A multi-band photonic polishing device based on spectral feedback

Abstract

The utility model discloses a kind of multi-band photon polishing devices based on spectrum feedback, including sealed cabin, multi-axis guide rail polishing system being located in sealed cabin, multi-axis guide rail polishing system makes workpiece along x, y, z three-axis linkage and can rotate;Sealed cabin top two sides stand from outside to inside sequentially arranged 1064nm laser and its collimation, beam expansion, galvanometer, field lens component and 355nm ultraviolet laser and its collimation, beam expansion, galvanometer, field lens component;Photon polishing head device cabin is built-in support rod and photon polishing head, photon polishing head integrates spectrum acquisition sensor;Sealed cabin is equipped with cabin pressure, oxygen concentration sensor;Spectrum feedback controller independent of laser system real-time acquisition surface spectrum and closed-loop regulation laser power, scanning speed and polishing head vibration parameter;Through infrared and ultraviolet laser cooperative heating and photon vibration polishing, realize defect suppression, residual stress regulation and control, surface hardness and wear resistance promotion, complete complex curved surface and microstructure's high efficiency low-damage polishing.

Description

Technical Field

[0001] This utility model belongs to the field of laser surface treatment technology, specifically relating to a multi-band photon polishing device based on spectral feedback, which is suitable for high-precision polishing of metal surfaces to improve the quality and performance of metal surfaces. Background Technology

[0002] As the requirements for surface quality of metal components in high-end manufacturing continue to increase, traditional methods such as mechanical polishing and single laser processing are no longer sufficient to meet the precision machining needs of complex curved surfaces, high-reflectivity materials, or highly consistent surface morphologies. Against this backdrop, laser-assisted polishing technology and precision vibration polishing technology have gradually become hot topics in research and industry.

[0003] Laser polishing is a non-contact surface treatment technology that primarily utilizes a high-energy-density laser beam to irradiate the material surface, causing the micro-protrusions to melt or vaporize, thereby achieving remelting and reconstruction and improving surface finish. This technology boasts advantages such as high forming speed, high control precision, and adaptability to complex geometric contours, and is widely used in mold repair and precision device manufacturing. However, laser polishing is essentially a thermal processing procedure, which can easily generate problems such as heat-affected zones and molten pool fluctuations. Especially in deep melting zones or after multiple scans, phenomena such as uneven microstructure, resolidification defects, and lattice distortion can easily occur, affecting the stability and reliability of the component's surface properties.

[0004] On the other hand, in order to avoid the difference in energy absorption rate of a single wavelength laser on different metals or composite materials, some technical solutions introduce dual-wavelength or multi-source collaborative processing. However, most of them are currently static combinations, lacking real-time response and adaptive adjustment capabilities, and still cannot effectively perceive and optimize the energy coupling state and material surface feedback information during the processing.

[0005] Meanwhile, traditional laser polishing devices are mostly open-loop systems with fixed processing paths and energy parameters, lacking a real-time feedback mechanism based on changes in processing conditions. This makes it difficult to adapt to the dynamic changes in material reactions during actual processing, especially when scanning large areas or processing irregular curved surfaces, which can easily lead to problems such as decreased processing consistency, localized overheating, or insufficient polishing. In addition, existing polishing systems often rely solely on laser thermal effects for surface reconstruction without combining methods for fine adjustment and strengthening of the material's microstructure, resulting in limited improvement in grain structure, surface stress state, and physical properties.

[0006] Therefore, there is an urgent need for a surface treatment device and method that integrates multi-band laser preprocessing, controllable photon vibration polishing, and a closed-loop control system based on spectral feedback, in order to achieve accurate identification of the surface condition of metal components, real-time adjustment of energy input, and comprehensive improvement of structural performance, thereby breaking through the limitations of traditional laser polishing technology and meeting the needs of high-quality and intelligent polishing processing under complex working conditions. Summary of the Invention

[0007] To address the shortcomings and deficiencies of the existing technology, the purpose of this invention is to provide a multi-band photonic polishing device based on spectral feedback. This device integrates multi-band laser synergistic heating, photonic vibration precision polishing, and real-time spectral feedback control technology, significantly improving the processing efficiency and quality stability of metal surfaces. It achieves intelligent sensing of processing status and adaptive process control, making it particularly suitable for efficient polishing of aerospace components and mold parts with extremely high surface quality requirements.

