A probe station

Abstract

This application discloses a probe station, which includes a cavity, a wafer carrier stage located within the cavity, a support platform supporting the wafer carrier stage, a motion mechanism connected to the support platform, and a probe holder located at the top of the cavity. Support components are arranged on opposite sides of the support platform. The support components facing the support platform have several linearly arranged air inlets, and the opposite support components facing the support platform have several linearly arranged exhaust outlets. The air inlets and exhaust outlets are arranged parallel to each other. In operation, the motion mechanism drives the support platform to a first preset position, at which point the air inlets / exhaust outlets are at the same height as the probe tip of the probe holder. The air inlets purge the probe tip, and the exhaust outlets discharge the purged gas. This probe station solves the problems of time-consuming, inefficient, and easily damaged probe holders in existing technologies.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically to a probe station. Background Technology

[0002] In semiconductor device manufacturing, wafer-level reliability testing (WAT) is a crucial step in ensuring device performance. WAT testing requires a probe station, where probes on a probe card make electrical contact with the metal pads on the wafer surface to measure electrical performance parameters. As a precision testing device, the accuracy of the probe station directly impacts the quality assessment and yield statistics of semiconductor devices. Currently, the industry standard for probe card cleaning is primarily manual. Operators clean and maintain the probe cards periodically based on actual testing needs. Cleaning is typically performed twice a week, with each cleaning of a single probe card taking approximately 25 minutes.

[0003] However, existing manual cleaning methods have some shortcomings. First, manual cleaning is time-consuming, affecting the efficiency of equipment use; second, manual operation is subject to certain uncertainties and may result in improper operation; moreover, particles may adhere to the probe tip during the test, thus affecting the contact resistance.

[0004] Therefore, solutions to the problems in existing technologies are needed. Utility Model Content

[0005] The purpose of this application is to provide a probe station to solve the problems of long time consumption, low efficiency and easy damage to probe cards in the prior art when manually cleaning probe cards.

[0006] To achieve the above objectives, this application adopts the following technical solution.

[0007] This application provides a probe station, which includes a cavity, a wafer carrier stage located within the cavity, a support platform supporting the wafer carrier stage, a motion mechanism connected to the support platform, and a probe holder located at the top of the cavity. Support components are provided on opposite sides of the support platform, with the wafer carrier stage positioned between the two support components. On one side of the support component facing the support platform, a plurality of linearly arranged air inlets are provided, and on the opposite side of the support component facing the support platform, a plurality of linearly arranged exhaust outlets are provided, with the air inlets and exhaust outlets arranged parallel to each other. In operation, the motion mechanism drives the support platform to move to a first preset position, at which point the air inlets / exhaust outlets are at the same height as the probe tip of the probe holder. The air inlets purge the probe tip, and the exhaust outlets discharge the purged gas.

[0008] In some possible implementations, the air inlet is connected to an air source via a first air passage, and the exhaust port is connected to an outlet via a second air passage.

[0009] In some possible implementations, the first air path includes a first pipe and a plurality of first branch pipes, the first pipe being connected to a plurality of the air inlets through the plurality of first branch pipes, and the first pipe being connected to the air source; the second air path includes a second pipe and a plurality of second branch pipes, the second pipe being connected to a plurality of the exhaust ports through the plurality of second branch pipes, and the second pipe being connected to the exhaust outlet.

[0010] In some possible implementations, the first pipeline is provided with a first pressure regulating valve and a first solenoid valve, and the second pipeline is provided with a second solenoid valve.

[0011] In some possible implementations, both the gas source and the exhaust port are located outside the cavity.

[0012] In some possible implementations, any of the air inlets is provided with a first nozzle, the first nozzle being funnel-shaped, with one end of the small opening of the first nozzle facing the support platform; any of the exhaust ports is provided with a second nozzle, the second nozzle being funnel-shaped, with one end of the large opening of the second nozzle facing the support platform.

[0013] In some possible implementations, the cavity has a protrusion at a position corresponding to the support component, and in the working state, the top height of the support component is flush with the lower top surface of the cavity.

[0014] In some possible implementations, the top of the cavity is further provided with a probe card support portion, on which the probe card is mounted, and the cross-section of the probe card support portion is L-shaped.

