A structure of plating silicon carbide layer on oxide film layer for preparing aluminum-based copper-clad plate

Abstract

The utility model discloses a kind of for preparing aluminum-based copper-clad plate with silicon carbide layer structure plated on oxide film layer, it is related to aluminum-based copper-clad plate technical field, including frame, conveying belt, plating box, partition, spray plate and cooling plate, the top of frame is provided with conveying belt. Through the start of driving motor, so that rotating rod can be moved to gear plate by rotating gear, and then fixed frame and auxiliary roller can be limited to substrate after moving, and then avoid producing deviation when moving, can be cleaned by cleaning brush to the surface of substrate, finally, cleaned substrate can enter the inside of plating box, so that the spray head of spray plate bottom end can be sprayed after the surface of substrate with molten silicon carbide powder, so that it can form silicon carbide layer on oxide film layer, and with the movement of conveying belt, so that the cooling plate set on one side can be cooled to substrate by spraying inert gas, so that the formed silicon carbide layer substrate can have better thermal conductivity and stability.

Description

Technical Field

[0001] This utility model relates to the field of aluminum-based copper clad laminate technology, specifically to a structure for depositing a silicon carbide layer on an oxide film layer for preparing aluminum-based copper clad laminates. Background Technology

[0002] Aluminum-based copper clad laminate is a laminated composite material with an aluminum substrate and a copper foil coating on the surface. It plays a core role in electronics, communications and high-power equipment. The high thermal conductivity of the aluminum substrate quickly dissipates the heat generated by electronic components, effectively reducing the operating temperature of the equipment, solving the heat dissipation problem in high power density scenarios, significantly extending the life of devices and reducing light decay.

[0003] When producing the aforementioned aluminum-based copper clad laminate, a silicon carbide layer needs to be deposited on the oxide film layer on the substrate surface. However, during the silicon carbide depositing process, dust and impurities from the outside are easily introduced into the substrate during placement, resulting in a large number of impurities between the silicon carbide layer and the oxide film layer. Furthermore, the substrate is prone to displacement during placement, making it inconvenient to deposit the silicon carbide layer on the oxide film layer of the aluminum-based copper clad laminate. Utility Model Content

[0004] The purpose of this invention is to provide a structure for depositing a silicon carbide layer on the oxide film layer in the preparation of aluminum-based copper clad laminates, so as to solve the problem mentioned in the background art that it is inconvenient to deposit a silicon carbide layer on the oxide film layer in aluminum-based copper clad laminates.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a structure for depositing a silicon carbide layer on an oxide film layer for preparing aluminum-based copper-clad laminates, comprising a frame, a conveyor belt and a plating box at the top of the frame, the conveyor belt passing horizontally below the plating box, a spraying assembly inside the plating box for plating the substrate conveyed below, the spraying assembly including a vertically arranged partition plate inside the plating box, a spraying plate and a cooling plate respectively arranged on both sides of the partition plate, a connecting pipe at the top of both the cooling plate and the spraying plate, and a connecting pipe for feeding materials to both the cooling plate and the spraying plate respectively, a symmetrically distributed fixing frame at one end of the frame near the connecting pipe, an auxiliary roller for facilitating substrate movement inside the fixing frame, and the auxiliary rollers being symmetrically distributed inside the fixing frame, a stabilizing plate welded to the frame at the other end of the fixing frame away from the auxiliary rollers, and a protective frame at the top of the stabilizing plate.

[0006] Preferably, the stabilizing plate has through holes inside, and the protective frame is rectangular in shape.

[0007] Preferably, a drive motor is installed on one side of the protective frame, and the output end of the drive motor is connected to a rotating rod through a coupling. The surface of the rotating rod is provided with a rotating gear.

[0008] Preferably, a toothed plate that penetrates the stabilizing plate is welded to the end of the fixed frame away from the auxiliary roller, and guide rods are provided on both sides of the fixed frame near the toothed plate.

