Automatic identification, detection and rejection device for broken silicon wafers

Abstract

This utility model provides an automatic identification, detection, and rejection device for damaged silicon wafers, relating to the field of silicon wafer inspection. It includes a collection shell, a top plate frame, and an air pipe. A cylinder is installed at the end of the air pipe, and a base frame is installed at the top of the cylinder's telescopic rod. A conveyor bracket is installed at the top of the base frame. A conveyor motor is installed on the left side of the conveyor bracket, and an active rotating roller is mounted on the motor shaft of the conveyor motor. A belt is nested on the outer side of the active rotating roller. A light panel is installed on the lower side of the top plate frame, and a through hole is provided at the center of the top plate frame, within which a vision camera is installed. A waste box is placed on the inner side of the rectangular trough structure of the collection shell. Through the arrangement of the vision camera, belt, cylinder, waste box, conveyor motor, and active rotating roller, automated detection and rejection of damaged silicon wafers is achieved, solving the problem of visual fatigue among inspectors caused by prolonged manual visual inspection during traditional silicon wafer conveying, leading to misdetection and missed detection of damaged silicon wafers.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer inspection, and more specifically, it relates to an automatic identification, detection and rejection device for damaged silicon wafers. Background Technology

[0002] Silicon wafers are thin semiconductor sheets cut from monocrystalline silicon, and they are the foundational material for the modern semiconductor and photovoltaic industries. Currently, to ensure the quality of silicon wafers and prevent damaged products from being conveyed onto the production line of electrical equipment, quality control personnel typically need to visually inspect the silicon wafers on the production line. When inspectors find damaged silicon wafers moving on the conveyor belt, they remove the damaged wafers from the conveyor belt and discard them into a waste bin. This demonstrates that traditional manual inspection methods place extremely high demands on the visual concentration of inspectors. They need to maintain a highly focused state for extended periods, closely monitoring each group of silicon wafers moving on the conveyor belt. This high-intensity visual observation leads to rapid eye muscle fatigue, significantly reducing the inspectors' visual acuity and making it difficult for them to detect surface cracks on the silicon wafers. This increases the risk of damaged products and reduces the overall quality of the silicon wafers. Utility Model Content

[0003] To address the aforementioned technical problems, this invention provides an automatic identification, detection, and rejection device for damaged silicon wafers, thereby resolving the issue of misdetection and missed detection of damaged silicon wafers caused by visual fatigue of inspectors during prolonged manual visual inspection in traditional silicon wafer transportation.

[0004] This utility model provides an automatic identification, detection, and rejection device for damaged silicon wafers, including a base plate; a collection shell is welded to the upper side of the base plate, and a guide frame is bolted to the upper side of the base plate; a vertical frame is bolted to the left side of the guide frame; a control unit and an air pump are installed on the left side of the vertical frame, and a top plate frame is installed on the right side of the vertical frame; it also includes an air pipe, a pressure rod, and a threaded rotating rod; an air pump is installed at one end of the air pipe, and a cylinder is installed at the other end of the air pipe; a base frame is installed at the top of the telescopic rod of the cylinder, and a conveying bracket is installed at the top of the base frame; the conveying... The front end of the conveying bracket is rotatably connected to an active roller, and the rear end of the conveying bracket is rotatably connected to a driven roller. A belt is nested on the outer side of the driven roller. A conveying motor is installed on the left side of the conveying bracket, and an active roller is installed on the motor shaft of the conveying motor. A belt is nested on the outer side of the active roller. A tension adjustment knob is welded to the top of the threaded rod. A base frame is rotatably connected to the outer side of the threaded rod, and a guide post is welded to the left end of the base frame. A sleeve is rotatably connected to the outer side of the pressure rod, and a belt is nested on the outer side of the sleeve. Lifting blocks are welded to both the left and right ends of the pressure rod.

[0005] Furthermore, the collection shell is a rectangular groove structure with an opening on the upper side. A speaker is installed on the rear side of the collection shell. A waste box is placed on the inner side of the rectangular groove structure of the collection shell. A pull handle is installed on the left side of the waste box. A rectangular through slot is provided on the left side of the rectangular groove structure of the collection shell. The waste box and the rectangular through slot of the collection shell are opposite each other. A through-hole groove is provided on the front side of the collection shell near the top. An infrared sensor is installed on the bottom side of the groove. The infrared sensor is connected to the controller via a wire.

