A polishing liquid supply system and a polishing machine

Abstract

This invention provides a polishing slurry supply system and a polishing machine. The polishing slurry supply system includes a storage container and a dispensing device. The dispensing device is connected to the outlet of the storage container and includes a power pump and filter pipelines connected in series. Multiple filter pipelines are arranged in parallel, and each filter pipeline is equipped with a filter and a filter pipeline regulating valve. The polishing slurry supply system of this invention has multiple parallel filter pipelines in its dispensing device. When one filter pipeline malfunctions, the dispensing device can flexibly switch to another normal filter pipeline to continue supplying polishing slurry, allowing the flow rate of the polishing slurry to return to a stable state. This avoids interruption of polishing slurry supply due to filter pipeline failure, ensuring the continuity and stability of the polishing process. This polishing slurry supply system can effectively provide polishing slurry with a stable flow rate, significantly improving the working efficiency and reliability of the polishing equipment.

Description

Technical Field

[0001] This utility model relates to the field of polishing equipment technology, and in particular to a polishing liquid supply system and a polishing machine. Background Technology

[0002] In recent years, China's semiconductor industry has flourished, and the research and development and manufacturing of equipment required for each stage of semiconductor processing have been continuously advancing. Among the many key processes, polishing is particularly crucial, as it grinds wafers to an extremely high level of surface smoothness and flatness. The polishing slurry supply system on the polishing machine plays a vital role in the precision, efficiency, and stability of the polishing process.

[0003] However, this technological field still faces many challenges. The main issues focus on the stability of the polishing slurry supply, cooling efficiency, particle uniformity, and resistance to contamination. Specifically, during the polishing process, the polishing slurry must achieve sufficient chemical corrosion and particle grinding while also controlling the temperature. Simultaneously, it is crucial that no corrosion occurs in the areas in contact with the polishing slurry to prevent contamination and thus affect the quality of the polished product.

[0004] Therefore, the technical problems that urgently need to be solved in this field mainly include the following three aspects: first, how to provide polishing fluid with a stable flow rate; second, how to adequately cool the polishing fluid; and third, how to avoid contamination caused by corrosion at the contact points of the polishing fluid. Utility Model Content

[0005] The purpose of this invention is to provide a polishing slurry supply system and a polishing machine, aiming to improve the numerous drawbacks of existing polishing slurry supply systems.

[0006] To solve the above-mentioned technical problems, embodiments of this utility model provide a polishing slurry supply system, comprising:

[0007] A storage container for storing polishing fluid;

[0008] The liquid outlet device is connected to the outlet of the storage container and is used to output the polishing liquid in the storage container to the polishing station. The liquid outlet device includes a power pump and a filter pipeline connected in series. Multiple filter pipelines are arranged in parallel, and each filter pipeline is equipped with a filter and a filter pipeline regulating valve.

[0009] Preferably, the storage container is equipped with at least one of a temperature sensor and a pH detector.

[0010] Preferably, the outlet of the storage container is located at the bottom of the storage container.

[0011] Preferably, the power pump is a magnetic pump.

[0012] Preferably, the liquid outlet device further includes a polishing liquid reflux regulating valve, the input end and output end of which are respectively connected to the first output end of the power pump and the reflux port of the storage container.

[0013] Preferably, the liquid outlet device further includes a pressure gauge, the input end and the second output end of the power pump are respectively connected to the liquid outlet of the storage container and the input end of the pressure gauge, and the output end of the pressure gauge is connected to the input end of multiple filter pipelines.

[0014] Preferably, the liquid outlet device further includes an outlet regulating valve and a flow meter, wherein the input end and output end of the outlet regulating valve are respectively connected to the output end of the multiple filter pipelines and the input end of the flow meter.

[0015] Preferably, the filter pipeline regulating valve includes a front filter pipeline regulating valve and a rear filter pipeline regulating valve, the front filter pipeline regulating valve and the rear filter pipeline regulating valve are respectively disposed at the input end and the output end of the filter pipeline, and the filter is disposed between the front filter pipeline regulating valve and the rear filter pipeline regulating valve.

[0016] Preferably, the polishing slurry supply system further includes a cooling device, the cooling device comprising:

[0017] Cooling circulation piping, wherein the cooling circulation piping is located within the storage container;

[0018] A coolant inlet pipe, the input end of which is located outside the storage container, and the output end of which is connected to the input end of the cooling circulation pipe;

[0019] A coolant outlet pipe, the output end of which is located outside the storage container, and the input end of which is connected to the output end of the cooling circulation pipeline.

