Evaporative end vertical pin fin heat tower heat sink

Abstract

The utility model relates to computer heat dissipation technical field especially is publicize a kind of vertical straight contact type heat tower radiator of evaporation end, including fixed base, fixed buckle, heat pipe, the evaporation end of multiple heat pipe is vertically fixed in fixed base, and the fixed base is fixed on the heat dissipation surface by fixed buckle.Affinity effect lies in: the evaporation end of heat pipe directly contacts CPU surface with vertical mode, and adopts honeycomb matrix type arrangement, breaks the restriction of traditional horizontal layout to heat pipe quantity, and the number of heat pipe that can be accommodated under same area is realized substantial increase, forms a "three-dimensional heat equalizing bucket", effectively reduces thermal resistance, significantly improves heat conduction performance.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation technology, and in particular to a vertical direct-contact heat tower radiator with an evaporating end. Background Technology

[0002] With the significant increase in CPU cores and threads, the heat generated by multi-core high-performance processors has increased dramatically. The heat generated by their continuous high-load operation usually requires the use of powerful liquid cooling radiators for heat dissipation.

[0003] However, all-in-one water cooling radiators have the following significant drawbacks: High cost: The price is much higher than that of traditional air-cooled radiators.

[0004] Risk: There is a potential risk of leakage, which may damage other computer hardware.

[0005] Limited lifespan: Its lifespan is shorter than that of air-cooled radiators.

[0006] While traditional tower air coolers offer advantages such as low cost, no risk of leakage, and long lifespan, their heat dissipation capacity is often insufficient. The evaporator section (the part of the heat pipes in contact with the heat source) of traditional tower air coolers has a horizontal layout design. Limited by the width of the CPU, this allows only about eight 6mm diameter heat pipes to be placed horizontally side-by-side, creating a bottleneck in heat conduction efficiency. Even high-end dual-tower air coolers are limited in their cooling capacity by the number of parallel heat pipes, and are also accompanied by disadvantages such as large size, large footprint, and poor compatibility with cases and memory. Utility Model Content

[0007] This invention provides a vertical direct-contact evaporator-type heat tower radiator to solve the above-mentioned problems.

[0008] The technical solution of this utility model is implemented as follows: A vertical direct-contact heat tower radiator with an evaporating end includes a fixed base, a fixing clip, and heat-conducting pipes. The evaporating ends of multiple heat-conducting pipes are vertically fixed on the fixed base, and the fixed base is fixed in the heat dissipation surface by the fixing clip.

[0009] Furthermore, the evaporation ends of the heat pipes are arranged in parallel and combined together, the evaporation ends of the heat pipes are perpendicular to the end face of the fixed base, the heat dissipation ends of the heat pipes are bent upwards and spread vertically and evenly, and several vertically stacked heat dissipation fins are provided on the outside of the heat dissipation ends of the heat pipes.

[0010] Furthermore, all the heat pipes are divided into multiple groups, and the heat dissipation fins on each group of heat pipes are combined to form a heat dissipation tower. The heat dissipation fins of two adjacent heat dissipation towers are arranged in a parallel staggered manner in the vertical direction.

[0011] Furthermore, the fixing base has a fixing groove formed in the middle that runs through the entire length of the base, and the fixing groove is adapted to the shape of the outer ring of the heat-conducting pipes arranged in parallel.

[0012] Furthermore, the lower surface of the evaporation end of the heat pipe is flush with the lower surface of the fixed base.

[0013] Furthermore, the heat pipe is made of an 8 mm copper tube, and the lower end face of all the heat pipes is welded to the lower end face of the fixed base on the same heat-conducting metal plate. The fixed base can also be made of heat-conducting metal, and the heat-conducting metal plate and the fixed base are formed as one piece.

[0014] Furthermore, the fixing buckle includes a square frame that is slidably installed on the outer wall of the fixing base. An upper stop frame is integrally formed on the upper surface of the square frame, and the upper stop frame abuts against the upper surface of the fixing base. Two fixing plates are symmetrically fixed on the side wall of the square frame, and screw holes are formed on the fixing plates.

