A multilayer composite deformation-resistant circuit board

Abstract

The utility model relates to related technical field of circuit board discloses a multilayer composite anti -deformation circuit board including circuit board body, the circuit board body includes circuit board anti -deformation outer frame and circuit board, and circuit board sets up in circuit board anti -deformation outer frame, the four around of circuit board anti -deformation outer frame is provided with the heat dissipation slot of heat dissipation use to circuit board, the inside bottom of circuit board anti -deformation outer frame is fixed with the anti -deformation support of supporting use to circuit board, the bottom of circuit board is provided with circuit board anti -deformation structure layer, and circuit board anti -deformation structure layer supports in the top of anti -deformation support, the inside bottom of circuit board anti -deformation outer frame four around all are fixed with the support sleeve of supporting use to circuit board, and support sleeve supports in the bottom of circuit board anti -deformation structure layer, and this technical scheme can better reinforce protection to circuit board, increase the anti -deformation effect of circuit board, can increase the use quality of circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a multilayer composite anti-deformation circuit board. Background Technology

[0002] A circuit board (PCB) can also be called a printed circuit board or a printed circuit board.

[0003] Circuit boards are composed of integrated circuits, quartz oscillators, trimmer capacitors and printed circuit boards [1]. Circuit boards are named as follows: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. In electronic devices, they are mainly used to connect various electronic components and serve as structural support components.

[0004] In existing technology, the four corners of circuit boards lack protective features, making them susceptible to damage and deformation under external forces. Besides the corners, the center of the circuit board is also prone to deformation under pressure or vibration, and this deformation is difficult to reverse, affecting the quality of the circuit board.

[0005] In view of this, this technical solution proposes a multilayer composite anti-deformation circuit board, which can better solve the problems mentioned above. Utility Model Content

[0006] The technical solution adopted by this utility model is as follows: a multi-layer composite anti-deformation circuit board, including a circuit board body, the circuit board body including an anti-deformation outer frame and a circuit board, and the circuit board is disposed in the anti-deformation outer frame. The anti-deformation outer frame is provided with heat dissipation slots around the circuit board for heat dissipation.

[0007] The inner bottom of the anti-deformation outer frame of the circuit board is fixed with an anti-deformation bracket for supporting the circuit board. The bottom of the circuit board is provided with an anti-deformation structural layer, which is supported on top of the anti-deformation bracket. Support sleeves for supporting the circuit board are fixed around the inner bottom of the anti-deformation outer frame of the circuit board, and the support sleeves are supported on the bottom of the anti-deformation structural layer. The internal threads of the anti-deformation outer frame of the circuit board and the support sleeves are connected with fixing bolts, and the fixing bolts are threaded into the circuit board through the anti-deformation structural layer to fix the circuit board in the anti-deformation outer frame of the circuit board.

[0008] In a preferred embodiment, the circuit board anti-deformation outer frame is adapted to the circuit board, and the circuit board anti-deformation outer frame is made of FR-4 reinforced material, which is a glass fiber reinforced epoxy resin composite material with good electrical insulation and mechanical strength, and can improve its mechanical strength and deformation resistance.

[0009] In a preferred embodiment, the deformation-resistant support is made of polyimide material, which has high temperature stability, high strength and excellent mechanical properties.

[0010] In a preferred embodiment, the anti-deformation bracket consists of a horizontal plate and inclined plates disposed on both sides of the horizontal plate.

[0011] In a preferred embodiment, the circuit board anti-deformation structural layer is composed of circuit board anti-deformation structural adhesive, heat dissipation grooves and heat dissipation through holes. The circuit board anti-deformation structural adhesive is fixed to the bottom of the circuit board, and the circuit board anti-deformation structural adhesive has heat dissipation grooves and heat dissipation through holes inside.

[0012] In a preferred embodiment, the anti-deformation structural adhesive for the circuit board is an epoxy resin structural adhesive, which effectively prevents deformation and extends service life by increasing thickness and curing strength. It is suitable for reinforcing conventional circuit boards.

[0013] In a preferred embodiment, the heat dissipation channel and the heat exhaust hole are connected, and the heat exhaust hole is located above the heat dissipation channel and is equidistantly distributed.

[0014] In a preferred embodiment, the anti-deformation structural adhesive for the circuit board is the same length and width as the circuit board, and the anti-deformation structural adhesive for the circuit board is bonded to the bottom of the circuit board.