[0020] Preferably, the cooling circulation pipeline is a multi-pipe cooling pipeline or a single-section cooling pipeline.

[0021] Preferably, a coolant inlet regulating valve is provided on the coolant inlet pipe.

[0022] Preferably, the polishing fluid supply system further includes a level sensor, wherein: the level sensor is located outside the storage container; or, the level sensor is an internally connected level sensor.

[0023] Preferably, the polishing slurry supply system further includes a polishing slurry inlet pipe, the output end of which is connected to the polishing slurry inlet of the storage container.

[0024] Preferably, the polishing fluid supply system further includes a pure water inlet pipe, the output end of which is connected to the pure water inlet of the storage container, and a pure water inlet regulating valve is provided on the pure water inlet pipe.

[0025] Preferably, the polishing slurry supply system further includes a container drain pipe, the input end of which is connected to the drain port of the storage container, and a drain regulating valve is provided on the container drain pipe.

[0026] Preferably, the polishing fluid supply system further includes a stirring device, which includes a stirring impeller and a stirring motor. The stirring impeller is located inside the storage container, and the stirring motor is located outside the storage container and is power-coupled to the stirring impeller so as to drive the stirring impeller to rotate.

[0027] To achieve the above objectives, this utility model also provides a polishing machine, including the aforementioned polishing liquid supply system.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The polishing slurry supply system of this invention features a discharge device with multiple parallel filter lines. When one filter line malfunctions, the discharge device can flexibly switch to another functioning filter line to continue supplying the polishing slurry, restoring the flow rate to a stable state. This prevents interruptions in the polishing slurry supply due to filter line failure, ensuring the continuity and stability of the polishing process. This polishing slurry supply system effectively provides a stable flow rate of polishing slurry, significantly improving the working efficiency and reliability of the polishing equipment. Attached Figure Description

[0030] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0031] Figure 1 This is a schematic diagram of the polishing slurry supply system provided in an embodiment of the present invention.

[0032] Explanation of reference numerals in the accompanying drawings of this utility model:

[0033] Polishing slurry supply system 100, storage container 1, temperature sensor 11, pH detector 12, liquid outlet device 2, power pump 21, filter pipeline 22, filter 221, filter pipeline regulating valve 222, pre-filter pipeline regulating valve 222a, post-filter pipeline regulating valve 222b, polishing slurry return regulating valve 23, pressure gauge 24, liquid outlet regulating valve 25, flow meter 26, cooling device 3, cooling circulation pipeline 31, coolant inlet pipe 32, coolant inlet regulating valve 321, coolant outlet pipe 33, liquid level sensor 4, polishing slurry inlet pipe 5, pure water inlet pipe 6, pure water inlet regulating valve 61, container drain pipe 7, drain regulating valve 71, stirring device 8, stirring impeller 81, stirring motor 82.

[0034] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0037] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0038] This invention provides a polishing slurry supply system, which can be used in polishing equipment such as polishing machines. The following description will take the application of this polishing slurry supply system in a semiconductor wafer single-sided polishing machine as an example. Figure 1A preferred embodiment of the polishing slurry supply system provided by this utility model is shown.

[0039] Please see Figure 1 In this embodiment, the polishing slurry supply system 100 includes a storage container 1 and a dispensing device 2. The storage container 1 is used to store polishing slurry. The dispensing device 2 is connected to the outlet of the storage container 1 and is used to output the polishing slurry in the storage container 1 to the polishing station. The dispensing device 2 includes a power pump 21 connected in series and a filter pipeline 22. Multiple filter pipelines 22 are arranged in parallel. Each filter pipeline 22 is equipped with a filter 221 and a filter pipeline regulating valve 222.

[0040] Specifically, the polishing slurry supply system 100 can be used to supply polishing fluid to a semiconductor wafer single-sided polishing machine. The polishing slurry supply system 100 includes a storage container 1 and a dispensing device 2. The storage container 1 can be shaped like a can or a barrel, etc. The storage container 1 can be used to store polishing slurry. The storage container 1 is provided with a dispensing port, which is connected to the input end of the dispensing device 2. The output end of the dispensing device 2 extends to the polishing station of the semiconductor wafer single-sided polishing machine. In this way, the polishing slurry in the storage container 1 can flow from the dispensing port into the dispensing device 2 and be delivered to the polishing station of the semiconductor wafer single-sided polishing machine through the dispensing device 2.