[0008] To achieve the above objectives, the present invention adopts the following technical solution:

[0009] A multi-band photonic polishing device based on spectral feedback includes a sealed chamber 2, a multi-axis guide rail polishing system disposed inside the sealed chamber 2, and a detection and sensing system disposed on the top of the sealed chamber 2.

[0010] The multi-axis guide rail polishing system includes a support 1, an x-direction guide rail 3 driven by a motor and movable in the x-direction, a clamping part 4 disposed in the z-direction of the support 1, a replaceable work panel 5 mounted on the clamping part 4, a fixture 6 mounted on the work panel 5, a y-direction guide rail 7 disposed on the x-direction guide rail 3 and movable in the y-direction, a photon polishing head device compartment 8 disposed on the y-direction guide rail 7 and movable in the z-direction, a support rod 9 extending from the photon polishing head device compartment 8, and a light... The photon polishing head 10 extends through the bottom of the chamber and contacts the workpiece surface. The photon polishing head 10 contains a spectral acquisition sensor. There are two columns on each side of the support 1. The infrared optical components arranged sequentially on the left column 11-1 include: a 1064nm laser 12, a 1064nm laser collimator 13, a 1064nm laser beam expander 14, a 1064nm laser adapter neck 15, a 1064nm laser galvanometer 16, and a 1064nm laser field lens 17. The ultraviolet optical components, including a 355nm laser 18, a 355nm laser collimator 19, a 355nm laser beam expander 20, a 355nm laser adapter 21, a 355nm laser galvanometer 22, and a 355nm laser field lens 23, are sequentially mounted on the right-side column 11-2. During installation, the workpiece is fixed to the work panel 5 by the clamp 6, the photon polishing head 10 is aligned with the workpiece, and the beam from the 1064nm laser 12 passes sequentially through the 1064nm laser collimator 13 and 144nm laser galvanometer 24. After collimation, beam expansion, and focusing by the 064nm laser beam expander 14, the beam then passes sequentially through the 1064nm laser galvanometer 16 and the 1064nm laser field lens 17 to cover the area of ​​the working panel 5. The beam of the 355nm laser 18 is collimated, expanded, and focused sequentially by the 355nm laser collimator 19 and the 355nm laser beam expander 20, and then passes sequentially through the 355nm laser galvanometer 22 and the 355nm laser field lens 23 to cover the area of ​​the working panel 5.

[0011] The top of the sealed chamber 2 is equipped with a chamber pressure detection sensor 24 and an oxygen concentration sensor 25. The outside of the sealed chamber 2 is equipped with a laser control system and a spectral feedback controller. The spectral feedback controller is connected to the photon polishing head device chamber 8 via wires. The spectral feedback controller is also connected to a spectral acquisition sensor to monitor the spectral signal during the polishing process in real time and provide feedback to control the parameters of the photon polishing head 10, thereby realizing the control and adjustment of the photon polishing head 10.

[0012] The sealed chamber 2 is an argon-sealed chamber, and an argon filling system is provided outside the sealed chamber to fill argon gas to create a low-oxygen working environment.

[0013] The support 1 and the sealed chamber 2 are fixedly connected by bolts. The photon polishing head device chamber 8 slides along the y-direction guide rail 7, and the y-direction guide rail 7 slides along the x-direction guide rail 3, forming xy dual-axis linkage. The support rod 9 drives the photon polishing head 10 to rise and fall along the z-axis to achieve three-axis spatial positioning.

[0014] Compared with the prior art, the present invention has the following advantages:

[0015] 1) Due to the multi-band collaborative structure of the 1064nm laser 12 (infrared laser), the 355nm laser 18 (ultraviolet laser) and the photonic polishing head 10, it can provide a composite processing capability of dual-wavelength laser pretreatment and high-frequency vibration polishing for different material properties, realize the synergistic effect of rough polishing and fine polishing, achieve defect suppression, residual stress control, surface hardness and wear resistance improvement, complete the efficient and low-damage polishing of complex curved surfaces and microstructures, and significantly improve the surface quality of anisotropic materials after polishing.

