A device for separating a sliced substrate ingot

Abstract

This utility model discloses a wafer splitting device after slicing a substrate ingot, including a laser cutting mechanism, a limiting fixture, a limiting frame, and a wafer splitting mechanism. The limiting fixture has an installation space for placing the wafer slicing assembly. The limiting frame is spaced apart from the limiting fixture. The emitting end of the laser cutting mechanism is suspended above the limiting fixture to emit a laser to separate the wafers from the connecting plate of the wafer slicing assembly. The wafer splitting mechanism includes a lifting assembly, a traversing assembly, and a gripper assembly for holding the wafers. The lifting assembly is connected to the traversing assembly to drive the traversing assembly to move up and down. The traversing assembly is connected to the gripper assembly to drive the gripper assembly to move back and forth between the wafer slicing assembly and the limiting frame. This utility model automatically separates the wafers using laser and automatically picks them up and places them at the limiting frame, which not only improves efficiency but also avoids breakage or fragmentation caused by manual breaking, thus reducing production costs.

Description

Technical Field

[0001] This utility model relates to the technical field of slicing and deslicing devices, and in particular to a deslicing device for substrate crystal rods after slicing. Background Technology

[0002] Indium phosphide (InP) substrates have a significant market application in the manufacture of high-frequency, high-power devices, fiber optic communications, wireless transmission, and radio astronomy. RF devices based on InP substrates have demonstrated superior performance in key applications such as satellites and radar, exhibiting strong competitiveness, particularly in the RF front-end of radar and communication systems and wide-bandwidth analog / mixed-signal circuits. They are suitable for high-end applications such as high-speed data processing and high-precision wide-bandwidth A / D conversion.

[0003] Furthermore, indium phosphide-based radio frequency devices, such as low-noise amplifiers, modules, and receivers, are widely used in satellite communications, millimeter-wave radar, and active and passive millimeter-wave imaging. Of particular note is the unique advantage that indium phosphide-based radio frequency devices demonstrate in wireless transmission over backhaul and point-to-point communication networks at bandwidth levels exceeding 100 GHz.

[0004] However, despite significant advancements in the technology and applications of indium phosphide substrates and related RF devices, challenges remain in actual production. For instance, the slicing and disassembly process after ingot cutting typically relies on manual operation, which is not only inefficient but also prone to causing breakage or fragmentation of the finished product, increasing production costs. Utility Model Content

[0005] The technical problem this invention aims to solve is that the disassembly of the wafers after crystal rod cutting usually relies on manual operation, which is not only inefficient but also prone to causing the finished product to break or produce fragments, increasing production costs.

[0006] To solve the above-mentioned technical problems, this utility model provides a wafer splitting device after substrate ingot slicing, including a laser cutting mechanism, a limiting fixture, a limiting frame, and a wafer splitting mechanism; the limiting fixture has an installation space for placing the slicing assembly, the limiting frame is spaced apart from the limiting fixture, and the emitting end of the laser cutting mechanism is suspended above the limiting fixture to emit a laser to separate the slices of the slicing assembly from the connecting plate;

[0007] The slicing mechanism includes a lifting assembly, a traversing assembly, and a gripper assembly for holding the slices. The lifting assembly is connected to the traversing assembly to drive the traversing assembly to lift and lower. The traversing assembly is connected to the gripper assembly to drive the gripper assembly to move back and forth between the slicing assembly and the limiting frame.

[0008] Furthermore, the lifting assembly includes a first mounting frame, a first driving member, a first lead screw, and a first slider. The first mounting frame is mounted on the side of the limiting fixture facing the slice, and a first slide rail is provided on the first mounting frame. The first driving member is mounted on the first mounting frame. One end of the first lead screw is connected to the first driving member, and the other end is rotatably connected to the first mounting frame. The first slider is mounted on the first lead screw and slidably mounted on the first slide rail. The transverse component is mounted on the first slider.

[0009] Furthermore, the lateral movement assembly includes a second mounting bracket, a second driving member, a second lead screw, and a second slider. The lifting assembly is connected to the second mounting bracket, and a second slide rail is provided on the second mounting bracket. The second driving member is mounted on the second mounting bracket. One end of the second lead screw is connected to the second driving member, and the other end is rotatably connected to the second mounting bracket. The second slider is mounted on the second lead screw and slidably mounted on the second slide rail. The gripper assembly is mounted on the second slider.

[0010] Furthermore, the gripper assembly includes a third drive member and two gripping arms. The lateral movement assembly is connected to the third drive member, and the third drive member is connected to the two gripping arms to drive the two gripping arms to move towards or away from each other.

