Metal shell for semiconductor device

Abstract

The utility model discloses a sheet metal shell for semiconductor equipment, including a plurality of shell unit that concatenates in proper order, every shell unit includes shell board, skeleton and inner shell board, the four around of shell board is equipped with outer bending part respectively, all outer bending part surrounds and forms and holds the groove, and the skeleton and inner shell board are located in the holding groove, and the skeleton is located between shell board and inner shell board, and the skeleton includes a plurality of horizontal support plate and a plurality of vertical support plate, and the four around of inner shell board is equipped with inner bending part respectively. The utility model discloses a multilayer structure design of shell board, skeleton and inner shell board, cooperate with the skeleton of horizontal and vertical support plate cross -linked, significantly enhanced the overall strength and impact resistance of sheet metal shell, effectively resist mechanical vibration and collision, protect internal element. The functional filling material between shell board and inner shell board can select sound insulation, heat insulation, electromagnetic shielding or fireproof material as needed, and satisfies the semiconductor equipment operation demand all -round.

Description

Technical Field

[0001] This utility model belongs to the field of housing technology, specifically relating to sheet metal housings for semiconductor equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, the performance and reliability of semiconductor equipment play a crucial role in the entire production process. As an important component of semiconductor equipment, sheet metal housings not only need to provide physical protection for the internal precision electronic components, but also need to meet various functional requirements such as sound insulation, heat insulation, electromagnetic shielding, and fire resistance to ensure stable equipment operation and reduce the impact of external interference on production accuracy. Traditional semiconductor equipment sheet metal housings are typically simple in structure, often consisting of a single-layer metal sheet or assembled from simple splicing. These housings suffer from significant strength deficiencies, making them unable to withstand mechanical vibrations, collisions, and other external impacts that may occur during production, easily leading to damage to internal components. Furthermore, their sound insulation, heat insulation, electromagnetic shielding, and fire resistance performance fail to meet the high standards required for modern semiconductor equipment. External noise, heat, and electromagnetic interference can affect the normal operation of the equipment and may even pose safety hazards. In addition, the connections between components in traditional housings are not robust enough during assembly, and loosening is likely to occur after prolonged use, reducing the overall performance and lifespan of the housing. Utility Model Content

[0003] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a sheet metal housing for semiconductor equipment, comprising a plurality of housing units assembled sequentially, each housing unit comprising an outer shell plate, a frame, and an inner shell plate, the outer shell plate having outwardly bent portions formed by inward bending around its perimeter, all outwardly bent portions forming a receiving groove, the frame and the inner shell plate being located within the receiving groove, the frame being located between the outer shell plate and the inner shell plate, the frame comprising a plurality of horizontal support plates and a plurality of vertical support plates, the horizontal support plates being sequentially and cross-connected with the vertical support plates, the inner shell plate having inwardly bent portions formed by inward bending around its perimeter, the inner bent portions respectively fitting against the corresponding outer bent portions and being fastened, welded, or connected to the corresponding outer bent portions by a plurality of screws, the inner bent portions and the outer bent portions respectively having a plurality of mounting holes.

[0004] As a preferred embodiment of the above technical solution, a functional filling material is provided between the outer shell plate and the inner shell plate.

[0005] As a preferred embodiment of the above technical solution, the functional filling material includes any one or more of the following: sound insulation material, heat insulation material, electromagnetic shielding filling material, and fireproof material.

[0006] As a preferred embodiment of the above technical solution, the frame is provided with a plurality of front support blocks and a plurality of rear support blocks. The front support blocks and the rear support blocks are respectively located at the connection between the horizontal support plate and the vertical support plate. The front support blocks abut against the outer shell plate, and the rear support blocks abut against the inner shell plate.

[0007] As a preferred embodiment of the above technical solution, the front support block and the rear support block are staggered.

[0008] As a preferred embodiment of the above technical solution, the outer shell plate and the inner shell plate are respectively formed by stamping metal plates.

[0009] The beneficial effects of this utility model are as follows: Through a multi-layered structural design of the outer shell, frame, and inner shell, combined with a frame featuring intersecting horizontal and vertical support plates, this utility model significantly enhances the overall strength and impact resistance of the sheet metal shell, effectively resisting mechanical vibration and collisions, and protecting internal components. The functional filling material between the outer shell and inner shell can be selected as needed, including sound insulation, heat insulation, electromagnetic shielding, or fireproof materials, comprehensively meeting the operational requirements of semiconductor equipment. The staggered distribution of the front and rear support blocks further optimizes the internal support structure of the shell, ensuring uniform stress distribution. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of this utility model.

[0011] Figure 2 This is a schematic diagram of the cross-sectional structure of this utility model.