[0006] Furthermore, the number of lifting blocks is two sets, with each set of lifting blocks symmetrically distributed left and right. The center of the right lifting block is provided with a threaded through hole that runs vertically through the center, and the center of the left lifting block is provided with a through hole that runs vertically through the center. The outer side of the threaded rotating rod is threadedly engaged in the threaded through hole of the right lifting block, and the guide post is inserted into the through hole of the left lifting block.

[0007] Furthermore, the guide frame is an inverted U-shaped structure. A circular through hole is provided at the center of the upper side of the guide frame. The telescopic rod of the cylinder is inserted into the circular through hole of the guide frame. Long through slots are provided on both the left and right sides of the circular through hole of the guide frame. Guide plates are inserted into the long through slots of the guide frame. The top of the guide plate is connected to the base frame by bolts.

[0008] Furthermore, a light panel is installed on the lower side of the top plate frame, and a through hole is provided in the center of the top plate frame. A vision camera is installed in the through hole of the top plate frame. The vision camera is vertically opposite to the belt mounted on the conveyor bracket, and the vision camera is connected to the control unit through a wire.

[0009] Furthermore, the light panel has a circular structure, and thirty sets of LED light stickers are installed on the lower side of the light panel. The LED light stickers are arranged in a circular array around the vertical central axis of the circular structure of the light panel, and the visual camera is located at the center of the circular structure of the light panel.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] 1. In this utility model, a vision camera captures images of silicon wafers placed on a conveyor belt. After the controller identifies the damage to the silicon wafers by comparing the captured images, it controls the air pump to supply air to the cylinder. The telescopic rod of the cylinder moves the silicon wafers placed on the conveyor belt to the front of the groove in the collection shell through the base frame and the conveyor bracket. Then, the conveyor motor drives the belt nested on the outer side of the active roller to push the silicon wafers to the waste box. This achieves automated rejection of damaged silicon wafers, avoiding the situation of missed or incorrect detection of damaged silicon wafers due to visual fatigue in traditional manual inspection. This greatly improves the accuracy of silicon wafer inspection and enhances the overall quality of silicon wafer products. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model.

[0013] Figure 2 This is a schematic diagram of the left side view of this utility model.

[0014] Figure 3 This is a schematic diagram of the structure of this utility model from a bottom view.

[0015] Figure 4 This is a front view structural diagram of this utility model.

[0016] Figure 5 This is a cross-sectional structural diagram of the present invention.

[0017] Figure 6 This is the utility model Figure 5 Enlarged structural diagram of part A in the middle.

[0018] Figure 7 This is a schematic diagram of the rear side view of this utility model.

[0019] Figure 8 This is an electrical principle block diagram of this utility model.

[0020] Reference numerals: 1. Base plate; 2. Collection shell; 3. Sound unit; 4. Guide frame; 5. Cylinder; 6. Air pipe; 7. Waste box; 8. Driven roller; 9. Conveying bracket; 10. Driven roller; 11. Vision camera; 12. Top plate frame; 13. Control unit; 14. Air pump; 15. Guide plate; 16. Belt; 17. Conveying motor; 18. Sleeve; 19. Pressure rod; 20. Base frame; 21. Lifting block; 22. Tension adjustment knob; 23. Threaded rotating rod; 24. Infrared sensor; 25. Light panel; 26. Stand; 27. Pull handle; 28. Guide column. Detailed Implementation

[0021] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0022] like Figures 1-8As shown, this utility model provides an automatic identification, detection, and rejection device for damaged silicon wafers, including a base plate 1; a collection shell 2 is welded to the upper side of the base plate 1, a guide frame 4 is bolted to the upper side of the base plate 1, and a stand 26 is bolted to the left side of the guide frame 4; a control unit 13 and an air pump 14 are installed on the left side of the stand 26, and a top plate frame 12 is installed on the right side of the stand 26; it also includes an air pipe 6, a pressure rod 19, and a threaded rotating rod 23; an air pump 14 is installed at one end of the air pipe 6, and a cylinder 5 is installed at the other end of the air pipe 6; a base frame 20 is installed at the top of the telescopic rod of the cylinder 5, and a conveying bracket 9 is installed at the top of the base frame 20; the conveying bracket 9... The front end is rotatably connected to an active roller 10, and the rear end of the conveyor support 9 is rotatably connected to a driven roller 8. A belt 16 is nested on the outer side of the driven roller 8. A conveyor motor 17 is installed on the left side of the conveyor support 9. An active roller 10 is installed on the motor shaft of the conveyor motor 17. A belt 16 is nested on the outer side of the active roller 10. A tension adjustment knob 22 is welded to the top of the threaded rod 23. A base frame 20 is rotatably connected to the outer side of the threaded rod 23. A guide post 28 is welded to the left end of the base frame 20. A sleeve 18 is rotatably connected to the outer side of the pressure rod 19. A belt 16 is nested on the outer side of the sleeve 18. Lifting blocks 21 are welded to both the left and right ends of the pressure rod 19.

