layer facing downward; or the upper conductive adhesive layer is a double-sided conductive adhesive strip; or the upper conductive adhesive layer is a cured conductive silver paste layer.

[0011] In an embodiment of this utility model, the conductive bonding structure further includes a lower conductive bonding layer, and the lower surface of the conductive output part is electrically connected to the electrode mounting area through the lower conductive bonding layer.

[0012] In this embodiment of the invention, the upper conductive bonding layer further comprises two third conductive bonding segments, which are located between the two second conductive bonding segments and the first conductive bonding segment. The lower conductive bonding layer comprises a fourth conductive bonding segment and two fifth conductive bonding segments. The third conductive bonding segment is located between the two fourth conductive bonding segments. The fourth conductive bonding segment is bonded and fixed between the lower surface of the conductive output portion and the electrode mounting area. The two fifth conductive bonding segments are bonded and fixed between the two third conductive bonding segments and the electrode mounting area and are electrically connected to the two third conductive bonding segments and the electrode mounting area. The lower conductive bonding layer is a double-sided conductive adhesive strip; or the lower conductive bonding layer is a cured conductive silver paste layer; or the lower conductive bonding layer is a cured anisotropic conductive film layer.

[0013] This utility model also provides a dimming film, including the above-mentioned conductive electrode, wherein the dimming film has an electrode mounting area for mounting the conductive electrode.

[0014] This utility model also provides a dimming glass, including the dimming film described above.

[0015] The features and advantages of this utility model are:

[0016] The conductive electrode, dimming film, and dimming glass of this invention feature a flexible circuit board with an intermediate conductive layer, a portion of which is not covered by a cover layer to form a conductive output section. This ensures that any surface of the conductive output section is conductive. Furthermore, while the lower surface of the conductive output section can be directly attached to the electrode mounting area or electrically connected to the electrode mounting area via a conductive bonding structure, the upper surface of the conductive output section can also be electrically connected to the electrode mounting area via the conductive bonding structure. This not only increases the bonding area between the conductive bonding structure and the conductive output section but also further increases the bonding area between the conductive output section and the electrode mounting area. Additionally, the conductive bonding structure can be used to further press and fix the conductive output section, thereby effectively improving the anti-peeling performance of the conductive output section and the conductive electrode, and also effectively improving the electrical connection stability between the conductive electrode and the electrode mounting area. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is an exploded view of the flexible circuit board in one embodiment of the present invention.

[0019] Figure 2 This is a perspective view of a flexible circuit board in one embodiment of the present invention.

[0020] Figure 3 This is a perspective view of the conductive electrode in one embodiment of the present invention.

[0021] Figure 4 This is a cross-sectional view of the conductive electrode in another embodiment of the present invention.

[0022] Figure 5 This is a cross-sectional view of the conductive electrode in another embodiment of the present invention.

[0023] Figure 6 This is a perspective view of the flexible circuit board in another embodiment of the present invention.

[0024] Figure 7 This is a rear view of the flexible circuit board in another embodiment of the present invention.

[0025] Figure 8 This is a rear view of the flexible circuit board in another embodiment of the present invention.

[0026] Figure 9 This is a perspective view of the flexible circuit board in another embodiment of the present invention.

[0027] Figure 10 This is a rear view of the flexible circuit board in another embodiment of the present invention.

[0028] Figure 11 This is a cross-sectional view of the conductive electrode in another embodiment of the present invention.

[0029] Figure 12 This is a perspective view of the flexible circuit board with multiple intermediate conductive layers in this utility model.

[0030] In the picture:

[0031] 1. Flexible circuit board; 11. Intermediate conductive layer; 111. Conductive output section; 1111. Upper surface; 1112. Lower surface; 1113. Side surface; 1114. Upper groove; 1115. Lower groove; 1116. Connecting channel; 112. Circuit section; 113. Conductive input section; 12. First cover layer; 13. Second cover layer;

[0032] 2. Conductive bonding structure; 21. Upper conductive bonding layer; 211. First conductive bonding segment; 212. Second conductive bonding segment; 213. Third conductive bonding segment; 22. Lower conductive bonding layer; 221. Fourth conductive bonding segment; 222. Fifth conductive bonding segment; 23. Connecting conductive part;