[0012] Figure 3 This is a schematic diagram of the skeleton. Detailed Implementation

[0013] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0014] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0015] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0016] like Figure 1-3 As shown, a sheet metal housing for semiconductor equipment includes several housing units assembled sequentially. Each housing unit includes an outer shell plate 1, a frame, and an inner shell plate 2. The outer shell plate 1 has outwardly bent portions 3 formed by inward bending around its perimeter. All outwardly bent portions 3 form a receiving groove. The frame and inner shell plate 2 are located within the receiving groove, with the frame positioned between the outer shell plate 1 and the inner shell plate 2. The frame includes several horizontal support plates 4 and several vertical support plates 5. The horizontal support plates 4 are sequentially and intersectingly connected to the vertical support plates 5. The inner shell plate 2 has inwardly bent portions 6 formed by inward bending around its perimeter. The inwardly bent portions 6 are respectively fitted to and fastened to the corresponding outwardly bent portions 3. Several mounting holes 7 are provided on the inwardly bent portions 6 and the outwardly bent portions 3. The housing units are connected by bolts passing through the mounting holes 7.

[0017] Furthermore, a functional filling material is provided between the outer shell plate 1 and the inner shell plate 2.

[0018] Furthermore, the functional filling material includes any one or more of sound insulation materials, heat insulation materials, electromagnetic shielding filling materials, and fireproof materials. Sound insulation materials include sound-absorbing cotton, and heat insulation materials include heat-insulating cotton, facilitating filling. The functional filling material is selected according to needs.

[0019] Furthermore, the frame is provided with a plurality of front support blocks 8 and a plurality of rear support blocks 9, which are located at the connection points of the horizontal support plate 4 and the vertical support plate 5, respectively. The front support blocks 8 abut against the outer shell plate 1, and the rear support blocks 9 abut against the inner shell plate 2. The front support blocks 8 and the rear support blocks 9 can be made of plastic and are fixedly connected to the frame by adhesive.

[0020] Furthermore, the front support block 8 and the rear support block 9 are staggered, which makes the outer shell plate 1 and the inner shell plate 2 bear force evenly, reduces deformation, and improves impact resistance.

[0021] Furthermore, the outer shell plate 1 and the inner shell plate 2 are respectively formed by stamping metal sheets. The outer bending portion 3 on the outer shell plate 1 can also be formed by cutting, bending, and then welding adjacent outer bending portions 3.

[0022] Furthermore, the inner shell plate 2 is provided with several transverse strip-shaped through holes 10 and several longitudinal strip-shaped through holes 11.

[0023] It is worth mentioning that the technical features such as functional filling materials involved in this utility model patent application should be regarded as prior art. The specific structure, working principle and possible control methods and spatial arrangement methods of these technical features can be adopted by conventional choices in the field and should not be regarded as the inventive point of this utility model patent. This utility model patent will not be further elaborated in detail.

[0024] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make many modifications and variations based on the concept of the present invention without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning or limited experimentation on the basis of the prior art should be within the scope of protection defined by the claims.

Claims

1. A sheet metal housing for semiconductor equipment, characterized in that, The device comprises several shell units assembled sequentially. Each shell unit includes an outer shell plate, a frame, and an inner shell plate. The outer shell plate has outwardly bent portions formed by bending inwards around its perimeter. All outwardly bent portions form a receiving groove. The frame and inner shell plate are located within the receiving groove, with the frame positioned between the outer shell plate and the inner shell plate. The frame includes several horizontal support plates and several vertical support plates. The horizontal support plates are sequentially and crosswise connected to the vertical support plates. The inner shell plate has inwardly bent portions formed by bending inwards around its perimeter. The inwardly bent portions are respectively fitted to the corresponding outwardly bent portions and are fastened, welded, or connected to the corresponding outwardly bent portions by several screws. Several mounting holes are provided on the inwardly bent portions and the outwardly bent portions, respectively.

2. The sheet metal housing for semiconductor equipment as described in claim 1, characterized in that, A functional filler material is provided between the outer shell plate and the inner shell plate.

3. The sheet metal housing for semiconductor equipment as described in claim 2, characterized in that, The functional filling material includes any one or more of the following: sound insulation material, heat insulation material, electromagnetic shielding filling material, and fireproof material.

4. The sheet metal housing for semiconductor devices as described in claim 1, characterized in that, The frame is provided with a number of front support blocks and a number of rear support blocks. The front support blocks and rear support blocks are located at the connection of the horizontal support plate and the vertical support plate, respectively. The front support blocks abut against the outer shell plate, and the rear support blocks abut against the inner shell plate.

5. The sheet metal housing for semiconductor equipment as described in claim 4, characterized in that, The front and rear support blocks are staggered.

6. The sheet metal housing for semiconductor equipment as described in claim 1, characterized in that, The outer shell plate and the inner shell plate are respectively formed by stamping metal plates.

Images