A heat dissipation device for a circuit board

Abstract

The utility model discloses a heat abstractor of circuit board. Heat abstractor of circuit board, include: heat abstractor and install the air -cooled group of heat abstractor, heat abstractor includes the heat conduction sheet, the heat conduction sheet is attached in electronic component side wall, and the heat conduction sheet outer wall installs several leaf fin, the air -cooled group includes the fan, and the fan is installed on the heat conduction sheet upper end through the connecting component, the fan drives the leaf fin periphery air flow, the heat conduction sheet and leaf fin constitute the heat abstractor unit, and multiple heat abstractor units are attached on electronic component side wall, and the elastic connection between each heat abstractor unit is equipped with the spring between two adjacent heat abstractor units, and one section of spring is fixed on the leaf fin, and the other end of spring is fixed on the leaf fin of another heat abstractor unit. The utility model provides heat abstractor of circuit board realizes the effect of heat dissipation from electronic component side surface through setting heat abstractor, and compared with the heat dissipation mode from the upper surface, and the heat dissipation efficiency of higher electronic component for the height is higher.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a heat dissipation device for circuit boards. Background Technology

[0002] Circuit board heat dissipation is a key technology for ensuring the stable operation of electronic equipment. It is achieved through various methods, including adding heat sinks or heat pipes to a few high-heat-generating components, using fan-equipped heat sinks to enhance heat dissipation when necessary, and customizing large heat dissipation devices in conjunction with thermal phase-change thermal pads for a large number of high-heat-generating components. Utilizing the PCB board itself for heat dissipation, such as increasing copper foil area and using high thermal conductivity materials, is also effective. Proper trace design, such as increasing copper foil surplus and using thermal vias, can improve the equivalent thermal conductivity. Natural convection and forced convection cooling can also be employed; the former relies on natural airflow, while the latter uses fans to increase airflow. Liquid cooling and heat pipe technology are also used for cooling high-performance equipment. Simultaneously, adhering to design principles, such as arranging components according to heat generation zones, avoiding hotspot concentration, rationally planning airflow paths, properly placing sensitive components, and reducing thermal resistance, is crucial. The comprehensive application of these methods and principles can effectively improve the heat dissipation performance of circuit boards, ensuring reliable operation of electronic equipment within safe temperatures.

[0003] The prior art provides a heat dissipation device for a circuit board, which includes a heat sink plate connected to the circuit board. The heat sink plate includes a heat sink body with connection holes at each of its four corners. Parallel heat sink fins are vertically arranged on the surface of the heat sink body. A mounting plane is formed by removing a portion of the heat sink fins from the middle of the heat sink body, which is on the same plane as the heat sink fins. A fan is mounted on the mounting plane. This invention designs a heat dissipation device suitable for video processing circuit boards, which has the advantages of simple structure and good heat dissipation effect. Furthermore, the heat sink plate is floatingly connected to the connecting assembly, making it suitable for the heat dissipation needs of chips of different heights, thus having better applicability.

[0004] The heat dissipation part of the above device is attached to the upper surface of the electronic component. For components with a larger height, the side area is larger than the top area, so the heat dissipation efficiency of the side is higher.

[0005] Therefore, it is necessary to provide a heat dissipation device for a circuit board to solve the above-mentioned technical problems. Utility Model Content

[0006] In view of the above situation and to overcome the defects of the prior art, this utility model provides a heat dissipation device for circuit boards that can dissipate heat from the side of electronic components, thereby obtaining a better heat dissipation effect.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0008] The heat dissipation device for the circuit board includes: a heat sink and an air-cooling unit mounted on the heat sink;

[0009] The heat sink includes a heat-conducting sheet, which is attached to the side wall of the electronic component, and several blades are installed on the outer wall of the heat-conducting sheet.

[0010] The air-cooled unit includes a fan, which is mounted on the upper end of the heat-conducting plate via a connecting assembly;

[0011] The fan drives the airflow around the blades.

[0012] Preferably, the heat-conducting sheet and the blades form a heat dissipation unit, and multiple heat dissipation units are attached to the sidewall of the electronic component, with each heat dissipation unit being elastically connected to the others.

[0013] Preferably, a spring is provided between two adjacent heat dissipation units, one end of which is fixed to the blade, and the other end of which is fixed to the blade of another heat dissipation unit.

