Double-layer metal substrate with heat conduction mechanism

Abstract

The utility model relates to metal substrate technical field, specifically disclose a double -layer metal substrate with heat conduction mechanism, include: heat conduction structure, the heat conduction structure includes the butt heat conduction fin, the top and bottom of butt heat conduction fin Fixed setting has lower layer metal substrate and upper layer metal substrate, the bottom of lower layer metal substrate and the top of upper layer metal substrate are all fixed settings have the hollow cushion frame, the hollow cushion frame is fixed with heat conduction layer through the adhesion of adhesive layer and is bonded, through the setting of butt heat conduction fin in heat conduction structure, can reduce the thickness of lower layer metal substrate and upper layer metal substrate, so that the heat can accelerate transmission to butt heat conduction fin, and the setting of multiple butt heat conduction fins can form three -dimensional heat conduction network, can quickly disperse the heat that densely packed heat conduction structure exports, wherein, the material of heat conduction structure can also replace into aluminium material, can alleviate the overall weight of substrate, adapts to the use of different scenes.

Description

Technical Field

[0001] This utility model relates to the field of metal substrate technology, specifically to a double-layer metal substrate with a heat-conducting mechanism. Background Technology

[0002] LED lights are frequently used for lighting in people's lives. Currently, in different living or working environments, LED light sources have increasingly higher requirements for brightness and wavelength. Moreover, dual-color and multi-color light sources will become more widespread and will inevitably occupy an advantageous position among many light sources. Due to the high power density lighting requirements, a double-layer metal substrate will be used, that is, an insulating layer and a circuit layer will be set on the top and bottom of the metal substrate to meet the high power and high intensity lighting requirements.

[0003] The metal substrate is used for heat conduction. Heat is generated from the chip, then conducted through the copper foil circuitry, and finally diffused through the insulating layer to the metal substrate, thus achieving the effect of heat conduction.

[0004] However, the existing technology has the following problems: the chips on the circuit board are in fixed positions, while the metal substrate is usually solid. Therefore, heat will be concentrated in a local area, and it takes a long time for the heat to completely diffuse to all parts of the metal substrate, resulting in low thermal conductivity of the metal substrate. Utility Model Content

[0005] The purpose of this invention is to provide a double-layer metal substrate with a heat-conducting mechanism to solve the problem mentioned in the background art that the chips on the circuit board are in fixed positions, while the metal substrate is usually solid, so the heat will be concentrated locally, and the time for the heat to completely diffuse to all parts of the metal substrate is long, resulting in low thermal conductivity of the metal substrate.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a double-layer metal substrate with a heat-conducting mechanism, comprising: Thermally conductive structure; The heat-conducting structure includes heat-conducting fins, with a lower metal substrate and an upper metal substrate fixedly disposed at the top and bottom of the heat-conducting fins. A hollowed-out pad frame is fixedly disposed at the bottom of the lower metal substrate and the top of the upper metal substrate. The hollowed-out pad frame is bonded and fixed to the heat-conducting layer by an adhesive layer. The bottom end of the thermally conductive layer is provided with multiple closely spaced thermally conductive structures, which are formed into a closely spaced thermally conductive matrix. The closely spaced thermally conductive structures are in contact with the lower metal substrate and the upper metal substrate.

[0007] Preferably, the heat-conducting fins, lower metal substrate, upper metal substrate, and hollowed-out pad frame are made of copper.

[0008] Using the above technical solution, copper has better thermal conductivity, so copper can be used as the material for the thermal conductive structure if a lighter overall weight is required.

[0009] Preferably, multiple heat-conducting fins are provided, the thickness of the heat-conducting fins is 1mm, and the spacing between the heat-conducting fins is 10mm.

[0010] Using the above technical solution, multiple heat-conducting fins can form a three-dimensional heat-conducting network, which can quickly disperse the heat transferred and discharged through the densely packed heat-conducting structure. This can work in conjunction with the densely packed heat-conducting structure to achieve a dual effect of heat dispersion.

