A double-sided polishing machine

Abstract

This invention provides a double-sided polishing machine, including an upper plate assembly, a lower plate assembly, and a liquid cooler. The upper plate assembly has an internal upper plate flow channel, and an upper plate inlet and an upper plate outlet communicating with the flow channel. The lower plate assembly has an internal lower plate flow channel, and a lower plate inlet and a lower plate outlet communicating with the flow channel. The liquid cooler has a liquid outlet and a liquid return outlet. The liquid outlet is connected to the upper plate inlet and the lower plate inlet via a liquid supply pipeline, and the liquid return outlet is connected to the upper plate outlet and the lower plate outlet via a liquid return pipeline. The cooling and temperature control system of this invention effectively dissipates heat from the double-sided polishing machine, thereby ensuring its processing accuracy. Furthermore, by optimizing the piping design, the double-sided polishing machine incorporates upper and lower plate flow channels internally in the upper and lower plate assemblies respectively. This design not only simplifies the installation process of the cooling and temperature control system but also reduces the risk of leakage.

Description

Technical Field

[0001] This utility model relates to the field of polishing equipment technology, and in particular to a double-sided polishing machine. Background Technology

[0002] Common materials for semiconductor wafers include silicon (Si) and silicon carbide (SiC). These materials possess high hardness, high brittleness, and good chemical stability, making wafer processing challenging. Double-sided polishing machines play a crucial role in wafer substrate processing, optimizing wafer surface flatness and warpage, and improving processing efficiency. Their working principle involves placing the wafer on a planetary gear between upper and lower polishing pads. Through the relative movement of the upper and lower polishing pads and the application of appropriate pressure, combined with the rotation and revolution of the planetary gear, both sides of the wafer are polished simultaneously. During the polishing process, polishing fluid flows into the polishing area.

[0003] During the grinding and polishing of wafers, the closely fitted components such as the grinding and polishing disks, sun gear spindle, and rotating shaft are prone to high temperatures due to prolonged equipment operation. Friction between the upper and lower disks and the wafer generates significant heat, raising the disk surface temperature. Under continuous high temperature and high pressure, the wafer may deform, and in severe cases, even shatter. If the temperature cannot be controlled within a reasonable range during polishing, the wafer will undergo dimensional changes due to thermal expansion and contraction, thus affecting its precision and surface quality. A suitable and stable temperature, however, can improve the fluidity of the polishing slurry, thereby increasing polishing efficiency and surface finish.

[0004] Currently available double-sided polishing machines have some issues with their cooling systems, featuring complex cooling paths and extensive use of flexible hoses. This not only makes installation cumbersome but also increases the risk of leaks. Utility Model Content

[0005] The purpose of this invention is to provide a double-sided polishing machine that addresses the numerous drawbacks of existing double-sided polishing machine cooling systems.

[0006] To solve the above-mentioned technical problems, the present invention provides a double-sided polishing machine, comprising:

[0007] The upper plate device has an upper plate flow channel inside, and an upper plate inlet and an upper plate outlet that communicate with the upper plate flow channel.

[0008] A lower plate device, wherein the lower plate device is provided with a lower plate flow channel inside, and the lower plate device is provided with a lower plate inlet and a lower plate outlet communicating with the lower plate flow channel;

[0009] A liquid chiller is provided with a liquid outlet and a liquid return port. The liquid outlet is connected to the upper plate inlet and the lower plate inlet through a liquid supply pipeline, and the liquid return port is connected to the upper plate outlet and the lower plate outlet through a liquid return pipeline.

[0010] Preferably, the liquid supply pipeline includes:

[0011] The first multi-way valve, wherein the inlet end of the first multi-way valve is the inlet end of the liquid supply pipeline;

[0012] The first liquid supply branch is connected at both ends to the first outlet end of the first multi-way valve and the inlet of the lower plate, respectively.

[0013] The second liquid supply branch is connected at both ends to the second outlet end of the first multi-way valve and the inlet of the upper plate, respectively.

[0014] Preferably, from the first outlet end of the first multi-way valve to the inlet of the lower plate, the first liquid supply branch is sequentially provided with a first switching valve, a first flow sensor, and a first pressure sensor.

[0015] Preferably, from the second outlet end of the first multi-way valve to the inlet of the upper plate, the second liquid supply branch is sequentially provided with a second switching valve, a second flow sensor, and a second pressure sensor.

[0016] Preferably, the return pipeline includes:

[0017] The second multi-way valve, the outlet end of the second multi-way valve is the outlet end of the return pipeline;

[0018] The first return liquid branch is connected at both ends to the first inlet end of the second multi-way valve and the outlet of the lower plate, respectively.