[0015] By adopting the above technical solution, the beneficial effects of this utility model are as follows: 1. The evaporation end of the heat pipe is made to directly contact the CPU surface vertically and arranged in a honeycomb matrix. This breaks the limitation of the number of heat pipes in the traditional horizontal layout. The number of heat pipes that can be accommodated in the same area is greatly increased, forming a "three-dimensional heat dissipation tank", which effectively reduces thermal resistance and significantly improves heat conduction performance.

[0016] 2. The heat pipe heat dissipation end adopts a design of multiple independent heat dissipation towers, and the heat dissipation fins are arranged in parallel staggered arrangement in the vertical direction. This design shortens the heat dissipation path and avoids the heated "hot air" from repeatedly flowing through the rear fins, thereby significantly improving heat exchange efficiency and increasing the effective heat dissipation area. The airflow impacting the staggered fin edges will generate a "turbulence effect", breaking the laminar boundary layer and enhancing airflow disturbance, which will greatly improve heat exchange efficiency under the same air pressure. Under the same heat dissipation area, this structure is more compact than the traditional neatly arranged fin group, effectively controlling the overall volume of the heat sink. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is an explosion attempt of this utility model; Figure 2This is a perspective view of the present invention; Figure 3 This is a perspective view of the fixed base of this utility model; Figure 4 This is a three-dimensional view of the fixing buckle of this utility model; Figure 5 This is a three-dimensional view of the heat pipe of this utility model; Figure 6 This is a layout diagram of the evaporator end of the heat pipe of this utility model; Figure 7 This is a cross-sectional view of the heat pipe of this utility model; Figure 8 This is a schematic diagram of the heat dissipation tower structure of this utility model; Figure 9 This is a schematic diagram of the installation of the heat dissipation tower and heat conduction pipe of this utility model.

[0019] The annotations in the attached figures are explained as follows: 1. Fixed base; 11. Fixed groove; 2. Fixed buckle; 21. Square frame; 22. Upper frame; 23. Fixed plate; 24. Screw hole; 3. Heat pipe; 31. Evaporation end; 32. Heat dissipation end; 4. Heat dissipation tower; 5. Heat dissipation fins. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figures 1-9 As shown, a vertical direct-contact heat tower radiator includes several heat pipes 3. The evaporation ends 31 of the heat pipes 3 are arranged in a vertical honeycomb matrix to form a three-dimensional heat dissipation tank. This layout breaks through the bottleneck of traditional horizontal arrangement limited by CPU width, allowing more heat pipes to be accommodated in the same base area, significantly improving heat conduction efficiency and heat dissipation density. The heat dissipation ends 32 are curved upwards and vertically and uniformly extended to form a multi-tower condensation structure, further improving the heat dissipation area and airflow organization efficiency. The heat pipes 3 are divided into three groups, with a heat dissipation tower 4 nested and fixed on each group of heat pipes 3. This multi-tower design allows for flexible adjustment of the layout of the heat pipes 3 and the number of towers according to actual heat dissipation needs, enhancing system adaptability. Figures 8-9As shown, the heat dissipation tower 4 is formed by vertically stacking multiple heat dissipation fins 5. The heat dissipation fins 5 and the heat pipes 3 are reliably connected through fin-through or reflow soldering processes to ensure structural stability and heat conduction performance. The heat dissipation fins 5 of two adjacent heat dissipation towers 4 are arranged in a parallel staggered manner in the vertical direction. This arrangement can effectively reduce heat reuse, optimize airflow path, and enhance turbulence effect, thereby increasing the effective heat dissipation area and heat exchange efficiency. The lower end of the heat pipes 3 is provided with a fixing base 1 that fixes the evaporation ends 31 of all the heat pipes 3 together. The base is made of high thermal conductivity metal. The heat pipes 3 are vertically and directly in contact with the heat source through welding and milling process to maximize heat conduction performance. The fixing base 1 is fixed with a fixing buckle 2 to limit the position of the fixing base 1. The fixing buckle 2 is fixed to the heat dissipation surface with screws. The fixing buckle 2 is installed with the fixing base 1 through a concave-convex surface structure, which improves the installation stability and vibration resistance.

