Circular surface emitting LED package structure

Abstract

The utility model belongs to LED technical field relates to a circular surface luminous LED packaging structure, including the substrate, and the bowl cup that is moulded in the upper of substrate is used for the bowl cup of the side surface luminous of LED wafer on the substrate is shielded, wherein, the thickness of substrate is D, the thickness of bowl cup is d, and satisfy following relation formula: 0.25 < d / D < 2. The utility model discloses through the design of the bowl cup of not light -proof, can form the cup -shaped structure of the shielding effect in the four around of LED wafer, so monochromatic wafer luminous or mixed color luminous all can present the luminous surface effect of positive surface cup mouth circular shape, simultaneously, still can promote luminous effect, make LED luminous brightness keep at higher level to better reach energy -conserving effect, in addition, its size length -width -thickness can be consistent with the existing product, so terminal use also does not need to make design modification and can replace use, the practicality is better, the compatibility is better, the effect is better.

Description

Technical Field

[0001] This utility model belongs to the field of LED technology, specifically relating to a circular surface-emitting LED packaging structure. Background Technology

[0002] Currently, LED products on the market, such as 1010 and 0808RGB LED beads, are all designed with a CHIP full-coverage encapsulation solution. Since the LED beads are unobstructed on all sides, the sides and top are all light-emitting surfaces, resulting in a less than ideal overall light-emitting effect for the module. At the same time, many applications require LEDs that emit light from only one side, with strict requirements on the height, width, and shape of the emitted light spot. It is difficult for a five-sided LED to achieve a perfect light pattern. Therefore, it is very difficult to require an LED to emit light only from the front surface and not from the sides. Current technical solutions cannot adjust the light-emitting surface to be a circular light-emitting surface on the front. Utility Model Content

[0003] The purpose of this invention is to address the defects and shortcomings in the existing technology. It is designed to achieve both positive surface light emission and improved light emission, thereby maintaining the LED brightness at a high level.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: a circular surface-emitting LED packaging structure, including a substrate and a cup molded on the substrate for blocking the side-emitting light of the LED chip on the substrate, wherein the thickness of the substrate is D, the thickness of the cup is d, and the following relationship is satisfied: 0.25<d / D<2.

[0005] Preferably, the substrate is made of BT, FR4 or CEM-3.

[0006] Preferably, the bowl / cup is made of black, opaque material, and the rim of the bowl / cup is round.

[0007] Preferably, the thickness of the substrate is 0.05-0.2 mm, and the thickness of the bowl / cup is 0.05-0.1 mm.

[0008] Preferably, the upper surface of the substrate has multiple pads corresponding to the bottom of the bowl / cup, which are arranged to correspond to the LED chips.

[0009] Preferably, the LED chip is connected to the pads via die bond adhesive, which is either solder paste or conductive adhesive.

[0010] Preferably, the LED chip includes a red R chip, a green G chip, and a blue B chip.

[0011] Preferably, the LED chip is installed using either a right-side-mounted or flip-mounted method.

[0012] Preferably, the bowl is filled with an encapsulating colloid that encapsulates the LED chip, and the thickness of the encapsulating colloid is consistent with the thickness of the bowl.

[0013] Preferably, the encapsulating colloid is epoxy resin or silicone resin, and the encapsulating colloid is a transparent colloid, a mist colloid, or a fluorescent colloid.

[0014] After adopting the above technical solution, the circular surface-emitting LED packaging structure provided by this utility model has the following beneficial effects:

[0015] This invention utilizes an opaque cup design to create a cup-shaped structure around the LED chip, providing a shielding effect. This ensures that whether the chip emits monochromatic or mixed-color light, the light-emitting surface will have a circular cup-shaped luminous surface. Simultaneously, it enhances the luminous effect, maintaining a high level of LED brightness for better energy savings. Furthermore, its dimensions (length, width, and thickness) can be identical to existing products, allowing for easy replacement without design modifications in end-user applications. This results in superior practicality, compatibility, and performance. Attached Figure Description

[0016] Figure 1 This is a side view of a circular surface-emitting LED packaging structure according to the present invention;

[0017] Figure 2 This is a top view of a circular surface-emitting LED packaging structure according to the present invention.

[0018] The components are: substrate 1, LED chip 2, cup 3, solder pad 4, die bond adhesive 5, and encapsulating colloid 6. Detailed Implementation

[0019] The present invention will now be described in further clear and complete detail with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0020] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0021] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0022] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0023] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0024] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0025] This utility model discloses a circular surface-emitting LED packaging structure, such as... Figure 1-2 As shown, the device includes a substrate 1 and a cup 3 molded on top of the substrate 1 to block the side light emission of the LED chip 2 on the substrate 1. The substrate 1 is made of BT, FR4 or CEM-3, and the cup 3 is made of black opaque material. The cup 3 has a circular opening. The thickness of the substrate 1 is D, and the thickness of the cup 3 is d, which satisfies the following relationship: 0.25 < d / D < 2. Specifically, the thickness of the substrate 1 is 0.05-0.2 mm, and the thickness of the cup 3 is 0.05-0.1 mm.