[0019] The second return branch is connected at both ends to the second inlet end of the second multi-way valve and the outlet of the upper plate, respectively.

[0020] Preferably, the double-sided polishing machine further includes a pressure regulating pipeline, wherein the first inlet end and the second inlet end of the pressure regulating pipeline are respectively connected to the liquid outlet and the outlet end of the liquid return pipeline; and the first outlet end and the second outlet end of the pressure regulating pipeline are respectively connected to the inlet end of the liquid supply pipeline and the liquid return port.

[0021] Preferably, the pressure regulating pipeline includes:

[0022] The third multi-way valve, wherein the inlet end and the first outlet end of the third multi-way valve are respectively the first inlet end and the first outlet end of the pressure regulating pipeline;

[0023] The fourth multi-way valve, wherein the first inlet end and the outlet end of the fourth multi-way valve are respectively the second inlet end and the second outlet end of the pressure regulating pipeline;

[0024] The third switching valve has its inlet and outlet ends connected to the second outlet end of the third multi-way valve and the second inlet end of the fourth multi-way valve, respectively.

[0025] Preferably, the upper plate device includes:

[0026] Upper rotary sealing assembly;

[0027] An upper cooling plate is disposed on the lower side of the upper rotary sealing assembly;

[0028] The upper plate is positioned below the upper cold plate;

[0029] The upper plate flow channel includes an upper rotary sealing channel disposed inside the upper rotary sealing assembly and an upper cold plate channel disposed inside the upper cold plate.

[0030] Preferably, a temperature sensor is provided on the upper cooling plate.

[0031] Preferably, the upper rotary sealing channel and the upper cold plate channel are connected by a conduit.

[0032] Preferably, the upper plate inlet and the upper plate outlet are disposed on the upper rotary sealing assembly.

[0033] Preferably, the lower plate device includes:

[0034] Lower shaft;

[0035] A lower rotary sealing assembly, which is sleeved on the lower end of the lower disc shaft;

[0036] A tray, which is disposed at the upper end of the lower plate shaft;

[0037] A lower cold tray, which is disposed on the upper side of the tray;

[0038] The lower plate is positioned above the lower cold plate;

[0039] The lower plate flow channel includes a lower rotary sealing channel disposed inside the lower rotary sealing assembly, a lower plate shaft channel disposed inside the lower plate shaft, a tray channel disposed inside the tray, and a lower cold plate channel disposed inside the lower cold plate.

[0040] Preferably, the lower plate inlet and the lower plate outlet are disposed on the lower rotary sealing assembly.

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] The cooling and temperature control system of this double-sided polishing machine consists of a liquid cooler, a liquid supply pipeline, an upper plate flow channel, a lower plate flow channel, and a return pipeline. This system effectively dissipates heat from the double-sided polishing machine, thereby ensuring its processing accuracy. Furthermore, by optimizing the pipeline design, the double-sided polishing machine incorporates upper and lower plate flow channels within the upper and lower plate devices respectively. This design not only simplifies the installation process of the cooling and temperature control system but also reduces the risk of leakage. Attached Figure Description

[0043] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0044] Figure 1 A schematic diagram of the cooling and constant temperature control system of the double-sided polishing machine provided in this embodiment of the utility model;

[0045] Figure 2 for Figure 1 Schematic diagram of the upper and lower platen devices;

[0046] Figure 3 for Figure 2 Cross-sectional view of the upper and middle rotary seal assembly;

[0047] Figure 4 for Figure 2 Cross-sectional view of the lower and middle plate assembly;

[0048] Figure 5 for Figure 2 Cross-sectional view of the lower rotary seal assembly.

[0049] Explanation of reference numerals in the accompanying drawings of this utility model:

[0050] Double-sided polishing machine 100, upper plate device 1, upper plate flow channel 11, upper plate inlet 12, upper plate outlet 13, upper rotary seal assembly 14, upper rotary seal channel 141, connecting flange 142, flange channel 143, upper outer ring 144, upper inner ring 145, upper inner ring channel 146, upper cold plate 15, upper cold plate channel 151, temperature sensor 152, conduit 153, upper fixed plate 16, fixed plate 17, fixed rod 18, lower plate device 2, lower plate flow channel 21, lower plate inlet 22, lower plate outlet 23, lower plate shaft 24, lower plate shaft channel 241, lower rotary seal assembly 25, lower rotary seal channel 251, inner ring gland 252, gland channel 253, lower outer ring 254. Lower inner ring; 255. Lower inner ring channel; 256. Tray; 26. Tray channel; 261. Lower cold plate; 27. Lower cold plate channel; 271. Lower fixed plate; 28. Liquid cooler; 3. Liquid outlet; 31. Liquid return port; 32. Liquid supply line; 4. First multi-way valve; 41. First liquid supply branch; 42. First switching valve; 421. First flow sensor; 422. First pressure sensor; 423. Second liquid supply branch; 431. Second switching valve; 432. Second flow sensor; 433. Second pressure sensor; 5. Liquid return line; 51. Second multi-way valve; 52. First liquid return branch; 53. Second liquid return branch; 6. Pressure regulating line; 61. Third multi-way valve; 62. Fourth multi-way valve; 63. Third switching valve.