[0015] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are: this technical solution can better reinforce and protect the circuit board, increase the circuit board's resistance to deformation, and thus increase the quality of the circuit board in use.

[0016] 1. In this utility model, by setting an anti-deformation outer frame on the outside of the circuit board, the overall anti-deformation effect of the circuit board can be increased. At the same time, an anti-deformation bracket is set at the bottom of the inner part of the anti-deformation outer frame. The anti-deformation bracket can support and reinforce the circuit board, which can further increase the anti-deformation effect of the circuit board. Furthermore, an anti-deformation structural layer is set at the bottom of the circuit board. The anti-deformation structural layer is integrally formed with the circuit board, which can better reinforce the anti-deformation ability of the circuit board.

[0017] 2. In this utility model, the heat dissipation grooves and heat exhaust holes inside the anti-deformation structural adhesive of the circuit board can dissipate heat to the bottom of the circuit board, and then the heat generated by the circuit board is discharged through the heat dissipation grooves. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the first state structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the second state structure of this utility model;

[0020] Figure 3 This utility model Figure 2 Enlarged schematic diagram of the structure of region A in the middle;

[0021] Figure 4 This is a half-sectional schematic diagram of the anti-deformation support structure of this utility model;

[0022] Figure 5 This is a schematic diagram of the anti-deformation structure layer of the circuit board of this utility model.

[0023] The markings in the diagram are: 1-Circuit board body; 2-Circuit board anti-deformation outer frame; 3-Circuit board; 4-Heat dissipation slot; 5-Anti-deformation bracket; 6-Support sleeve; 7-Fixing bolt; 8-Circuit board anti-deformation structural layer; 9-Circuit board anti-deformation structural adhesive; 10-Heat dissipation channel; 11-Heat exhaust through hole. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0025] The following will combine Figures 1-5 A detailed description of a multilayer composite anti-deformation circuit board according to an embodiment of the present invention is provided.

[0026] refer to Figures 1-3 As shown, a multilayer composite anti-deformation circuit board includes a circuit board body 1, which includes an anti-deformation outer frame 2 and a circuit board 3. The circuit board 3 is disposed in the anti-deformation outer frame 2, and the anti-deformation outer frame 2 is adapted to the circuit board 3. The anti-deformation outer frame 2 is made of FR-4 reinforced material, which is a glass fiber reinforced epoxy resin composite material with good electrical insulation and mechanical strength, which can improve its mechanical strength and anti-deformation ability. Heat dissipation slots 4 are provided around the anti-deformation outer frame 2 for heat dissipation of the circuit board 3.

[0027] refer to Figures 2-5As shown, the inner bottom of the circuit board anti-deformation outer frame 2 is fixed with an anti-deformation bracket 5 for supporting the circuit board 3. The anti-deformation bracket 5 is made of polyimide material, which has high temperature stability, high strength and excellent mechanical properties. The anti-deformation bracket 5 consists of a horizontal plate and inclined plates set on both sides of the horizontal plate. The bottom of the circuit board 3 is provided with a circuit board anti-deformation structure layer 8, and the circuit board anti-deformation structure layer 8 is supported on the top of the anti-deformation bracket 5. Support sleeves 6 for supporting the circuit board 3 are fixed around the inner bottom of the circuit board anti-deformation outer frame 2. The support sleeves 6 support the circuit board 3. At the bottom of the anti-deformation structural layer 8, the internal threads of the circuit board anti-deformation outer frame 2 and the support sleeve 6 are connected to fixing bolts 7. These fixing bolts 7 are threaded into the circuit board 3 through the anti-deformation structural layer 8, fixing the circuit board 3 within the anti-deformation outer frame 2. The anti-deformation structural layer 8 consists of anti-deformation structural adhesive 9, heat dissipation grooves 10, and heat dissipation holes 11. The anti-deformation structural adhesive 9 is fixed to the bottom of the circuit board 3. The anti-deformation structural adhesive 9 is an epoxy resin structural adhesive; by increasing its thickness and curing strength, it effectively prevents deformation and extends its service life. It is suitable for reinforcing conventional circuit boards. The anti-deformation structural adhesive 9 has the same length and width as the circuit board 3 and is bonded to the bottom of the circuit board 3. The anti-deformation structural adhesive 9 has heat dissipation grooves 10 and heat dissipation holes 11 inside. The heat dissipation grooves 10 and heat dissipation holes 11 are interconnected, and the heat dissipation holes 11 are located above the heat dissipation grooves 10 and are equidistantly distributed.

