Semiconductor refrigeration device and home appliance

Abstract

The utility model relates to the technical field of semiconductor refrigeration equipment discloses a kind of semiconductor refrigeration device and household appliance, wherein, semiconductor refrigeration device, including semiconductor refrigeration chip, one-way heat insulation component, heat dissipation component and jar body, the cold end of the semiconductor refrigeration chip is contacted with the jar body by the one-way heat insulation component, the hot end of the semiconductor refrigeration chip is contacted with the heat dissipation component by the one-way heat insulation component, the one-way heat insulation component reduces the heat conduction of the hot end heat of the semiconductor refrigeration chip to the cold end side of the semiconductor refrigeration chip, the heat dissipation component is used for the heat dissipation of the hot end of the semiconductor refrigeration chip, the jar body is used for storing liquid. The present application carries out refrigeration to jar body by semiconductor refrigeration chip, carries out heat dissipation to semiconductor refrigeration chip by heat dissipation component, one-way heat insulation component to avoid the heat backflow of semiconductor refrigeration chip work stop, with the effect of maintaining refrigeration effect and reducing the energy consumption of semiconductor refrigeration chip.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor refrigeration equipment technology, specifically to a semiconductor refrigeration device and a household appliance. Background Technology

[0002] Home refrigerators or ice chambers typically use one or more 40x40 semiconductor chips for cooling. Because heat conduction is bidirectional, when the cooling chip completes its task of cooling the air or water inside the refrigerator or ice chamber to a very low temperature, it also creates a large temperature difference with the outside environment. As a result, when the cooling chip stops working, heat can easily flow back to the low-temperature area, causing its temperature to rise. Therefore, the cooling chip must run for extended periods to prevent this reverse heat flow, which significantly increases the energy consumption of the chip-based cooling system.

[0003] Chinese patent application CN202310005314.X discloses a refrigerator, comprising: a drying chamber with a connection port communicating with a storage chamber; a drying duct disposed within the drying chamber, one end connected to the connection port and the other end connected to the drying chamber; a fan disposed at the connection port, used to draw cold air from the storage chamber into the drying duct and accelerate it to form an airflow that is then introduced into the drying chamber through the drying duct; and a semiconductor refrigeration device having a heat dissipation end and a condensation end, the heat dissipation end being located within the drying duct, and the condensation end being located outside the drying duct and inside the drying chamber. The heat dissipation end heats the airflow within the drying duct, and the condensation end condenses moisture in the air within the drying chamber. Therefore, the heat dissipation end dissipates heat through the airflow and heats the airflow, ensuring its operational stability and increasing the airflow temperature, while the condensation end condenses moisture in the air within the drying chamber, thereby improving the drying effect on the items to be dried.

[0004] This invention overcomes the shortcomings of the prior art and provides a semiconductor refrigeration device and household appliance that can realize heat recirculation when the refrigeration chip stops working. Utility Model Content

[0005] The main objective of this invention is to provide a semiconductor cooling device, comprising a semiconductor cooling chip, a one-way heat insulation component, a heat dissipation component, and a container. The cold end of the semiconductor cooling chip is in contact with the container through the one-way heat insulation component, and the hot end of the semiconductor cooling chip is in contact with the heat dissipation component through the one-way heat insulation component. The one-way heat insulation component reduces the heat transfer from the hot end of the semiconductor cooling chip to the cold end of the semiconductor cooling chip. The heat dissipation component is used to dissipate heat from the hot end of the semiconductor cooling chip, and the container is used to store liquid.

[0006] Optionally, the outer side of the tank is wrapped with an insulation layer, and the semiconductor cooling chip is embedded in the insulation layer.

[0007] Optionally, the unidirectional insulation component includes a cold-end heat pipe and a hot-end heat pipe; the cold-end heat pipe is disposed within the insulation layer, located between the tank and the thermoelectric cooling chip, with its lower end in contact with the tank and its upper end in contact with the cold end of the thermoelectric cooling chip; the hot-end heat pipe is disposed outside the insulation layer, located between the thermoelectric cooling chip and the heat dissipation component, with its lower end in contact with the hot end of the thermoelectric cooling chip and its upper end in contact with the heat dissipation component.

[0008] Optionally, when the temperature of the tank is higher than the cold end temperature of the semiconductor refrigeration chip, the cold end heat pipe is turned on; when the temperature of the heat dissipation component is lower than the hot end temperature of the semiconductor refrigeration chip, the hot end heat pipe is turned on, thereby cooling the liquid inside the tank.

[0009] Optionally, when the liquid in the tank reaches a predetermined cooling temperature, and the temperature of the tank is lower than the cold end temperature of the semiconductor cooling chip, the cold end heat pipe is cut off. When the temperature of the heat dissipation component is higher than the hot end temperature of the semiconductor cooling chip, the hot end heat pipe is cut off, thereby reducing the conduction of heat from the hot end side of the semiconductor cooling chip to the cold end side.

