High current igbt printed circuit board

Abstract

The utility model relates to a kind of high current-carrying IGBT printed circuit board.It solves the problem that IGBT packaging technology in prior art gradually cannot meet the higher and higher current carrying capacity.It includes multilayer hard board layer, both sides of multilayer hard board layer are provided with ink layer, contact prevention positioning structure is arranged between multilayer hard board layer and ink layer, copper-plated connecting hole assembly is arranged on ink layer, and annular plug-in positioning structure is arranged circumferentially on copper-plated connecting hole assembly, and copper-plated connecting hole assembly bottom is positioned by the above contact prevention positioning structure.The utility model has the advantages that the welding stability of multilayer hard board layer is effectively improved, and the current passing performance is strong, the high-power output demand is met, and the safety under high load is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a high current-carrying IGBT printed circuit board. Background Technology

[0002] As electronic products enter the era of functionalization and intelligence, the development trend of high integration, miniaturization, and micro-miniaturization is becoming increasingly urgent. Printed circuit boards (PCBs) or semiconductor integrated circuit packaging substrates, while meeting the good electrical and thermal performance requirements of electronic products, are also developing towards a design trend of being lighter, thinner, shorter, and smaller. This means that PCBs must, on the one hand, increase the wiring density of each layer of the circuit board, and on the other hand, minimize the thickness of the insulating dielectric material. Any-layer interconnect technology maximizes the use of limited circuit layout area by connecting and transmitting electrical signals between any layers, thus maximizing circuit density. Simultaneously, the application of ultra-thin dielectric materials effectively reduces the overall thickness of the circuit board or packaging substrate, especially the thickness of multilayer circuit boards.

[0003] As products trend towards thinner and lighter designs, the industry typically uses core boards with thinner dielectric layers to reduce the overall thickness of the finished circuit board or packaging substrate. However, when the dielectric layer thickness of the core board is below 50μm, specialized and expensive ultra-thin core board processing equipment must be used, significantly increasing production costs. While some industries use auxiliary tools on conventional equipment for ultra-thin core board processing, these methods suffer from drawbacks such as operational complexity, low efficiency, and low yield. Furthermore, traditional IGBT packaging technology is increasingly unable to meet the ever-increasing current carrying capacity and achieve higher power densities.

[0004] To address the shortcomings of existing technologies, people have conducted long-term explorations and proposed various solutions. For example, Chinese patent literature discloses a processing method for ultra-thin multilayer printed circuit boards [CN106211638A]. This method involves simultaneously stacking and pressing ultra-thin carrier copper foil and carrier prepreg to form a detachable multilayer circuit board with a carrier structure. The ultra-thin copper foil is then attached and fixed to the carrier structure using the resin flow of the carrier prepreg, forming a unified overall structure. The alignment system is determined by using positioning holes on the ultra-thin carrier copper foil for subsequent processing. When the processed board reaches a thickness ≥0.06mm, it can be separated from the ultra-thin copper foil and carrier copper foil through edge milling and board disassembly operations, resulting in two identical processed circuit boards. The two processed boards are then processed separately using conventional processes until the required circuitry or packaging substrate is fabricated.

[0005] The above solution has solved to some extent the problems of complex operation, low efficiency and low yield in the existing ultra-thin core board processing method. However, the solution still has many shortcomings. For example, the traditional IGBT packaging technology is gradually unable to meet the increasingly high current carrying capacity and cannot achieve higher power density. Summary of the Invention

[0006] The purpose of this invention is to address the above-mentioned problems by providing a high current-carrying IGBT printed circuit board.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a high current-carrying IGBT printed circuit board, comprising multiple rigid board layers, ink layers on both the upper and lower sides of the multiple rigid board layers, an anti-contact positioning structure between the multiple rigid board layers and the ink layers, a copper-plated connection hole assembly on the ink layer, and a ring-shaped insertion positioning structure circumferentially provided on the copper-plated connection hole assembly, the bottom of the copper-plated connection hole assembly being positioned by the aforementioned anti-contact positioning structure.

[0008] In the aforementioned high current-carrying IGBT printed circuit board, the anti-contact positioning structure includes an insulating pad, a heat dissipation gap between the insulating pad and the multilayer rigid board layer, and the aforementioned ink layer is laid on the outer surface of the corresponding insulating pad.