[0033] 3. Dimming film body; 31. Upper substrate layer; 32. Upper conductive layer; 33. Middle light control layer; 34. Lower conductive layer; 341. Electrode mounting area; 3411. Inner boundary; 35. Lower substrate layer. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] Implementation Method 1

[0036] like Figures 1 to 3As shown, this utility model provides a conductive electrode, including: a flexible circuit board 1, including an intermediate conductive layer 11, a first cover layer 12, and a second cover layer 13, the intermediate conductive layer 11 having a conductive input part 113, a circuit part 112, and a conductive output part 111; a conductive bonding structure 2, the conductive output part 111 being bonded and fixed to an electrode mounting area 341 through the conductive bonding structure 2; wherein, the upper surface 1111 of the conductive output part 111 is electrically connected to the electrode mounting area 341 through the conductive bonding structure 2, and the lower surface 1112 of the conductive output part 111 is electrically connected to the electrode mounting area 341 through the conductive bonding structure 2, or the lower surface 1112 of the conductive output part 111 is attached and electrically connected to the electrode mounting area 341.

[0037] In this novel conductive electrode, a flexible circuit board 1 has an intermediate conductive layer 11, with a portion of the intermediate conductive layer 11 not covered by a cover layer to form a conductive output portion 111. This ensures that any surface of the conductive output portion 111 is conductive. Furthermore, while the lower surface 1112 of the conductive output portion 111 can be directly attached to the electrode mounting area 341 or electrically connected to the electrode mounting area 341 via the conductive bonding structure 2, the upper surface 1111 of the conductive output portion 111 can also be electrically connected to the electrode mounting area 341 via the conductive bonding structure 2. This not only increases the bonding area between the conductive bonding structure 2 and the conductive output portion 111, but also increases the bonding area between the conductive output portion 111 and the electrode mounting area 341. Additionally, the conductive bonding structure 2 can further press and fix the conductive output portion 111, thereby effectively improving the anti-peeling performance of the conductive output portion 111 and the conductive electrode, and also effectively improving the electrical connection stability between the conductive electrode and the electrode mounting area 341.

[0038] Specifically, such as Figure 1 and Figure 2As shown, an intermediate conductive layer 11 is sandwiched between a first cover layer 12 and a second cover layer 13. A portion of the intermediate conductive layer 11 extends out from between the first cover layer 12 and the second cover layer 13 without being covered by them, thus forming a conductive output portion 111 of the intermediate conductive layer 11. Another portion of the intermediate conductive layer 11 is located between the first cover layer 12 and the second cover layer 13, forming a conductive input portion 113 and a circuit portion 112. The intermediate conductive layer 11 is made of a conductive metal. In this embodiment, the intermediate conductive layer 11 is formed by punching a copper sheet, and to further improve the conductivity of the conductive output portion 111, both the upper surface 1111 and the lower surface 1112 of the conductive output portion 111 are provided with a nickel-gold composite plating layer. The materials of the first cover layer 12 and the second cover layer 13 may be, but are not limited to, polyimide, polyester, and other transparent plastics, or other opaque materials. The first cover layer 12 and the second cover layer 13 are bonded to the intermediate conductive layer 11 by an adhesive (which may be, but is not limited to, acrylic adhesive). In this embodiment, the second cover layer 13 covers the lower surface of the circuit section 112 and the lower surface of the conductive input section 113, while the first cover layer 12 covers the upper surface of the circuit section 112, the side surface of the circuit section 112, and the side surface of the conductive input section 113. The first cover layer 12 has a window for exposing a portion of the upper surface of the conductive input section 113, so that current can be introduced from the exposed area of ​​the upper surface of the conductive input section 113.