[0051] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0052] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0053] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0054] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0055] This utility model provides a double-sided polishing machine. Figures 1 to 5 A preferred embodiment of the plate temperature control and cooling system of the double-sided polishing machine provided by this utility model is shown.

[0056] Please see Figures 1 to 5 In this embodiment, the double-sided polishing machine 100 includes an upper plate device 1, a lower plate device 2, a liquid cooler 3, a liquid supply pipeline 4, and a liquid return pipeline 5. The upper plate device 1 is provided with an upper plate flow channel 11, and the upper plate device 1 is provided with an upper plate inlet 12 and an upper plate outlet 13 that communicate with the upper plate flow channel 11. The lower plate device 2 is provided with a lower plate flow channel 21, and the lower plate device 2 is provided with a lower plate inlet 22 and a lower plate outlet 23 that communicate with the lower plate flow channel 21. The liquid cooler 3 is provided with a liquid outlet 31 and a liquid return outlet 32. The liquid outlet 31 is connected to the upper plate inlet 12 and the lower plate inlet 22 through the liquid supply pipeline 4, and the liquid return outlet 32 ​​is connected to the upper plate outlet 13 and the lower plate outlet 23 through the liquid return pipeline 5.

[0057] Specifically, the upper plate device 1 includes an upper fixed plate 16 and an upper plate mounting assembly. The upper plate mounting assembly is disposed on the upper side of the upper fixed plate 16 to mount the upper fixed plate 16 onto the double-sided polishing machine 100. An upper plate flow channel 11 is provided inside the upper plate mounting assembly, with both ends of the upper plate flow channel 11 penetrating the outer surface of the upper plate mounting assembly to form an upper plate inlet 12 and an upper plate outlet 13 on the outer surface of the upper plate mounting assembly, respectively. Similarly, the lower plate device 2 includes a lower fixed plate 28 and a lower plate mounting assembly. The lower fixed plate 28 is vertically spaced from the upper fixed plate 16 and is positioned below the lower fixed plate 28 to mount the lower fixed plate 28 onto the double-sided polishing machine 100. A lower plate flow channel 21 is provided inside the lower plate mounting assembly, with both ends of the lower plate flow channel 21 penetrating the outer surface of the lower plate mounting assembly to form a lower plate inlet 22 and a lower plate outlet 23 on the outer surface of the lower plate mounting assembly, respectively.

[0058] The liquid chiller 3 is used to supply coolant such as water; the following description will use water as the coolant. The outlet 31 of the liquid chiller 3 is connected to the upper plate inlet 12 of the upper plate assembly 1 and the lower plate inlet 22 of the lower plate assembly 2 via the supply pipe 4. The return port 32 of the liquid chiller 3 is connected to the upper plate outlet 13 of the upper plate assembly 1 and the lower plate outlet 23 of the lower plate assembly 2 via the return pipe 5. Thus, the liquid chiller 3 can supply coolant to the upper plate assembly 1 via the supply pipe 4. The coolant first flows into the supply pipe 4 from the outlet 31 of the liquid chiller 3, then flows into the upper plate flow channel 11 from the upper plate inlet 12, then flows through the upper plate flow channel 11 and carries away the heat from the upper plate assembly 1, before flowing into the return pipe 5 from the upper plate outlet 13. Finally, it flows back to the liquid chiller 3 from the return port 32 after passing through the return pipe 5. Similarly, the liquid chiller 3 can also supply coolant to the lower platen device 2 through the liquid supply line 4. The coolant first flows into the liquid supply line 4 from the liquid outlet 31 of the liquid chiller 3, and after flowing through the liquid supply line 4, it flows into the lower platen channel 21 from the lower platen inlet 22. After flowing through the lower platen channel 21 and carrying away the heat of the lower platen device 2, it flows into the return line 5 from the lower platen outlet 23. Finally, after flowing through the return line 5, it flows back to the liquid chiller 3 from the return outlet 32.