[0015] In some possible implementations, the distance between the first surface of the horizontal portion of the L-shaped structure facing the wafer carrier and the second surface of the probe card facing the wafer carrier is 5 mm.

[0016] In some possible implementations, the support platform has a first preset position and a second preset position, the second preset position is lower than the first preset position, and the second preset position has a vertical height difference of 300mm relative to the first preset position.

[0017] The probe station provided in this application, by setting up a support component, an air inlet, an air outlet, and a corresponding air path structure, serves as a novel cleaning method for cleaning probe cards, simultaneously cleaning the wafer carrier stage. This cleaning method significantly reduces the time required for traditional manual cleaning, improving equipment efficiency. Furthermore, the funnel-shaped design of the air inlet and outlet, combined with the pressure setting of the pressure regulating valve, creates optimal gas flow. In addition, the exhaust port can promptly discharge particulate-containing gas to prevent particulate residue inside the cavity, thereby ensuring environmental cleanliness. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the probe station provided in an embodiment of this application.

[0020] Figure 2 This is a three-dimensional structural diagram of the support component provided in an embodiment of this application.

[0021] Figure 3 This is another schematic diagram of the probe station provided in an embodiment of this application.

[0022] Figure 4 This is a schematic diagram of the control device according to an embodiment of this application. Detailed Implementation

[0023] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. It should be particularly noted that the following embodiments are only used to illustrate the embodiments of this application and do not limit the scope of the embodiments of this application. Similarly, the following embodiments are only some embodiments of the embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the embodiments of this application.

[0024] It should be understood that in the description of this application, terms such as "first" and "second" are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0025] Furthermore, the directional terms mentioned in the embodiments of this application, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the embodiments of this application, and not for limiting the embodiments of this application. In the various drawings, structurally similar units are represented by the same reference numerals. For clarity, the various parts in the drawings are schematically shown and not drawn to scale. In addition, some related parts may not be shown in the drawings.

[0026] In related technologies, the cleaning of probe cards for WAT testing equipment mainly relies on manual operation. The researchers in this application found that when the probe tips of the probe card contact the metal pads on the wafer for electrical testing, existing cleaning methods suffer from inefficiency and operational risks. Specifically, particles may adhere to the probe tips during contact, increasing or affecting contact resistance and causing abnormal test data, thus failing to accurately characterize the electrical performance of the tested device. Currently, the industry-standard manual cleaning method requires operators to perform manual cleaning periodically based on actual conditions, each cleaning session taking approximately 25 minutes and needing to be performed twice a week, which reduces equipment utilization.

[0027] The researchers in this application further discovered that existing manual cleaning methods typically require operators to manually disassemble the probe card, perform the cleaning operation, and then reinstall and debug it. The entire process relies on manual operation, and the uncertainty of manual operation makes it difficult to control the cleaning effect. Moreover, human error may damage the probe card, which requires replacement and reinstallation, further extending equipment downtime and affecting overall cleaning efficiency. Therefore, a new solution is needed that can reduce manual intervention and improve cleaning efficiency.

[0028] To address the aforementioned problems, this application proposes a probe station, comprising a cavity, a wafer carrier stage located within the cavity, a support platform supporting the wafer carrier stage, a motion mechanism connected to the support platform, and a probe holder located at the top of the cavity. Support components are disposed on opposite sides of the support platform, with the wafer carrier stage positioned between the two support components. On one side of the support component facing the support platform, a plurality of linearly arranged air inlets are provided, and on the opposite side of the support component facing the support platform, a plurality of linearly arranged exhaust outlets are provided, with the air inlets and exhaust outlets arranged parallel to each other. In operation, the motion mechanism drives the support platform to move to a first preset position, at which point the air inlets / exhaust outlets are at the same height as the probe tip of the probe holder. The air inlets purge the probe tip, and the exhaust outlets discharge the purged gas. The probe station of this application embodiment overcomes the deficiencies of the prior art and improves the cleaning efficiency of the equipment.

[0029] The probe station will be described in detail below with reference to the accompanying drawings.

[0030] Reference Figures 1 to 4 As shown, this application provides a probe station 1. The probe station 1 includes a cavity 5, a wafer carrier stage 2 located within the cavity 5, a carrier platform 3 that carries the wafer carrier stage 2, a motion mechanism 4 connected to the carrier platform 3, and a probe card 6 located at the top of the cavity 5.