[0009] In the aforementioned high current-carrying IGBT printed circuit board, several heat dissipation support pillars are provided in the heat dissipation gap, and one end of the heat dissipation support pillar is connected to an insulating pad. The heat dissipation gap is circumferentially open.

[0010] In the aforementioned high current-carrying IGBT printed circuit board, the copper-plated connection hole assembly includes a positioning hole seat that passes through the positioning layer and the insulating pad. One end of the positioning hole seat is threadedly connected to a positioning connection disc, which is positioned in the heat dissipation gap and connected to the multilayer rigid board layer.

[0011] In the aforementioned high current-carrying IGBT printed circuit board, the end of the positioning hole seat away from the positioning connection plate is connected to a plug connector via a sliding structure, and the plug connector is coated with a resin film layer on its inner circumference.

[0012] In the aforementioned high current-carrying IGBT printed circuit board, the sliding structure includes a sliding connection part disposed at one end of the positioning hole seat, the outer wall of the sliding connection part is provided with a plurality of guide protrusions, and the inner cavity of the plug connector is provided with a plurality of guide grooves that correspond one-to-one with the guide protrusions.

[0013] In the aforementioned high current-carrying IGBT printed circuit board, the annular insertion positioning structure includes an annular groove provided on the positioning hole seat, an annular insertion seat provided in the annular groove, a plurality of insertion positioning parts provided at the lower end of the annular insertion seat, and an annular positioning disk rotatably provided on the ink layer, and a plurality of connection slots corresponding one-to-one with the insertion positioning parts are arranged circumferentially on the annular positioning disk.

[0014] In the aforementioned high current-carrying IGBT printed circuit board, the annular positioning disk has a clearance through hole at its axis, through which the positioning hole seat can pass.

[0015] In the aforementioned high current-carrying IGBT printed circuit board, the copper-plated interconnecting hole assemblies located on the upper and lower sides of the multilayer rigid board layer are staggered.

[0016] In the aforementioned high current-carrying IGBT printed circuit board, the positioning hole seat and the inner and outer walls of the plug connector are plated with copper layers, and the aforementioned resin film layer is disposed on the surface of the copper layer on the inner wall.

[0017] Compared with the prior art, the advantages of this utility model are: it effectively improves the welding stability of multi-layer rigid plates, and the annular plug-in positioning structure covered by copper plating and resin film has strong current carrying capacity, meeting the high power output requirements. It also improves the copper thickness and corrosion resistance of the hole plug-in connector, enhancing safety under high load conditions. Attached Figure Description

[0018] Figure 1 This is a cross-sectional view of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the installation position of the multi-ring positioning disc in this utility model;

[0020] Figure 3 This is a schematic diagram of the annular insertion positioning structure in this utility model;

[0021] Figure 4 This is a schematic diagram of the plug-in connector after it has slid in this utility model;

[0022] In the diagram: 1. Multilayer rigid board layer; 11. Ink layer; 2. Anti-contact positioning structure; 21. Insulating gasket; 22. Heat dissipation gap; 23. Heat dissipation support column; 3. Copper-plated connecting hole assembly; 31. Positioning hole seat; 32. Positioning connecting plate; 4. Annular plug-in positioning structure; 41. Annular groove; 42. Annular plug-in seat; 43. Annular positioning part; 44. Connecting slot; 45. Clearance through hole; 46. Sliding structure; 51. Sliding connecting part; 52. Guide protrusion; 6. Plug-in connector. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0024] like Figure 1-4As shown, the high current-carrying IGBT printed circuit board includes a multilayer rigid board layer 1. Ink layers 11 are provided on both the upper and lower sides of the multilayer rigid board layer 1. An anti-contact positioning structure 2 is provided between the multilayer rigid board layer 1 and the ink layer 11. A copper-plated connection hole assembly 3 is provided on the ink layer 11, and an annular insertion positioning structure 4 is provided around the copper-plated connection hole assembly 3. The bottom of the copper-plated connection hole assembly 3 is positioned by the aforementioned anti-contact positioning structure 2.

[0025] Ink layer 11 is solder resist ink. Multilayer rigid board layer 1 is a double or multilayer rigid board with an outer copper thickness ranging from 0.17 to 0.30 mm and a current carrying capacity of ≥70 A.

[0026] The ink layer 11 exposes the solder pads through the solder resist window, and then copper is plated in the solder pad area so that the solder pads are 50-70um higher than the ink layer. When the component is packaged and placed, the silicon carbide surface on the component can make full contact with the copper-plated solder pads, thus improving reliability.