[0059] The cooling and temperature control system of the double-sided polishing machine 100 of this invention consists of a liquid cooler 3, a liquid supply pipeline 4, an upper plate flow channel 11, a lower plate flow channel 21, and a return pipeline 5. This system can effectively dissipate heat from the double-sided polishing machine 100, thereby ensuring its processing accuracy. Furthermore, by optimizing the pipeline design, the double-sided polishing machine 100 has upper plate flow channels 11 and lower plate flow channels 21 respectively installed inside the upper plate device 1 and the lower plate device 2. This design not only simplifies the installation process of the cooling and temperature control system but also reduces the risk of water leakage.

[0060] The upper plate flow channel 11 of the upper plate device 1 and the lower plate flow channel 21 of the lower plate device 2 are both connected to the liquid cooler 3. The upper plate flow channel 11 of the upper plate device 1 and the lower plate flow channel 21 of the lower plate device 2 can be connected in series. For example, the upper plate inlet 12 is connected to the liquid outlet 31, the upper plate outlet 13 is connected to the lower plate inlet 22, and the lower plate outlet 23 is connected to the return liquid outlet 32; or the lower plate inlet 22 is connected to the liquid outlet 31, the lower plate outlet 23 is connected to the upper plate inlet 12, and the upper plate outlet 13 is connected to the return liquid outlet 32. The upper plate flow channel 11 of the upper plate device 1 can also be connected in parallel with the lower plate flow channel 21 of the lower plate device 2. For example, the upper plate inlet 12 and the lower plate inlet 22 are both connected to the liquid outlet 31, and the upper plate outlet 13 and the lower plate outlet 23 are both connected to the return liquid outlet 32. The following description uses the parallel connection of the upper plate flow channel 11 of the upper plate device 1 and the lower plate flow channel 21 of the lower plate device 2 as an example.

[0061] The outlet 31 of the liquid cooler 3 is connected to the upper plate flow channel 11 and the lower plate flow channel 21 via the liquid supply pipeline 4, so as to supply coolant to the upper plate device 1 and the lower plate device 2 through the liquid supply pipeline 4. The specific configuration of the liquid supply pipeline 4 can be set according to the actual situation. Optionally, please refer to [reference needed]. Figure 1 In this embodiment, the liquid supply line 4 includes a first multi-way valve 41, a first liquid supply branch 42, and a second liquid supply branch 43. The inlet end of the first multi-way valve 41 is the inlet end of the liquid supply line 4. The two ends of the first liquid supply branch 42 are respectively connected to the first outlet end of the first multi-way valve 41 and the lower plate inlet 22. The two ends of the second liquid supply branch 43 are respectively connected to the second outlet end of the first multi-way valve 41 and the upper plate inlet 12.

[0062] Specifically, the coolant flowing from the outlet 31 of the liquid cooler 3 can flow into the first supply branch 42 via the first multi-way valve 41, and after flowing through the first supply branch 42, it flows into the lower plate flow channel 21 of the lower plate device 2 from the lower plate inlet 22. The coolant flowing from the outlet 31 of the liquid cooler 3 can also flow into the second supply branch 43 via the first multi-way valve 41, and after flowing through the second supply branch 43, it flows into the upper plate flow channel 11 of the upper plate device 1 from the upper plate inlet 12. The first multi-way valve 41 can be a three-way valve, etc.

[0063] Further, please refer to Figure 1 In this embodiment, from the first outlet end of the first multi-way valve 41 to the lower plate inlet 22, the first liquid supply branch 42 is sequentially provided with a first switching valve 421, a first flow sensor 422, and a first pressure sensor 423.

[0064] Specifically, a first switching valve 421 is installed on the first coolant supply branch 42, which controls the flow rate of coolant in the first coolant supply branch 42. A first flow sensor 422 is installed on the first coolant supply branch 42, which detects the flow rate of coolant in the first coolant supply branch 42. A first pressure sensor 423 is installed on the first coolant supply branch 42, which detects the pressure of coolant in the first coolant supply branch 42. The first switching valve 421 can be a ball valve, etc.

[0065] Similarly, please see Figure 1 In this embodiment, from the second outlet end of the first multi-way valve 41 to the upper plate inlet 12, the second liquid supply branch 43 is sequentially provided with a second switching valve 431, a second flow sensor 432, and a second pressure sensor 433.

[0066] Specifically, a second switching valve 431 is installed on the second coolant supply branch 43, which controls the flow rate of coolant in the second coolant supply branch 43. A second flow sensor 432 is installed on the second coolant supply branch 43, which detects the flow rate of coolant in the second coolant supply branch 43. A second pressure sensor 433 is installed on the second coolant supply branch 43, which detects the pressure of coolant in the second coolant supply branch 43. The second switching valve 431 can be a ball valve, etc.