[0016] 2) Since the spectral feedback controller adjusts the laser energy density and photon polishing head parameters in real time based on the surface spectrum-roughness model, it can achieve closed-loop control for precise control of surface quality, significantly improving polishing consistency and reliability.

[0017] 3) Due to the combination structure of the three-axis linkage guide rail (x-direction guide rail 3, y-direction guide rail 7, photon polishing head device compartment 8) and the adjustable gap fixture 6, the multi-degree-of-freedom motion control can achieve all-round precise polishing of complex curved surfaces (such as edges, bevels, and gradient curvatures).

[0018] 4) Due to the sealed chamber 2 and its built-in chamber pressure detection sensor 24 and oxygen concentration sensor 25, the oxygen concentration in the processing environment is precisely controlled below 100ppm, which can effectively suppress the oxidation of materials during the high-temperature polishing process. Attached Figure Description

[0019] Figure 1 This is an isometric view of the multi-band photon polishing device based on spectral feedback of this utility model, including the external sealed chamber.

[0020] Figure 2 Axonometric drawing of the multi-band photon polishing device based on spectral feedback according to this utility model;

[0021] Figure 3 This is a front view of the multi-band photon polishing device based on spectral feedback according to this utility model;

[0022] Figure 4 This is a side view of the multi-band photon polishing device based on spectral feedback according to this utility model;

[0023] Figure 5This is a top view of the multi-band photon polishing device based on spectral feedback according to this utility model;

[0024] Figure 6 This is a schematic diagram illustrating the connection process between the sensor and external equipment in the processing device of this utility model.

[0025] Figure 7 The following is a flowchart illustrating the specific implementation steps of this utility model; Detailed Implementation

[0026] To make the objectives and technical solutions of this utility model clearer and easier to understand, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. The specific structures and control flows described in this embodiment are only for illustrating the present utility model and are not intended to limit the present utility model.

[0027] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, this utility model discloses a multi-band photon polishing device based on spectral feedback, including a sealed chamber 2, a multi-axis guide rail polishing system disposed inside the sealed chamber 2, and a detection and sensing system disposed on the top of the sealed chamber 2.

[0028] The multi-axis guide rail polishing system includes a support 1, an x-direction guide rail 3 driven by a motor and movable in the x-direction, a clamping part 4 in the z-direction, a replaceable work panel 5 mounted on the clamping part 4, a fixture 6 mounted on the work panel 5, a y-direction guide rail 7 on the x-direction guide rail 3 and movable in the y-direction, a photon polishing head housing 8 on the y-direction guide rail 7 and movable in the z-direction, a support rod 9 extending from the photon polishing head housing 8, and a photon polishing head 10. The photon polishing head 10 extends through the bottom of the housing and contacts the workpiece surface. A spectral acquisition sensor is installed inside the photon polishing head 10. There are two columns on each side of the support 1, and infrared optical groups are sequentially arranged on the left column 11-1. The components include: a 1064nm laser 12, a 1064nm laser collimator 13, a 1064nm laser beam expander 14, a 1064nm laser adapter 15, a 1064nm laser galvanometer 16, and a 1064nm laser field lens 17; the ultraviolet optical components arranged sequentially on the right column 11-2 include: a 355nm laser 18, a 355nm laser collimator 19, a 355nm laser beam expander 20, a 355nm laser adapter 21, a 355nm laser galvanometer 22, and a 355nm laser field lens 23; the laser beam path is introduced into the chamber through the beam slot provided on the side wall of the sealed chamber 2, and focused on the workpiece processing area to achieve surface pretreatment and auxiliary heating effects of lasers of different wavelengths. During installation, the workpiece is fixed on the work panel 5 by the clamp 6, the photon polishing head 10 is aligned with the workpiece, and the beam of the 1064nm laser 12 is collimated, expanded and focused by the 1064nm laser collimator 13 and the 1064nm laser beam expander 14 in sequence, and then passes through the 1064nm laser galvanometer 16 and the 1064nm laser field lens 17 in sequence to cover the area of ​​the work panel 5. The beam of the 355nm laser 18 is collimated, expanded and focused by the 355nm laser collimator 19 and the 355nm laser beam expander 20 in sequence, and then passes through the 355nm laser galvanometer 22 and the 355nm laser field lens 23 in sequence to cover the area of ​​the work panel 5.