[0011] Furthermore, the clamping arm includes a first arm, a second arm, and a third arm. One end of the first arm is connected to the third driving member, and the other end of the first arm is connected to the third arm through the second arm. The second arm extends from the other end of the first arm in a direction away from the other first arm, and the second arm is arranged perpendicular to the first arm. The third arm is arranged horizontally to the first arm.

[0012] Furthermore, the laser cutting mechanism includes a third mounting bracket and a laser. The third mounting bracket is mounted on the side of the limiting fixture opposite to the connecting plate, and the laser is mounted on the third mounting bracket and suspended above the limiting fixture.

[0013] Furthermore, the limiting fixture includes at least two limiting blocks mounted on the mounting plane. Each limiting block has a first notch that engages with the connecting plate, and the two limiting blocks are spaced apart along a first direction to define the mounting space.

[0014] Furthermore, the mounting space has a second notch for the gripper assembly to hold the slice.

[0015] Furthermore, the limiting frame includes two limiting plates mounted on the mounting plane, the two limiting plates being spaced apart, and the gap between the two limiting plates being greater than or equal to the width of the slice.

[0016] Furthermore, the limiting plate includes a first plate and a second plate, the first plate and the second plate are arranged perpendicularly, and the first plate is spaced apart from another first plate to form a placement space, the two sides of the placement space perpendicular to the first direction are open.

[0017] Compared with the prior art, the wafer splitting device of this utility model embodiment has the following advantages:

[0018] This utility model embodiment uses laser to automatically separate slices and automatically clamp them to the limiting frame, which not only improves efficiency but also avoids breakage or fragmentation caused by manual breaking, thus reducing production costs. Attached Figure Description

[0019] The present application will be further described in detail below with reference to the accompanying drawings and preferred embodiments. However, those skilled in the art will appreciate that these drawings are drawn only for the purpose of explaining the preferred embodiments and therefore should not be construed as limiting the scope of the present application. Furthermore, unless specifically indicated, the drawings are intended only to conceptually represent the composition or structure of the described objects and may contain exaggerated representations, and the drawings are not necessarily drawn to scale.

[0020] Figure 1 This is a schematic diagram of the structure of the substrate crystal bar slicing device provided in this embodiment of the utility model;

[0021] Figure 2 This is a schematic diagram of the disassembly mechanism provided in an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the structure of the limiting fixture and the slicing assembly provided in this embodiment of the utility model;

[0023] Figure 4 This is provided by the embodiment of the present utility model. Figure 3 A magnified view of part A circled in the diagram;

[0024] Figure 5 This is a schematic diagram of the structure of the limiting frame and the slice provided in this embodiment of the utility model;

[0025] In the diagram, 1 is the laser cutting mechanism; 11 is the third mounting bracket; 12 is the laser; 2 is the limiting fixture; 21 is the limiting block; 3 is the limiting frame; 31 is the limiting plate; 311 is the first plate; 312 is the second plate; 4 is the slicing mechanism; 41 is the lifting assembly; 411 is the first mounting bracket; 412 is the first driving component; 413 is the first lead screw; 414 is the first slider; 42 is the transverse assembly; 421 is the second mounting bracket; 422 is the second driving component; 423 is the second lead screw; 424 is the second slider; 43 is the gripper assembly; 431 is the third driving component; 432 is the gripping arm; 4321 is the first arm; 4322 is the second arm; 4323 is the third arm; 5 is the slicing assembly; 51 is the connecting plate; 52 is the slice; and 53 is the cutting line. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0027] like Figure 3 As shown, in actual production, the crystal rod is mounted on a fixture and connected to the connecting plate 51 via the fixture to form a slicing assembly 5. This slicing assembly 5 can be sliced ​​by a slicing device to form multiple slices 52 on the connecting plate 51. Usually, a portion of the width is left during slicing to allow for slicing and to avoid damage to the connecting plate 51. This utility model provides a slicing device for substrate crystal rod slicing, used for slicing substrate crystal rods after slicing; that is, this slicing device is used to cut and separate the slices 52 from the connecting plate 51.