[0026] In a preferred embodiment of this utility model, the upper surface of the substrate 1 has a plurality of pads 4 corresponding to the bottom of the cup 3, which are arranged to correspond to the LED chip 2. The LED chip 2 is connected to the pads 4 by die bond 5. The die bond 5 is selected as solder paste or conductive adhesive. Further, the LED chip 2 includes a red R chip, a green G chip, and a blue B chip. The LED chip 2 is mounted in a right-side-up or flip-top manner. The cup 3 is filled with an encapsulating colloid 6 that encapsulates the LED chip 2. The thickness of the encapsulating colloid 6 is consistent with the thickness of the cup 3. Specifically, the encapsulating colloid 6 is selected as epoxy or silicone, and the encapsulating colloid 6 is a transparent colloid, a mist colloid, or a fluorescent colloid.

[0027] The manufacturing process of the circular surface-emitting LED packaging structure of this utility model is as follows:

[0028] S1. Design the circuit layout on the upper surface of the substrate;

[0029] S2. Use a mold to mold black bowls and cups onto a substrate;

[0030] S3. Adhere the LED chip onto the substrate using conductive adhesive;

[0031] S4. Fix the LED light-emitting chip onto the substrate through a reflow soldering flip-chip process or baking process;

[0032] S5. Fill the top and surrounding area of ​​the LED chip with encapsulating colloid through injection molding or molding processes;

[0033] S6. Cut the entire PCB product into individual LED units using a cutting process;

[0034] S7. Test, sort, and package the products.

[0035] In summary, the circular surface-emitting LED packaging structure provided by this utility model, through the design of an opaque cup, forms a cup-shaped structure around the LED chip, thus creating a shielding effect. This ensures that whether the chip emits single-color or mixed-color light, the light-emitting surface will exhibit a circular cup-shaped emitting surface. Simultaneously, it enhances the luminous effect, maintaining the LED's brightness at a high level, thereby achieving better energy savings. Furthermore, its dimensions (length, width, and thickness) can be consistent with existing products, allowing for easy replacement by end-users without design modifications. It offers superior practicality, compatibility, and performance, possessing significant market value and deserving widespread application.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A circular surface-emitting LED packaging structure, characterized in that: It includes a substrate (1) and a bowl (3) molded on the substrate (1) for blocking the side light emission of the LED chip (2) on the substrate (1), wherein the thickness of the substrate (1) is D, the thickness of the bowl (3) is d, and the following relationship is satisfied: 0.25 < d / D < 2.

2. The circular surface-emitting LED packaging structure according to claim 1, characterized in that: The substrate (1) is made of BT, FR4 or CEM-3.

3. The circular surface-emitting LED packaging structure according to claim 1, characterized in that: The bowl (3) is made of black opaque material, and the rim of the bowl (3) is designed in a round shape.

4. The circular surface-emitting LED packaging structure according to claim 1, characterized in that: The thickness of the substrate (1) is 0.05-0.2 mm, and the thickness of the bowl (3) is 0.05-0.1 mm.

5. The circular surface-emitting LED packaging structure according to claim 1, characterized in that: The upper surface of the substrate (1) has multiple pads (4) corresponding to the bottom of the bowl (3) and arranged in relation to the LED chip (2).

6. The circular surface-emitting LED packaging structure according to claim 1, characterized in that: The LED chip (2) is connected to the pad (4) through die bond adhesive (5), which can be solder paste or conductive adhesive.

7. The circular surface-emitting LED packaging structure according to claim 1, characterized in that: The LED chip (2) includes a red R chip, a green G chip, and a blue B chip.

8. The circular surface-emitting LED packaging structure according to claim 1, characterized in that: The LED chip (2) is installed either upright or flip-flop.

9. A circular surface-emitting LED packaging structure according to claim 1, characterized in that: The bowl (3) is filled with an encapsulating colloid (6) that encapsulates the LED chip (2), and the thickness of the encapsulating colloid (6) is consistent with the thickness of the bowl (3).

10. A circular surface-emitting LED packaging structure according to claim 9, characterized in that: The encapsulating colloid (6) is selected from epoxy resin or silicone, and the encapsulating colloid (6) is a transparent colloid, a mist colloid, or a fluorescent colloid.

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