[0023] In this embodiment of the utility model, the collection shell 2 is a rectangular groove structure with an opening on the upper side. A speaker 3 is installed on the rear side of the collection shell 2. A waste box 7 is placed on the inner side of the rectangular groove structure of the collection shell 2. A pull handle 27 is installed on the left side of the waste box 7. A rectangular through groove is provided on the left side of the rectangular groove structure of the collection shell 2. The waste box 7 and the rectangular through groove of the collection shell 2 are opposite each other. The waste box 7 can be pulled out to the left from the rectangular through groove of the collection shell 2. After completion, the waste box 7 collects and removes the broken silicon wafers in a unified manner. The front side of the collection shell 2 has an opening groove that runs through the front and back near the top. An infrared sensor 24 is installed on the bottom side of the opening groove. The infrared sensor 24 is connected to the controller 13 through a wire. The infrared sensor 24 emits infrared light to count the broken silicon wafers that fall into the waste box 7 and transmits the counting signal to the controller 13. When the number of collected wafers is close to the full value, the controller 13 controls the speaker 3 to emit an alarm sound through the wire to prevent the silicon wafers in the waste box 7 from overflowing.

[0024] In this embodiment of the utility model, there are two sets of lifting blocks 21, each set of lifting blocks 21 is symmetrically distributed on the left and right. The center of the right lifting block 21 is provided with a threaded through hole that runs vertically through the center, and the center of the left lifting block 21 is provided with a through hole that runs vertically through the center. The outer side of the threaded rotating rod 23 is threadedly engaged in the threaded through hole of the right lifting block 21. The guide post 28 is inserted into the through hole of the left lifting block 21. During the rotation of the threaded rotating rod 23, it drives the pressure rod 19 welded to the lifting block 21 to move downward. The pressure rod 19 drives the sleeve 18 rotatably connected to the outer side to simultaneously squeeze the belt 16 nested on the outer side downward, thereby realizing the tension adjustment of the belt 16, ensuring that the belt 16 is tightly attached to the driven roller 8 and the active roller 10, and ensuring the stability of the belt 16 in conveying the silicon wafer.

[0025] In this embodiment of the utility model, the guide frame 4 is an inverted U-shaped structure. A circular through hole is provided at the center of the upper side of the guide frame 4. The telescopic rod of the cylinder 5 is inserted into the circular through hole of the guide frame 4. Long through slots are provided on both the left and right sides of the circular through hole of the guide frame 4. A guide plate 15 is inserted into the long through slot of the guide frame 4. The top of the guide plate 15 is connected to the base frame 20 by bolts. During the process of the telescopic rod of the cylinder 5 pushing and pulling the base frame 20 to move up and down, the sliding insertion structure formed by the guide plate 15 in the long through slot of the guide frame 4 provides directional support for the base frame 20, allowing the conveyor bracket 9 to move up and down with the belt 16 in a directional manner, avoiding horizontal deflection of the conveyor bracket 9, and ensuring that the belt 16 and the external conveyor belt remain aligned in the front and back direction during the process of the belt 16 rising and falling with the base frame 20.