[0041] The liquid outlet device 2 includes a power pump 21 and multiple filter lines 22. The multiple filter lines 22 are first connected in parallel, and then connected in series with the power pump 21. When the power pump 21 is energized, the polishing liquid in the storage container 1 can be drawn from the outlet by the power pump 21 into the liquid outlet device 2 and flow along it. When the polishing liquid in the liquid outlet device 2 flows through any one of the filter lines 22, the filter line 22 can filter the polishing liquid. The specific number of filter lines 22 can be set according to actual conditions; for example, there can be two, three, four, five, or more filter lines. Optionally, please refer to... Figure 1 In this embodiment, the filter pipe 22 is provided with two paths, and the following will describe the filter pipe 22 with two paths as an example.

[0042] Each filter line 22 is equipped with a filter 221 and a filter line regulating valve 222. The filter 221 filters the polishing slurry, while the filter line regulating valve 222 adjusts the flow rate of the polishing slurry in each filter line 22. The polishing slurry supply system 100 has two filter lines 22, which can be flexibly switched via the filter line regulating valve 222. When the polishing slurry supply system 100 supplies polishing slurry through the first filter line 22 and the first filter line 22 malfunctions, the filter line regulating valve 222 on the first filter line 22 can be adjusted to close the first filter line 22, and then the filter line regulating valve 222 on the second filter line 22 can be adjusted to open the second filter line 22. This allows the polishing slurry supply system 100 to continue supplying polishing slurry through the second filter line 22, restoring the flow rate of the polishing slurry to a stable state, thus not affecting the polishing process of the semiconductor wafer single-sided polishing machine.

[0043] The polishing slurry supply system 100 of this invention has a slurry outlet device 2 equipped with multiple parallel filter lines 22. When one filter line 22 malfunctions, the outlet device 2 can flexibly switch to another normal filter line 22 to continue supplying polishing slurry, allowing the flow rate of the polishing slurry to return to a stable state. This avoids interruption of polishing slurry supply due to filter line 22 failure, ensuring the continuity and stability of the polishing process. Thus, the polishing slurry supply system 100 can effectively provide polishing slurry with a stable flow rate, significantly improving the working efficiency and reliability of the polishing equipment.

[0044] The storage container 1 is provided with a liquid outlet. The specific location of the liquid outlet on the storage container 1 can be set according to the actual situation. Optionally, please refer to Figure 1 In this embodiment, the liquid outlet of the storage container 1 is located at the bottom of the storage container 1.

[0045] Specifically, the storage container 1 can be arranged in a hollow cylindrical shape, with an open top and a removable circular cap. The bottom of the storage container 1 can be sealed by a circular plate, and the outlet of the storage container 1 can be located in the center of the circular plate. Positioning the outlet of the storage container 1 at the bottom can reduce the deposition of abrasive particles in the polishing fluid at the bottom of the storage container 1, thus enabling the circulation of the polishing fluid within the storage container 1. All non-metallic internal parts of the storage container 1 are made of corrosion-resistant plastic, and all metallic internal parts are treated with a Teflon coating for protection. This provides corrosion resistance while preventing crystallization, thereby avoiding contamination of the polishing fluid.

[0046] Storage container 1 is typically equipped with a detection sensor; optionally, please refer to [link / reference]. Figure 1In this embodiment, the storage container 1 is provided with at least one of a temperature sensor 11 and a pH detector 12.

[0047] Specifically, the temperature sensor 11 and pH detector 12 are typically located on the top of the storage container 1. For example, the temperature sensor 11 and pH detector 12 can be threaded onto the top cover of the storage container 1. In this way, the temperature of the polishing liquid inside the storage container 1 can be detected by the temperature sensor 11, and the pH value of the polishing liquid inside the storage container 1 can be detected by the pH detector 12.

[0048] Optionally, please refer to Figure 1 In this embodiment, the polishing slurry supply system 100 also includes a level sensor 4. Thus, the level sensor 4 can detect the level of the polishing slurry in the storage container 1.

[0049] The specific configuration of the liquid level sensor 4 can be set according to the actual situation. For example, the liquid level sensor 4 can be an internally connected liquid level sensor, that is, a communicating vessel is provided on the side wall of the storage container 1, one end of the communicating vessel is connected to the storage container 1, and the other end of the communicating vessel is provided with an internally connected liquid level sensor.