[0067] The return port 32 of the liquid cooler 3 is connected to the upper plate flow channel 11 and the lower plate flow channel 21 via the return pipe 5, so that the coolant in the upper plate device 1 and the lower plate device 2 can be returned to the liquid cooler 3 through the return pipe 5. The specific configuration of the return pipe 5 can be set according to the actual situation. Optionally, please refer to [reference needed]. Figure 1 In this embodiment, the return line 5 includes a second multi-way valve 51, a first return line branch 52, and a second return line branch 53. The outlet end of the second multi-way valve 51 is the outlet end of the return line 5. The two ends of the first return line branch 52 are respectively connected to the first inlet end of the second multi-way valve 51 and the lower plate outlet 23. The two ends of the second return line branch 53 are respectively connected to the second inlet end of the second multi-way valve 51 and the upper plate outlet 13.

[0068] Specifically, the coolant flowing out of the lower plate outlet 23 of the lower platen device 2 can flow back to the liquid chiller 3 sequentially via the first return branch 52 and the second multi-way valve 51. The coolant flowing out of the upper platen outlet 13 of the upper platen device 1 can flow back to the liquid chiller 3 sequentially via the second return branch 53 and the second multi-way valve 51. The second multi-way valve 51 can be a three-way valve, etc.

[0069] Optionally, please refer to Figure 1 In this embodiment, the double-sided polishing machine 100 also includes a pressure regulating pipeline 6. The first inlet end and the second inlet end of the pressure regulating pipeline 6 are respectively connected to the liquid outlet 31 and the outlet end of the return pipeline 5; the first outlet end and the second outlet end of the pressure regulating pipeline 6 are respectively connected to the inlet end of the liquid supply pipeline 4 and the return port 32.

[0070] Specifically, a pressure regulating pipe 6 is installed between the liquid chiller 3 and the liquid supply pipe 4 and the liquid return pipe 5. The pressure regulating pipe 6 can play a role in pressure reduction protection to ensure that the pipe pressure is not too high.

[0071] Further, please refer to Figure 1In this embodiment, the pressure regulating pipeline 6 includes a third multi-way valve 61, a fourth multi-way valve 62, and a third switching valve 63. The inlet end and the first outlet end of the third multi-way valve 61 are the first inlet end and the first outlet end of the pressure regulating pipeline 6, respectively. The first inlet end and the outlet end of the fourth multi-way valve 62 are the second inlet end and the second outlet end of the pressure regulating pipeline 6, respectively. The inlet end and the outlet end of the third switching valve 63 are connected to the second outlet end of the third multi-way valve 61 and the second inlet end of the fourth multi-way valve 62, respectively.

[0072] Specifically, the inlet, first outlet, and second outlet of the third multi-way valve 61 are respectively connected to the liquid outlet 31 of the liquid cooler 3, the inlet of the first multi-way valve 41, and the inlet of the third switching valve 63; the first inlet, second inlet, and outlet of the fourth multi-way valve 62 are respectively connected to the outlet of the second multi-way valve 51, the outlet of the third switching valve 63, and the return port 32 of the liquid cooler 3. The third multi-way valve 61 and the fourth multi-way valve 62 can be three-way valves, etc., and the third switching valve 63 can be a ball valve, etc. By adjusting the opening sizes of the third switching valve 63, the second switching valve 431, and the first switching valve 421, the pressure and flow rate of the coolant entering the upper and lower plates can be adjusted according to process requirements.

[0073] The lower plate device 2 has a lower plate flow channel 21 inside. The specific arrangement of the lower plate device 2 is not particularly limited. Optionally, please refer to [link / reference needed]. Figure 1 , Figure 2 , Figure 4 and Figure 5 In this embodiment, the lower plate device 2 includes a lower plate shaft 24, a lower rotary sealing assembly 25, a tray 26, a lower cold plate 27, and a lower fixed plate 28. The lower rotary sealing assembly 25 is sleeved on the lower end of the lower plate shaft 24; the tray 26 is disposed on the upper end of the lower plate shaft 24; the lower cold plate 27 is disposed on the upper side of the tray 26; and the lower fixed plate 28 is disposed on the upper side of the lower cold plate 27. The lower plate flow channel 21 includes a lower rotary sealing channel 251 disposed inside the lower rotary sealing assembly 25, a lower plate shaft channel 241 disposed inside the lower plate shaft 24, a tray channel 261 disposed inside the tray 26, and a lower cold plate channel 271 disposed inside the lower cold plate 27.

