An integrated frame and power module

Abstract

The application discloses an integrated frame and a power module, comprising support beams, the support beams are multiple, and the multiple support beams are connected to each other to form a plane frame, the plane frame surrounds a placement space for accommodating multiple chips; a connecting part is connected to the support beam, and the connecting part extends into the placement space along a first direction, and the connecting part is used for connecting at least one chip; a connecting terminal has one end arranged on the support beam, and the other end of the connecting terminal is used for electrically connecting with an external element. The integrated frame of the application can reduce the overall volume of the power module, can reduce the actual use area of the substrate, and can effectively reduce the impedance loss and parasitic interference in the signal transmission process.

Description

Technical Field

[0001] This application relates to the field of power module technology, and in particular to an integrated frame and power module. Background Technology

[0002] As the new energy vehicle industry rapidly develops towards higher range, higher power density, and higher safety, automotive power modules, as core components of the electric drive system and on-board power system of new energy vehicles, directly determine the power efficiency, reliability, and manufacturing cost of the entire vehicle. The industry's requirements for automotive power modules in terms of integration, electrical performance, miniaturization, and cost control are becoming increasingly stringent.

[0003] In the current automotive power module packaging field, the industry generally adopts a method of connecting a single chip to external circuits within the same package using copper sheet connections or wire bonding to complete signal and energy transmission functions in scenarios such as electric drive and energy conversion. However, this traditional chip connection method requires a significant increase in substrate area to avoid interference between different chip connection lines and meet the requirements for conduction reliability, which limits the integration density and makes it difficult to match the high power density requirements. Utility Model Content

[0004] This application discloses an integrated frame and power module, which can reduce the overall size of the power module, reduce the actual usable area of ​​the substrate, and effectively reduce impedance loss and parasitic interference during signal transmission.

[0005] To achieve the above objectives, this application discloses an integrated frame for connecting multiple chips, including:

[0006] Support beams, wherein there are multiple support beams and the multiple support beams are interconnected to form a planar frame, the planar frame enclosing a placement space for accommodating multiple chips;

[0007] A connecting portion is connected to the support beam and extends into the placement space along a first direction; the connecting portion is used to connect at least one of the chips.

[0008] A connecting terminal is provided, one end of which is located on the support beam, and the other end of which is used for electrical connection with an external component.

[0009] In one possible implementation, the connection includes a fixed section and a connecting section connected to each other, the fixed section being fixed to the support beam, and the connecting section being used for electrical connection with the chip. Along a second direction, the width of the fixed section is greater than the width of the connecting section, and the second direction is perpendicular to the first direction.

[0010] In one possible implementation, the connecting segment is a bent structure, forming a protruding structure bent towards a third direction, which is perpendicular to both the first and second directions, and the protruding structure is used to connect to the chip.

[0011] In one possible implementation, the connection terminal includes a first connection terminal and a second connection terminal;

[0012] The first connecting terminal extends along the first direction, one end of the first connecting terminal extends into the placement space, and the other end of the first connecting terminal extends away from the placement space.

[0013] The second connection terminal extends along the third direction and is electrically connected to the fixed segment.

[0014] In one possible implementation, the integral frame is a sheet metal part, and both the connecting portion and the second connecting terminal are formed by bending relative to the support beam.

[0015] This application also discloses a power module, including:

[0016] A substrate having a component mounting surface;

[0017] Multiple chips are disposed on the component mounting surface and electrically connected to the substrate;

[0018] An integrated frame, wherein the integrated frame is any one of the integrated frames described above, the support beam of the integrated frame is fixedly connected to the component mounting surface, and the connecting part of the integrated frame is located above the chip and electrically connected to the chip.

[0019] A plastic-sealed shell, which is plastic-sealed onto the integral frame.

[0020] In one possible implementation, the plurality of chips include a first chip and a second chip spaced apart along a first direction, and the connecting portion of the integrated frame includes a first connecting portion that extends along the first direction and is electrically connected to the first chip and the second chip, respectively.