[0039] like Figure 3 As shown, the conductive electrode of this embodiment can be used, but is not limited to, in a dimming film. The dimming film also includes a dimming film body 3, which includes two substrate layers, two conductive layers, and an intermediate light-controlling layer 33. The two conductive layers are disposed on the inner surfaces of the two substrate layers, and the intermediate light-controlling layer 33 is disposed between the two conductive layers. The intermediate light-controlling layer 33, as well as the conductive layer (defined as the upper conductive layer 32) and the substrate layer (defined as the upper substrate layer 31) located on the same side as the intermediate light-controlling layer 33, are respectively provided with a hollow area, so that an electrode mounting area 341 for mounting the conductive electrode is formed on the conductive layer (defined as the lower conductive layer 34) on the other substrate layer (defined as the lower substrate layer 35). The electrode mounting area 341 has an inner boundary 3411 adjacent to the intermediate light-controlling layer 33. To prevent the conductive electrode from electrically connecting the two lower conductive layers 34 and forming a short circuit, the conductive electrode is spaced apart from the inner boundary 3411. The spacing between the conductive electrode and the inner boundary 3411 is preferably greater than or equal to 2 mm.

[0040] Combination Figure 2 and Figure 4As shown, in order to further improve the electrical connection stability between the conductive electrode and the electrode mounting area 341, in this embodiment of the invention, the conductive output part 111 also has a side surface 1113 connecting its upper surface 1111 and lower surface 1112. The side surface 1113 of the conductive output part 111 is electrically connected to the electrode mounting area 341 through the conductive bonding structure 2, thereby maximizing the conduction area of ​​the conductive output part 111. The current of the conductive output part 111 can be drawn out from its upper surface 1111, lower surface 1112 and side surface 1113. At the same time, the bonding area between the conductive output part 111 and the conductive bonding structure 2 is further increased, thereby further improving the anti-peeling performance of the conductive output part 111.

[0041] Combination Figure 2 , Figure 3 as well as Figure 4 As shown, in the embodiment of this utility model, the conductive bonding structure 2 includes an upper conductive bonding layer 21. The upper conductive bonding layer 21 has a first conductive bonding segment 211 and two second conductive bonding segments 212. The first conductive bonding segment 211 is located between the two second conductive bonding segments 212. The first conductive bonding segment 211 is bonded and fixed to the upper surface 1111 of the conductive output part 111 and can be electrically connected to the conductive output part 111. The two second conductive bonding segments 212 are bonded and fixed to the electrode mounting area 341 and can be electrically connected to the electrode mounting area 341.

[0042] In some embodiments of this invention, the upper conductive bonding layer 21 is a single-sided conductive adhesive strip, which has lower cost and does not require prolonged high-temperature baking and curing, significantly improving production efficiency. The conductive adhesive layer of the single-sided conductive adhesive strip is positioned downwards. Specifically, the single-sided conductive adhesive strip can be, but is not limited to, a conductive woven fabric single-sided conductive adhesive strip, a conductive fiber single-sided conductive adhesive strip, a conductive copper foil single-sided conductive adhesive strip, or a conductive aluminum foil single-sided conductive adhesive strip.

[0043] In some other embodiments of this utility model, the upper conductive bonding layer 21 is a double-sided conductive adhesive strip, which can be set with the conductive adhesive layer on either side facing downwards, making installation more convenient. Specifically, the double-sided conductive adhesive strip can be, but is not limited to, a conductive woven fabric double-sided conductive adhesive strip, a conductive fiber double-sided conductive adhesive strip, a conductive copper foil double-sided conductive adhesive strip, or a conductive aluminum foil double-sided conductive adhesive strip.

[0044] Combination Figure 3 As shown, in some embodiments of this invention, the upper conductive bonding layer 21 is a cured conductive silver paste layer, that is, the upper conductive bonding layer 21 is formed after the conductive silver paste is dried and cured. Since no other structure needs to be attached after the conductive silver paste is cured to form the upper conductive bonding layer 21, the problem of the cured conductive silver paste cracking under pressure can be avoided, and the problem of unstable connection and poor electrical contact between the conductive silver paste and the conductive output part 111 can also be avoided.