[0022] As another preferred embodiment of the present invention, such as Figures 5-7 As shown, heat pipe 3 is made of 16 eight-millimeter copper tubes, divided into three groups: four tubes in the middle group and two symmetrical groups on both sides, with six tubes in each group. Compared with traditional 6mm heat pipes, it has a stronger unit heat capacity and conductivity, further improving heat dissipation performance. The lower end face of all heat pipes 3 is welded to the lower end face of the fixed base 1 on the same heat-conducting metal plate. The overall welding and milling process ensures that the bottom surface of the evaporation end is flat, achieving full contact with the CPU surface and reducing contact thermal resistance.

[0023] As another preferred embodiment of the present invention, such as Figure 3 As shown, the fixed base 1 has a fixed groove 11 that runs through the middle. The fixed groove 11 is adapted to the outer ring shape of the honeycomb matrix arrangement of the heat pipe 3. This structural design facilitates the precise positioning and fixing of the heat pipe 3, improves the assembly accuracy and heat conduction consistency, and the heat pipe 3 is welded to the fixed base 1 as a whole.

[0024] As another preferred embodiment of the present invention, such as Figure 4 As shown, the fixing buckle 2 includes a square frame 21 that is slidably installed on the outer wall of the fixing base 1. An upper frame 22 is integrally formed on the upper surface of the square frame 21. The upper frame 22 abuts against the upper surface of the fixing base 1. This structure can restrict the vertical movement of the fixing base 1 and enhance the overall structural rigidity. Two fixing plates 23 are symmetrically fixed on the side wall of the square frame 21. Screw holes 24 are formed on the fixing plates 23. The fixing plates are fixed to the motherboard by screws to achieve stable installation of the heat sink and prevent poor contact due to vibration or tilt.

[0025] The working principle of this invention is as follows: In use, the device is installed on the CPU socket of the computer motherboard using screws. The end face of the fixing base 1 contacts the CPU. The heat generated by the CPU is transferred to the heat sink 4 through heat conduction and dissipated into the air. The heat is then carried away by the airflow blowing through the heat sink 4, thus achieving heat dissipation. This heat sink is particularly suitable for high-power multi-core processors. While maintaining the advantages of air-cooled heat sinks, such as no leakage risk and long lifespan, it provides heat dissipation capabilities close to those of water-cooled heat sinks, offering high cost-effectiveness and high reliability.

[0026] Heat pipe manufacturing process: First, the lower part of the evaporation end 31 of the heat pipe 3 is welded (or sintered) with a metal sheet of a certain thickness to form a flat bottom of a certain thickness. Then, copper powder is filled into a mold to sinter a capillary structure, ensuring that the bottom of the evaporation end of the heat pipe also has a sintered capillary structure. This maximizes the heat conduction performance of the heat pipe. Then, it is mechanically bent into the corresponding dimensions. The stamped heat dissipation fins 5 are fixed to the heat dissipation end 32 of the heat pipe 3 using a traditional and reliable through-fin or reflow soldering process.

[0027] The independent 3-tower heatsink design (more heatsinks can be designed depending on the number of heat pipes) effectively increases the heat dissipation area and improves heat dissipation efficiency. However, increasing the heat dissipation area increases the unit volume of the heatsink and can also lead to heat reuse, reducing the effective heat dissipation area. Installing a cooling fan on one side of the heatsink can accelerate heat dissipation.

