Switch product BGA repair air port mechanism

Abstract

The utility model discloses an exchange product BGA repair air port mechanism, including repair air port, even wind steel mesh, magnetic attraction interface and spiral flow guide plate, realize the integrated thermocouple and infrared sensor of even temperature control module of air temperature difference even of through vortex airflow and even wind design, and the temperature is dynamically adjusted in combination with PID algorithm, and the outside of air outlet mouth is equipped with annular cooling air groove and cold gas pipe, and supports the quick cooling after welding. The mechanism realizes the quick replacement of air outlet mouth through magnetic attraction interface, adapts to different BGA chip size, has the advantages of even heating, accurate temperature control, high -efficient heat dissipation and convenient operation, and the repair success rate and production efficiency are improved significantly.

Description

Technical Field

[0001] This utility model relates to the technical field, specifically a BGA rework vent mechanism for a switch product. Background Technology

[0002] Currently, it is a core switching device with professional performance in the industry. A single unit can provide 3072 line-speed 10G / 25G ports and 768 line-speed 40G / T+ level core ports, providing ultra-high density 10G / 25G and high density 40G / T+ level core access capabilities. It is also the first switch to integrate three technologies: IRF2 (second-generation intelligent elastic architecture), IRF3.1 (third-generation intelligent elastic architecture upgrade), and MDC (multi-tenant device environment), meeting the requirements of cloud computing data center virtualization, truly realizing network device resource pooling, and providing users with flexible choices. Facing the burst traffic of next-generation data centers, it innovatively adopts "distributed ingress caching" technology, which can achieve 200ms data caching, meeting the requirements of burst traffic in data centers, high-performance computing, and other networks. At the same time, it supports independent control engines, detection engines, and maintenance engines, providing the system with powerful control capabilities and 50ms high reliability guarantee.

[0003] With significant performance improvements in electronic devices such as chips, coupled with ever-increasing physical BGA sizes, the power consumption of these devices has increased dramatically. To address manufacturing defects (solder bridging, open circuits, floating solder joints), repair is crucial. Larger BGA sizes, higher device density, and heavier products present greater repair challenges. During repair heating, the internal temperature difference of the BGA needs to be controlled within 5°C, requiring highly uniform airflow and heating from the BGA vents. Exceeding this requirement can cause substrate deformation due to the misalignment between the BGA and the substrate, leading to poor soldering during the non-coplanar bonding process.

[0004] Therefore, there is an urgent need for a BGA rework vent mechanism for switch products to solve the above-mentioned technical problems. Traditional BGA rework equipment often uses a fixed vent structure, resulting in uneven heat distribution, which can easily lead to localized overheating or underheating, causing thermal damage to the PCB board or adjacent components. The vents have poor size compatibility with the BGA chips, requiring frequent tool changes for different chip sizes, making the operation cumbersome. There is a lack of precise temperature control feedback, relying on manual experience to adjust airflow and temperature, resulting in a low rework success rate. Furthermore, the heat dissipation efficiency is low, and the cooling time after rework is long, affecting production efficiency.

[0005] To address this issue, this technical solution designs a BGA rework vent mechanism for switch products to solve the aforementioned problems. Utility Model Content

[0006] The purpose of this utility model is to provide a BGA repair air vent mechanism for switch products to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: A BGA rework vent mechanism for a switch product includes a rework vent. The rework vent has a rectangular vent housing. A uniform air distribution steel mesh is installed in the middle of the vent housing to uniformly diffuse the flowing gas. A magnetic interface installed at the air inlet of the rework vent is connected to one side of the uniform air distribution steel mesh. An air inlet channel is magnetically connected to one side of the magnetic interface. The air outlet side of the rework vent is positioned above the BGA chip to apply uniform hot air to the BGA chip for heating the BGA solder joints. The air intake channel adopts a multi-section detachable structure with a spiral guide plate inside. An air outlet is located at the bottom of the main air duct. The spiral guide plate guides the hot air to spread in a vortex towards the air outlet. The bottom of the air outlet is equipped with a size adapter ring with magnetic adsorption function. The size adapter ring is magnetically connected to the magnetic interface, which facilitates quick replacement of air outlets of different sizes to match different BGA chips. A temperature control module is set on one side of the BGA chip. The temperature control module integrates a miniature thermocouple and an infrared temperature sensor to monitor the temperature of the air outlet shell and the surface temperature of the BGA chip in real time, and dynamically adjusts the heating power through a PID algorithm. A ring-shaped cooling air channel is provided on the outside of the air outlet. The outside of the ring-shaped cooling air channel is connected to a cold air pipe. The cold air pipe is equipped with a control valve. By inputting external cold air into the ring-shaped cooling air channel along the cold air pipe, and then transferring it to the BGA chip through the air outlet and the diffusion of the uniform air mesh, the BGA chip after soldering and packaging is rapidly cooled down.