[0050] Optionally, please refer to Figure 1 In this embodiment, the liquid level sensor 4 is located outside the storage container 1.

[0051] Specifically, the liquid level sensor 4 is a non-contact liquid level sensor. The liquid level sensor 4 can be fixed to the outside of the storage container 1 by threads. The part of the side wall of the storage container 1 opposite to the liquid level sensor 4 is transparent. There can be one liquid level sensor 4 or multiple liquid level sensors 4 spaced apart along the height direction of the storage container 1. In this way, the liquid level height of the polishing liquid in the storage container 1 can be determined by the detection signal of the liquid level sensor 4 at different positions.

[0052] Optionally, please refer to Figure 1 In this embodiment, the power pump 21 is a magnetic pump. The power pump 21 employs an internally corrosion-resistant magnetic pump, thus enabling it to provide a continuous and stable supply of polishing fluid without contaminating it. The power pump 21 can be mounted on the base plate of the polishing fluid supply system 100, and it can be connected to the pipeline of the outlet device 2 via a threaded connection.

[0053] The power pump 21 is connected in series with the multi-channel filter line 22. The power pump 21 can be located upstream of the multi-channel filter line 22; the power pump 21 can also be located downstream of the multi-channel filter line 22. Optionally, please refer to... Figure 1In this embodiment, the liquid outlet device 2 also includes a pressure gauge 24. The input end and the second output end of the power pump 21 are respectively connected to the liquid outlet of the storage container 1 and the input end of the pressure gauge 24. The output end of the pressure gauge 24 is connected to the input end of the multi-channel filter pipeline 22.

[0054] Specifically, pressure gauge 24 is located downstream of power pump 21 and upstream of multi-channel filter line 22. The input end of power pump 21 is the input end of liquid outlet device 2. Pressure gauge 24 can detect the hydraulic pressure of polishing fluid in liquid outlet device 2. When filter line 22 malfunctions, the hydraulic pressure detected by pressure gauge 24 will change, thus determining whether filter line 22 is malfunctioning based on the hydraulic pressure detected by pressure gauge 24.

[0055] Optionally, please refer to Figure 1 In this embodiment, the liquid outlet device 2 also includes a polishing liquid reflux regulating valve 23, the input end and the output end of which are respectively connected to the first output end of the power pump 21 and the reflux port of the storage container 1.

[0056] Specifically, a polishing slurry return pipeline is installed downstream of the power pump 21, and a polishing slurry return regulating valve 23 is installed on the polishing slurry return pipeline, allowing the polishing slurry to return to the storage container 1 through the polishing slurry return pipeline. The polishing slurry return regulating valve 23 can both regulate the flow rate of the polishing slurry and allow the abrasive deposited at the bottom of the storage container 1 to flow back into the storage container 1, thereby realizing the circulation of polishing slurry in the storage container 1 and better ensuring the uniformity of polishing slurry and abrasive in the storage container 1.

[0057] Optionally, please refer to Figure 1 In this embodiment, the liquid outlet device 2 also includes a liquid outlet regulating valve 25 and a flow meter 26. The input end and output end of the liquid outlet regulating valve 25 are respectively connected to the output end of the multi-channel filter pipeline 22 and the input end of the flow meter 26.

[0058] Specifically, the liquid outlet regulating valve 25 is located downstream of the multi-channel filter pipeline 22, and upstream of the flow meter 26. The output end of the flow meter 26 is the output end of the liquid outlet device 2.

[0059] Optionally, please refer to Figure 1 In this embodiment, the filter pipeline regulating valve 222 includes a front filter pipeline regulating valve 222a and a rear filter pipeline regulating valve 222b. The front filter pipeline regulating valve 222a and the rear filter pipeline regulating valve 222b are respectively disposed at the input end and the output end of the filter pipeline 22, and the filter 221 is disposed between the front filter pipeline regulating valve 222a and the rear filter pipeline regulating valve 222b.

[0060] Specifically, the pre-filter pipeline regulating valve 222a and the post-filter pipeline regulating valve 222b are located upstream and downstream of the filter 221, respectively. The filter 221 can be cylindrical or other shapes, and a filter element is installed inside the filter 221.

[0061] Optionally, please refer to Figure 1 In this embodiment, the polishing slurry supply system 100 further includes a cooling device 3, which is used to cool the polishing slurry in the storage container 1. The cooling device 3 enables the polishing slurry supply system 100 to have a polishing slurry circulation and cooling function.