[0028] To increase the effective heat dissipation area and reduce the unit volume, the heat dissipation fins 5 between the independent heat dissipation towers 4 are arranged in a horizontally staggered manner. While increasing the heat dissipation fin area, this arrangement can effectively reduce the unit volume. This horizontally staggered arrangement also brings the following advantages: Reducing heat reuse: In the first half of the heatsink fins, the air blown in by the fan is close to ambient temperature. The large temperature difference between the cool air and the hot fins results in the highest heat exchange efficiency, removing a significant amount of heat. In the second half, the air has been continuously heated as it flows past the first half, greatly reducing the temperature difference between the hot air and the fins. This results in the lowest heat exchange efficiency and the least amount of heat removed. The horizontally staggered arrangement increases the heat dissipation area while shortening the heat dissipation path, thus reducing heat reuse.

[0029] Increase effective heat dissipation area: The heat dissipation fins are arranged in a horizontally staggered manner. In the air intake section, the airflow blown in from between the fins exchanges heat with the high-temperature fins through the laminar flow layer on the surface of the front fins. At this time, the airflow in the middle layer is still close to the ambient temperature. The horizontally staggered fins can also have the most efficient heat exchange with the airflow that is close to the ambient temperature.

[0030] Optimized airflow path: The airflow impacts the edges of the horizontally staggered heat dissipation fins 5 to generate a "turbulence effect" to avoid the formation of a laminar boundary layer. Optimized airflow path enhances airflow disturbance and improves heat exchange efficiency, providing better thermal resistance performance under the same air pressure, and achieving lower thermal resistance and higher heat dissipation capacity.

[0031] Components not described in detail in this article are existing technologies.

[0032] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A vertical direct-contact evaporator-end heat tower radiator, comprising a fixed base (1), a fixed buckle (2), and a heat-conducting pipe (3), characterized in that: The evaporation ends (31) of the multiple heat pipes (3) are vertically fixed in the fixed base (1), and the fixed base (1) is fixed to the heat dissipation surface by a fixing buckle (2).

2. The evaporator-end vertical direct-contact heat tower radiator according to claim 1, characterized in that: The evaporation ends (31) of the heat pipe (3) are arranged in parallel and combined together. The evaporation ends (31) of the heat pipe (3) are perpendicular to the end face of the fixed base (1). The heat dissipation ends (32) of the heat pipe (3) are bent upward and vertically and evenly spread out. Several vertically stacked heat dissipation fins (5) are provided on the outside of the heat dissipation ends (32) of the heat pipe (3).

3. The evaporator-end vertical direct-contact heat tower radiator according to claim 2, characterized in that: All the heat pipes (3) are divided into multiple groups, and the heat dissipation fins on each group of heat pipes (3) are combined to form a heat dissipation tower (4). The heat dissipation fins (5) of two adjacent heat dissipation towers (4) are arranged in a parallel staggered manner in the vertical direction.

4. A vertical direct-contact evaporator-end heat tower radiator according to claim 2, characterized in that: The fixed base (1) has a fixed groove (11) formed in the middle that runs through the top and bottom. The fixed groove (11) is adapted to the shape of the outer ring of the heat pipe (3) arranged in parallel.

5. A vertical direct-contact evaporator-end heat tower radiator according to claim 4, characterized in that: The lower surface of the evaporation end (31) of the heat pipe (3) is flush with the lower surface of the fixed base (1).

6. A vertical direct-contact evaporator-end heat tower radiator according to claim 5, characterized in that: The lower end face of the heat pipe (3) is welded to the lower end face of the fixed base (1) on the same heat-conducting metal plate.

7. A vertical direct-contact evaporator-end heat tower radiator according to any one of claims 1-6, characterized in that: The fixing buckle (2) includes a square frame (21) that is slidably installed on the outer wall of the fixing base (1). An upper frame (22) is integrally formed on the upper surface of the square frame (21). The upper frame (22) abuts against the upper surface of the fixing base (1). Two fixing plates (23) are symmetrically fixed on the side wall of the square frame (21). Screw holes (24) are formed on the fixing plates (23).

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