[0008] Compared with the prior art, the beneficial effects of this utility model are: by forming a vortex airflow through the uniform airflow steel mesh and spiral guide plate, the outlet air temperature is evenly distributed, avoiding substrate deformation caused by internal thermal stress of BGA, and reducing defects such as solder bridging and open solder joints.

[0009] The air outlet can be replaced in seconds via a magnetic interface and size adapter ring, matching different BGA chips and improving operational efficiency.

[0010] By combining a temperature control module with miniature thermocouples (contact type) and infrared sensors (non-contact type), and using a PID algorithm to adjust the heating power in real time, the reliance on human experience is reduced, and the repair success rate is increased by more than 90%.

[0011] Cool air is injected through a ring-shaped cooling duct and a cooling pipe, and then diffused through a uniform air mesh to quickly cool the solder joints, reducing the cooling time by a percentage and preventing thermal damage to the PCB board. Attached Figure Description

[0012] Figure 1This is a schematic diagram showing the distribution structure between the BGA rework air vent mechanism, the main air duct, and the BGA package of a switch product.

[0013] Figure 2 This is a schematic diagram of the rework air vent structure in the BGA rework air vent mechanism of a switch product.

[0014] The components include: main air duct 10, air outlet 11, rework air outlet 12, BGA package substrate 13, BGA chip 14, temperature control module 15, spiral guide plate 16, air outlet shell 17, air distribution steel mesh 18, magnetic interface 19, annular cooling air channel 20, and cold air pipe 21. Detailed Implementation

[0015] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0016] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0017] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0018] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0019] Please see Figures 1-2A BGA rework vent mechanism for a switch product includes a rework vent 12. The rework vent 12 includes a rectangular vent housing 17. A uniform air distribution steel mesh 18 is installed in the middle of the vent housing 17 to uniformly diffuse the flowing gas. A magnetic interface 19 installed at the air inlet of the rework vent 12 is connected to one side of the uniform air distribution steel mesh 18. An air inlet channel is magnetically connected to one side of the magnetic interface 19. The air outlet side of the rework vent 12 is located above the BGA chip 14 to apply uniform hot air to the BGA chip 14 for heating the BGA solder joints. The air intake channel adopts a multi-section detachable structure, with a spiral guide plate 16 inside. The bottom of the main air duct 10 is equipped with an air outlet 11. The spiral guide plate 16 guides the hot air to spread towards the air outlet 11 in a vortex state. The bottom of the air outlet 11 is equipped with a size adapter ring with magnetic adsorption function. The size adapter ring is magnetically connected to the magnetic interface 19, which facilitates the quick replacement of air outlets 11 of different sizes to match different sizes of BGA chips 14. A temperature control module 15 is provided on one side of the BGA chip 14. The temperature control module 15 integrates a miniature thermocouple and an infrared temperature sensor to monitor the air outlet temperature of the air outlet shell 17 and the surface temperature of the BGA chip 14 in real time, and dynamically adjusts the heating power through a PID algorithm. An annular cooling air channel 20 is provided on the outside of the air outlet 11. A cold air pipe 21 is connected to the outside of the annular cooling air channel 20. A control valve is provided on the cold air pipe 21. External cold air is input into the annular cooling air channel 20 along the cold air pipe 21, and then transferred to the BGA chip 14 by the diffusion of the air outlet 11 and the uniform air mesh 18, so as to rapidly cool down the soldered and packaged BGA chip 14.

[0020] In this embodiment of the invention, a BGA packaging substrate 13 is provided at the bottom of the BGA chip 14. When the rework air vent 12 applies high-temperature gas to the BGA chip 14, it solders and packages the BGA packaging substrate 13 together with the BGA chip 14. The main air duct has a detachable structure of more than 10 sections, which can be connected by flanges, sockets, or clamps. The specific choice can be determined according to the actual situation, and will not be elaborated here.

[0021] The main air duct 10 is equipped with a check valve to prevent backflow of gas delivered toward the air outlet 11 or cold air injected along the annular cooling air groove 20.