[0045] Combination Figure 2 and Figure 4 As shown, in some embodiments of this utility model, the lower surface 1112 of the conductive output portion 111 is also electrically connected to the electrode mounting area 341 via the conductive bonding structure 2. The conductive bonding structure 2 further includes a lower conductive bonding layer 22, through which the lower surface 1112 of the conductive output portion 111 is electrically connected to the electrode mounting area 341. By setting the lower conductive bonding layer 22 to be bonded and electrically connected to the lower surface 1112 of the conductive output portion 111 and the electrode mounting area 341, the bonding area and current conduction area between the conductive bonding structure 2 and the conductive output portion 111 and the electrode mounting area 341 are increased, thereby improving the peel resistance and electrical performance stability of the conductive electrode. Furthermore, the conductive output portion 111 is locked between the upper conductive bonding layer 21 and the lower conductive bonding layer 22, which also effectively improves the peel resistance and electrical performance stability.

[0046] Combination Figure 2 and Figure 5 As shown, in some embodiments of this utility model, the upper conductive bonding layer 21 further comprises two third conductive bonding segments 213, one third conductive bonding segment 213 being located between a second conductive bonding segment 212 and a first conductive bonding segment 211, and the other third conductive bonding segment 213 being located between another second conductive bonding segment 212 and a first conductive bonding segment 211. The lower conductive bonding layer 22 comprises a fourth conductive bonding segment 221 and two fifth conductive bonding segments 222, the fourth conductive bonding segment 221 being located between the two fifth conductive bonding segments 222. Between the conductive output section 111, the fourth conductive bonding section 221 is bonded and fixed between the lower surface 1112 of the conductive output section 111 and the electrode mounting area 341. A fifth conductive bonding section 222 is bonded and fixed between a third conductive bonding section 213 and the electrode mounting area 341 and is electrically connected to the third conductive bonding section 213 and the electrode mounting area 341. Another fifth conductive bonding section 222 is bonded and fixed between another third conductive bonding section 213 and the electrode mounting area 341 and is electrically connected to the third conductive bonding section 213 and the electrode mounting area 341.

[0047] By adding two third conductive bonding segments 213 to the upper conductive bonding layer 21 and two fifth conductive bonding segments 222 to the lower conductive bonding layer 22, the upper conductive bonding layer 21 is also bonded to the lower conductive bonding layer 22 at both ends of the conductive output section 111. This not only makes the upper conductive bonding layer 21 and the lower conductive bonding layer 22 lock the conductive output section 111 more stably, but also allows the current transmitted from the conductive output section 111 to the lower conductive bonding layer 22 to be transmitted through the fifth conductive bonding segment 222 to the third conductive bonding segment 213, and then through the second conductive bonding segment 212 to the electrode mounting area 341. In other words, even if the lower conductive bonding layer 22 peels off from the electrode mounting area 341, the conductive electrode can still transmit the current to the electrode mounting area 341, thereby forming a multi-layer current compensation protection and improving the reliability of the conductive electrode.

[0048] Specifically, the lower conductive bonding layer 22 is a double-sided conductive adhesive strip, which has a lower cost. Optionally, the lower conductive bonding layer 22 is a cured conductive silver paste layer, that is, the lower conductive bonding layer 22 is formed after the conductive silver paste is dried and cured, which has excellent conductivity. Optionally, the lower conductive bonding layer 22 is a cured anisotropic conductive adhesive film layer, that is, the lower conductive bonding layer 22 is formed after the anisotropic conductive adhesive film is hot-pressed and cured, which has good conductivity and good adhesion. In the embodiments of this utility model, in order to ensure reliable connection between the third conductive bonding segment 213 and the fifth conductive bonding segment 222, the bonding length X between the third conductive bonding segment 213 and the fifth conductive bonding segment 222 is preferably greater than or equal to 20mm.