[0028] like Figure 1As shown, the slicing device includes a laser cutting mechanism 1, a limiting fixture 2, a limiting frame 3, and a slicing mechanism 4. The limiting fixture 2 has an installation space for placing the slicing assembly 5, so as to facilitate the subsequent positioning of the slicing assembly 5, ensure the accuracy of laser cutting and subsequent slicing actions, prevent the assembly from moving during processing, and improve process stability. The laser cutting mechanism 1 has its emitting end suspended above the limiting fixture 2 to emit a laser to separate the slice 52 of the slicing assembly 5 from the connecting plate 51. The limiting frame 3 is spaced apart from the limiting fixture 2 and is used to receive the transferred slice 52. The slicing mechanism 4 includes a lifting assembly 41, a traversing assembly 42, and a gripper assembly 43. The gripper assembly 43 is used to hold the slice 52 and, with the cooperation of the lifting assembly 41 and the traversing assembly 42, transfers the laser-separated slice 52 to the limiting frame 3. The traversing assembly 42 is connected to the gripper assembly 43 to drive the gripper assembly 43 to move back and forth between the slicing assembly 5 and the limiting frame 3 to complete the transport of the slice 52. The lifting assembly 41 is connected to the traversing assembly 42 to drive the traversing assembly 42 to lift and lower, thereby controlling the rise and fall of the gripper assembly 43 so that it can accurately contact the slice 52 and pick it up or put it down.

[0029] Based on the above structure, the slice component 5 to be separated is placed in the limiting fixture 2 and fixed, according to the cutting line 53 on the slice component 5 (e.g., Figure 3 As shown, the laser cutting mechanism 1 emits a laser from above to cut the slice 52 off the connecting plate 51, while the slice removal mechanism 4 is activated. At this time, the lifting assembly 41 drives the traversing assembly 42 to move upward, and moves the gripper assembly 43 to above the slice assembly 5. The lifting assembly 41 then moves the gripper assembly 43 to the center position of the first slice 52 at the top, where the gripper assembly 43 clamps the slice 52. The traversing assembly 42 moves the gripper assembly 43 to above the limiting frame 3, and the lifting assembly 41 descends again, placing the slice 52 on the limiting frame 3. The gripper is then released, completing one slice removal operation. This embodiment automatically separates the slice 52 using laser and automatically clamps and places it on the limiting frame 3, which not only improves efficiency but also avoids breakage or fragmentation caused by manual breaking, thus reducing production costs.

[0030] like Figure 2As shown, the lifting assembly 41 includes a first mounting frame 411, a first drive member 412, a first lead screw 413, and a first slider 414. The first mounting frame 411 is the supporting base of the entire lifting assembly 41. It is installed on the side of the limiting fixture 2 facing the slice 52 to provide a stable mounting platform and support other components. The second mounting frame 421 has a second slide rail to provide a sliding path. The first drive member 412 is installed on the first mounting frame 411 to provide power. One end of the first lead screw 413 is connected to the first drive member 412 to receive the rotational power transmitted by the first drive member 412, and the other end is rotatably connected to the first mounting frame 411. The first slider 414 is installed on the first lead screw 413 and slidably installed on the first slide rail. When the first lead screw 413 rotates, the first slider 414 will move up and down linearly along the first slide rail. The transverse component 42 is installed on the first slider 414 to move up and down together with the first slider 414.

[0031] Based on the above structure, when the first driving member 412 starts and rotates, it drives the first lead screw 413 to rotate, which in turn drives the first slider 414 to move linearly (up or down) along the first slide rail. The lateral movement component 42 will also move up and down accordingly, realizing the height adjustment of the gripper component 43. It should be noted that the first driving member 412 in this embodiment is a motor.

[0032] Furthermore, the transverse assembly 42 includes a second mounting bracket 421, a second drive member 422, a second lead screw 423, and a second slider 424. The lifting assembly 41 is connected to the second mounting bracket 421, which serves as the supporting foundation for the entire transverse assembly 42, providing a stable mounting platform. The second mounting bracket 421 is provided with a second slide rail for providing a sliding path. The second drive member 422 is mounted on the second mounting bracket 421. One end of the second lead screw 423 is connected to the second drive member 422 to receive the rotational power transmitted from the second drive member 422, and the other end is rotatably connected to the second mounting bracket 421. The second slider 424 is mounted on the second lead screw 423 and slidably mounted on the second slide rail. When the second lead screw 423 rotates, the second slider 424 will move laterally in a straight line along the second slide rail. The gripper assembly 43 is mounted on the second slider 424.

[0033] Based on the above structure, when the second driving member 422 starts and rotates, it drives the second lead screw 423 to rotate, which in turn drives the second slider 424 to move back and forth in a straight line along the second slide rail. The lateral moving component 42 will also move back and forth accordingly, realizing the adjustment of the gripper component 43 on the horizontal line. It should be noted that the second driving member 422 in this embodiment is a motor.