[0021] In one possible implementation, the plurality of chips includes a third chip, which is arranged at intervals from the first chip and the second chip along a second direction perpendicular to the first direction. The connection portion includes a plurality of second connection portions, which are parallel to each other and extend along the first direction. The plurality of second connection portions are disposed on the third chip and are all electrically connected to the third chip.

[0022] In one possible implementation, a plurality of the chips are soldered to the component mounting surface, the support beam is soldered to the component mounting surface and located at the edge of the substrate, and the connection is soldered above the chips.

[0023] In one possible implementation, the power module includes a plurality of the integrated frames connected in sequence, and the plastic encapsulation shell is encapsulated on the outer periphery of the plurality of integrated frames.

[0024] Compared with the prior art, the beneficial effects of this application are as follows:

[0025] The integrated frame and power module provided in this application include multiple interconnected support beams forming a planar frame, with the interior of the frame enclosing a mounting space. The support beams provide stable structural support for the entire frame, ensuring that the frame is not easily deformed during subsequent chip connection, guaranteeing packaging reliability. The planar frame defines the mounting range of multiple chips and provides a fixed foundation for the connection parts and connection terminals. The connection parts are connected to the support beams and extend into the mounting space along a first direction. The connection parts extend directionally from the edge of the frame towards the internal chip area, forming a connection channel for the chips within the mounting space. The connection terminals serve as electrical interface structures with external components. One end is electrically connected to the support beam (or indirectly to the connection part through the support beam), while the other end is used to connect to external components (such as circuit boards, power supplies, wiring harnesses, heat sinks, etc.).

[0026] Therefore, this application utilizes a mounting space enclosed by a support beam and a connecting portion extending from the support beam into the mounting space. This allows multiple chips to be accommodated and connected within the same package. The connecting portion extends directly to the chip mounting location, eliminating the need for long external wiring. This enables multiple chips to be tightly integrated within the frame, significantly reducing the overall module size. Furthermore, the integrated frame design, through the integration of the support beam and the connecting portion, has already planned the interconnection paths for multiple chips within the frame. Chips can be directly fixed to the mounting space enclosed by the frame. The connecting portion replaces the independent wiring on the traditional substrate, eliminating the need for additional substrate wiring space and reducing the actual usable area of ​​the substrate. Moreover, the connecting portion extends directly from the support beam to the chip, resulting in an extremely short interconnection path. The integrated structure of the connecting portion effectively reduces impedance loss and parasitic interference during signal transmission. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1A simplified diagram of the power module provided in an embodiment of this utility model;

[0029] Figure 2 A schematic diagram of the integrated frame provided in an embodiment of this utility model;

[0030] Figure 3 This is a schematic diagram of the structure of the chip and substrate provided in an embodiment of the present utility model;

[0031] Figure 4 A schematic diagram of the power module provided in an embodiment of this utility model;

[0032] Figure 5 A schematic diagram of the structure of multiple integrated frame connections provided in the embodiments of this utility model.

[0033] Explanation of reference numerals in the attached figures:

[0034] 10-Integrated frame;

[0035] 20 - Support beam; 21 - Installation space;

[0036] 30 - Connecting part; 31 - Fixed section; 32 - Connecting section; 321 - Protruding structure; 33 - First connecting part; 34 - Second connecting part;

[0037] 40 - Connecting terminal; 41 - First connecting terminal; 42 - Second connecting terminal;

[0038] 50 - Chip; 51 - First chip; 52 - Second chip; 53 - Third chip;

[0039] 60-substrate;

[0040] 100-Power Module. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] In this application, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0044] As the new energy vehicle industry rapidly develops towards higher range, higher power density, and higher safety, automotive power modules, as core components of the electric drive system and on-board power system of new energy vehicles, directly determine the power efficiency, reliability, and manufacturing cost of the entire vehicle. The industry's requirements for automotive power modules in terms of integration, electrical performance, miniaturization, and cost control are becoming increasingly stringent.