[0074] Specifically, the lower plate shaft 24 extends vertically, with the tray 26 and the lower rotary sealing assembly 25 respectively located at the upper and lower ends of the lower plate shaft 24. The lower cold plate 27 is located on the upper surface of the tray 26, and the lower fixed plate 28 is located on the upper surface of the lower cold plate 27. Thus, the lower plate shaft 24 can drive the lower fixed plate 28 to rotate. The specific shapes and styles of the lower plate shaft 24, tray 26, and lower cold plate 27 are not particularly limited. For example, the lower plate shaft 24 can be a hollow T-shaped cylindrical structure; the tray 26 can be a disc-shaped structure with a boss on one surface, and two flow channels inside the boss; the lower cold plate 27 is a hollow disc structure; and the lower fixed plate 28 is a hollow ring structure.

[0075] The lower plate inlet 22 can be located on the lower plate shaft 24, the lower rotary seal assembly 25, the tray 26, or the lower cold plate 27, and the lower plate outlet 23 can also be located on the lower plate shaft 24, the lower rotary seal assembly 25, the tray 26, or the lower cold plate 27. Optionally, please refer to... Figure 1 , Figure 2 , Figure 4 and Figure 5 In this embodiment, the lower plate inlet 22 and the lower plate outlet 23 are disposed on the lower rotary sealing assembly 25. The inlet of the lower rotary sealing assembly 25 is provided with a first pressure sensor 423 to detect the pressure in real time, so as to prevent insufficient pressure from causing low cooling efficiency and excessive pressure from exceeding the sealing ring and causing water leakage from the rotary seal.

[0076] The lower rotary seal assembly 25 has a lower rotary seal channel 251 inside. Optionally, please refer to Figure 1 , Figure 2 , Figure 4 and Figure 5 In this embodiment, the lower rotary sealing assembly 25 includes an inner ring cap 252, a lower outer ring 254, and a lower inner ring 255. The lower outer ring 254 is fitted over the lower inner ring 255. The inner ring cap 252 is disposed at the upper end of the lower inner ring 255. The inner ring cap 252 is provided with a lower plate inlet 22, a lower plate outlet 23, and a cap channel 253 connecting the lower plate inlet 22 and the lower plate outlet 23. The lower inner ring 255 is provided with a lower inner ring channel 256 connecting the cap channel 253. The cap channel 253 and the lower inner ring channel 256 constitute the lower rotary sealing channel 251.

[0077] Specifically, the inner ring cap 252 is annular with a boss, and has flow channels inside. The lower outer ring 254 is a hollow cylinder, and its outer side wall has two holes. The lower inner ring 255 is a hollow cylinder, and its outer side wall has grooves with two staggered holes in the middle. The flow channel holes on the inner ring cap 252 correspond to the flow channel holes on the lower inner ring 255.

[0078] The upper plate device 1 has an upper plate flow channel 11 inside. The specific arrangement of the upper plate device 1 is not particularly limited. Optionally, please refer to [link to relevant documentation]. Figures 1 to 3 In this embodiment, the upper plate device 1 includes an upper rotary sealing assembly 14, an upper cold plate 15, and an upper fixed plate 16; the upper cold plate 15 is disposed on the lower side of the upper rotary sealing assembly 14; the upper fixed plate 16 is disposed on the lower side of the upper cold plate 15; wherein, the upper plate flow channel 11 includes an upper rotary sealing channel 141 disposed inside the upper rotary sealing assembly 14 and an upper cold plate channel 151 disposed inside the upper cold plate 15.

[0079] Specifically, the upper plate device 1 also includes a fixed plate 17 and a fixing rod 18. An upper rotary sealing assembly 14 is disposed on the upper surface of the fixed plate 17. The upper rotary sealing assembly 14 is typically used to connect a lifting drive mechanism to drive the upper plate device 1 to rise and fall. An upper cold plate 15 is located below the fixed plate 17, with the upper cold plate 15 and the fixed plate 17 vertically spaced apart. A fixing rod 18 extending vertically is disposed between the upper cold plate 15 and the fixed plate 17. An upper fixed plate 16 is disposed on the lower surface of the upper cold plate 15.

[0080] The upper plate inlet 12 can be located on the upper rotary sealing assembly 14 or the upper cold plate 15, and the upper plate outlet 13 can also be located on the upper rotary sealing assembly 14 or the upper cold plate 15. Optionally, please refer to [link / reference]. Figures 1 to 3 In this embodiment, the upper plate inlet 12 and the upper plate outlet 13 are disposed on the upper rotary sealing assembly 14.