[0031] like Figure 1 As shown, in this embodiment, a wafer carrier stage 2 is disposed at the center of the surface of the carrier platform 3, and support components 10 are respectively disposed on opposite sides of the carrier platform 3. That is, the support components 10 are disposed on the opposite edges of the carrier platform 3, and the wafer carrier stage 2 is located on the surface of the carrier platform 3 between the two support components 10. Preferably, the support components 10 are disposed on the opposite outer walls of the carrier platform 3 and are in close contact with the carrier platform 3. Figure 2 As shown, the distance between the support components 10 on both sides of the bearing platform 3 is 400mm. Each support component 10 has dimensions of 50×400×500mm and is made of austenitic stainless steel. In other embodiments, the size and material of the support components 10 can be adjusted according to actual needs. In this embodiment, the support components 10 on opposite sides of the bearing platform 3 are fixed to the bearing platform 3 by fasteners 103 (e.g., screws or bolts). Specifically, the bottom of the support component 10 is provided with multiple mounting holes (not shown in the figure), which are evenly distributed and correspond to the threaded holes on the corresponding side of the bearing platform 3. The support component 10 is fixed to the bearing platform 3 by fasteners 103. A motion mechanism 4 is connected to the bottom of the bearing platform 3, and the motion mechanism 4 drives the bearing platform 3 to move.

[0032] like Figure 1 As shown, the support assembly 10 on one side of the support platform 3 has multiple linearly arranged air inlets 11 facing the support platform 3, and the support assembly 10 on the opposite side of the support platform 3 has multiple linearly arranged exhaust ports 12. The air inlets 11 and exhaust ports 12 are arranged parallel to each other. As a specific embodiment, as... Figure 2 As shown, the support component 10 on one side of the support platform 3 has eight air inlets 11, and the support component 10 on the opposite side also has eight exhaust ports 12. The spacing between each air inlet 11 is 20mm, and the distance between the outermost air inlet 11 and the outer periphery of the support component 10 is 10mm. The spacing between each exhaust port 122 is also 20mm, and the distance between the outermost exhaust port 12 and the outer periphery of the support component 10 is 10mm. The number of air inlets 11 and exhaust ports 12, and the spacing between air inlets 11 and exhaust ports 12, can be set according to the size of the support component 10, and the size of the support component 10 can be set according to the actual size of the support platform 3. Therefore, there are no restrictions on the number of air inlets 11 and exhaust ports 12, or the spacing between air inlets 11 and exhaust ports 12.

[0033] See Figure 1 In this embodiment, the air inlet 11 is connected to the air source 102 via the first air passage 13, and the exhaust port 12 is connected to the exhaust port 104 via the second air passage 14. Both the air source 102 and the exhaust port 104 are located outside the cavity 5. The air source 102 can specifically use an inert gas, preferably nitrogen, which has the characteristics of purity and cleanliness, and is also low in cost.

[0034] In this embodiment, the first air passage 13 includes a first pipe 132 and a plurality of first branch pipes 131. The first pipe 132 is connected to a plurality of air inlets 11 through the plurality of first branch pipes 131, and the first branch pipes 131 are connected to the air inlets 11 one by one. The first pipe is also connected to the air source 102. The second air passage 14 includes a second pipe 142 and a plurality of second branch pipes 141. The second pipe 142 is connected to a plurality of exhaust ports 12 through the plurality of second branch pipes 141, and the second branch pipes 141 are connected to the exhaust ports 12 one by one. The second pipe is also connected to the outlet 104.