[0034] Furthermore, the gripper assembly 43 includes a third drive member 431 and two gripping arms 432. The lateral movement assembly 42 is connected to the third drive member 431, and the third drive member 431 is connected to the two gripping arms 432 to drive the two gripping arms 432 to move towards or away from each other. In this embodiment, the power provided by the third drive member 431 enables the two gripping arms 432 to perform opening (moving away from each other) and closing (moving towards each other) actions, thereby realizing the gripping and releasing of the slice 52, reducing manual intervention, and improving the automation level and work efficiency of slice removal. At the same time, because it can precisely control the gripping force and position, it also avoids breakage or fragmentation caused by manual breaking. It should be noted that the third drive member 431 in this embodiment is a finger cylinder.

[0035] Furthermore, the clamping arm 432 includes a first arm 4321, a second arm 4322, and a third arm 4323. The first arm 4321 is the root of the clamping arm 432, and one end of it is connected to the third drive member 431 to receive the driving force. The other end of the first arm 4321 is connected to the third arm 4323 through the second arm 4322. The second arm 4322 extends from the other end of the first arm 4321 in a direction away from the other first arm 4321, and the second arm 4322 is perpendicular to the first arm 4321. The third arm 4323 is horizontal to the first arm 4321, so that the second arm 4322 and the third arm 4323 form an L-shaped structure to better match the shape of the slice 52, while better resisting bending force and improving the stability during clamping.

[0036] Furthermore, the laser cutting mechanism 1 includes a third mounting bracket 11 and a laser 12. The third mounting bracket 11 is mounted on the side of the limiting fixture 2 away from the connecting plate 51, providing a stable mounting platform for the laser 12. The laser 12 is mounted on the third mounting bracket 11 to ensure the stability and accuracy of the laser 12's position, and is suspended above the limiting fixture 2, so that the laser can directly irradiate the slicing assembly 5 placed on the limiting fixture 2 for cutting.

[0037] like Figure 4 As shown, the limiting fixture 2 includes at least two limiting blocks 21 mounted on the mounting plane. Each limiting block 21 has a first notch that engages with the connecting plate 51, enabling it to engage or embed the slicing assembly 5, thereby limiting the lateral or sideways movement of the connecting plate 51 and preventing it from moving horizontally. The two limiting blocks 21 are spaced apart along a first direction to define the mounting space for accommodating and positioning the slicing assembly 5. In this embodiment, the first notch engages with the connecting plate 51, restricting its forward and backward freedom in the horizontal direction and ensuring the consistency of the connecting plate 51's position during processing.

[0038] It should be noted that the mounting surface can be a workbench, a substrate, or the ground, etc., and is not specifically limited here. The first direction is the length direction of the transverse moving component 42.

[0039] Furthermore, the installation space has a second notch for the gripper assembly 43 to hold the slice 52, allowing the external gripper assembly 43 to extend in and grip the slice 52 located in the installation space, ensuring that the gripper assembly 43 will not interfere with the limiting fixture 2 during the gripping action, ensuring smooth operation and improving production efficiency.

[0040] like Figure 5 As shown, the limiting frame 3 includes two limiting plates 31 installed on the mounting plane. The two limiting plates 31 are spaced apart, and the gap between the two limiting plates 31 is greater than or equal to the width of the slice 52, so that the slice 52 can be placed between the two limiting plates 31 without being stuck. At the same time, the limiting plates 31 can restrict its movement in the left and right directions, thus playing a role in positioning and preventing deviation.

[0041] It should be noted that the mounting surface can be a workbench, a base plate, or the ground, etc., and there are no special limitations here.

[0042] Furthermore, the limiting plate 31 includes a first plate 311 and a second plate 312. The first plate 311 and the second plate 312 are arranged perpendicularly to form an L-shaped structure, which enhances the structural strength. The first plate 311 and the other first plate 311 are spaced apart to form a placement space for accommodating the slice 52. The two sides of the placement space that are perpendicular to the first direction are open, so that the gripper assembly 43 can be placed on the side along the height direction of the limiting plate 31 when placing the slice 52, thus avoiding interference.

