The utility model discloses a
lead frame for
chip packaging, and belongs to the technical field of
chip packaging. The
lead frame comprises a base, a placing groove, a cover plate, clamping grooves and pins, wherein the placing groove is formed in the base and used for placing a
chip; the cover plate is arranged at the position, corresponding to the upper portion of the placing groove, of the base; the clamping grooves are formed in the base, located on the periphery of the placing groove and distributed in a
linear array; according to the
lead frame for chip packaging, through the arrangement of the bonding parts, the
welding positions of the gold wires and the pins can be positioned, the
welding contact area of the gold wires and the pins is increased, the risk that
welding spots fall off is reduced, meanwhile, through the arrangement of the buffer connecting pieces, stress generated by
thermal expansion or machinery can be buffered in the
welding process, and the welding quality is improved. The problem of deformation or welding spot
cracking caused by
stress concentration of the pins is reduced, and the reliability of the lead frame in complex environments of high temperature, vibration and the like is improved.