An ultrathin mini LED light plate

Abstract

The utility model relates to a kind of ultra-thin Mini LED lamp panels, including substrate and lamp bead, at least one surface of the substrate is equipped with multiple inward recessed mounting grooves, the lamp bead is one-to-one correspondingly embedded in the mounting groove, the substrate has inner layer circuit layer, the inner layer circuit layer extends to the groove bottom of the mounting groove and forms welding part, the welding part is electrically connected with the lamp bead.The ultra-thin Mini LED lamp panel of the utility model is reasonable in structure, can effectively reduce the thickness of lamp panel, while ensuring the reliability and high efficiency of lamp bead connection.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and more specifically, to an ultra-thin Mini LED light board. Background Technology

[0002] In the field of display and backlight technology, Mini LEDs are widely used due to their high brightness, high contrast, and excellent color performance. Among them, POB (Package on Board) packaging is a mainstream technology. However, in the traditional Mini LED POB lamp board structure, the LED chips are usually mounted on the surface of the substrate. This structure causes the LED chips to protrude from the substrate surface, which affects the thinness of the product. Utility Model Content

[0003] The purpose of this invention is to provide an ultra-thin Mini LED light board with a reasonable structure that can effectively reduce the thickness of the light board while ensuring the reliability and efficiency of the LED connection.

[0004] An ultra-thin Mini LED light panel includes a substrate and LED chips. At least one surface of the substrate is provided with a plurality of inwardly recessed mounting grooves. The LED chips are embedded in the mounting grooves one by one. The substrate has an inner circuit layer that extends to the bottom of the mounting groove to form a solder joint. The solder joint is electrically connected to the LED chips.

[0005] In the above technical solution, by setting mounting grooves on the substrate surface and embedding the LED beads inside them, the LED beads can be prevented from protruding from the substrate surface, thereby reducing the overall thickness of the lamp board and achieving a thinner structure. Furthermore, extending the inner circuit layer to the bottom of the groove to form a solder joint and connecting it to the LED beads, this structure simplifies the circuit connection method while achieving an ultra-thin design. It not only enhances the reliability and mechanical strength of the electrical connection but also facilitates the soldering process of the LED beads, which is beneficial for improving production efficiency and product yield.

[0006] Furthermore, the lamp bead has a light-emitting surface that faces the opening of the mounting groove.

[0007] In the above technical solution, by setting the light-emitting surface of the lamp bead to face the opening of the mounting slot, it is ensured that the light can be emitted directly and efficiently from the slot, reducing light loss and obstruction inside the structure, and optimizing the light emission efficiency and directionality.

[0008] Furthermore, a uniform light structure layer is attached to the light-emitting surface.

[0009] In the above technical solution, by setting a uniform light structure layer on the light-emitting surface, the point light source emitted by the Mini LED can be diffused and homogenized, effectively eliminating local bright spots and graininess, and improving the uniformity of light emission and visual comfort.

[0010] Furthermore, the surface of the lamp bead is not higher than the surface of the substrate.

[0011] In the above technical solution, by ensuring that the surface of the LED bead is not higher than the surface of the substrate, a flat LED panel appearance is formed, which avoids mechanical damage or assembly interference that may be caused by the protrusion of the LED bead, and at the same time facilitates the subsequent bonding of optical film materials.

[0012] Furthermore, the mounting groove is provided with a filler.

[0013] In the above technical solution, by setting a filler in the mounting groove, the LED beads can be reliably encapsulated and fixed in the groove, which plays a protective role and prevents them from shifting or being damaged due to external forces or environmental factors, thereby improving the overall integrity and reliability of the structure.

[0014] Furthermore, the filler is made of an insulating transparent material.

[0015] In the above technical solution, an insulating and transparent filling material is used, which can not only ensure electrical isolation between the lamp beads and the surrounding circuits, improving the safety of use, but also ensure efficient light transmission without affecting the luminous performance and luminous efficiency of the lamp.

[0016] Furthermore, the surface of the filler is not higher than the surface of the substrate.

[0017] In the above technical solution, by ensuring that the surface of the filler is not higher than the surface of the substrate, the overall flatness of the lamp board is maintained, which facilitates subsequent assembly and surface treatment processes, while ensuring the consistency and aesthetics of the appearance.

[0018] Furthermore, the lamp bead is a Mini LED lamp bead.

[0019] In the above technical solution, the thinning of the light source itself is achieved by limiting the use of ultra-thin Mini LED beads.

[0020] Compared with existing technologies, the advantages of this invention are as follows: by setting mounting grooves on the surface of the substrate and embedding the LED beads inside them, the LED beads can be prevented from protruding from the substrate surface, thereby reducing the overall thickness of the lamp board and achieving a thinner structure. Furthermore, extending the inner circuit layer to the bottom of the groove to form a welding section and connecting it to the LED beads simplifies the circuit connection method while achieving an ultra-thin design. This not only enhances the reliability and mechanical strength of the electrical connection but also facilitates the welding process of the LED beads, which is beneficial for improving production efficiency and product yield. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the ultra-thin Mini LED light panel according to an embodiment of the present invention.

[0022] Explanation of icon numbers: Substrate 1, inner circuit layer 11, soldering part 12, mounting groove 13, lamp bead 2, light-emitting surface 21, filler 3. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] like Figure 1 As shown, in a preferred embodiment, the ultra-thin Mini LED light board of this utility model mainly includes a substrate 1 and LED beads 2. At least one surface of the substrate 1 is provided with a plurality of inwardly recessed mounting grooves 13, and the LED beads 2 are embedded in the mounting grooves 13 one by one. The substrate 1 has an inner circuit layer 11, which extends to the bottom of the mounting groove 13 to form a welding part 12, and the welding part 12 is electrically connected to the LED beads 2.