[0049] Among them, combined Figure 3 and Figure 4As shown, in order to increase the bonding length between the conductive output portion 111 and the upper conductive bonding layer 21 and the lower conductive bonding layer 22, both the upper conductive bonding layer 21 and the lower conductive bonding layer 22 extend along the length direction L of the conductive output portion 111; wherein, the length of the lower conductive bonding layer 22 is greater than or equal to the length of the conductive output portion 111, thereby maximizing the bonding length between the lower conductive bonding layer 22 and the conductive output portion 111; the length of the upper conductive bonding layer 21 is greater than the length of the lower conductive bonding layer 22, such that the two ends of the lower conductive bonding layer 22 extend outward relative to the two ends of the lower conductive bonding layer 22 to form two second conductive bonding segments 212 that can be bonded and fixed to the electrode mounting area 341. Furthermore, to further increase the bonding area between the conductive output portion 111 and the upper conductive adhesive layer 21 and the lower conductive adhesive layer 22, thereby improving the peel resistance of the conductive output portion 111, the width of the upper conductive adhesive layer 21 and the width of the lower conductive adhesive layer 22 are both greater than or equal to the width of the conductive output portion 111. The upper surface 1111 of the conductive output portion 111 is covered by the upper conductive adhesive layer 21 in the width direction W, and the lower surface 1112 of the conductive output portion 111 is covered by the lower conductive adhesive layer 22 in the width direction W. In this embodiment, the width of the lower conductive adhesive layer 22 is equal to the width of the upper conductive adhesive layer 21.

[0050] like Figure 6 and Figure 7 As shown in the embodiment of this utility model, the upper surface 1111 of the conductive output part 111 is provided with a plurality of upper grooves 1114 spaced apart, and the conductive bonding structure 2 has a plurality of upper embedded bonding conductive parts (not shown in the figure) embedded in the plurality of upper grooves 1114. By cooperating with the plurality of upper grooves 1114 and the plurality of upper embedded bonding conductive parts, the bonding area and electrical conduction area between the conductive output part 111 and the conductive bonding structure 2 are further increased, thereby further improving the peel resistance and electrical performance stability of the conductive output part 111.

[0051] Specifically, after covering the conductive output section 111 with a protective film and exposing only the preset positions of each upper groove 1114 on the upper surface 1111 of the conductive output section 111, the conductive metal (such as copper) at the preset positions is etched away by an etching solution, thereby forming multiple upper grooves 1114, and finally the protective film is removed.

[0052] In some embodiments of this utility model, during installation, after attaching the upper conductive adhesive layer 21 to the upper surface 1111 of the conductive output part 111 and the electrode mounting area 341, the upper conductive adhesive layer 21 is pressed firmly. This ensures that while the upper conductive adhesive layer 21 is pressed tightly against the electrode mounting area 341, a portion of the adhesive material of the upper conductive adhesive layer 21 is squeezed into each upper groove 1114 to form multiple upper embedded conductive parts. The upper conductive adhesive layer 21 can be attached manually, using tooling pressing, or by automated adhesive application equipment.

[0053] In some other embodiments of this utility model, during installation, conductive silver paste is applied to the upper surface 1111 of the conductive output part 111 and the corresponding part of the electrode mounting area 341, so that a portion of the conductive silver paste can flow into each upper groove 1114. Then, the dimming film is baked and cured, so that the conductive silver paste is dried and cured to form the upper conductive bonding layer 21, and the conductive silver paste in each upper groove 1114 is cured to form the upper embedded bonding conductive part.

[0054] In addition, combined Figure 6 and Figure 8 As shown, to improve the bonding stability and current conduction reliability between the conductive output portion 111 and the lower conductive bonding layer 22, a plurality of lower grooves 1115 are spaced apart on the lower surface 1112 of the conductive output portion 111. The conductive bonding structure 2 has a plurality of lower embedded bonding conductive portions (not shown in the figure) embedded in the plurality of lower grooves 1115. By cooperating with the plurality of lower grooves 1115 and the plurality of lower embedded bonding conductive portions, the bonding area and electrical conduction area between the conductive output portion 111 and the conductive bonding structure 2 are further increased, thereby further improving the peel resistance and electrical performance stability of the conductive output portion 111.

[0055] Specifically, after covering the conductive output section 111 with a protective film and exposing only the preset positions of each of the lower grooves 1115 on the lower surface 1112 of the conductive output section 111, the conductive metal (such as copper) at the preset positions is etched away by an etching solution, thereby forming multiple lower grooves 1115, and finally the protective film is removed.