[0045] In the current automotive power module packaging field, the industry generally adopts a method of connecting a single chip to external circuits within the same package using copper sheet connections or wire bonding to complete signal and energy transmission functions in scenarios such as electric drive and energy conversion. However, this traditional chip connection method requires a significant increase in substrate area to avoid interference between different chip connection lines and meet the requirements for conduction reliability, which limits the integration density and makes it difficult to match the high power density requirements.

[0046] In view of this, some embodiments of this application provide an integrated frame and power module. The integrated frame, through the integrated design of the support beam and the connecting part, can reduce the overall volume of the power module, reduce the actual usable area of ​​the substrate, and effectively reduce impedance loss and parasitic interference during signal transmission.

[0047] The present application will be described in detail below through specific embodiments:

[0048] The integrated frame 10 of this application embodiment, such as Figures 1 to 5 As shown, the integrated frame 10 is used to connect multiple chips 50, including:

[0049] Support beam 20, there are multiple support beams 20, and the multiple support beams 20 are connected to each other to form a planar frame, the planar frame encloses a placement space 21 for accommodating multiple chips 50;

[0050] The connecting part 30 is connected to the support beam 20 and extends into the placement space 21 along the first direction. The connecting part 30 is used to connect at least one chip 50.

[0051] The connecting terminal 40 has one end located on the support beam 20 and the other end used for electrical connection with external components.

[0052] The integrated frame 10 provided in this embodiment includes a planar frame composed of multiple interconnected support beams 20, with an enclosed placement space 21 formed inside the frame. The support beams 20 provide stable structural support for the entire frame, ensuring that the frame is not easily deformed during subsequent chip 50 connection, guaranteeing packaging reliability. The planar frame defines the installation range of the multiple chips 50 and provides a fixed foundation for the connecting part 30 and the connecting terminal 40. The connecting part 30 is connected to the support beams 20 and extends into the placement space 21 along a first direction. The connecting part 30 extends directionally from the edge of the frame towards the internal chip 50 area, forming a connection channel for the chips 50 within the placement space 21. The connecting terminal 40 serves as an electrical interface structure with external components. One end is electrically connected to the support beams 20 (or indirectly connected to the connecting part 30 through the support beams 20), while the other end is used to connect to external components (such as circuit boards, power supplies, wire harnesses, heat sinks, etc.).

[0053] Therefore, this application utilizes the placement space 21 enclosed by the support beam 20 and the connecting part 30 extending from the support beam 20 into the placement space 21. This allows multiple chips 50 to be accommodated and connected within the same package. The connecting part 30 extends directly to the chip 50 mounting position, eliminating the need for external long-distance wiring. This enables the multiple chips 50 to be tightly integrated within the frame, significantly reducing the overall module size. Furthermore, the integrated frame 10, through the integrated design of the support beam 20 and the connecting part 30, has already completed the interconnection path planning for the multiple chips 50 within the frame. The chips 50 can be directly fixed to the placement space 21 enclosed by the frame. The connecting part 30 replaces the independent wiring on the traditional substrate 60, eliminating the need for additional wiring space on the substrate 60 and reducing the actual usable area of ​​the substrate 60. Moreover, the connecting part 30 extends directly from the support beam 20 to the chip 50, resulting in an extremely short interconnection path. The integrated structure of the connecting part 30 effectively reduces impedance loss and parasitic interference during signal transmission.

[0054] Furthermore, this application overcomes the limitations of traditional single-chip independent connection by directly connecting multiple chips 50 to the frame within the package through a structure extending into the placement space 21. For example, a set of connection parts 30 can simultaneously connect adjacent power chips 50 and driver chips 50, or multiple power chips 50 can form series or parallel circuits through different connection parts 30, structurally achieving interconnection of multiple chips 50 within the package without relying on external circuitry.

[0055] In the diagram, the X direction is the first direction, the Y direction is the second direction, and the Z direction is the third direction.