[0062] The specific configuration of cooling device 3 can be set according to actual conditions. Optionally, please refer to [link / reference needed]. Figure 1 In this embodiment, the cooling device 3 includes a cooling circulation pipe 31, a coolant inlet pipe 32, and a coolant outlet pipe 33. The cooling circulation pipe 31 is located inside the storage container 1. The input end of the coolant inlet pipe 32 is located outside the storage container 1, and the output end of the coolant inlet pipe 32 is connected to the input end of the cooling circulation pipe 31. The output end of the coolant outlet pipe 33 is located outside the storage container 1, and the input end of the coolant outlet pipe 33 is connected to the output end of the cooling circulation pipe 31.

[0063] Specifically, the cooling circulation pipe 31, the coolant inlet pipe 32, and the coolant outlet pipe 33 constitute the polishing fluid cooling circuit. Coolant can be supplied to the polishing fluid cooling circuit by a water-cooled or air-cooled refrigeration unit. The flow rate and temperature of the coolant can be adjusted by the air-cooled refrigeration unit, and the temperature sensor 11 can be used to precisely regulate the temperature of the polishing fluid. The cooling pipes of the polishing fluid cooling circuit can be made of corrosion-resistant material, unaffected by the polishing fluid, and a coolant inlet regulating valve 321 can be installed on the coolant inlet pipe 32 or the coolant outlet pipe 33.

[0064] The cooling circulation pipe 31 can be a single-section cooling pipe; for example, the cooling circulation pipe 31 can be a large-size single-section cooling pipe. The cooling circulation pipe 31 can also be a multi-pipe cooling pipe. Optionally, please refer to... Figure 1 In this embodiment, the cooling circulation pipe 31 is a multi-pipe cooling pipe.

[0065] Specifically, the cooling circulation pipe 31 can be composed of multiple corrosion-resistant cooling pipes. Compared with the traditional coil structure, the cooling device 3 uses multi-pipe cooling pipes to cool the polishing fluid, which makes the heat exchange area between the cooling device 3 and the polishing fluid larger, and the cooling device 3 has a better cooling effect on the polishing fluid.

[0066] Optionally, please refer to Figure 1In this embodiment, the polishing liquid supply system 100 further includes a stirring device 8, which includes a stirring impeller 81 and a stirring motor 82. The stirring impeller 81 is located inside the storage container 1, and the stirring motor 82 is located outside the storage container 1 and is poweredly coupled to the stirring impeller 81 so as to drive the stirring impeller 81 to rotate.

[0067] Specifically, the stirring motor 82 can be a vertical or orthogonal shaft horizontal motor. Optionally, in this embodiment, the stirring motor 82 is a right-angle motor with a hollow output end. The stirring motor 82 is disposed on the top of the storage container 1. For example, the stirring motor 82 can be threaded onto the top cover of the storage container 1. The stirring motor 82 can be directly driven by the upper end of the stirring impeller 81.

[0068] Optionally, please refer to Figure 1 In this embodiment, the polishing slurry supply system 100 further includes a polishing slurry inlet pipe 5, the output end of which is connected to the polishing slurry inlet of the storage container 1. The polishing slurry inlet of the storage container 1 is usually located at the top of the storage container 1, and polishing slurry can be replenished into the storage container 1 through the polishing slurry inlet pipe 5.

[0069] Optionally, please refer to Figure 1 In this embodiment, the polishing slurry supply system 100 also includes a pure water inlet pipe 6. The output end of the pure water inlet pipe 6 is connected to the pure water inlet of the storage container 1, and a pure water inlet regulating valve 61 is provided on the pure water inlet pipe 6. The pure water inlet of the storage container 1 is usually located at the top of the storage container 1, and pure water can be replenished into the storage container 1 through the pure water inlet pipe 6.

[0070] Optionally, please refer to Figure 1 In this embodiment, the polishing slurry supply system 100 further includes a container drain pipe 7. The input end of the container drain pipe 7 is connected to the drain port of the storage container 1, and a drain regulating valve 71 is provided on the container drain pipe 7. The drain port of the storage container 1 is usually located at the bottom of the storage container 1, and the liquid in the storage container 1 can be directly discharged to the outside through the container drain pipe 7.