[0009] Preferably, a welding-connected mounting block is provided on one side of the fixed frame, and a horizontal plate is provided inside the mounting block, the horizontal plate being symmetrically distributed inside the mounting block.

[0010] Preferably, an adjusting rod is welded to one side of the edge of the horizontal plate, a locking plate is provided at one end of the horizontal plate, a limit spring is connected between the horizontal plate and the mounting block, and a cleaning brush is slidably connected to the surface of the mounting block.

[0011] Preferably, a locking block is provided on the side of the mounting block near the adjusting rod, and a displacement block is slidably connected between the locking block and the mounting block.

[0012] Compared with the prior art, the beneficial effects of this utility model are: This invention relates to a structure for depositing a silicon carbide layer on an oxide film layer in the preparation of aluminum-based copper clad laminates. During the process of depositing the silicon carbide layer on the oxide film layer, the drive motor is activated, allowing auxiliary rollers to contact the placed substrate. This prevents the substrate from shifting as it moves along the conveyor belt. Simultaneously, two adjusting rods are moved to remove a cleaning brush, which removes dust and impurities adhering to the surface. The cleaned brush is then reinstalled. The cooperation between the auxiliary rollers and the cleaning brush ensures both good anti-shifting and effective cleaning during substrate transport. Finally, the cleaned substrate enters the plating tank, where a nozzle at the bottom of the spraying plate sprays molten silicon carbide powder onto the substrate surface, forming a silicon carbide layer on the oxide film. As the conveyor belt moves, a cooling plate on one side cools the substrate by spraying inert gas, resulting in a silicon carbide layer substrate with good thermal conductivity and stability. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the three-dimensional cross-sectional structure of this utility model; Figure 3 This is a three-dimensional structural diagram of the toothed plate of this utility model; Figure 4 This is a three-dimensional cross-sectional view of the mounting block of this utility model.

[0014] In the diagram: 1. Frame; 2. Conveyor belt; 3. Plating box; 4. Divider plate; 5. Spraying plate; 6. Cooling plate; 7. Connecting pipe; 8. Fixing frame; 9. Auxiliary roller; 10. Stabilizing plate; 11. Protective frame; 12. Drive motor; 13. Rotating rod; 14. Rotating gear; 15. Tooth plate; 16. Guide rod; 17. Mounting block; 18. Horizontal plate; 19. Adjusting rod; 20. Locking plate; 21. Limit spring; 22. Cleaning brush; 23. Locking block; 24. Displacement block. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Please see Figures 1-4 This utility model provides a technical solution: a structure for depositing a silicon carbide layer on an oxide film layer for preparing aluminum-based copper-clad laminates, comprising a frame 1, a conveyor belt 2 and a plating tank 3 at the top of the frame 1, the conveyor belt 2 passing horizontally below the plating tank 3, and a spraying assembly inside the plating tank 3 for plating the substrate conveyed below. The spraying assembly includes a partition plate 4 vertically arranged inside the plating tank 3, and a spraying plate 5 and a cooling plate 6 respectively arranged on both sides of the partition plate 4. The top of each of the 5 is provided with a connecting pipe 7. The top of the cooling plate 6 and the spray plate 5 are both connected with connecting pipes 7 for feeding materials to each of them. The frame 1 is provided with a symmetrically distributed fixing frame 8 near the connecting pipe 7. The fixing frame 8 is provided with an auxiliary roller 9 for facilitating the movement of the substrate. The auxiliary roller 9 is symmetrically distributed inside the fixing frame 8. The fixing frame 8 is provided with a stabilizing plate 10 welded to the frame 1 at the end away from the auxiliary roller 9. The top of the stabilizing plate 10 is provided with a protective frame 11.

[0017] This invention relates to a structure for depositing a silicon carbide layer on an oxide film layer used in the preparation of aluminum-based copper-clad laminates. By setting up a spray plate 5, molten silicon carbide powder can be sprayed out, thereby achieving rapid spraying on the oxide layer.