[0081] The upper plate flow channel 11 includes an upper rotary sealing channel 141 disposed on the upper rotary sealing assembly 14 and an upper cold plate channel 151 disposed on the upper cold plate 15, wherein the upper rotary sealing channel 141 communicates with the upper cold plate channel 151. Optionally, please refer to Figures 1 to 3 In this embodiment, the upper rotary sealing channel 141 and the upper cold plate channel 151 are connected by a conduit 153. The upper rotary sealing channel 141 and the upper cold plate channel 151 are connected by two conduits 153 to form a loop. A second pressure sensor 433 is provided at the inlet of the upper rotary sealing assembly 14 to detect the pressure in real time, so as to prevent insufficient pressure from causing low cooling efficiency and excessive pressure from exceeding the sealing ring and causing water leakage from the rotary seal.

[0082] Optionally, please refer to Figures 1 to 3 In this embodiment, a temperature sensor 152 is provided on the upper cooling plate 15. A mounting hole is provided on the upper surface of the upper cooling plate 15, and the temperature sensor 152 is disposed within the mounting hole. The temperature sensor 152 is linked to the temperature sensor of the liquid chiller 3. When the temperature of the upper cooling plate 15 is higher than the temperature of the liquid chiller 3, the liquid chiller 3 will increase its cooling power. If the temperature remains high and the increased cooling power of the liquid chiller 3 does not significantly reduce the cooling capacity, an alarm will be triggered.

[0083] The upper rotary sealing assembly 14 has an internal upper rotary sealing channel 141. Optionally, please refer to Figures 1 to 3 In this embodiment, the upper rotary sealing assembly 14 includes a connecting flange 142, an upper outer ring 144, and an upper inner ring 145. The upper outer ring 144 is fitted over the upper inner ring 145. The connecting flange 142 is located at the upper end of the upper inner ring 145. The connecting flange 142 is provided with an upper plate inlet 12, an upper plate outlet 13, and a flange channel 143 connecting the upper plate inlet 12 and the upper plate outlet 13. The upper inner ring 145 is provided with an upper inner ring channel 146 connecting the flange channel 143. The flange channel 143 and the upper inner ring channel 146 constitute the upper rotary sealing channel 141.

[0084] Specifically, the connecting flange 142 is annular with a boss and has flow channels on both sides. The upper outer ring 144 is an inverted T-shaped hollow cylinder with two holes on its outer side wall. The upper inner ring 145 is a hollow cylinder with grooves on its outer side wall and two staggered holes in the middle. The flow channel holes on the connecting flange 142 correspond to the flow channel holes on the upper inner ring 145.

[0085] Please see Figure 1 The coolant flows out from the outlet 31 of the liquid chiller 3, passes through the third multi-way valve 61, one end of which is connected to the third switching valve 63, which is connected to the return port 32 of the liquid chiller 3 to prevent excessive pressure in the pipeline. The other end of the third multi-way valve 61 is connected to the first multi-way valve 41, which divides the outlet into two paths. One path is connected to the first switching valve 421, passes through the first flow sensor 422 to the first pressure sensor 423, and then to the lower rotary sealing assembly 25. After circulating once inside the lower rotary sealing assembly 25, it connects to the internal channel of the tray 26 through the lower plate shaft 24. The tray channel 261 of the tray 26 is connected to the lower cold plate channel 271 of the lower cold plate 27. After passing through the internal channel of the lower cold plate 27, it reaches the outlet on the other side and then exits through the tray 26, the lower plate shaft 24, and the other flow channel of the lower rotary sealing assembly 25 into the liquid chiller 3.

[0086] The other path of the flow from the first multi-way valve 41 is connected to the second switching valve 431, passes through the second flow sensor 432 to the second pressure sensor 433, and then to the upper rotary sealing assembly 14. It then connects to the inlet of the upper cold plate channel 151 of the upper cold plate 15 via a hose (i.e., conduit 153). After circulating through the internal channel of the upper cold plate 15, it flows out from the outlet at the other end and returns to the upper rotary sealing assembly 14 via the hose. After circulating inside the upper rotary sealing assembly 14, it returns to the liquid chiller 3. At least one temperature sensor 152 is installed on the upper cold plate 15 from the outside to the inside to monitor the temperature of the plate surface area in real time.

