A multilayer wiring board press mechanism

Abstract

The utility model relates to a circuit board compression technical field, specifically a kind of multilayer circuit board compression mechanism, including base and the drive mechanism of installation in the top of base, the power output end of drive mechanism is fixed with sliding table, and sliding table is driven connection through multiple groups of connecting rod between multiple limit mechanisms, and the bottom of sliding table and the top of each limit mechanism are all equipped with hot press plate, and limit mechanism includes bottom plate and clamping plate, and connecting rod is installed on sliding table, bottom plate, and clamping rod is fixed on bottom plate, and connecting rod and clamping rod are slidably connected, and sliding table, bottom plate are all fixed with hot press plate and plug block, and clamping plate slides in bottom plate, and clamping plate is fixed with pull rod, and hot press plate and clamping plate are clamped connection, and plug block and bottom plate are clamped connection;Heat, pressure is synchronously transmitted to circuit board when hot press plate is pressed down, and bottom plate limits clamping plate, ensures that clamping plate is aligned circuit board, even if the transverse thrust generated when hot press plate is pressed down, clamping plate does not deviate from the limit position, and then avoid circuit board to be pushed and shifted by clamping plate.

Description

Technical Field

[0001] This utility model relates to a pressing mechanism, specifically a multi-layer circuit board pressing mechanism, belonging to the field of circuit board pressing technology. Background Technology

[0002] Multilayer circuit boards (PCBs), as core components for miniaturization, high density, and high performance in electronic devices, are widely used in precision fields such as smartphones and servers. The quality of interlayer lamination directly determines the signal transmission stability, structural mechanical strength, and long-term service life of electronic devices. PCBs are composed of alternating layers of core boards and prepregs. The core working principle of lamination is to simultaneously apply uniform and controllable pressure and stable, continuous heat to the laminated circuit board, causing the epoxy resin and other binders in the prepregs to melt, flow, and cross-link and cure, ultimately achieving tight bonding and integrated molding of the core boards.

[0003] For example, a multi-layer circuit board pressing device is disclosed in the patent with publication number CN219087440U. Although the basic positioning of the circuit board is achieved by adjusting the positioning mechanism, the integrated structure for simultaneous pressure and heat transfer is not designed, and the pressure cannot be evenly distributed to each layer of the circuit board, resulting in inconsistent curing effect. At the same time, relying solely on the basic positioning cannot ensure that the edge of the circuit board and the pressing area are always accurately aligned, and the lateral force generated when the hot press plate is pressed down can easily cause the circuit board to shift position. Utility Model Content

[0004] The purpose of this utility model is to provide a multi-layer circuit board pressing mechanism to solve the above problems. When the hot press plate is pressed down, heat and pressure are transferred to the circuit board simultaneously, so that the adhesive between the circuit board layers is cured. The bottom plate limits the clamping plate to ensure that the clamping plate is always aligned with the edge of the circuit board. Even if the hot press plate generates a lateral thrust when it is pressed down, the clamping plate will not deviate from the limit position, thereby avoiding the circuit board being pushed and shifted by the clamping plate.

[0005] This utility model achieves the above-mentioned objectives through the following technical solution: a multi-layer circuit board pressing mechanism, including a base and a drive mechanism mounted on the top of the base. A slide is fixed to the power output end of the drive mechanism. The slide is connected to multiple limiting mechanisms via multiple sets of connecting rods. A hot press plate is mounted on the bottom of the slide and the top of each limiting mechanism. The limiting mechanism includes a base plate and a clamping plate. A connecting rod is fixedly installed on both the slide and the base plate. A clamping rod is fixedly connected to the base plate. The connecting rod and the clamping rod are slidably connected. A hot press plate and an insert block are fixedly installed on both the slide and the base plate. A clamping plate is slidably installed inside the base plate. A pull rod is fixedly connected to the clamping plate. The pull rod abuts against the side wall of the base plate. The hot press plate and the clamping plate are engaged. The insert block is engaged with the base plate.

[0006] Preferably, the limiting mechanism further includes insertion holes, and insertion holes are provided at the four corners of the base plate. Insertion blocks are engaged and installed at the insertion holes, and both the insertion blocks and insertion holes are arranged in a regular hexagonal structure.

[0007] Preferably, the end of the connecting rod away from the base plate is provided with a sliding groove, the locking rod is located in the sliding groove, and the diameter of the locking rod is equal to the width of the sliding groove.

[0008] Preferably, the base plate has two symmetrical slots, and a card plate is slidably installed in the slot. The part of the card plate that contacts the base plate has an inclined structure.