[0043] The workflow is as follows:

[0044] When the artificial slicing assembly 5 reaches the limiting fixture 2, the second drive member 422 rotates, causing the gripper assembly 43 to move in the direction of the second drive member 422 to reset. The first drive member 412 rotates, causing the gripper assembly 43 to move upward. Then, the second drive member 422 rotates, causing the gripper assembly 43 to move in the direction of the first drive member 412 to above the slicing assembly 5. The first drive member 412 rotates, causing the gripper assembly 43 to move to the center position of the first slice 52 at the top. The third drive member 431 closes the clamping arm 432 to clamp the slice 52. The second drive member 422 rotates, causing the gripper assembly 43 to move in the opposite direction of the first drive member 412 to the center of the limiting frame 3. The first drive member 412 rotates, causing the gripper assembly 43 to move to the bottom of the limiting frame 3. The third drive member 431 opens the clamping arm 432 and puts down the slice 52, completing one operation.

[0045] In summary, this utility model provides a wafer splitting device after substrate ingot slicing. It automatically separates the wafers 52 by laser and automatically clamps and places them at the limiting frame 3, which not only improves efficiency but also avoids breakage or fragmentation caused by manual breaking, thus reducing production costs.

[0046] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A wafer splitting device after slicing a substrate ingot, characterized in that, It includes a laser cutting mechanism, a limiting fixture, a limiting frame, and a slicing mechanism; the limiting fixture has an installation space for placing the slicing assembly, the limiting frame is spaced apart from the limiting fixture, and the emitting end of the laser cutting mechanism is suspended above the limiting fixture to emit a laser to separate the slices of the slicing assembly from the connecting plate; The slicing mechanism includes a lifting assembly, a traversing assembly, and a gripper assembly for holding the slices. The lifting assembly is connected to the traversing assembly to drive the traversing assembly to lift and lower. The traversing assembly is connected to the gripper assembly to drive the gripper assembly to move back and forth between the slicing assembly and the limiting frame.

2. The wafer splitting device after slicing a substrate ingot according to claim 1, characterized in that, The lifting assembly includes a first mounting frame, a first driving component, a first lead screw, and a first slider. The first mounting frame is mounted on the side of the limiting fixture facing the slice, and a first slide rail is provided on the first mounting frame. The first driving component is mounted on the first mounting frame. One end of the first lead screw is connected to the first driving component, and the other end is rotatably connected to the first mounting frame. The first slider is mounted on the first lead screw and slidably mounted on the first slide rail. The transverse component is mounted on the first slider.

3. The wafer splitting device after slicing a substrate ingot according to claim 1, characterized in that, The lateral movement assembly includes a second mounting bracket, a second driving component, a second lead screw, and a second slider. The lifting assembly is connected to the second mounting bracket, and a second slide rail is provided on the second mounting bracket. The second driving component is mounted on the second mounting bracket. One end of the second lead screw is connected to the second driving component, and the other end is rotatably connected to the second mounting bracket. The second slider is mounted on the second lead screw and slidably mounted on the second slide rail. The gripper assembly is mounted on the second slider.

4. The wafer splitting device after slicing a substrate ingot according to claim 1, characterized in that, The gripper assembly includes a third drive member and two gripping arms. The lateral movement assembly is connected to the third drive member, and the third drive member is connected to the two gripping arms to drive the two gripping arms to move towards or away from each other.

5. The substrate ingot slicing device according to claim 4, characterized in that, The clamping arm includes a first arm, a second arm, and a third arm. One end of the first arm is connected to the third driving member, and the other end of the first arm is connected to the third arm through the second arm. The second arm extends from the other end of the first arm in a direction away from the other first arm, and the second arm is perpendicular to the first arm. The third arm is horizontally arranged with respect to the first arm.

6. The wafer splitting device after slicing a substrate ingot according to claim 1, characterized in that, The laser cutting mechanism includes a third mounting bracket and a laser. The third mounting bracket is mounted on the side of the limiting fixture away from the connecting plate, and the laser is mounted on the third mounting bracket and suspended above the limiting fixture.

7. The wafer splitting device after slicing a substrate ingot according to claim 1, characterized in that, The limiting fixture includes at least two limiting blocks mounted on the mounting plane. Each limiting block has a first notch that engages with the connecting plate, and the two limiting blocks are spaced apart along a first direction to define the mounting space.

8. The substrate stripping device according to claim 7, characterized in that, The mounting space has a second notch for the gripper assembly to hold the slice.

9. The wafer splitting device after slicing a substrate ingot according to claim 1, characterized in that, The limiting frame includes two limiting plates mounted on the mounting plane, the two limiting plates are spaced apart, and the distance between the two limiting plates is greater than or equal to the width of the slice.

10. The substrate ingot slicing device according to claim 9, characterized in that, The limiting plate includes a first plate and a second plate, which are arranged perpendicularly to each other, and the first plate is spaced apart from another first plate to form a placement space. The two sides of the placement space that are perpendicular to the first direction are open.

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