[0011] Preferably, the outer side of the hollowed-out pad frame is provided with multiple auxiliary drainage slots, which are used to discharge some of the heat within the area enclosed by the hollowed-out pad frame to the outside. The side of the heat-conducting fin receiving plate is provided with a flow channel, which is used for hot gas to flow between the heat-conducting fin receiving plate.

[0012] The above technical solution allows for faster airflow through the flow slots on the side of the heat-conducting fins, enabling heat to be transferred to other heat-conducting fins more quickly, thereby improving heat conduction efficiency. Meanwhile, the outer side of the auxiliary drainage slots can dissipate some of the heat from the hollowed-out frame to the outside, reducing heat accumulation and improving heat dissipation capacity.

[0013] Preferably, the densely packed thermal conductive structure is arranged in a honeycomb hexagonal shape, and the thermal conductive layer and the densely packed thermal conductive structure are made of high thermal conductivity addition-cured silicone rubber.

[0014] The above technical solution facilitates heat conduction through multiple paths, thereby accelerating heat conduction efficiency.

[0015] Preferably, an insulating layer is fixedly disposed at one end of the heat-conducting layers that are far apart from each other, and a PCB circuit board is fixedly disposed at one end of the insulating layers that are far apart from each other.

[0016] By adopting the above technical solution, the heat generated by the chips on the PCB can be conducted to the heat-conducting layer.

[0017] Compared with the prior art, the beneficial effects of this utility model are: the double-layer metal substrate with a heat-conducting mechanism: 1. By setting up heat-conducting fins in the heat-conducting structure, the thickness of the lower and upper metal substrates can be reduced, allowing heat to be transferred to the heat-conducting fins more quickly. Furthermore, the arrangement of multiple heat-conducting fins can form a three-dimensional heat-conducting network, which can quickly disperse the heat dissipated by the densely packed heat-conducting structure. The material of the heat-conducting structure can also be replaced with aluminum, which can reduce the overall weight of the substrate and adapt to different application scenarios. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the disassembled three-dimensional structure of this utility model; Figure 3 This is a schematic diagram of the upper and lower axonometric three-dimensional structure of the heat-conducting layer in this application. Figure 4 This is a schematic diagram of the right-hand structure of the heat-conducting structure in this application.

[0019] In the diagram: 1. Thermal conductive structure; 101. Receiving thermal conductive fins; 102. Flow channel; 103. Lower metal substrate; 104. Upper metal substrate; 105. Hollowed-out pad frame; 106. Auxiliary drainage channel; 2. Adhesive layer; 3. Thermal conductive layer; 301. Densely packed thermal conductive structure; 4. Insulating layer; 5. PCB circuit board. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4 This utility model provides a technical solution: a double-layer metal substrate with a heat-conducting mechanism, comprising: a heat-conducting structure 1, the heat-conducting structure 1 including heat-conducting fins 101, a lower metal substrate 103 and an upper metal substrate 104 fixedly disposed at the top and bottom ends of the heat-conducting fins 101, and a hollowed-out frame 105 fixedly disposed at the bottom end of the lower metal substrate 103 and the top end of the upper metal substrate 104, the hollowed-out frame 105 being bonded and fixed to the heat-conducting layer 3 by an adhesive layer 2, the heat-conducting layer 3... Multiple closely spaced heat-conducting structures 301 are provided at the bottom, forming a closely spaced heat-conducting matrix. The closely spaced heat-conducting structures 301 are in contact with the lower metal substrate 103 and the upper metal substrate 104. The closely spaced heat-conducting structures 301 are arranged in a honeycomb hexagonal shape. The heat-conducting layer 3 and the closely spaced heat-conducting structures 301 are made of high thermal conductivity addition-cured silicone rubber. An insulating layer 4 is fixedly provided at the ends of the heat-conducting layers 3 that are far apart from each other, and a PCB circuit board 5 is fixedly provided at the ends of the insulating layers 4 that are far apart from each other.