[0009] Preferably, the bottom base plate is fixedly connected to the machine base, and the top hot press plate is fixedly connected to the slide table.

[0010] Preferably, the drive mechanism includes guide columns and a fixed base. Two sets of guide columns are symmetrically fixedly connected to the top of the base, and a fixed base is fixedly installed between the two sets of guide columns. A hydraulic cylinder is fixedly installed on the top of the fixed base.

[0011] Preferably, the telescopic end of the hydraulic cylinder is fixedly connected to a slide, and the four corners of the slide are slidably connected to the guide post.

[0012] Preferably, the hot press plate is equipped with an electric heating element, and the four corners of the hot press plate are all arc-shaped.

[0013] The beneficial effects of this utility model are as follows: The slide table, acting as a power transfer carrier, directly supports the top-layer hot press plate on one hand, and simultaneously distributes the power to the lower base plate through multiple sets of connecting rods, ensuring consistent pressure and descent speed for each hot press plate. During the pressing process, as the slide table descends, the sliding cooperation between the connecting rods and the locking rods synchronously constrains the horizontal displacement of the slide table, preventing tilting due to uneven thrust. This ensures uniform pressure distribution on the circuit board from the hot press plate, reducing defects such as circuit board substrate deformation and via collapse caused by localized overpressure. When multiple circuit boards are stacked, each base plate engages with the upper component via inserts, ensuring... The pressing areas of the upper and lower hot press plates are completely aligned to avoid problems such as loose edge pressing of the circuit board and misalignment of inner circuits caused by interlayer misalignment. The clamping plate is slidably installed inside the base plate. When the hot press plate is pressed down, it can contact the circuit board placed inside the clamping plate. At this time, the electric heating element inside the hot press plate has been heated to the set temperature. The hot press plate transfers heat and pressure to the circuit board simultaneously, so that the adhesive between the circuit board layers is cured. The base plate limits the clamping plate to ensure that the clamping plate is always aligned with the edge of the circuit board. Even if the hot press plate generates lateral thrust when it is pressed down, the clamping plate will not deviate from the limit position, thereby preventing the circuit board from being pushed and shifted by the clamping plate. Attached Figure Description

[0014] Figure 1This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the connection structure between the card plate and the pull rod of this utility model;

[0016] Figure 3 for Figure 2 The diagram shown is an enlarged view of the structure of part A.

[0017] Figure 4 This is a schematic diagram of the connection structure between the hydraulic cylinder and the slide table of this utility model;

[0018] Figure 5 for Figure 4 The diagram shows an enlarged view of section B.

[0019] In the diagram: 1. Base; 2. Drive mechanism; 201. Guide column; 202. Fixed base; 203. Hydraulic cylinder; 3. Slide table; 4. Hot press plate; 5. Limiting mechanism; 501. Base plate; 502. Insert block; 503. Card plate; 504. Insertion hole; 505. Pull rod; 506. Carding rod; 6. Connecting rod; 7. Card slot. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figures 1-5As shown, a multilayer circuit board pressing mechanism includes a base 1 and a drive mechanism 2 mounted on the top of the base 1. A slide 3 is fixed to the power output end of the drive mechanism 2. The slide 3 is connected to multiple limiting mechanisms 5 via multiple sets of connecting rods 6. A hot press plate 4 is mounted on the bottom of the slide 3 and the top of each limiting mechanism 5. Each limiting mechanism 5 includes a base plate 501 and a clamping plate 503. Connecting rods 6 are fixedly mounted on both the slide 3 and the base plate 501. A clamping rod 506 is fixedly connected to the base plate 501, and the connecting rods 6 and clamping rods 506 are slidably connected. Multilayer circuit boards are placed one by one into the area of ​​the clamping plate 503 corresponding to each base plate 501, ensuring that the edges of the circuit boards are tightly fitted to the inner side of the clamping plate 503. The inclined structure of the contact area between the clamping plate 503 and the base plate 501 reduces the frictional resistance when the circuit boards are placed in, and initially restricts the lateral displacement of the circuit boards. A hot press plate 4 and an insert block 502 are fixedly mounted on both the slide 3 and the base plate 501. A sliding plate 503 is installed inside the base plate 501. A pull rod 505 is fixedly connected to the sliding plate 503. The pull rod 505 abuts against the side wall of the base plate 501. The hot press plate 4 is engaged with the sliding plate 503. When the slide table 3 descends, multiple sets of connecting rods 6 drive the lower base plate 501 to move synchronously downwards. One end of the connecting rod 6 moves with the slide table 3, and the other end slides with the locking rod 506 of the base plate 501 through a sliding groove, so as to transmit the vertical power of the slide table 3 to each base plate 501 without loss. The slide table 3 drives all the base plates 501 to descend synchronously, avoiding uneven pressure caused by differences in descent speed between layers; the insert block 502 is engaged with the base plate 501, and the four corners of the base plate 501 are provided with insertion holes 504, and the insertion holes 504 are engaged with the insert block 502. The insert block 502 and the insertion hole 504 are both hexagonal in shape. The bottom base plate 501 is fixedly connected to the machine base 1, and the top hot press plate 4 is fixedly connected to the slide table 3.