[0035] In this embodiment, the first branch pipe 131 of the first air passage 13 and the second branch pipe 141 of the second air passage 14 are respectively located within the support components 10 on opposite sides of the support platform 3. The diameter of the first branch pipe 131 at the air inlet 11 is 10 mm, and the diameter of the second branch pipe 141 at the exhaust port 12 is 10 mm. Furthermore, the first branch pipe 131 and the second branch pipe 141 are made of rigid tubing as gas transmission channels. The first pipe 132 and the second pipe 142 can be made of flexible tubing to meet the movement requirements of the support platform 3 along the X, Y, and Z axes. The first pipe 132 is connected to the air inlet 11 via the first branch pipe 131, and the second pipe 142 is connected to the exhaust port 12 via the second branch pipe 141. In one specific embodiment, the first branch pipe 131 and the second branch pipe 141 are respectively sleeved on the corresponding first pipe 132 and second pipe 142. The sleeve length can be determined according to the movement range of the support platform 3 to ensure that an effective connection can still be maintained under the maximum displacement state. When the support platform 3 moves, the first pipe 132 and the second pipe 142 can adapt to the displacement change, and the first branch pipe 131 and the second branch pipe 141 move together with the support assembly 10, while maintaining the continuity of the air passage.

[0036] In this embodiment, each air inlet 11 is provided with a first nozzle 110, which is funnel-shaped, with one end of the small opening of the first nozzle 110 facing the support platform 3. The funnel cone angle of the first nozzle is 30 degrees, gradually transitioning from a large opening diameter of 30 mm to a small opening diameter of 10 mm.

[0037] In this embodiment, each exhaust port 12 is provided with a second nozzle 120. The second nozzle 120 is funnel-shaped, with the larger opening end of the second nozzle 120 facing the support platform 3. The funnel cone angle of the second nozzle 120 is 30 degrees, gradually transitioning from a small opening diameter of 10 mm to a large opening diameter of 30 mm.

[0038] The above-described air path and nozzle configuration provides gas supply and exhaust channels for cleaning the probe card 6. During the cleaning process, the small opening design of the first nozzle 110 facilitates the formation of a high-speed, concentrated airflow for better cleaning of the probe card, while the large opening design of the second nozzle 120 allows for better exhaust of particulate-containing gas, thereby ensuring environmental cleanliness.

[0039] In this embodiment, a first pressure regulating valve 20 and a first solenoid valve 21 are provided on the first pipeline 132. Specifically, the first pressure regulating valve 20 is installed above the first solenoid valve 21. The pressure setting value of the first pressure regulating valve 20 is 80psi±10% to ensure that the gas pressure supplied to the first nozzle 110 is within a suitable pressure range, thereby effectively removing particles adhering to the probe tip 61 of the probe card 6. A second solenoid valve 22 is provided on the second pipeline 142, which works in coordination with the first solenoid valve 21. When the first solenoid valve 21 is opened to supply gas for cleaning, the second solenoid valve 22 opens simultaneously to discharge the particulate-containing gas generated during the cleaning process, thereby timely discharging the particulate-containing gas through the second branch pipeline 141, the second pipeline 142 and the outlet 104 to the outside of the cavity 5, and preventing particulates from remaining in the cavity 5 or causing secondary pollution.

[0040] In one embodiment, a second pressure regulating valve 23 may also be provided on the second pipeline 142, the second pressure regulating valve 23 being used to regulate the negative pressure in the second pipeline 142.

[0041] In this embodiment, the probe station 1 is equipped with a motion mechanism 4, which is connected to the bottom of the support platform 3 and can drive the support platform 3 to move along the X, Y, and Z axes. The support platform 3 has two preset positions, namely the first preset position A and the second preset position B, which can be referred to. Figure 1 As shown, the second preset position B has a vertical (i.e., along the Z-axis) height difference of 300mm relative to the first preset position A. Specifically, when the motion mechanism 4 drives the bearing platform 3 to reach the first preset position A, the probe station 1 enters the working state. At this time, the air inlet 11 / exhaust outlet 12 is at the same height as the probe tip of the probe card 6. When the probe card cleaning conditions are met (see the description below), the air inlet 11 blows the probe tip of the probe card 6, and the exhaust outlet 12 discharges the blown gas.

[0042] It should be noted that the first preset position A refers to the working position of the probe station 1, where probe testing or probe card cleaning can be performed. The second preset position B refers to the standby position of the probe station (i.e., in an idle state). Probe testing and cleaning are both performed in the first preset position A. Figure 1 The preset positions A and B shown in the figure are for illustrative purposes only, and the positional relationships and dimensional proportions shown do not represent actual values. Furthermore, the Z-direction height difference between the second preset position B and the first preset position A can be set according to actual needs, as long as sufficient space is provided. In this embodiment, the motion mechanism 4 adopts a conventional drive method using a motor and transmission mechanism. Multi-axis motion control of the motion mechanism 4 is a conventional technique in the art and will not be described in detail here.

