The invention discloses a
semiconductor packaging structure and a packaging method thereof, and relates to the technical field of semiconductors, the
semiconductor packaging structure comprises a base island, a
chip and a plurality of pins, the
chip is mounted on the base island, the plurality of pins are arranged along the
peripheral side of the base island, the
chip is electrically connected with the inner end parts of the pins, and the outer end parts of the pins are provided with grooves, so that the outer end parts of the pins form
cantilever beam structures; the
cantilever beam structure is divided into a first pin part and at least one second pin part which are stacked in the thickness direction of the pin, and the length of the first pin part is larger than that of the second pin part, so that the first pin part and the second pin part are arranged in a staggered mode on a plane perpendicular to the thickness direction and jointly form a stepped
welding structure. The
welding structure is used for being connected with a circuit board. According to the
semiconductor packaging structure, through the stepped
welding structure, the wettability of
soldering tin is improved to optimize the welding quality, thermal stress and mechanical stress can be buffered and absorbed to reduce welding spot cracks, and the stability and reliability of the packaging structure are further improved.