[0022] As a technical optimization of this utility model, the end of the connecting rod 6 away from the base plate 501 is provided with a sliding groove. One end of the connecting rod 6 moves with the slide table 3, and the other end slides with the locking rod 506 of the base plate 501 through the sliding groove, so as to transmit the vertical power of the slide table 3 to each layer of the base plate 501 without loss, so as to realize that the slide table 3 drives all the base plates 501 to descend synchronously, avoiding uneven pressure caused by the difference in descent speed between layers; the locking rod 506 is located in the sliding groove, and the diameter of the locking rod 506 is equal to the width of the sliding groove.

[0023] As a technical optimization of this utility model, two slots 7 are symmetrically provided in the base plate 501. A card plate 503 is slidably installed in the slot 7. The slot 7 provides a sliding track for the card plate 503 to prevent the card plate 503 from shifting during use until the area enclosed by the card plate 503 matches the size of the circuit board to be pressed. The part of the card plate 503 that contacts the base plate 501 is set with an inclined structure.

[0024] As a technical optimization of this utility model, the drive mechanism 2 includes guide columns 201 and fixed seats 202. Two sets of guide columns 201 are symmetrically fixedly connected to the top of the base 1. A fixed seat 202 is fixedly installed between the two sets of guide columns 201. A hydraulic cylinder 203 is fixedly installed on the top of the fixed seat 202. A slide 3 is fixedly connected to the telescopic end of the hydraulic cylinder 203. The telescopic end of the hydraulic cylinder 203 pushes the slide 3 to slide vertically downward along the guide columns 201. The guide columns 201 provide guidance for the slide 3, prevent the slide 3 from shifting laterally, and ensure that the slide 3 descends horizontally. The four corners of the slide 3 are slidably connected to the guide columns 201. An electric heating element is embedded inside the hot press plate 4. The four corners of the hot press plate 4 are all set with an arc surface structure.