[0014] Preferably, both the heat-conducting sheet and the blades are made of aluminum. The heat-conducting sheet is arc-shaped, and the blades are radially fixed on the outer wall of the heat-conducting sheet.

[0015] Preferably, the connecting assembly includes a connecting plate mounted on the lower end of the fan, and a fixing plate is mounted on the connecting plate, the fixing plate being detachably connected to the heat sink.

[0016] Preferably, the fixing plate is provided with a fixing groove that matches the blade, and the blade can be fitted into the fixing groove.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] (1) This utility model achieves the effect of heat dissipation from the side of electronic components by setting heat dissipation blocks. Compared with the existing heat dissipation method from the top surface, it has a higher heat dissipation efficiency for electronic components with greater height.

[0019] (2) The spring connection of this utility model allows radial displacement between the heat conduction units, so that the heat sink can be installed on electronic components of different specifications;

[0020] (3) The heat-conducting sheet and blades of this utility model are made of aluminum. Aluminum has good thermal conductivity and its specific gravity is relatively small compared to other metals. It is soft and has good machinability. Attached Figure Description

[0021] Figure 1 A schematic diagram of the heat dissipation device for the circuit board provided by this utility model;

[0022] Figure 2A schematic diagram of the heat dissipation device heat sink block for the circuit board provided by this utility model;

[0023] Figure 3 A schematic diagram of the air-cooled heat dissipation device for the circuit board provided by this utility model.

[0024] The corresponding names of the reference numerals in the attached drawings are: 10, heat sink; 11, heat conduction plate; 12, blade; 13, spring; 20, air-cooled assembly; 21, fan; 22, connecting plate; 23, fixing plate; 231, fixing groove. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of the present invention include, but are not limited to, the following embodiments.

[0026] During operation, circuit boards generate heat due to the presence of high-power electronic components or the high current of the circuit board itself. Since the circuit board and its electronic components have resistance, heat is generated when the circuit board is powered on. If this heat cannot be dissipated in time, it accumulates, causing the circuit board to overheat and eventually leading to the loss of function of electronic components or the complete burnout of the circuit board. Therefore, heat dissipation can be addressed by targeting the circuit board itself, such as by creating heat-conducting holes, or by targeting the electronic components on the circuit board. The inventors discovered that most existing heat dissipation methods involve directly attaching thermally conductive materials to the upper surface of the electronic components. However, for some components with greater height, their side surface area is larger than their top surface area. Therefore, heat dissipation from the side is more effective than from the top surface for such electronic components.

[0027] First embodiment:

[0028] like Figure 1 As shown, the heat dissipation device for the circuit board provided by this utility model includes: a heat sink 10 and an air cooling group 20 mounted on the heat sink 10. The function of the heat sink 10 is to transfer heat to the electronic components and conduct the heat to itself. The air cooling group 20 blows the heat on the heat sink 10 into the air.

[0029] Specifically, such as Figure 2 As shown, the heat sink 10 includes a heat-conducting plate 11, which is arc-shaped. Multiple blades 12 are vertically and equidistantly distributed around the heat-conducting plate 11, pointing towards the center of the arc. The height of the blades 12 is the same as the height of the heat-conducting plate 11. One heat-conducting plate 11 and the multiple blades 12 fixedly installed around it constitute a heat dissipation unit. Figure 2 The diagram shows four heat dissipation units. The inner wall of the heat-conducting plate 11 is attached to the side wall of the electronic component. Furthermore, adjacent heat-conducting units are connected by springs 13. Figure 2As shown, one end of the spring 13 is fixed to the blade 12 of a heat-conducting plate 11, and the other end of the spring 13 is fixed to the blade 12 of an adjacent heat-conducting plate 11. Through the connection of the spring 13, the radius of the virtual circle formed by the heat-conducting unit can be changed, so it can be installed on electronic components of different specifications.

[0030] On the other hand, the air-cooled assembly 20 includes a fan 21, which refers to a heat dissipation fan in the prior art, which can drive airflow perpendicular to its surface. The lower end of the fan 21 is attached to a fixed connecting plate 22. The connecting plate 22 is rectangular and runs through the top and bottom. A fixing plate 23 is horizontally attached to its inner wall. The fixing plate 23 has a through hole in the middle. A fixing groove 231 corresponding to the position and size of the blade 12 is opened around the through hole. The length of the fixing groove 231 is greater than the length of the blade 12 to accommodate the change in the position of the heat conduction unit.