[0026] For example, substrate 1 can be an existing multilayer printed circuit board. In specific implementation, substrate 1 with at least one inner circuit layer 11 can be formed by existing processes, and then multiple mounting grooves 13 are formed on the surface of substrate 1 by a depth-controlled soldering process. The depth of the mounting groove 13 is equal to the distance from the inner circuit layer 11 to the surface of substrate 1, so that the inner circuit layer 11 is exposed from the bottom of the mounting groove 13 to form a soldering part 12. The bottom of the LED bead 2 is provided with solder feet, which can be soldered to the soldering part 12 with solder paste, thereby realizing the electrical connection between the LED bead 2 and the inner circuit layer 11. The surface of the soldering part 12 can be a self-contained solder paste layer, or a solder paste layer can be formed on the surface of the soldering part 12 by stencil printing or soldering process, and the LED bead 2 is then soldered to the soldering part 12 through the solder paste layer.

[0027] As can be seen from the above technical solution, by setting a mounting groove 13 on the surface of the substrate 1 and embedding the LED bead 2 inside it, the LED bead 2 can be prevented from protruding from the surface of the substrate 1, thereby reducing the overall thickness of the lamp board and achieving a thinner structure. Furthermore, extending the inner circuit layer 11 to the bottom of the groove to form a welding part 12 and connecting it to the LED bead 2, this structure simplifies the circuit connection method while achieving an ultra-thin design. It not only enhances the reliability and mechanical strength of the electrical connection but also facilitates the welding process of the LED bead 2, which is beneficial for improving production efficiency and product yield.

[0028] In this embodiment, the LED bead 2 has a light-emitting surface 21 facing the opening of the mounting groove 13. By aligning the light-emitting surface 21 of the LED bead 2 with the opening of the mounting groove 13, it is ensured that light can be emitted directly and efficiently from the groove, reducing light loss and obstruction within the structure, and optimizing light emission efficiency and directionality.

[0029] In this embodiment, a light-uniforming structure layer is attached to the light-emitting surface 21. For example, the light-uniforming structure layer can be an existing optical film material, such as a diffusion film. By providing a light-uniforming structure layer on the light-emitting surface 21, the point light source emitted by the Mini LED can be diffused and homogenized, effectively eliminating local bright spots and graininess, and improving the uniformity of light emission and visual comfort.

[0030] In this embodiment, the surface of the LED bead 2 is not higher than the surface of the substrate 1. By ensuring that the surface of the LED bead 2 is not higher than the surface of the substrate 1, a flat LED panel appearance is formed, avoiding mechanical damage or assembly interference that may be caused by the protrusion of the LED bead 2, and also facilitating the subsequent bonding of optical film materials.

[0031] In this embodiment, a filler 3 is provided in the mounting groove 13. By providing the filler 3 in the mounting groove 13, the LED bead 2 can be reliably encapsulated and fixed in the groove, playing a protective role and preventing it from shifting or being damaged due to external forces or environmental factors, thereby improving the overall integrity and reliability of the structure.

[0032] The filler 3 is made of an insulating transparent material. For example, the filler 3 can be an existing transparent insulating adhesive, applied individually to the mounting groove 13 or molded over the entire surface of the mounting groove 13 and the substrate 1. The filler 3 can cover the light-emitting surface 21 of the LED chip 2, or it can fill only the gap between the LED chip 2 and the substrate 1 without covering the light-emitting surface of the LED chip 2. By using an insulating transparent filler material, electrical isolation between the LED chip 2 and surrounding circuitry can be ensured, improving safety, while also ensuring efficient light transmission without affecting the luminous performance and luminous efficacy of the lamp.

[0033] In this embodiment, the surface of the filler 3 is not higher than the surface of the substrate 1. By ensuring that the surface of the filler 3 is not higher than the surface of the substrate 1, the overall flatness of the lamp panel is maintained, which facilitates subsequent assembly and surface treatment processes, while also ensuring the consistency and aesthetics of the appearance.

[0034] The lamp bead 2 is a Mini LED lamp bead 2. By limiting the use of ultra-thin Mini LED lamp beads 2, thinning is achieved from the light source itself. In this embodiment, the lamp bead 2 can be a blue lamp bead 2 or a white lamp bead 2. In other possible embodiments, the lamp bead 2 can also be of other colors, which is not limited here.

[0035] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An ultra-thin Mini LED light panel, characterized in that, The device includes a substrate and LED chips. At least one surface of the substrate is provided with a plurality of inwardly recessed mounting grooves. The LED chips are embedded in the mounting grooves one by one. The substrate has an inner circuit layer that extends to the bottom of the mounting groove to form a solder joint. The solder joint is electrically connected to the LED chips.

2. The ultra-thin Mini LED light panel according to claim 1, characterized in that, The lamp bead has a light-emitting surface, which faces the opening of the mounting groove.

3. The ultra-thin Mini LED light panel according to claim 2, characterized in that, A uniform light structure layer is attached to the light-emitting surface.

4. The ultra-thin Mini LED light panel according to claim 1, characterized in that, The surface of the LED bead is not higher than the surface of the substrate.

5. The ultra-thin Mini LED light panel according to claim 1, characterized in that, The mounting slot is filled with a filler.

6. The ultra-thin Mini LED light panel according to claim 5, characterized in that, The filler is made of an insulating transparent material.

7. The ultra-thin Mini LED light panel according to claim 5, characterized in that, The surface of the filler is not higher than the surface of the substrate.

8. The ultra-thin Mini LED light panel according to claim 1, characterized in that, The LED beads are Mini LED beads.

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