[0018] exist Figure 1 and Figure 2In the middle, a stabilizing plate 10 is provided at the end of the fixed frame 8 away from the auxiliary roller 9 and is welded to the frame 1. A protective frame 11 is provided at the top of the stabilizing plate 10. A drive motor 12 is installed on one side of the protective frame 11. The output end of the drive motor 12 is connected to a rotating rod 13 through a coupling. A rotating gear 14 is provided on the surface of the rotating rod 13.

[0019] This is a structure for preparing an aluminum-based copper-clad laminate with a silicon carbide layer deposited on an oxide film layer. The purpose of the drive motor 12 is to provide power to the rotating rod 13 so that the rotating rod 13 can drive the connected rotating gear 14 to rotate.

[0020] exist Figure 3 and Figure 4 In the middle, a toothed plate 15 that penetrates the stabilizing plate 10 is welded to the end of the fixed frame 8 away from the auxiliary roller 9. Guide rods 16 are provided on both sides of the fixed frame 8 near the toothed plate 15. The guide rods 16 are symmetrically distributed at one end of the fixed frame 8. A mounting block 17 is welded to one side of the fixed frame 8. A horizontal plate 18 is provided inside the mounting block 17. The horizontal plates 18 are symmetrically distributed inside the mounting block 17.

[0021] This is a structure for depositing a silicon carbide layer on an oxide film layer used in the preparation of aluminum-based copper clad laminates. The guide rod 16 enables the fixed frame 8 to move smoothly and avoids displacement.

[0022] exist Figure 4 In the middle, an adjusting rod 19 is welded to one side of the edge of the horizontal plate 18. The surface of the mounting block 17 is provided with a sliding groove that matches the adjusting rod 19. A locking plate 20 is provided at one end of the horizontal plate 18. A limit spring 21 is connected between the horizontal plate 18 and the mounting block 17. A cleaning brush 22 is slidably connected to the surface of the mounting block 17. A locking block 23 is provided on the side of the mounting block 17 near the adjusting rod 19. The locking block 23 is U-shaped. A displacement block 24 is slidably connected between the locking block 23 and the mounting block 17.

[0023] This structure, used for preparing aluminum-based copper-clad laminates with a silicon carbide layer deposited on an oxide film, uses a locking block 23 to restrict the adjusted rod 19, thus facilitating the removal and cleaning of the cleaning brush 22. By starting the drive motor 12, the drive motor 12 rotates the rotating rod 13 connected to its output end. The rotating rod 13, in turn, rotates the connected rotating gear 14, causing the rotating gear 14 to move the fixed frame 8 via the toothed plate 15. This allows the fixed frame 8 to move... The auxiliary roller 9 inside can be moved to contact the placed substrate, preventing the substrate from shifting when moving along the conveyor belt 2. When adjusting the position of the auxiliary roller 9, two adjusting rods 19 on one side of the mounting block 17 can be moved, pushing the locking block 23. This allows the locking block 23 to move, causing the connected displacement block 24 to slide inside the mounting block 17. Simultaneously, the adjusting rods 19 can move the connected cross plate 18, allowing the cross plate to move. When plate 18 moves, it can move the connected locking plate 20, allowing the locking plate 20 to separate from the cleaning brush 22. At this point, the cleaning brush 22 can be removed to clean the dust and impurities adhering to its surface. The cleaned cleaning brush 22 is then reinstalled, and the locking block 23 is removed, allowing the adjusting rod 19 to lose its restraint. Consequently, the limit spring 21 between the horizontal plate 18 and the mounting block 17 loses its restraint and resets, allowing the adjusting rod 19 to re-engage with the pre-drilled groove inside the cleaning brush 22. By cooperating with the auxiliary roller 9 and the cleaning brush 22, the substrate not only has a good anti-deviation effect during transportation, but also a good cleaning effect. Finally, the cleaned substrate can enter the plating tank 3, so that the nozzle at the bottom of the spraying plate 5 can spray the molten silicon carbide powder onto the surface of the substrate, so that a silicon carbide layer can be formed on the oxide film layer. As the conveyor belt 2 moves, the cooling plate 6 set on one side can cool the substrate by spraying inert gas, so that the formed silicon carbide layer substrate has good thermal conductivity and stability.