[0056] It should be explained that the support beam 20 needs to have a certain mechanical strength (e.g., using metal materials such as copper alloy or aluminum alloy) to serve as the skeleton of the frame, bearing the overall weight, and also to divide the space into independent areas for accommodating multiple chips 50 through interconnected arrangements (e.g., rectangular or polygonal enclosure structures). Furthermore, the connecting part 30 can be a copper sheet, connecting at least one chip 50. Multiple sets of connecting parts can be designed depending on the number and position of the chips 50, and the ends must have connection structures adapted to the pins of the chip 50 (e.g., solder contacts, elastic clips, etc.).

[0057] In some embodiments, such as Figure 1 As shown, the connecting part 30 includes a fixed section 31 and a connecting section 32 that are connected to each other. The fixed section 31 is fixed to the support beam 20, and the connecting section 32 is used to electrically connect to the chip 50. Along the second direction, the width of the fixed section 31 is greater than the width of the connecting part 30, and the second direction is perpendicular to the first direction.

[0058] Therefore, the wide design of the fixed section 31 enhances the connection strength with the support beam 20, thereby increasing the vibration and impact resistance of the entire frame and preventing the connection 30 from loosening, breaking, or the chip 50 from falling off, thus reducing the risk of module failure. At the same time, the reduced contact resistance of the fixed section 31 can reduce local heat generation, avoid connection aging caused by high temperature, and extend the service life of the connection 30 and even the entire module.

[0059] Meanwhile, the narrow design of the connecting section 32 solves the spatial conflict problem of the multi-chip 50 layout, allowing multiple chips 50 to be closely arranged within the frame placement space 21 without having to reserve too much gap for the connecting section 30, thereby increasing the integration density of the multi-chip 50 in the frame and effectively reducing the overall volume of the module.

[0060] In some embodiments, such as Figure 1 As shown, the connecting segment 32 has a bent structure, so that a protrusion 321 is formed on the connecting segment 32, which bends toward a third direction. The third direction is perpendicular to both the first and second directions. The protrusion 321 is used to connect with the chip 50.

[0061] The connecting segment 32 forms a protruding structure 321 along a third direction, which is the height direction perpendicular to the frame plane. If it bends upward or downward from the frame plane, the protruding structure 321 will detach from the plane of the frame, forming a three-dimensional connecting node. The chip 50 is fixed on the substrate 60 within the frame placement space 21. The protruding structure 321 can precisely extend to the electrode position at the top of the chip 50, so that the protruding structure 321 formed after bending can adapt to height deviations, such as the flatness error after the chip 50 is soldered, the thickness fluctuation of the substrate 60, etc., without having to pursue the ultimate assembly precision, reducing the debugging difficulty and cost of automated assembly equipment.

[0062] Under high and low temperature cycling and vibration and shock conditions, the stress buffering effect of the bending structure is significant, avoiding damage to the connection nodes caused by stress concentration and extending the service life of the connection part 30. During vibration and shock, the elasticity of the protruding structure 321 can reduce the rigid collision between the chip 50 and the connection part 30, preventing the electrode from falling off or the chip 50 from cracking, and ensuring the long-term reliability of the power module 100.

[0063] In some embodiments, such as Figure 1 As shown, the connection terminal 40 includes a first connection terminal 41 and a second connection terminal 42;

[0064] The first connecting terminal 41 extends along a first direction, with one end of the first connecting terminal 41 extending into the placement space 21 and the other end of the first connecting terminal 41 extending away from the placement space 21.

[0065] The second connecting terminal 42 extends along a third direction and is electrically connected to the fixed section 31.

[0066] The differentiated design of the first connection terminal 41 and the second connection terminal 42 allows them to adapt to different types of external components and signal transmission requirements. For example, the first connection terminal 41 is suitable for low-power, small-signal components such as PCB boards and sensors; the second connection terminal 42 is suitable for high-power, high-current components such as heat sinks, external buses, and power supplies. Each terminal performs its specific function, eliminating the need for additional adapter structures and improving the adaptability of the power module 100.