[0029] The top of the sealed chamber 2 is equipped with a chamber pressure detection sensor 24 and an oxygen concentration sensor 25. The outside of the sealed chamber 2 is equipped with a laser control system and a spectral feedback controller. The spectral feedback controller is connected to the photon polishing head device chamber 8 via wires. The spectral feedback controller is also connected to a spectral acquisition sensor to monitor the spectral signal during the polishing process in real time and provide feedback to control the parameters of the photon polishing head 10, thereby realizing the control and adjustment of the photon polishing head 10.

[0030] Preferably, the sealed chamber 2 is an argon-sealed chamber, and an argon filling system is provided outside the sealed chamber to fill in an inert gas (such as argon) to create a low-oxygen working environment.

[0031] Preferably, the support 1 and the sealed chamber 2 are fixedly connected by bolts, the photon polishing head device chamber 8 slides along the y-direction guide rail 7, the y-direction guide rail 7 slides along the x-direction guide rail 3, forming xy dual-axis linkage; the support rod 9 drives the photon polishing head 10 to rise and fall along the z-axis to achieve three-axis spatial positioning.

[0032] Preferably, the support 1 is a metal frame structure with sufficient rigidity for mounting the sealed chamber 2. The sealed chamber 2 is a metal airtight structure.

[0033] like Figure 7 As shown, the working method of the multi-band photonic polishing device based on spectral feedback includes the following steps:

[0034] Step 1: Open the top cover of the sealed chamber 2. Before actual use, select the appropriate working panel 5 and fixture 6 according to the shape, size and material properties of the workpiece to be processed, and install them on the clamping parts 4. Fix the workpiece on the fixture 6 of the working panel 5, and set the clamping force and contact method of the fixture to ensure that the workpiece will not slide relative to the working panel 5 after starting.

[0035] Step 2: Start the argon filling system to replace the air in the sealed chamber, and monitor the data of oxygen concentration sensor 25 in real time. When the concentration is ≥100ppm, continue filling with argon; when the concentration is <100ppm, close the inlet and outlet ports. At the same time, the chamber pressure detection sensor 24 confirms that the ambient pressure is stable. The photon polishing head 10 has a built-in displacement sensor and temperature sensor, and its built-in spectral acquisition sensor collects the reflection signal of the workpiece surface in real time. When abnormal fluctuations such as abnormal resistance or amplitude deviation occur, the laser control system will immediately stop the operation of the equipment and record the abnormal fluctuations.

[0036] Step 3: When the concentration is <100ppm and the chamber pressure detection sensor 24 confirms that there is no abnormal fluctuation in the ambient pressure (fluctuation <±0.5%), the processing parameters are initialized, the workpiece 3D model is imported, the processing mesh is automatically divided into partitions, and the initial process parameters are set: 1064nm laser power, 355nm laser power, photon polishing head vibration frequency, target energy density, and roughness threshold.

[0037] Step 4: Dual-band laser collaborative preprocessing, rotating the 1064nm laser galvanometer 16 and the 355nm laser galvanometer 22 so that the two laser beams can simultaneously cover the polished area.

[0038] Step 5: Perform collimation, beam expansion and focusing processes on the 1064nm laser collimator 13 and 1064nm laser beam expander 14, as well as the 355nm laser collimator 19 and 355nm laser beam expander 20 in sequence, so that the two laser bands reach the energy density that meets the polishing requirements.

[0039] Step 6: In order to achieve the consistency of the laser processing trajectory and ensure the balance of energy density, the 1064nm laser field lens 17 and the 355nm laser field lens 23 shall be executed at the predetermined scanning speed.