[0043] In one embodiment, see Figure 1 As shown, the cavity 5 has protrusions at positions corresponding to the support assembly 10. These protrusions include a first protrusion 51 and a second protrusion 52. Specifically, the first protrusion 51 and the second protrusion 52 are respectively located on the upper and lower sides of the cavity 5 corresponding to the air inlet 11 and the upper and lower sides corresponding to the exhaust outlet 12, and both protrude towards the side opposite to the wafer carrier stage 2. The dimensions of both the first protrusion 51 and the second protrusion 52 are 100 × 20 mm. A 20 mm high accommodating space is formed between the second protrusion 52 and the inner surface of the cavity 5. In operation, when the motion mechanism 4 drives the carrier platform 3 to move to the first preset position A, the air inlet 11 and the exhaust outlet 12 can reach the same height as the probe tip of the probe card 6. By providing the first protrusion 51 and the second protrusion 52, space is guaranteed for the positioning of the support assembly 10, and the structural strength of the cavity 5 at the positions corresponding to the support assembly 10 is enhanced.

[0044] In another embodiment, see Figure 3 As shown, the top of the cavity 5 is provided with a probe card carrier 7, and the probe card 6 is mounted on the probe card carrier 7. The cross-section of the probe card carrier 7 is an L-shaped structure 71. Specifically, the horizontal part 72 of the L-shaped structure 71 has a dimension of 20mm, and the vertical part 73 has a dimension of 15mm. The distance between the first surface of the horizontal part 72 of the L-shaped structure 71 facing the wafer carrier stage 2 and the second surface of the probe card 6 facing the wafer carrier stage 2 is 5mm.

[0045] See Figure 4 In this embodiment, the probe station 1 further includes a control device 15, which includes a programmable logic controller 151. This controller 151 has two counting devices: a needle prick count counter 152 and a wafer count counter 153. The needle prick count counter 152 has a set threshold of 150,000 pricks, and the wafer count counter 153 has a set threshold of 375 wafers. When either counter reaches its corresponding preset threshold, the control device 15 triggers a cleaning operation signal. The control device 15 is connected to the motion mechanism 4 via a control cable to control the movement of the support platform 3, and is also connected to the first solenoid valve 21 and the second solenoid valve 22 to control the opening and closing of the corresponding solenoid valves.

[0046] See Figure 1 , Figure 2 and Figure 4 The following will further describe the workflow of cleaning probe card 6 by the probe station.

[0047] When the control device 15 detects that the number of probe punctures (e.g., 150,000 times) or the number of wafers (e.g., 375 wafers) has reached a set threshold, the cleaning operation is initiated. Specifically, when the control device detects that the number of probe punctures has reached the threshold during probe testing, since the probe testing position is the cleaning working position (first preset position A), the carrier platform 3 does not need to move and can start the cleaning operation at the current position. After testing a wafer, the carrier platform 3 returns to the idle position (second preset position B). At this time, if the control device detects that the number of wafers has reached the set threshold, it sends a cleaning operation signal, and the motion mechanism 4 drives the carrier platform 3 to move from the second preset position B to the first preset position A for cleaning according to the signal. When the carrier platform 3 is located at the first preset position A, the air inlet 11 / exhaust outlet 12 is at the same height as the probe tip 61 of the probe card 6, specifically, so that the air inlet 11 and the exhaust outlet 12 are aligned with the position of the probe tip 61 of the probe card 6. Subsequently, the control device 15 sends a signal to open the first solenoid valve 21 and the second solenoid valve 22. The gas source 102 supplies gas at a preset pressure to the first nozzle 110 through the first gas path 13. The first pressure regulating valve 20 ensures that the gas pressure is maintained at 80psi±10%. The first nozzle 110 forms a concentrated airflow to purge the probe tip 61 to remove particles adhering to the probe tip 61. At the same time, the second nozzle 120 of the exhaust port 12 performs synchronous suction to promptly discharge the gas containing particles out of the cavity 5. Furthermore, since the wafer carrier stage 2 is located between the exhaust port 11 and the exhaust port 12, the wafer carrier stage 2 can be purged simultaneously with the probe tip 61, ensuring the cleanliness of the wafer carrier stage 2. If a second pressure regulating valve 23 is provided, the suction pressure can be adjusted according to actual needs. After the entire purging action lasts for 30 seconds, the control device 15 closes the first solenoid valve 21 and the second solenoid valve 22, and controls the motion mechanism 4 to drive the carrier platform 3 back to the second preset position B.