[0067] The two connection terminals 40 can also avoid mutual interference between small signals and large current signals. The small signal transmitted by the first connection terminal 41 is far away from the large current transmitted by the second connection terminal 42, reducing the interference of the electromagnetic field generated by the large current on the small signal and ensuring the sampling accuracy and the accuracy of the control signal. At the same time, the second connection terminal 42 is directly connected to the fixed section 31, which can converge the current of the multi-chip 50 through the fixed section 31, reduce the path length of the large current transmission, reduce the impedance loss of the conductive path, reduce energy loss, and improve power transmission efficiency.

[0068] The first connection terminal 41 extends along the first direction, utilizing the planar space of the frame edge, without occupying the chip 50 layout area within the placement space 21; the second connection terminal 42 extends along the third direction, utilizing the three-dimensional space above and below the frame, without occupying the interface space within the frame plane, thus meeting the core requirements of miniaturization and high integration of the automotive power module 100.

[0069] In some embodiments, such as Figure 1 As shown, the integrated frame 10 is a sheet metal part, and the connecting part 30 and the second connecting terminal 42 are both formed by bending relative to the support beam 20.

[0070] The integrated frame 10 is a one-piece sheet metal part. The connecting part 30, the second connecting terminal 42 and the support beam 20 have no splicing nodes. Its mechanical strength is higher than that of the split frame, which can effectively avoid failures such as the connecting part 30 falling off and the connecting terminal 40 loosening. At the same time, the high tensile strength and elasticity of the sheet metal material can enable the connecting part 30 and the second connecting terminal 42 to resist deformation and fracture caused by thermal stress in high and low temperature cycles, extend the service life of the frame and ensure the long-term reliability of the vehicle power module 100.

[0071] The connecting part 30, the second connecting terminal 42 and the support beam 20 are integrally bent and formed without splicing gaps and contact resistance. Combined with the high conductivity of the sheet metal material, a low impedance conductive path can be formed. The low impedance characteristic can avoid contact aging caused by local heating, reduce voltage spikes and signal interference, ensure the electrical performance of the automotive power module 100 under high frequency switching and high current conditions, and improve power transmission efficiency.

[0072] This application also discloses a power module 100, including:

[0073] Substrate 60, substrate 60 having a component mounting surface;

[0074] Multiple chips 50 are disposed on the component mounting surface and electrically connected to the substrate 60.

[0075] An integrated frame 10, the support beam 20 of the integrated frame 10 is fixedly connected to the component mounting surface, and the connecting part 30 of the integrated frame 10 is located above the chip 50 and is electrically connected to the chip 50.

[0076] A plastic-sealed shell is fitted onto the integrated frame 10.

[0077] The component mounting surface of the substrate 60 also serves as the fixing surface of the support beam 20 of the integrated frame 10. The support beam 20 is fixed to the substrate 60. The placement space 21 of the frame needs to be aligned with the layout of the chip 50 on the substrate 60 to ensure that the connecting part 30 of the frame can extend exactly above the chip 50 and make electrical connection with the electrode of the chip 50, thus avoiding connection failure caused by the positioning deviation between the frame and the substrate 60.

[0078] The molding compound is injection molded onto the integrated frame 10. The molding compound uses a high-temperature resistant, moisture-resistant, and highly insulating molding compound (such as epoxy molding compound), which isolates the metal structures of the frame, chip 50, and substrate 60 from external dust, moisture, and corrosive gases, preventing oxidation or short circuits. Simultaneously, the molding compound has a certain degree of thermal conductivity, which helps dissipate the heat generated by the chip 50, improving the module's heat dissipation efficiency. The molding compound, frame, and substrate 60 form a tightly fitted whole, enhancing the module's vibration and impact resistance. The molding compound restricts the displacement of the frame and chip 50, preventing loosening of the contact between the connection part 30 and the chip 50 electrodes, thus extending the module's lifespan.

[0079] The substrate 60 is typically made of a material with high thermal conductivity and high insulation, such as an AMB substrate 60 (Active Metal Brazing Substrate) or a DBC substrate 60 (Direct Bonded Copper Substrate), which is not limited herein.

[0080] The integrated frame 10 in the power module 100 is the same as the integrated frame 10 described above. Therefore, the power module 100 in this embodiment has roughly the same technical effect as the integrated frame 10 described above. Since the technical effect of the integrated frame 10 has been fully explained, it will not be repeated here.