[0031] In use, first, the heat sink 10 is placed around the electronic component. Then, the air-cooled assembly 20 is installed on the upper end of the heat sink 10. The fixing groove 231 on the fixing plate 23 is aligned with the blade 12 on the heat-conducting plate 11. The assembly is fitted into the fixing groove 231 from top to bottom. The friction between the fixing groove 231 and the blade 12 or the two are connected and fixed by using thermally conductive adhesive. In this way, the air-cooled assembly 20 is fixed on the heat sink 10. When the electronic component generates heat, the heat-conducting plate 11, which is in contact with the side wall of the motor component, transfers the heat to the blade 12. The heat in the blade 12, which has a large surface area, is carried away by the airflow generated by the fan 21, thereby maintaining the normal heat dissipation of the electronic component.

[0032] By setting up heat sink 10, heat dissipation is achieved from the side of the electronic component. Compared with the existing heat dissipation method from the top surface, the heat dissipation efficiency is higher for electronic components with greater height.

[0033] The spring 13 connects each heat-conducting unit, allowing radial displacement between the heat-conducting units, thereby enabling the heat sink 10 to be installed on electronic components of different specifications.

[0034] Second embodiment:

[0035] Both the heat-conducting plate 11 and the blade 12 are made of aluminum. Aluminum has good thermal conductivity and a relatively low specific gravity compared to other metals. It is also soft and has good machinability.

[0036] Working principle: The heat sink 10 is placed around the electronic component, and the air-cooling assembly 20 is installed on the upper end of the heat sink 10. The fixing groove 231 on the fixing plate 23 corresponds to the position of the blade 12 on the heat-conducting plate 11. The air-cooling assembly 20 is fitted into the fixing groove 231 from top to bottom. The friction between the fixing groove 231 and the blade 12 or the two are connected and fixed by using thermally conductive adhesive. In this way, the air-cooling assembly 20 is fixed on the heat sink 10. When the electronic component generates heat, the heat-conducting plate 11, which is in contact with the side wall of the motor component, transfers the heat to the blade 12. The heat in the blade 12 with a large surface area is carried away by the airflow generated by the fan 21, thereby maintaining the normal heat dissipation of the electronic component.

[0037] The above embodiments are merely one of the preferred embodiments of this utility model and should not be used to limit the scope of protection of this utility model. Any modifications or refinements made to the main design concept and spirit of this utility model that are not of substantial significance, but solve the same technical problem as this utility model, should be included within the scope of protection of this utility model.

Claims

1. A heat dissipation device for a circuit board, characterized in that, include: Heat sink (10) and air cooling unit (20) mounted on heat sink (10); The heat sink (10) includes a heat-conducting sheet (11), which is attached to the side wall of the electronic component, and a number of blades (12) are installed on the outer wall of the heat-conducting sheet (11). The air-cooled assembly (20) includes a fan (21), which is mounted on the upper end of the heat-conducting plate (11) via a connecting assembly; The fan (21) drives the airflow around the blades (12).

2. The heat dissipation device for the circuit board according to claim 1, characterized in that, The heat-conducting sheet (11) and the blade (12) form a heat dissipation unit. Multiple heat dissipation units are attached to the side wall of the electronic component and are elastically connected to each other.

3. The heat dissipation device for the circuit board according to claim 2, characterized in that, A spring (13) is provided between two adjacent heat dissipation units. One end of the spring (13) is fixed on the blade (12), and the other end of the spring (13) is fixed on the blade (12) of another heat dissipation unit.

4. The heat dissipation device for the circuit board according to claim 3, characterized in that, The heat-conducting plate (11) and the blade (12) are both made of aluminum. The heat-conducting plate (11) is arc-shaped, and the blade (12) is radially fixed on the outer wall of the heat-conducting plate (11).

5. The heat dissipation device for the circuit board according to claim 1 or 4, characterized in that, The connection assembly includes a connection plate (22) mounted on the lower end of the fan (21), on which a fixing plate (23) is mounted, and the fixing plate (23) is detachably connected to the heat sink (10).

6. The heat dissipation device for the circuit board according to claim 5, characterized in that, The fixing plate (23) is provided with a fixing groove (231) that is compatible with the blade (12), and the blade (12) can be fitted into the fixing groove (231).

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