[0048] The probe station in this embodiment, with its support component 10, air inlet 11, exhaust outlet 12, and corresponding air path structure, serves as a novel cleaning method for cleaning the probe tips 61 of the probe card 6. Simultaneously, it cleans the wafer carrier stage 2. A complete cleaning operation by the probe station takes approximately 2 minutes, significantly reducing cleaning time compared to the 25 minutes required for traditional manual cleaning. It also eliminates the uncertainty and potential damage risks associated with manual operation. Based on actual application data, assuming a cleaning frequency of twice per week for each WAT testing device, this translates to a reduction of 39.8 hours of equipment downtime annually and 43.3 hours of manual cleaning time for probe cards. Furthermore, it avoids probe card damage caused by manual cleaning errors. Assuming a 5% damage rate, this translates to a reduction of approximately 5.2 probe cards lost per device per year. Therefore, the probe station of this application improves the overall efficiency of the equipment.

[0049] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The features, structures, or characteristics described above can be combined in any suitable manner in one or more embodiments.

[0050] It is understood that those skilled in the art, guided by the above embodiments, can combine various implementation methods in the above embodiments to obtain technical solutions with multiple implementation methods. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A probe station, characterized in that, The probe station includes a cavity, a wafer carrier stage located within the cavity, a support platform supporting the wafer carrier stage, a motion mechanism connected to the support platform, and a probe card located at the top of the cavity. Support components are provided on opposite sides of the carrier platform, and the wafer carrier stage is located between the two support components; wherein, the support component on one side of the carrier platform has a plurality of linearly arranged air inlets facing the carrier platform, and the support component on the opposite side has a plurality of linearly arranged exhaust outlets facing the carrier platform, and the air inlets and exhaust outlets are arranged parallel to each other. In operation, the motion mechanism drives the support platform to move to a first preset position. At this time, the air inlet / exhaust outlet is at the same height as the probe tip of the probe card. The air inlet blows the probe tip, and the exhaust outlet discharges the blown gas.

2. The probe station of claim 1, wherein, The air inlet is connected to the air source through the first air passage, and the exhaust port is connected to the exhaust outlet through the second air passage.

3. The probe station of claim 2, wherein, The first air path includes a first pipe and a plurality of first branch pipes. The first pipe is connected to a plurality of air inlets through the plurality of first branch pipes and is connected to the air source. The second air path includes a second pipe and a plurality of second branch pipes. The second pipe is connected to a plurality of exhaust ports through the plurality of second branch pipes and is connected to the exhaust outlet.

4. The probe station of claim 3, wherein, The first pipeline is equipped with a first pressure regulating valve and a first solenoid valve, and the second pipeline is equipped with a second solenoid valve.

5. The probe station of claim 2, wherein, Both the gas source and the exhaust port are located outside the cavity.

6. Probe station according to any of claims 1-5, characterized in that Each of the air inlets is provided with a first nozzle, the first nozzle being funnel-shaped, with one end of the small opening of the first nozzle facing the support platform; Each of the exhaust ports is provided with a second nozzle, the second nozzle being funnel-shaped, with one end of the large opening of the second nozzle facing the support platform.

7. The probe station of claim 1, wherein The cavity has a protrusion at the position corresponding to the support component. In the working state, the top height of the support component is flush with the lower top surface of the cavity.

8. The probe station of claim 1, wherein The top of the cavity is also provided with a probe card support part, on which the probe card is installed. The cross-section of the probe card support part is L-shaped.

9. The probe station of claim 8, wherein, The distance between the first surface of the horizontal portion of the L-shaped structure facing the wafer carrier and the second surface of the probe card facing the wafer carrier is 5 mm.

10. The probe station as claimed in claim 1, characterized in that, The support platform has a first preset position and a second preset position. The second preset position is lower than the first preset position, and the second preset position has a vertical height difference of 300mm relative to the first preset position.

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