[0026] In this embodiment of the utility model, a light panel 25 is installed on the lower side of the top plate frame 12. A through hole is provided in the center of the top plate frame 12, and a vision camera 11 is installed in the through hole of the top plate frame 12. The vision camera 11 and the belt 16 mounted on the conveyor bracket 9 are vertically opposite each other. The vision camera 11 is connected to the control unit 13 through a wire. The vision camera 11 takes pictures of the silicon wafers placed on the belt 16 and transmits the captured images to the control unit 13 through the wire for image comparison and analysis. When the control unit 13 finds that there is a broken silicon wafer in the captured image, the control unit 13 controls the air supply pump 14 to start through the wire. The air supply pump 14 controls the cylinder 5 through the air pipe 6 to drive the belt 16 mounted on the conveyor bracket 9 to move downward to the opening groove of the collection shell 2, so that the belt 16 pushes the unqualified silicon wafers into the waste box 7, thereby completing the silicon wafer rejection work.

[0027] In this embodiment of the utility model, the lamp board 25 has a circular structure, and thirty sets of LED light stickers are installed on the lower side of the lamp board 25. The LED light stickers are arranged in a circular array around the vertical central axis of the circular structure of the lamp board 25. The visual camera 11 is located at the center of the circular structure of the lamp board 25. The thirty sets of LED light stickers of the lamp board 25 provide shadowless illumination for the silicon wafer placed on the belt 16, so that the scratches and defects on the surface of the silicon wafer are clearly displayed, providing a clear image for accurate detection.

[0028] Specific usage and function of this utility model embodiment:

[0029] In the automatic detection, identification, and rejection of damaged silicon wafers, the control unit 13 starts the conveyor motor 17 via a wire. The conveyor motor 17 drives the active roller 10 to rotate. Since the belt 16 is nested on the outer side of the active roller 10 and the driven roller 8, when the external conveyor belt moves the silicon wafer to the belt 16, the belt 16 moves the silicon wafer directly below the vision camera 11. At this time, the vision camera 11 takes a picture of the silicon wafer placed on the belt 16, and transmits the captured image to the control unit 13 via a wire. The control unit 13 then transmits the image... The analysis and processing module compares the captured image with the image of a qualified product. When the image analysis and processing module of the control unit 13 determines that the captured image is a qualified product, the belt 16 moves the silicon wafer to the next conveyor belt. When the image analysis and processing module of the control unit 13 determines that the captured image is a defective product, the control unit 13 controls the air supply pump 14 to start via a wire. The air supply pump 14 controls the telescopic rod of the cylinder 5 via the air pipe 6 to move the base frame 20 downward. The base frame 20 then moves the conveyor support 9 downward until the belt 16 and the front opening groove of the collection shell 2 are aligned. The belt 16 moves the silicon wafers to the opening groove of the collection shell 2. The silicon wafers fall into the waste box 7 by gravity. Then, the telescopic rod of the cylinder 5 moves the base frame 20 upward until the belt 16 is horizontally aligned with the external conveyor belt, thus completing the automatic detection, identification, and rejection of damaged silicon wafers. During the process of the silicon wafers falling into the waste box 7, the infrared sensor 24 performs infrared irradiation sensing and counting of the silicon wafers. The infrared sensor 24 transmits the counting signal to the counting module of the control unit 13 through wires. The counting module of the control unit 13 counts the number of silicon wafers falling into the waste box 7. The record shows that when the number of silicon wafers approaches the maximum storage capacity, the controller 13 controls the speaker 3 to play an alarm sound to alert the user. If it is necessary to adjust the tension of the belt 16, the tension adjustment knob 22 is manually turned. The tension adjustment knob 22 drives the threaded rod 23. Since the threaded rod 23 is threadedly connected to the threaded through hole of the right lifting block 21, the threaded rod 23 drives the pressure rod 19 welded to the lifting block 21 to move downward. The sleeve 18 rotatably connected to the outer side of the pressure rod 19 pushes the belt 16 downward, thereby increasing the tension of the belt 16.

[0030] All the above components are installed, connected, or set up using common mechanical methods, such as welding, threaded connections, and screw connections. Furthermore, the specific structure, model, and coefficient specifications of all components are based on their own technologies, and any method that achieves the desired effect can be implemented. The audio unit 3, cylinder 5, vision camera 11, control unit 13, air pump 14, conveyor motor 17, and infrared sensor 24 mentioned above are all common commercially available components. Upon purchase and use, simply connect them according to the instruction manual provided with the purchase; therefore, further details are omitted here.

[0031] The technical solution of this utility model is not limited to the scope of the embodiments of this utility model. All technical contents not described in detail in this utility model are known technologies.