[0087] The double-sided polishing machine 100 effectively controls heat through its cooling and temperature control system. During the actual polishing process, friction generates a significant amount of heat. This system effectively dissipates heat, maintaining stable temperatures for the wafer, polishing disc, and drive shaft, ensuring processing accuracy. Sustained high temperatures accelerate equipment wear and aging; the cooling and temperature control system effectively reduces the machine's operating temperature. Furthermore, the double-sided polishing machine 100's cooling and temperature control system enhances disc surface temperature control, allowing for better control of the double-polishing process.

[0088] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A double-sided polishing machine characterized by comprising: include: The upper plate device has an upper plate flow channel inside, and an upper plate inlet and an upper plate outlet that communicate with the upper plate flow channel. A lower plate device, wherein the lower plate device is provided with a lower plate flow channel inside, and the lower plate device is provided with a lower plate inlet and a lower plate outlet communicating with the lower plate flow channel; A liquid chiller is provided with a liquid outlet and a liquid return port. The liquid outlet is connected to the upper plate inlet and the lower plate inlet through a liquid supply pipeline, and the liquid return port is connected to the upper plate outlet and the lower plate outlet through a liquid return pipeline.

2. The double-sided polisher of claim 1, wherein, The liquid supply pipeline includes: The first multi-way valve, wherein the inlet end of the first multi-way valve is the inlet end of the liquid supply pipeline; The first liquid supply branch is connected at both ends to the first outlet end of the first multi-way valve and the inlet of the lower plate, respectively. The second liquid supply branch is connected at both ends to the second outlet end of the first multi-way valve and the inlet of the upper plate, respectively.

3. The double-sided polisher of claim 2, wherein, From the first outlet end of the first multi-way valve to the inlet of the lower plate, a first switching valve, a first flow sensor, and a first pressure sensor are sequentially arranged on the first liquid supply branch; and / or, from the second outlet end of the first multi-way valve to the inlet of the upper plate, a second switching valve, a second flow sensor, and a second pressure sensor are sequentially arranged on the second liquid supply branch.

4. The double-sided polisher of claim 1, wherein, The return pipeline includes: The second multi-way valve, the outlet end of the second multi-way valve is the outlet end of the return pipeline; The first return liquid branch is connected at both ends to the first inlet end of the second multi-way valve and the outlet of the lower plate, respectively. The second return branch is connected at both ends to the second inlet end of the second multi-way valve and the outlet of the upper plate, respectively.

5. The double-sided polisher of claim 1, wherein, The double-sided polishing machine also includes a pressure regulating pipeline, wherein the first inlet end and the second inlet end of the pressure regulating pipeline are respectively connected to the liquid outlet and the outlet end of the liquid return pipeline; the first outlet end and the second outlet end of the pressure regulating pipeline are respectively connected to the inlet end of the liquid supply pipeline and the liquid return port.

6. The double-sided polisher of claim 5, wherein, The pressure regulating pipeline includes: The third multi-way valve, wherein the inlet end and the first outlet end of the third multi-way valve are respectively the first inlet end and the first outlet end of the pressure regulating pipeline; The fourth multi-way valve, wherein the first inlet end and the outlet end of the fourth multi-way valve are respectively the second inlet end and the second outlet end of the pressure regulating pipeline; The third switching valve has its inlet and outlet ends connected to the second outlet end of the third multi-way valve and the second inlet end of the fourth multi-way valve, respectively.

7. The double-sided polisher of claim 1, wherein, The upper plate device includes: Upper rotary sealing assembly; An upper cooling plate is disposed on the lower side of the upper rotary sealing assembly; The upper plate is positioned below the upper cold plate; The upper plate flow channel includes an upper rotary sealing channel disposed inside the upper rotary sealing assembly and an upper cold plate channel disposed inside the upper cold plate.

8. The double-sided polisher of claim 7, wherein, The upper plate inlet and the upper plate outlet are disposed on the upper rotary sealing assembly; and / or, A temperature sensor is installed on the upper cooling plate; and / or, The upper rotary sealing channel and the upper cold plate channel are connected by a conduit.

9. The double-sided polisher of claim 1, wherein, The lower plate device includes: Lower shaft; A lower rotary sealing assembly, which is sleeved on the lower end of the lower disc shaft; A tray, which is disposed at the upper end of the lower plate shaft; A lower cold tray, which is disposed on the upper side of the tray; The lower plate is positioned above the lower cold plate; The lower plate flow channel includes a lower rotary sealing channel disposed inside the lower rotary sealing assembly, a lower plate shaft channel disposed inside the lower plate shaft, a tray channel disposed inside the tray, and a lower cold plate channel disposed inside the lower cold plate.

10. The double-sided polisher of claim 9, wherein, The lower plate inlet and the lower plate outlet are located on the lower rotary sealing assembly.

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