[0027] Because the outer copper layer is relatively thick and the difference in height between the circuit and the substrate is relatively large, in order to improve the reliability of the solder resist ink, the outer circuit is pre-baked and subjected to a four-stage baking process after the solder resist ink is printed. The specific process is as follows: top circuit solder resist ink printing → pre-baking (75℃ / 30min) → solder resist surface exposure → development → four-stage baking process (①70℃ / 60min ②90℃ / 60min ③110℃ / 40min ④150℃ / 30min) → bottom circuit solder resist ink printing → pre-baking (75℃ / 30min) → solder resist surface exposure → development → four-stage baking process (①70℃ / 60min ②90℃ / 60min ③110℃ / 40min ④150℃ / 30min).

[0028] The anti-contact positioning structure 2 includes an insulating pad 21, with a heat dissipation gap 22 between the insulating pad 21 and the multilayer rigid plate layer 1, and the ink layer 11 is laid on the outer surface of the corresponding insulating pad 21.

[0029] Insulating pad 21 is used for current blocking, and heat dissipation gap 22 is used to improve heat dissipation under high current carrying capacity.

[0030] As can be seen, a number of heat dissipation support columns 23 are provided in the heat dissipation gap 22, and one end of the heat dissipation support column 23 is connected to the insulating pad 21. The heat dissipation gap 22 is open in the circumferential direction.

[0031] Furthermore, the copper-plated connection hole assembly 3 includes a positioning hole seat 31 that passes through the positioning layer and the insulating gasket 21. One end of the positioning hole seat 31 is threadedly connected to a positioning connecting plate 32, which is positioned within the heat dissipation gap 22 and connected to the multilayer rigid board layer 1.

[0032] The positioning hole seat 31 is used to maintain the stability of the insertion.

[0033] Specifically, the end of the positioning hole seat 31 away from the positioning connecting plate 32 is connected to the plug connector 6 through the sliding structure 5, and the plug connector 6 is coated with a resin film layer on its inner side.

[0034] The connector 6 is a copper bump. The connector 6 is 50-70um higher than the ink layer. During the encapsulation and soldering process, it can make full contact between the silicon carbide wafer surface and the pad surface, thus improving the reliability of the soldering.

[0035] Using a resin film layer for hole plugging enhances the corrosion resistance of the copper thickness inside the plug connector 6, thereby improving the safety of current transmission under high current load.

[0036] In detail, the sliding structure 5 includes a sliding connection part 51 disposed at one end of the positioning hole seat 31. The outer wall of the sliding connection part 51 is provided with a plurality of guide protrusions 52, and the inner cavity of the plug connector 6 is provided with a plurality of guide grooves that correspond one-to-one with the guide protrusions 52.

[0037] The sliding structure 5 allows the plug-in connector 6 to slide slightly after welding, providing a shock-absorbing effect.

[0038] Preferably, the annular plug-in positioning structure 4 includes an annular groove 41 provided on the positioning hole seat 31, an annular plug-in seat 42 provided in the annular groove 41, a plurality of plug-in positioning parts 43 provided at the lower end of the annular plug-in seat 42, and an annular positioning disk 44 rotatably provided on the ink layer 11, and a plurality of connecting slots 45 corresponding one-to-one with the plug-in positioning parts 43 are arranged circumferentially on the annular positioning disk 44.

[0039] Furthermore, the annular positioning disk 44 has a clearance through hole 46 at its axis, through which the positioning hole seat 31 can pass.

[0040] More specifically, the copper-plated connecting hole assemblies 3 located on the upper and lower sides of the multilayer rigid board layer 1 are staggered.

[0041] The annular insertion positioning structure 4 is used to form a circumferential rotation positioning of the positioning hole seat 31 to ensure welding accuracy.

[0042] In addition, the positioning hole seat 31 and the inner and outer walls of the plug connector 6 are plated with copper layers, and the aforementioned resin film layer is disposed on the surface of the copper layer on the inner wall.