[0025] In use, the operator first holds the pull rod 505 fixed to the outside of the clamping plate 503 and pulls the clamping plate 503 outward along the symmetrically opened grooves 7 inside the base plate 501. The grooves 7 provide a sliding track for the clamping plate 503 to prevent it from shifting during use, until the area enclosed by the clamping plate 503 matches the size of the circuit board to be pressed. The multi-layer circuit boards are then placed one by one into the corresponding area of ​​the clamping plate 503 in each layer of the base plate 501, ensuring that the edges of the circuit boards are tightly fitted to the inner side of the clamping plate 503. The beveled structure at the contact point between the clamping plate 503 and the base plate 501 reduces frictional resistance when the circuit boards are placed in, and initially restricts lateral displacement of the circuit boards. The hydraulic cylinder 203 is then activated. The telescopic end of the slide table 3 pushes the slide table 3 to slide vertically downward along the guide post 201. The guide post 201 provides guidance for the slide table 3, preventing the slide table 3 from shifting laterally and ensuring that the slide table 3 descends horizontally. When the slide table 3 descends, it drives the lower base plate 501 to move down synchronously through multiple sets of connecting rods 6: one end of the connecting rod 6 moves with the slide table 3, and the other end slides with the locking rod 506 of the base plate 501 through the sliding groove, so as to transmit the vertical power of the slide table 3 to each base plate 501 without loss, so that the slide table 3 drives all base plates 501 to descend synchronously, avoiding uneven pressure caused by the difference in descent speed between layers. As the slide table 3 and the base plate 501 continue to descend, the hot press plate 4 of each layer gradually approaches the circuit board of the corresponding layer, until the hot press plate 4 and the circuit board are in contact. When the circuit board is fully bonded, the hydraulic cylinder 203 reaches the set pressure value, and the system automatically switches to the pressure holding mode. During the pressure holding process, the hot press plate 4 continuously transfers heat to the circuit board, causing the interlayer prepreg and other adhesives to melt, flow, and solidify. Simultaneously, the sliding engagement of the connecting rod 6 and the clamping rod 506 continuously constrains the horizontal displacement of the base plate 501. Under the dual limiting of the clamping groove 7 within the base plate 501 and the pull rod 505, the clamping plate 503 remains in contact with the edge of the circuit board, ensuring that the circuit board will not shift even if the hot press plate 4 generates a slight lateral thrust. When the pressure holding time reaches the set value, the temperature control system automatically stops heating the hot press plate 4 and initiates a natural cooling program. Once the temperature of the hot press plate 4 decreases, the hydraulic control system... The system initiates the pressure relief procedure, and the telescopic end of the hydraulic cylinder 203 slowly retracts, driving the slide 3 to return to its original position along the guide post 201. At the same time, the connecting rod 6 pulls each layer of the base plate 501 to rise synchronously until the slide 3 returns to its initial top position. The hydraulic cylinder 203 stops operating after it is fully retracted. Grasp the pull rod 505 of each layer of the clamping plate 503 again and pull the clamping plate 503 outward along the clamping groove 7 to expand the area enclosed by the clamping plate 503. The multi-layer circuit board that has been pressed is then smoothly removed from the base plate 501. Clean the residual impurities on the surface of each layer of the base plate 501 and the surface of the hot press plate 4, check whether the engaging surfaces of the insert block 502 and the socket 504 are clean, and finally turn off the main power supply of the equipment to complete a single pressing operation.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0027] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A multilayer circuit board pressing mechanism, comprising a base (1) and a drive mechanism (2) mounted on the top of the base (1), wherein a slide (3) is fixed to the power output end of the drive mechanism (2), the slide (3) is connected to multiple limiting mechanisms (5) by multiple sets of connecting rods (6), and a hot press plate (4) is mounted on the bottom of the slide (3) and the top of each limiting mechanism (5), characterized in that: The limiting mechanism (5) includes a base plate (501) and a clamping plate (503). A connecting rod (6) is fixedly installed on both the slide table (3) and the base plate (501). A clamping rod (506) is fixedly connected to the base plate (501). The connecting rod (6) and the clamping rod (506) are slidably connected. A hot press plate (4) and an insert block (502) are fixedly installed on both the slide table (3) and the base plate (501). A clamping plate (503) is slidably installed inside the base plate (501). A pull rod (505) is fixedly connected to the clamping plate (503). The pull rod (505) abuts against the side wall of the base plate (501). The hot press plate (4) and the clamping plate (503) are engaged. The insert block (502) and the base plate (501) are engaged.

2. The multilayer circuit board lamination mechanism according to claim 1, characterized in that: The limiting mechanism (5) also includes a socket (504). The four corners of the base plate (501) are provided with sockets (504). A plug (502) is engaged and installed in the socket (504). The plug (502) and the socket (504) are both hexagonal in shape.

3. The multilayer circuit board lamination mechanism according to claim 1, characterized in that: The connecting rod (6) has a groove at one end away from the base plate (501), and the locking rod (506) is located in the groove. The diameter of the locking rod (506) is equal to the width of the groove.

4. The multilayer circuit board lamination mechanism according to claim 1, characterized in that: The base plate (501) is provided with two symmetrical slots (7), and a card plate (503) is slidably installed in the slot (7). The part of the card plate (503) that contacts the base plate (501) is set with an inclined structure.

5. The multilayer circuit board lamination mechanism according to claim 1, characterized in that: The bottom plate (501) is fixedly connected to the base (1), and the top hot plate (4) is fixedly connected to the slide (3).

6. The multilayer circuit board lamination mechanism according to claim 1, characterized in that: The drive mechanism (2) includes guide columns (201) and a fixed seat (202). Two sets of guide columns (201) are symmetrically fixedly connected to the top of the base (1). A fixed seat (202) is fixedly installed between the two sets of guide columns (201). A hydraulic cylinder (203) is fixedly installed on the top of the fixed seat (202).

7. The multilayer circuit board lamination mechanism according to claim 6, characterized in that: The extension end of the hydraulic cylinder (203) is fixedly connected to a slide (3), and the four corners of the slide (3) are slidably connected to the guide column (201).

8. The multilayer circuit board lamination mechanism according to claim 1, characterized in that: The hot press plate (4) is equipped with an electric heating element, and the four corners of the hot press plate (4) are all set with an arc surface structure.

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