[0081] In some embodiments, such as Figure 2 and Figure 4 As shown, the plurality of chips 50 include a first chip 51 and a second chip 52 arranged at intervals along a first direction. The connecting portion 30 of the integrated frame 10 includes a first connecting portion 33, which extends along the first direction and is electrically connected to the first chip 51 and the second chip 52 respectively.

[0082] The first connecting portion 33 spans the first chip 51 and the second chip 52, enabling simultaneous interconnection of the two chips 50 during frame assembly without additional steps, thus improving assembly efficiency. Simultaneously, it eliminates the need for dedicated interconnect lines on the substrate 60, simplifying its layout and reducing design complexity and manufacturing costs. This is particularly beneficial for the high-cost AMB substrate 60, as the simplified circuitry further reduces its area, indirectly lowering material costs.

[0083] The first connection part 33 is an integrated bridging structure with no intermediate nodes and a large contact area, which can reduce the interconnection impedance. Traditional external wires or long lines of the substrate 60 are prone to introducing high parasitic inductance. However, the first connection part 33 directly bridging the two chips 50 along the first direction, with a short interconnection path, can reduce parasitic inductance, effectively suppress voltage spikes, protect the chips 50 from overvoltage impact, and improve the electrical safety of the module.

[0084] The first connecting portion 33 bridges the two chips 50 along the first direction, eliminating the need for redundant space between the two chips 50 for substrate 60 lines or external wires. This reduces the spacing between the two chips 50 and minimizes space occupation along the first direction. Furthermore, the connecting portion 30 is an integrated structure, requiring no additional fixing components, further reducing space waste within the module. Within a limited module volume, more chips 50 can be accommodated, significantly improving the module's integration density and meeting the miniaturization requirements of new energy vehicle electric drive systems.

[0085] In some embodiments, such as Figure 3 and Figure 4 As shown, the plurality of chips 50 includes a third chip 53, which is arranged at intervals with the first chip 51 and the second chip 52 along a second direction, which is perpendicular to the first direction. The connecting portion 30 includes a plurality of second connecting portions 34, which are parallel and extend along the first direction. The plurality of second connecting portions 34 are disposed on the third chip 53 and are all electrically connected to the third chip 53.

[0086] The third chip 53, such as a driver chip or sampling chip, typically needs to transmit multiple independent signals. Multiple second connection parts 34 are arranged in parallel and spaced apart. Each connection part 30 transmits only one independent signal, with completely independent signal paths of consistent length, reducing signal crosstalk and ensuring signal transmission integrity. Simultaneously, the connection part 30 has a one-piece metal structure with low signal transmission impedance, reducing signal transmission delay and improving the module's control response speed, especially suitable for the operating requirements of automotive power modules 100 high-frequency switches.

[0087] In some embodiments, such as Figure 3 and Figure 4 As shown, multiple chips 50 are soldered to the component mounting surface, a support beam 20 is soldered to the component mounting surface and located at the edge of the substrate 60, and a connecting portion 30 is soldered above the chips 50.

[0088] The metallurgical bond formed by the welding process, such as the solder alloy layer between chip 50 and substrate 60, and the intermetallic compound layer between support beam 20 and substrate 60, has high bonding strength. Welding the support beam 20 along the edge of the substrate can firmly fix the frame and substrate 60, while welding the connecting part 30 ensures the tight interconnection between the frame and chip 50, avoiding faults such as chip 50 falling off and connecting part 30 loosening.

[0089] The soldering layers between chip 50 and substrate 60, and between connector 30 and chip 50, are all made of conductive material with a large contact area, which reduces the impedance of the conductive path and significantly improves the module's energy transmission efficiency. The soldering between connector 30 and chip 50 is a point-to-point direct connection, eliminating the parasitic inductance of traditional wire connections, protecting chip 50 from overvoltage surges, reducing signal interference, and improving the module's control accuracy.