[0056] In some embodiments of this invention, during installation, upper and lower conductive bonding layers 22 are pre-attached to the lower surface 1112 of the conductive output portion 111 of the flexible circuit board 1; then, the conductive output portion 111 with the lower conductive bonding layer 22 attached is pressed onto the electrode mounting area 341. During the pressing process, the lower conductive bonding layer 22 and the conductive output portion 111 are pressed against each other, causing a portion of the adhesive material of the lower conductive bonding layer 22 to be squeezed into each lower groove 1115 to form multiple upper embedded conductive portions. The conductive output portion 111 and the lower conductive bonding layer 22 can be attached manually, using tooling pressing, or by automated adhesive application equipment. Furthermore, the conductive bonding layer 22 is formed by hot pressing and curing anisotropic conductive adhesive film. Since the lower surface 1112 of the conductive output part 111 has multiple grooves 1115, the anisotropic conductive adhesive film can be squeezed into the multiple grooves 1115 during the hot pressing process, so that the conductive particles inside are fully squeezed and burst, thereby ensuring that the lower conductive bonding layer 22 formed by curing the anisotropic conductive adhesive film can meet the conductivity requirements.

[0057] like Figures 9 to 11 As shown, in order to further increase the bonding area and electrical conduction area between the conductive output part 111 and the conductive bonding structure 2, in the embodiment of this utility model, the conductive output part 111 is provided with a plurality of connecting channels 1116 at intervals. The connecting channels 1116 are arranged through the upper surface 1111 and the lower surface 1112 of the conductive output part 111. The conductive bonding structure 2 has a plurality of connecting and bonding conductive parts 23 embedded in the plurality of connecting channels 1116.

[0058] Specifically, after covering the conductive output section 111 with a protective film and exposing only the preset positions of each connection channel 1116, the conductive metal (such as copper) at the preset positions is completely etched away by an etching solution to form multiple connection channels 1116, and finally the protective film is removed.

[0059] like Figure 11 As shown, in some embodiments of this utility model, the upper conductive bonding layer 21 of the conductive bonding structure 2 can also be connected to the electrode mounting area 341 through multiple connecting conductive parts 23, thereby improving the reliability of the upper conductive bonding layer 21 in pressing and fixing the conductive output part 111 to the electrode mounting area 341. Therefore, even without the lower conductive bonding layer 22, it can ensure that the lower surface 1112 of the conductive output part 111 is tightly bonded to the electrode mounting area 341, thus ensuring the conductive area of ​​the conductive output part 111 directly connected to the electrode mounting area 341.

[0060] In some other embodiments of the present invention, the upper conductive bonding layer 21 of the conductive bonding structure 2 can also be connected to the lower conductive bonding layer 22 through a plurality of connecting bonding conductive parts 23, thereby improving the reliability of the upper conductive bonding layer 21 and the lower conductive bonding layer 22 locking the conductive output part 111.

[0061] The upper groove 1114, lower groove 1115, or connecting channel 1116 may have at least one open end extending to any side surface 1113 of the conductive output part 111. This increases the bonding area and electrical conduction area between the conductive output part 111 and the conductive bonding structure 2, and also facilitates the formation of the upper embedded conductive part, the lower embedded conductive part, or the connecting conductive part 23. In some embodiments, adhesive or conductive silver paste may also be squeezed into the upper groove 1114, lower groove 1115, or connecting channel 1116 from the corresponding open end to form the upper embedded conductive part, the lower embedded conductive part, or the connecting conductive part 23.

[0062] In addition, such as Figure 12 As shown, the flexible circuit board 1 can be provided with multiple mutually insulated intermediate conductive layers 11 and multiple conductive bonding structures 2 to match and be compatible with the partitioned dimming film. That is, the conductive output portions 111 of the multiple intermediate conductive layers 11 are respectively mounted on the multiple electrode mounting areas 341 of the partitioned dimming film through the multiple conductive bonding structures 2. The conductive output portions 111 of the multiple intermediate conductive layers 11 can be the same or different. For example, the conductive output portions 111 in the different embodiments described above can be combined.

[0063] Implementation Method 2

[0064] like Figure 3 As shown, this utility model also provides a dimming film, including a conductive electrode, and the dimming film has an electrode mounting area 341 for mounting the conductive electrode. The conductive electrode in this embodiment has the same specific structure, working principle, and beneficial effects as the conductive electrode in Embodiment 1, and will not be described again here.