[0028] Advantages of this application: This technical solution can better reinforce and protect the circuit board 3, increase the deformation resistance of the circuit board 3, and thus increase the quality of the circuit board 3.

[0029] Working principle: By setting an anti-deformation outer frame 2 on the outside of the circuit board 3, the overall anti-deformation effect of the circuit board 3 can be increased. At the same time, an anti-deformation bracket 5 is set at the bottom inside the anti-deformation outer frame 2. The anti-deformation bracket 5 can support and reinforce the circuit board 3, which can further increase the anti-deformation effect of the circuit board 3. Furthermore, an anti-deformation structural layer 8 is set at the bottom of the circuit board 3. The anti-deformation structural layer 8 is integrally formed with the circuit board 3, which can better reinforce the anti-deformation ability of the circuit board 3.

[0030] Heat can be dissipated from the bottom of the circuit board 3 through the heat dissipation grooves 10 and heat exhaust holes 11 inside the anti-deformation structural adhesive 9, and then the heat generated by the circuit board 3 can be discharged through the heat dissipation slots 4.

[0031] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A multilayer composite anti-deformation circuit board, comprising a circuit board body (1), characterized in that: The circuit board body (1) includes a circuit board anti-deformation outer frame (2) and a circuit board (3), and the circuit board (3) is disposed in the circuit board anti-deformation outer frame (2). The circuit board anti-deformation outer frame (2) is provided with heat dissipation slots (4) around the circuit board (3) for heat dissipation. The inner bottom of the circuit board anti-deformation outer frame (2) is fixed with an anti-deformation bracket (5) for supporting the circuit board (3). The bottom of the circuit board (3) is provided with a circuit board anti-deformation structure layer (8), and the circuit board anti-deformation structure layer (8) is supported on the top of the anti-deformation bracket (5). The inner bottom of the circuit board anti-deformation outer frame (2) is fixed with support sleeves (6) for supporting the circuit board (3), and the support sleeves (6) are supported on the bottom of the circuit board anti-deformation structure layer (8). The circuit board anti-deformation outer frame (2) and the support sleeves (6) are internally threaded with fixing bolts (7), and the fixing bolts (7) are threaded into the circuit board (3) through the circuit board anti-deformation structure layer (8) to fix the circuit board (3) in the circuit board anti-deformation outer frame (2).

2. The multilayer composite anti-deformation circuit board as described in claim 1, characterized in that: The circuit board anti-deformation outer frame (2) is adapted to the circuit board (3), and the circuit board anti-deformation outer frame (2) is made of FR-4 reinforced material.

3. The multilayer composite anti-deformation circuit board as described in claim 1, characterized in that: The deformation-resistant support (5) is made of polyimide material.

4. The multilayer composite anti-deformation circuit board as described in claim 1, characterized in that: The anti-deformation bracket (5) consists of a horizontal plate and inclined plates arranged on both sides of the horizontal plate.

5. The multilayer composite anti-deformation circuit board as described in claim 1, characterized in that: The circuit board anti-deformation structural layer (8) is composed of circuit board anti-deformation structural adhesive (9), heat dissipation channel (10) and heat dissipation through hole (11). The circuit board anti-deformation structural adhesive (9) is fixed to the bottom of the circuit board (3), and the circuit board anti-deformation structural adhesive (9) has heat dissipation channel (10) and heat dissipation through hole (11) inside.

6. The multilayer composite anti-deformation circuit board as described in claim 1, characterized in that: The anti-deformation structural adhesive (9) for the circuit board is an epoxy resin structural adhesive.

7. The multilayer composite anti-deformation circuit board as described in claim 1, characterized in that: The heat dissipation channel (10) and the heat exhaust hole (11) are connected, and the heat exhaust hole (11) is located above the heat dissipation channel (10) and is distributed at equal intervals.

8. The multilayer composite anti-deformation circuit board as described in claim 1, characterized in that: The anti-deformation structural adhesive (9) of the circuit board has the same length and width as the circuit board (3), and the anti-deformation structural adhesive (9) is bonded to the bottom of the circuit board (3).

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