[0040] Step 7: Determine whether the current zone meets the polishing requirements based on the spectral data. The determination condition is whether the average spectral reflection intensity of the area reaches the target reference value. If it reaches the reference value, the area will be automatically determined as "processed".

[0041] Step 8: If the average spectral reflection intensity of the area does not reach the target reference value, the area will be automatically determined as "not yet processed";

[0042] Step 9: After adjusting the polishing parameters of the photon polishing head, repeat steps 3-7. If the area is determined to be "processing complete", then exit the loop and jump to the next section.

[0043] Step 10: When all zones reach the "processing complete" condition, turn off the laser, exhaust the argon gas, open fixture 6, and remove the workpiece that has been laser polished.

[0044] During processing, a spectral feedback controller located outside the device receives signals from the device and provides parameter feedback to the photon polishing head 10. The support rod 9 adjusts the position of the photon polishing head 10 in real time according to processing requirements, ensuring appropriate contact and force between it and the workpiece surface. Simultaneously, the system records current spectral curves, processing parameters, and abnormal states, automatically storing this information as a processing log for process tracking and subsequent optimization.

[0045] This invention revolutionizes traditional surface treatment equipment by adding a spectral feedback controller, which can precisely adjust the parameters of the photon polishing head according to the spectral signal to achieve fine processing; it can flexibly switch working modes on the same platform; after installation, it is easy to calibrate parameters, improve processing stability, and bring convenience to material processing in the manufacturing industry.

Claims

1. A multi-band photonic polishing device based on spectral feedback, characterized by: Includes a sealed chamber (2), a multi-axis guide rail polishing system installed inside the sealed chamber (2), and a detection sensing system installed on the top of the sealed chamber (2); The multi-axis guide rail polishing system includes a support (1), an x-direction guide rail (3) driven by a motor and movable in the x-direction of space, a clamping part (4) in the z-direction of the support (1), a replaceable work panel (5) mounted on the clamping part (4), a fixture (6) mounted on the work panel (5), a y-direction guide rail (7) on the x-direction guide rail (3) and movable in the y-direction, a photon polishing head device compartment (8) on the y-direction guide rail (7) and movable in the z-direction, a support rod (9) extending out of the photon polishing head device compartment (8), and a photon polishing head (10). The photon polishing head (10) extends through the bottom of the compartment and contacts the workpiece surface. A spectral acquisition sensor is placed inside the photon polishing head (10). The base (1) has two pillars on each side. The infrared optical components arranged in sequence on the left pillar (11-1) include: a 1064nm laser (12), a 1064nm laser collimator (13), a 1064nm laser beam expander (14), a 1064nm laser adapter (15), a 1064nm laser galvanometer (16), and a 1064nm laser field lens (17); the ultraviolet optical components arranged in sequence on the right pillar (11-2) include: a 355nm laser (18), a 355nm laser collimator (19), a 355nm laser beam expander (20), a 355nm laser adapter (21), a 355nm laser galvanometer (22), and a 355nm laser field lens (23). The top of the sealed chamber (2) is equipped with a chamber pressure detection sensor (24) and an oxygen concentration sensor (25). The outside of the sealed chamber (2) is equipped with a laser control system and a spectral feedback controller. The spectral feedback controller is connected to the photon polishing head device chamber (8) via wires. The spectral feedback controller is also connected to a spectral acquisition sensor to monitor the spectral signal during the polishing process in real time and provide feedback to control the parameters of the photon polishing head (10), thereby realizing the control and adjustment of the photon polishing head (10).

2. A multi-band photonic polishing device based on spectral feedback according to claim 1, characterized in that: The sealed chamber (2) is an argon-sealed chamber, and an argon filling system is provided outside the sealed chamber to fill argon gas to create a low-oxygen working environment.

3. The multi-band photonic polishing device based on spectral feedback according to claim 1, wherein: The support (1) and the sealed chamber (2) are fixed together by bolts. The photon polishing head device chamber (8) slides along the y-direction guide rail (7) and the y-direction guide rail (7) slides along the x-direction guide rail (3) to form xy dual-axis linkage. The support rod (9) drives the photon polishing head (10) to rise and fall along the z-axis to achieve three-axis spatial positioning.

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