[0024] In summary, aluminum-based copper clad laminate is a laminated composite material with an aluminum plate as the base and a copper foil coating on the surface. It plays a core role in electronic, communication, and high-power equipment. By starting the drive motor 12, the rotating rod 13 can move the toothed plate 15 through the rotating gear 14. The fixing frame 8 and the auxiliary roller 9 can limit the substrate after movement, thus preventing deviation during movement. At the same time, the cleaning brush 22 can clean the surface of the substrate. Finally, the cleaned substrate can enter the plating tank 3, so that the nozzle at the bottom of the spraying plate 5 can spray molten silicon carbide powder onto the surface of the substrate, so that a silicon carbide layer can be formed on the oxide film layer. As the conveyor belt 2 moves, the cooling plate 6 on one side can cool the substrate by spraying inert gas, so that the formed silicon carbide layer substrate has good thermal conductivity and stability. The contents not described in detail in this description are prior art known to those skilled in the art.

[0025] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A structure for depositing a silicon carbide layer on an oxide film layer for preparing an aluminum-based copper clad laminate, comprising a frame (1), wherein a conveyor belt (2) and a plating box (3) are provided at the top of the frame (1), the conveyor belt (2) passes horizontally below the plating box (3), and a spraying assembly is provided inside the plating box (3) for plating a substrate conveyed from below, characterized in that: The frame (1) has a symmetrically distributed fixed frame (8) at one end near the connecting pipe (7). The fixed frame (8) has an auxiliary roller (9) inside for facilitating the movement of the substrate. The auxiliary roller (9) is symmetrically distributed inside the fixed frame (8). The fixed frame (8) is provided with a stabilizing plate (10) welded to the frame (1) at one end away from the auxiliary roller (9). The top of the stabilizing plate (10) is provided with a protective frame (11).

2. The structure for preparing an aluminum-based copper-clad laminate with a silicon carbide layer deposited on an oxide film layer according to claim 1, characterized in that: The stabilizing plate (10) has a through hole inside, and the protective frame (11) is rectangular in shape.

3. The structure for preparing an aluminum-based copper-clad laminate with a silicon carbide layer deposited on an oxide film layer according to claim 2, characterized in that: A drive motor (12) is installed on one side of the protective frame (11). The output end of the drive motor (12) is connected to a rotating rod (13) via a coupling. A rotating gear (14) is provided on the surface of the rotating rod (13).

4. The structure for preparing an aluminum-based copper-clad laminate with a silicon carbide layer deposited on an oxide film layer according to claim 2, characterized in that: The fixed frame (8) is welded to a toothed plate (15) that passes through the stabilizing plate (10) at one end away from the auxiliary roller (9), and guide rods (16) are provided on both sides of the fixed frame (8) near the toothed plate (15).

5. A silicon carbide layer deposited on an oxide film layer for preparing aluminum-based copper-clad laminates according to claim 4, characterized in that: A welding-connected mounting block (17) is provided on one side of the fixed frame (8), and a horizontal plate (18) is provided inside the mounting block (17). The horizontal plate (18) is symmetrically distributed inside the mounting block (17).

6. A silicon carbide layer deposited on an oxide film layer for preparing aluminum-based copper-clad laminates according to claim 5, characterized in that: An adjusting rod (19) is welded to one side of the edge of the horizontal plate (18), a locking plate (20) is provided at one end of the horizontal plate (18), a limit spring (21) is connected between the horizontal plate (18) and the mounting block (17), and a cleaning brush (22) is slidably connected to the surface of the mounting block (17).

7. A silicon carbide layer deposited on an oxide film layer for preparing aluminum-based copper-clad laminates according to claim 6, characterized in that: A locking block (23) is provided on the side of the mounting block (17) near the adjusting rod (19), and a displacement block (24) is slidably connected between the locking block (23) and the mounting block (17).

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