[0022] In one embodiment of the present invention, a miniature thermocouple and an infrared temperature sensor are used. The miniature thermocouple directly contacts the surface of the BGA chip 14 to monitor the chip's physical temperature, while the infrared temperature sensor non-contactly monitors the outlet temperature of the vent housing 17. The miniature thermocouple is connected to a signal conditioning circuit (amplification / filtering) via a high-temperature resistant wire, and its output is connected to the ADC pin of the MCU (such as the 12-bit ADC of STM32) to be converted into a digital temperature value.

[0023] Infrared sensors are directly connected to an MCU (such as TMP007) via an I²C / SPI digital interface, or converted into analog signals via an ADC. They are installed near the air vent with the lens aimed at the monitoring area. The PID control algorithm operates by dynamically adjusting the output to minimize the error between the target temperature and the actual temperature. It is a conventional control algorithm and will not be elaborated upon here.

[0024] The working principle of this utility model is as follows: In the idle position of this device, all the aforementioned driving components (representing power elements, electrical devices, and compatible power supplies) are connected via wires. The electrical connections are completed in sequence between the working components. The detailed connection methods are well-known in the field. The following mainly describes the working principle and process, without further explanation of the electrical control. Heating stage: Hot air enters through the main air duct 10 and is guided by the spiral guide plate 16 to form a vortex airflow; Airflow enters the repair air outlet 12 through the air outlet 11 and the magnetic interface 19; The uniform airflow steel mesh 18 evenly diffuses hot air onto the surface of the BGA chip 14 to heat the solder joints. The temperature control module 15 monitors the BGA chip temperature and the outlet air temperature in real time, and dynamically adjusts the heating power through a PID algorithm to ensure that the temperature difference is ≤5℃.

[0025] Cooling phase: After welding is completed, the control valve of the cold air pipe 21 is opened, and external cold air is injected into the annular cooling air channel 20; Cool air is delivered through the air outlet 11 to the uniform air distribution steel mesh 18, which evenly covers the BGA chip 14 to achieve rapid cooling. The check valve prevents cold air from flowing back and ensures that the airflow is unidirectional.

[0026] Adaptation and maintenance: When changing the BGA chip specification, remove the air outlet 11 at the magnetic interface 19 and replace it with a component of the appropriate size; The main air duct 10 has a multi-section structure that can be disassembled and maintained to ensure long-term stability.

[0027] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A BGA rework vent mechanism for a switch product, characterized in that, It includes a repair air vent (12), which is composed of an air vent shell (17). A uniform air mesh (18) is installed in the middle of the air vent shell (17). One side of the mesh is connected to the air inlet channel through a magnetic interface (19), and the air outlet side is located above the BGA chip (14). The air inlet channel is provided with a spiral guide plate (16), and the bottom of the main air duct (10) is provided with an air outlet (11). The air outlet (11) guides the hot air to form a vortex diffusion through the spiral guide plate (16). The bottom of the air outlet (11) is provided with a size-adaptive ring for magnetic adsorption, which is magnetically connected to the magnetic interface (19).

2. The BGA rework vent mechanism for a switch product according to claim 1, characterized in that, The BGA chip (14) is provided with a temperature control module (15) on its side. The temperature control module (15) integrates a miniature thermocouple and an infrared temperature sensor. The miniature thermocouple contacts the surface of the BGA chip (14), and the infrared temperature sensor monitors the air outlet temperature of the air vent housing (17).

3. The BGA rework vent mechanism for switch products according to claim 2, characterized in that, The temperature control module (15) dynamically adjusts the heating power through a PID algorithm. The miniature thermocouple is connected to the ADC pin of the MCU through a signal conditioning circuit. The infrared temperature sensor is directly connected to the MCU through an I²C / SPI interface or an ADC converter.

4. The BGA rework vent mechanism for a switch product according to claim 1, characterized in that, The air outlet (11) is provided with an annular cooling air groove (20) on the outside. The annular cooling air groove (20) is connected to an external cold air source through a cold air pipe (21). A control valve is provided on the cold air pipe (21).

5. The BGA rework vent mechanism for a switch product according to claim 1, characterized in that, The main air duct (10) adopts a multi-section disassembly structure, and the connection method is flange connection, socket connection or clamp connection, and a check valve is provided inside to prevent gas backflow.

6. The BGA rework vent mechanism for a switch product according to claim 1, characterized in that, The hot air applied by the rework air vent (12) is evenly diffused to the BGA chip (14) through the uniform air mesh (18), and then welded and packaged together with the BGA packaging substrate (13).

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