Claims

1. An automatic identification, detection, and rejection device for damaged silicon wafers, comprising a base plate (1); a collection shell (2) is welded to the upper side of the base plate (1), a guide frame (4) is bolted to the upper side of the base plate (1), and a stand (26) is bolted to the left side of the guide frame (4); a control unit (13) and an air supply pump (14) are installed on the left side of the stand (26), and a top plate frame (12) is installed on the right side of the stand (26); characterized in that: It also includes an air pipe (6), a pressure rod (19), and a threaded rotating rod (23); one end of the air pipe (6) is equipped with an air supply pump (14), and the other end of the air pipe (6) is equipped with a cylinder (5). The top of the telescopic rod of the cylinder (5) is equipped with a base frame (20), and the top of the base frame (20) is equipped with a conveying bracket (9); the front end of the conveying bracket (9) is rotatably connected to a driving roller (10), and the rear end of the conveying bracket (9) is rotatably connected to a driven roller (8). The outer side of the driven roller (8) is nested with a belt (16), and the left side of the conveying bracket (9) is equipped with a conveyor belt. A conveyor motor (17) is provided, and an active roller (10) is installed on the motor shaft of the conveyor motor (17). A belt (16) is nested on the outer side of the active roller (10). A tension adjustment knob (22) is welded to the top of the threaded rod (23). A base frame (20) is rotatably connected to the outer side of the threaded rod (23). A guide column (28) is welded to the left end of the base frame (20). A sleeve (18) is rotatably connected to the outer side of the pressure rod (19). A belt (16) is nested on the outer side of the sleeve (18). Lifting blocks (21) are welded to both the left and right ends of the pressure rod (19).

2. The automatic identification, detection, and rejection device for damaged silicon wafers as described in claim 1, characterized in that: The collection shell (2) is a rectangular groove structure with an opening on the upper side. A speaker (3) is installed on the rear side of the collection shell (2). A waste box (7) is placed on the inner side of the rectangular groove structure of the collection shell (2). A pull handle (27) is installed on the left side of the waste box (7). A rectangular through groove is provided on the left side of the rectangular groove structure of the collection shell (2). The waste box (7) and the rectangular through groove of the collection shell (2) are opposite each other. An opening groove that runs through the front and back is provided on the front side of the collection shell (2) near the top. An infrared sensor (24) is installed on the bottom side of the opening groove. The infrared sensor (24) is connected to the controller (13) by a wire.

3. The automatic identification, detection, and rejection device for damaged silicon wafers as described in claim 1, characterized in that: The number of lifting blocks (21) is two sets, and each set of lifting blocks (21) is symmetrically distributed on the left and right. The center of the right lifting block (21) is provided with a threaded through hole that runs vertically through the center, and the center of the left lifting block (21) is provided with a through hole that runs vertically through the center. The outer side of the threaded rotating rod (23) is threadedly engaged in the threaded through hole of the right lifting block (21), and the guide post (28) is inserted into the through hole of the left lifting block (21).

4. The automatic identification, detection, and rejection device for damaged silicon wafers as described in claim 1, characterized in that: The guide frame (4) is an inverted U-shaped structure. A circular through hole is provided at the center of the upper side of the guide frame (4). The telescopic rod of the cylinder (5) is inserted into the circular through hole of the guide frame (4). Long through slots are provided on both the left and right sides of the circular through hole of the guide frame (4). A guide plate (15) is inserted into the long through slot of the guide frame (4). The top of the guide plate (15) is connected to the base frame (20) by bolts.

5. The automatic identification, detection, and rejection device for damaged silicon wafers as described in claim 1, characterized in that: A light panel (25) is installed on the lower side of the top plate frame (12). A through hole is provided in the center of the top plate frame (12). A vision camera (11) is installed in the through hole of the top plate frame (12). The vision camera (11) and the belt (16) mounted on the conveyor bracket (9) are opposite each other. The vision camera (11) and the control unit (13) are connected by wires.

6. The automatic identification, detection, and rejection device for damaged silicon wafers as described in claim 5, characterized in that: The light panel (25) is a ring-shaped structure. Thirty sets of LED light stickers are installed on the lower side of the light panel (25). The LED light stickers are arranged in a ring array around the vertical central axis of the ring-shaped structure of the light panel (25). The visual camera (11) is located at the center of the ring-shaped structure of the light panel (25).

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