[0090] In some embodiments, such as Figure 5 As shown, the power module 100 includes multiple integrated frames 10, which are connected in sequence, and a plastic encapsulation shell is encapsulated on the outer periphery of the multiple integrated frames 10.

[0091] Power can be expanded by sequentially connecting multiple frames and stacking the number of chips 50. For example, three frames can be connected in the same direction, with each frame integrating multiple power chips 50, thereby increasing output power. At the same time, the number of frames can be flexibly adjusted according to power requirements without redesigning the overall module structure, greatly improving the module's power adaptability and reducing development costs for different power models.

[0092] The plastic-encapsulated shell covers the periphery of the multi-frame structure, forming a continuous protective barrier. The periphery can be encapsulated in a single injection molding process, eliminating the need for multiple encapsulation steps and further simplifying the process. After the multi-frame structure is encapsulated as a whole, only the uniform connection terminals 40 are exposed externally, facilitating future maintenance. The multiple frames are connected sequentially along the same direction to form a long, rectangular modular structure, which improves space utilization compared to the dispersed layout of multiple independent single-frame modules.

[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. An integrated frame for connecting multiple chips, characterized in that, include: Support beams, wherein there are multiple support beams and the multiple support beams are interconnected to form a planar frame, the planar frame enclosing a placement space for accommodating multiple chips; A connecting portion is connected to the support beam and extends into the placement space along a first direction; the connecting portion is used to connect at least one of the chips. A connecting terminal is provided, one end of which is located on the support beam, and the other end of which is used for electrical connection with an external component.

2. The integrated frame according to claim 1, characterized in that, The connecting portion includes a fixed section and a connecting section that are connected to each other. The fixed section is fixed to the support beam, and the connecting section is used to electrically connect to the chip. Along a second direction, the width of the fixed section is greater than the width of the connecting portion, and the second direction is perpendicular to the first direction.

3. The integrated frame according to claim 2, characterized in that, The connecting segment has a bent structure, so that a protruding structure is formed on the connecting segment that bends toward a third direction, which is perpendicular to both the first direction and the second direction. The protruding structure is used to connect with the chip.

4. The integrated frame according to claim 3, characterized in that, The connection terminal includes a first connection terminal and a second connection terminal; The first connecting terminal extends along the first direction, one end of the first connecting terminal extends into the placement space, and the other end of the first connecting terminal extends away from the placement space. The second connection terminal extends along the third direction and is electrically connected to the fixed segment.

5. The integrated frame according to claim 4, characterized in that, The integrated frame is a sheet metal part, and the connecting part and the second connecting terminal are both formed by bending relative to the support beam.

6. A power module, characterized in that, include: A substrate having a component mounting surface; Multiple chips are disposed on the component mounting surface and electrically connected to the substrate; An integrated frame, wherein the integrated frame is the integrated frame as described in any one of claims 1-5, wherein the support beam of the integrated frame is fixedly connected to the component mounting surface, and the connecting part of the integrated frame is located above the chip and electrically connected to the chip. A plastic-sealed shell, which is plastic-sealed onto the integral frame.

7. The power module according to claim 6, characterized in that, The plurality of chips include a first chip and a second chip arranged at intervals along a first direction, and the connecting portion of the integrated frame includes a first connecting portion that extends along the first direction and is electrically connected to the first chip and the second chip, respectively.

8. The power module according to claim 7, characterized in that, The plurality of chips include a third chip, which is arranged at intervals from the first chip and the second chip along a second direction, the second direction being perpendicular to the first direction. The connection portion includes a plurality of second connection portions, which are parallel to each other and extend along the first direction. The plurality of second connection portions are disposed on the third chip and are all electrically connected to the third chip.

9. The power module according to any one of claims 6-8, characterized in that, Multiple chips are soldered to the component mounting surface, the support beam is soldered to the component mounting surface and located at the edge of the substrate, and the connection portion is soldered above the chips.

10. The power module according to any one of claims 6-8, characterized in that, The power module includes multiple integrated frames connected in sequence, and the plastic encapsulation shell is encapsulated on the outer periphery of the multiple integrated frames.

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