[0043] In summary, the principle of this embodiment is as follows: using the multi-layer rigid board layer 1 as the core load-bearing substrate, the reliability of the ink layer 11 is ensured by printing solder resist ink on the top and bottom layers to adapt to the difference in height between the circuit and the substrate; at the same time, the insulating pad 21 in the anti-contact positioning structure 2 achieves current isolation, and the heat dissipation gap 22 assists in high current-carrying heat dissipation, taking into account both safety and thermal management; secondly, the copper-plated connection hole assembly 3 maintains the stability of the insertion through the positioning hole seat 31, the insertion connector 6 ensures the safety of welding and transmission, and the insertion connector 6 can slide slightly to achieve shock resistance, protect the stability of the high current-carrying connection, and ultimately achieve the requirements of high current-carrying and high reliability IGBT connection.

[0044] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.

[0045] Although this document frequently uses terms such as multi-layer rigid board layer 1, ink layer 11, anti-contact positioning structure 2, insulating gasket 21, heat dissipation gap 22, heat dissipation support column 23, copper-plated connecting hole assembly 3, positioning hole seat 31, positioning connecting plate 32, annular plug-in positioning structure 4, annular groove 41, annular plug-in seat 42, plug-in positioning part 43, annular positioning plate 44, connecting slot 45, clearance through hole 46, sliding structure 5, sliding connection part 51, guide protrusion part 52, and plug-in connector 6, the possibility of using other terms is not excluded. The use of these terms is merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

Claims

1. A high current IGBT printed circuit board comprising a plurality of hard board layers (1), characterized in that, The multi-layer rigid board layer (1) is provided with ink layers (11) on both the upper and lower sides. An anti-contact positioning structure (2) is provided between the multi-layer rigid board layer (1) and the ink layer (11). A copper-plated connecting hole assembly (3) is provided on the ink layer (11), and a ring-shaped insertion positioning structure (4) is provided around the copper-plated connecting hole assembly (3). The bottom of the copper-plated connecting hole assembly (3) is positioned by the anti-contact positioning structure (2).

2. The high current IGBT printed circuit board of claim 1, wherein, The anti-contact positioning structure (2) includes an insulating pad (21), and there is a heat dissipation gap (22) between the insulating pad (21) and the multilayer rigid plate layer (1), and the ink layer (11) is laid on the outer surface of the corresponding insulating pad (21).

3. The high current IGBT printed circuit board of claim 2, wherein, The heat dissipation gap (22) is provided with a number of heat dissipation support columns (23), and one end of the heat dissipation support column (23) is connected to the insulating pad (21). The heat dissipation gap (22) is circumferentially open.

4. The high current IGBT printed circuit board of claim 2, wherein, The copper-plated connection hole assembly (3) includes a positioning hole seat (31) that passes through the positioning layer and the insulating gasket (21). One end of the positioning hole seat (31) is threadedly connected to a positioning connecting plate (32). The positioning connecting plate (32) is positioned in the heat dissipation gap (22) and connected to the multilayer rigid board layer (1).

5. The high current IGBT printed circuit board of claim 4, wherein, The end of the positioning hole seat (31) away from the positioning connecting plate (32) is connected to the plug connector (6) through the sliding structure (5), and the plug connector (6) is coated with a resin film layer on the inner side of the circumference.

6. The high current IGBT printed circuit board of claim 5, wherein, The sliding structure (5) includes a sliding connection part (51) disposed at one end of the positioning hole seat (31). The outer wall of the sliding connection part (51) is provided with a number of guide protrusions (52), and the inner cavity of the plug connector (6) is provided with a number of guide grooves that correspond one-to-one with the guide protrusions (52).

7. The high current IGBT printed circuit board of claim 4, wherein, The annular plug-in positioning structure (4) includes an annular groove (41) provided on the positioning hole seat (31), an annular plug-in seat (42) provided in the annular groove (41), a plurality of plug-in positioning parts (43) provided at the lower end of the annular plug-in seat (42), and an annular positioning disk (44) rotatably provided on the ink layer (11), and a plurality of connection slots (45) corresponding to the plug-in positioning parts (43) are arranged circumferentially on the annular positioning disk (44).

8. The high current IGBT printed circuit board of claim 7, wherein, The annular positioning disk (44) has a clearance through hole (46) at its axis, through which the positioning hole seat (31) can pass.

9. The high current IGBT printed circuit board of claim 1, wherein, The copper-plated connecting hole assemblies (3) located on the upper and lower sides of the multilayer rigid board layer (1) are staggered.

10. The high current IGBT printed circuit board of claim 5, wherein, The positioning hole seat (31) and the plug connector (6) are plated with copper layers on their inner and outer walls, and the resin film layer is disposed on the surface of the copper layer on the inner wall.

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