[0022] In this embodiment, when the chip at the top of the PCB circuit board 5 heats up, it is transferred to the densely packed heat-conducting structure 301 through the heat-conducting layer 3. It should be noted that heat can be transferred regardless of the chip's position on the PCB circuit board 5. The temperature of the chip's position at the top of the heat-conducting layer 3 is relatively high. The densely packed heat-conducting matrix composed of multiple densely packed heat-conducting structures 301, wherein the densely packed heat-conducting structures 301 are hollow, thus forming a honeycomb-shaped polygonal structure, allows heat to be transferred through multiple paths. That is, the heat is transferred and directed to the upper metal substrate 104 through the polygons of the densely packed heat-conducting structures 301, while the heat at the bottom of the heat-conducting structure 1 is transferred and directed to the lower metal substrate 103. This can reduce the heat flux density and improve the heat dissipation efficiency.

[0023] Since the densely packed heat-conducting structure 301 adopts a hollow polygonal structure, it can reduce the overall weight while increasing the contact area with air, further promoting heat dissipation. In addition, since the heat flow is dispersed into multiple paths by the densely packed heat-conducting structure 301, the risk of local overheating is significantly reduced, thereby improving the stability of the entire heat conduction system. At the same time, the uniform distribution of the densely packed heat-conducting structure 301 makes the heat transfer more even throughout the heat-conducting layer, and the transferred heat can be further dispersed by the receiving heat-conducting fins 101, thereby achieving a highly efficient heat conduction effect.

[0024] The heat-conducting fins 101, the lower metal substrate 103, the upper metal substrate 104, and the hollowed-out pad frame 105 are all made of copper.

[0025] Copper has good thermal conductivity, so copper can be used as the material for thermal structure 1. If a lighter overall weight is required, aluminum can also be used to make thermal structure 1 in other embodiments, which can also achieve good thermal conductivity and reduce the overall weight of the substrate.

[0026] Multiple heat-conducting fins 101 are provided, each with a thickness of 1mm and a spacing of 10mm between them. Multiple auxiliary drainage slots 106 are provided on the outer side of the hollowed-out frame 105. The auxiliary drainage slots 106 are used to discharge some of the heat within the area enclosed by the hollowed-out frame 105 to the outside. A flow channel 102 is provided on one side of each heat-conducting fin 101. The flow channel 102 is used for hot gas to flow between the heat-conducting fins 101.

[0027] In this embodiment, multiple heat-conducting fins 101 can form a three-dimensional heat-conducting network, which can quickly disperse the heat transferred and discharged through the densely packed heat-conducting structure 301. This can work in conjunction with the densely packed heat-conducting structure 301 to achieve a double heat dispersion effect, so that the heat can be quickly dispersed to other locations, thereby achieving a rapid heat conduction effect.

[0028] Furthermore, the three-dimensional heat-conducting network formed by the lower metal substrate 103 and the upper metal substrate 104 through the heat-conducting fins 101 can significantly reduce the overall thermal resistance. Compared with traditional flat metal substrates, the fins, as vertical heat-conducting bridges, shorten the heat transfer path. Combined with the lateral diffusion of the upper and lower flat metal plates, the overall thermal resistance can be significantly reduced, clearing obstacles for the rapid heat dissipation of LED chips. It effectively eliminates local hot spots. The three-dimensional network allows concentrated heat to be evenly distributed to the entire metal substrate by multiple sets of heat-conducting fins 101. The array of heat-conducting fins 101 can expand the contact area between the substrate and the air or heat-conducting medium. Whether it is natural convection or forced convection, forced convection refers to heat dissipation through a fan, which can accelerate the removal of heat from the substrate. The fins are integrated between the upper and lower flat plates, without the need to increase the substrate thickness, meeting the requirements of lightweight and thin lamp design. At the same time, the integrated structure of the heat-conducting fins 101 with the lower metal substrate 103 and the upper metal substrate 104 can also improve the substrate's bending and vibration resistance, extending the device's service life and stability.