[0065] Implementation Method 3

[0066] This invention also provides a dimming glass, including a dimming film. The dimming film in this embodiment has the same specific structure, working principle, and beneficial effects as the dimming film in Embodiment Two, and will not be described again here.

[0067] The above descriptions are merely a few embodiments of this utility model. Those skilled in the art can make various modifications or variations to the embodiments of this utility model based on the content disclosed in the application documents without departing from the spirit and scope of this utility model.

Claims

1. A conductive electrode, characterized in that, include: A flexible circuit board includes a first cover layer, a second cover layer, and an intermediate conductive layer sandwiched between the first cover layer and the second cover layer. The intermediate conductive layer is provided with a conductive input section, a circuit section, and a conductive output section. A conductive bonding structure is provided, wherein the conductive output part is bonded and fixed to the electrode mounting area via the conductive bonding structure; The upper surface of the conductive output portion is electrically connected to the electrode mounting area through the conductive bonding structure, and the lower surface of the conductive output portion is electrically connected to the electrode mounting area through the conductive bonding structure, or the lower surface of the conductive output portion is attached to and electrically connected to the electrode mounting area.

2. The conductive electrode as described in claim 1, characterized in that, The conductive output section also has a side surface connecting its upper and lower surfaces, and the side surface of the conductive output section is electrically connected to the electrode mounting area through the conductive bonding structure.

3. The conductive electrode as described in claim 1, characterized in that, The upper surface of the conductive output portion is provided with a plurality of upper grooves spaced apart, and the conductive bonding structure has a plurality of upper embedded bonding conductive portions embedded in the plurality of upper grooves; and / or The lower surface of the conductive output part is provided with a plurality of lower grooves at intervals, and the conductive bonding structure has a plurality of lower embedded bonding conductive parts embedded in the plurality of lower grooves.

4. The conductive electrode as described in claim 1, characterized in that, The conductive output section is provided with multiple connection channels at intervals. The connection channels are arranged through the upper and lower surfaces of the conductive output section. The conductive bonding structure has multiple connecting and bonding conductive parts embedded in the multiple connection channels.

5. The conductive electrode according to any one of claims 1-4, characterized in that, The conductive bonding structure includes an upper conductive bonding layer, which has a first conductive bonding segment and two second conductive bonding segments. The first conductive bonding segment is located between the two second conductive bonding segments. The first conductive bonding segment is bonded and fixed to the upper surface of the conductive output part and can be electrically connected to the conductive output part. The two second conductive bonding segments are bonded and fixed to the electrode mounting area and can be electrically connected to the electrode mounting area.

6. The conductive electrode as described in claim 5, characterized in that, The upper conductive adhesive layer is a single-sided conductive adhesive strip, with the conductive adhesive layer of the single-sided conductive adhesive strip facing downwards; or the upper conductive adhesive layer is a double-sided conductive adhesive strip; or the upper conductive adhesive layer is a cured conductive silver paste layer.

7. The conductive electrode as described in claim 5, characterized in that, The conductive bonding structure further includes a lower conductive bonding layer, and the lower surface of the conductive output part is electrically connected to the electrode mounting area through the lower conductive bonding layer.

8. The conductive electrode as described in claim 7, characterized in that, The upper conductive bonding layer also has two third conductive bonding segments, which are located between the two second conductive bonding segments and the first conductive bonding segment. The lower conductive bonding layer has a fourth conductive bonding segment and two fifth conductive bonding segments. The third conductive bonding segment is located between the two fourth conductive bonding segments. The fourth conductive bonding segment is bonded and fixed between the lower surface of the conductive output portion and the electrode mounting area. The two fifth conductive bonding segments are bonded and fixed between the two third conductive bonding segments and the electrode mounting area and are electrically connected to the two third conductive bonding segments and the electrode mounting area. The lower conductive bonding layer is a double-sided conductive adhesive strip; or the lower conductive bonding layer is a cured conductive silver paste layer; or the lower conductive bonding layer is a cured anisotropic conductive adhesive film layer.

9. A dimming film, characterized in that, The dimming film includes the conductive electrode according to any one of claims 1-8, and has an electrode mounting area for mounting the conductive electrode.

10. A type of dimming glass, characterized in that, Including the dimming film as described in claim 9.

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