[0071] When the power pump 21 is powered on, the polishing liquid in the storage container 1 is drawn out from the bottom by the power pump 21. One path flows through the polishing liquid return regulating valve 23 to allow the polishing liquid to flow back to the storage container 1, and the other path flows through the pressure gauge 24. The two parallel filter pipes 22 are normally open and closed. After the polishing liquid is filtered by the filter 221 on the normally open filter pipe 22, it flows through the flow meter 26 to display the polishing liquid flow rate and reaches the polishing working position. After a series of polishing actions, the polishing liquid flows back to the storage container 1 through the polishing liquid inlet pipe 5. This completes one polishing liquid cycle of the polishing liquid supply system 100. The flow rate of the polishing liquid can be adjusted by adjusting the polishing liquid return regulating valve 23, the front filter pipe regulating valve 222a, the rear filter pipe regulating valve 222b, and the outlet regulating valve 25.

[0072] This utility model also provides a polishing machine, which includes a polishing liquid supply system. Since the polishing liquid supply system adopts the technical solution of the above embodiments, it has the beneficial effects brought about by the technical solution of the above embodiments.

[0073] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A polishing liquid supply system characterized by comprising: include: A storage container for storing polishing fluid; The liquid outlet device is connected to the outlet of the storage container and is used to output the polishing liquid in the storage container to the polishing station. The liquid outlet device includes a power pump and a filter pipeline connected in series. Multiple filter pipelines are arranged in parallel, and each filter pipeline is equipped with a filter and a filter pipeline regulating valve.

2. The polishing liquid supply system according to claim 1, wherein The storage container is equipped with at least one of a temperature sensor and a pH detector; and / or, The liquid outlet of the storage container is located at the bottom of the storage container.

3. The polishing liquid supply system according to Claim 1, wherein The power pump is a magnetic pump; and / or, The liquid outlet device further includes a polishing fluid reflux regulating valve, the input and output ends of which are respectively connected to the first output end of the power pump and the reflux port of the storage container; and / or, The liquid outlet device also includes a pressure gauge. The input end and the second output end of the power pump are respectively connected to the liquid outlet of the storage container and the input end of the pressure gauge. The output end of the pressure gauge is connected to the input end of multiple filter pipelines.

4. The polishing liquid supply system according to Claim 1, wherein The liquid outlet device also includes an outlet regulating valve and a flow meter. The input and output ends of the outlet regulating valve are respectively connected to the output ends of the multiple filter pipelines and the input end of the flow meter.

5. The polishing liquid supply system according to Claim 1, wherein The filter pipeline regulating valve includes a front filter pipeline regulating valve and a rear filter pipeline regulating valve. The front filter pipeline regulating valve and the rear filter pipeline regulating valve are respectively located at the input end and the output end of the filter pipeline, and the filter is located between the front filter pipeline regulating valve and the rear filter pipeline regulating valve.

6. The polishing liquid supply system according to Claim 1, wherein The polishing fluid supply system further includes a cooling device, which comprises: Cooling circulation piping, the cooling circulation piping being located within the storage container; A coolant inlet pipe, the input end of which is located outside the storage container, and the output end of which is connected to the input end of the cooling circulation pipe; A coolant outlet pipe, the output end of which is located outside the storage container, and the input end of which is connected to the output end of the cooling circulation pipeline.

7. The polishing slurry supply system as described in claim 6, characterized in that, The cooling circulation pipeline is a multi-pipe cooling pipeline or a single-section cooling pipeline; and / or, A coolant inlet regulating valve is installed on the coolant inlet pipe.

8. The polishing slurry supply system as described in claim 1, characterized in that, The polishing fluid supply system further includes a level sensor, wherein: the level sensor is located outside the storage container; or, the level sensor is an internally connected level sensor.

9. The polishing slurry supply system as described in claim 1, characterized in that, The polishing slurry supply system further includes a polishing slurry inlet pipe, the output end of which is connected to the polishing slurry inlet of the storage container; and / or, The polishing fluid supply system further includes a pure water inlet pipe, the output end of which is connected to the pure water inlet of the storage container, and a pure water inlet regulating valve is provided on the pure water inlet pipe; and / or, The polishing slurry supply system further includes a container drain pipe, the input end of which is connected to the drain port of the storage container, and a drain regulating valve is provided on the container drain pipe; and / or, The polishing fluid supply system also includes a stirring device, which includes a stirring impeller and a stirring motor. The stirring impeller is located inside the storage container, and the stirring motor is located outside the storage container and is poweredly coupled to the stirring impeller so as to drive the stirring impeller to rotate.

10. A polishing machine characterized by, Includes the polishing slurry supply system as described in any one of claims 1-9.

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