[0029] The flow channel 102 on one side of the heat-conducting fin 101 can accelerate airflow, allowing heat to be transferred to other heat-conducting fins 101 more quickly, thereby improving heat conduction efficiency. The outer side of the auxiliary drainage channel 106 can conduct some of the heat inside the hollowed-out pad frame 105 to the outside, reducing heat accumulation and improving heat dissipation capacity.

[0030] Working principle: When the chip at the top of the PCB circuit board 5 heats up, it is transferred to the densely packed heat-conducting structure 301 through the heat-conducting layer 3. The top of the heat-conducting layer 3 corresponds to the chip position with a higher temperature. Through the densely packed heat-conducting matrix composed of multiple densely packed heat-conducting structures 301, it should be noted that the densely packed heat-conducting structure 301 is hollow, thus forming a honeycomb-like polygonal structure. This allows heat to be transferred through multiple paths, which can reduce heat flux density and improve heat dissipation efficiency. The hollow polygonal structure of the densely packed heat-conducting structure 301 can reduce the overall weight while increasing the contact area with air, further promoting heat dissipation. In addition, since the heat flow is dispersed into multiple paths in the honeycomb structure, the risk of local overheating is significantly reduced, thereby improving the stability of the entire heat conduction system. This design not only optimizes the heat conduction performance, but also effectively avoids material aging or damage caused by high temperature concentration, extending the service life of the substrate. At the same time, the uniform distribution of the honeycomb structure makes the heat transfer more even throughout the heat-conducting layer, and the transferred heat can be further dispersed by the heat-conducting fins 101, thereby achieving a highly efficient heat conduction effect.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A double-layer metal substrate with a thermally conductive mechanism, characterized in that, include: Thermally conductive structure (1); The heat-conducting structure (1) includes a heat-conducting fin (101). A lower metal substrate (103) and an upper metal substrate (104) are fixedly disposed at the top and bottom of the heat-conducting fin (101). A hollowed-out pad frame (105) is fixedly disposed at the bottom of the lower metal substrate (103) and the top of the upper metal substrate (104). The hollowed-out pad frame (105) is bonded and fixed to the heat-conducting layer (3) by an adhesive layer (2). The bottom end of the thermal conductive layer (3) is provided with a plurality of closely packed thermal conductive structures (301), and the plurality of closely packed thermal conductive structures (301) form a closely packed thermal conductive matrix. The closely packed thermal conductive structures (301) are in contact with the lower metal substrate (103) and the upper metal substrate (104).

2. The double-layer metal substrate with a thermally conductive mechanism according to claim 1, characterized in that: The heat-conducting fins (101), the lower metal substrate (103), the upper metal substrate (104), and the hollowed-out pad frame (105) are made of copper.

3. A double-layer metal substrate with a thermally conductive mechanism according to claim 1, characterized in that: Multiple heat-conducting fins (101) are provided, the thickness of the heat-conducting fins (101) is 1mm, and the spacing between the heat-conducting fins (101) is 10mm.

4. A double-layer metal substrate with a thermally conductive mechanism according to claim 1, characterized in that: The outer side of the hollowed-out pad frame (105) is provided with multiple auxiliary drainage slots (106). The auxiliary drainage slots (106) are used to discharge part of the heat in the enclosed area of ​​the hollowed-out pad frame (105) to the outside. The side of the heat-conducting fins (101) is provided with flow slots (102). The flow slots (102) are used for hot gas to flow between the heat-conducting fins (101).

5. A double-layer metal substrate with a thermally conductive mechanism according to claim 1, characterized in that: The densely packed thermal conductive structure (301) is arranged in a honeycomb hexagonal shape, and the thermal conductive layer (3) and the densely packed thermal conductive structure (301) are made of high thermal conductivity addition-cured silicone rubber.

6. A double-layer metal substrate with a thermally conductive mechanism according to claim 1, characterized in that: An insulating layer (4) is fixedly disposed at one end of the heat-conducting layer (3) that is far apart from each other, and a PCB circuit board (5) is fixedly disposed at one end of the insulating layer (4) that is far apart from each other.

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