[0010] Optionally, the heat dissipation assembly includes a heat sink and a cooling fan, the heat sink and the cooling fan are connected, the heat sink is located between the hot end heat pipe and the cooling fan, one side of the heat sink is in contact with the upper end of the hot end heat pipe, and the other side is connected to the cooling fan.

[0011] Optionally, the tank is provided with an inlet pipe and an outlet pipe, which connect the inside and outside of the tank, and the outlet water temperature is lower than the inlet water temperature of the inlet pipe.

[0012] Optionally, one end of the water inlet pipe is located outside the tank and the other end is located inside the upper side of the tank, and one end of the water outlet pipe is located outside the tank and the other end is located inside the bottom side of the tank.

[0013] This utility model also provides a home appliance product, including the above-mentioned semiconductor refrigeration device, wherein the refrigeration environment of the home appliance product is generated by the semiconductor refrigeration device.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The semiconductor cooling device provided by this utility model cools the tank through a semiconductor cooling chip, dissipates heat from the semiconductor cooling chip through a heat dissipation component, and uses a one-way heat insulation component to prevent heat backflow when the semiconductor cooling chip stops working. It has the functions of maintaining the cooling effect and reducing the energy consumption of the semiconductor cooling chip. Attached Figure Description

[0015] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0016] Figure 1 This is a schematic diagram of an embodiment of the semiconductor refrigeration device of this utility model.

[0017] Figure label: 10-Semiconductor cooling chip; 20-One-way insulation component; 21-Cold end heat pipe; 22-Hot end heat pipe; 30-Heat dissipation component; 31-Heat trap; 32-Cooling fan; 40-Tank body; 41-Insulation layer; 42-Inlet pipe; 43-Outlet pipe; 44-Cold water. Detailed Implementation

[0018] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only. In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of indicated technical features. Thus, unless otherwise stated, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0019] Furthermore, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection; as a mechanical connection or an electrical connection; as a direct connection or an indirect connection through an intermediate medium, or as a connection within two components. All technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0020] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0021] like Figure 1 The diagram shown is a schematic representation of an embodiment of the semiconductor cooling device provided by this utility model.

[0022] Please refer to Figure 1 This embodiment is used for refrigeration in the ice chamber of a refrigerator or other household appliance, and includes a semiconductor cooling chip 10, a one-way heat insulation component 20, a heat dissipation component 30, and a tank 40. The cold end of the semiconductor cooling chip 10 is in contact with the tank 40 through the one-way heat insulation component 20, and the hot end of the semiconductor cooling chip 10 is in contact with the heat dissipation component 30 through the one-way heat insulation component 20. The one-way heat insulation component 20 reduces the conduction of heat from the hot end of the semiconductor cooling chip 10 to the cold end side of the semiconductor cooling chip 10. The heat dissipation component 30 is used to dissipate heat from the hot end of the semiconductor cooling chip 10, and the tank 40 is used to store cold water 44.

[0023] The core principle of the semiconductor cooling chip 10 is the Peltier effect, which occurs when a direct current flows through a junction composed of two different semiconductor materials (N-type and P-type). Directional heat transfer occurs at the junction; when the current flows from the N-type semiconductor to the P-type semiconductor, the junction absorbs heat, forming a cold junction; when the current flows in the opposite direction, the junction releases heat, forming a hot junction. The semiconductor cooling chip 10 uses conventional technology, and its specific structure and principle will not be described in detail. The unidirectional insulation component 20 can specifically employ a gravity-sensitive thermosiphon heat pipe, achieving thermal insulation based on its positional differences. It is also conductive when the semiconductor cooling chip 10 is operating, without affecting its cooling effect. The heat dissipation component 30 can employ various heat dissipation methods such as air cooling and water cooling.

[0024] In one embodiment, the outer side of the can 40 is wrapped with a heat insulation layer 41, and the semiconductor cooling chip 10 is embedded in the heat insulation layer 41. The heat insulation layer 41 is specifically made of heat insulation material, covering the outer surface of the can 40, and has a heat preservation function, slowing down the loss of cold air from the can 40. The semiconductor cooling chip 10 is embedded in the heat insulation layer 41, which also prevents heat from the hot end of the semiconductor cooling chip 10 from the edge to the cold end.

[0025] In one embodiment, the unidirectional thermal insulation component 20 includes a cold-end heat pipe 21 and a hot-end heat pipe 22. The cold-end heat pipe 21 is disposed within the thermal insulation layer 41, located between the tank 40 and the thermoelectric cooler chip 10. The lower end of the cold-end heat pipe 21 contacts the tank 40, and the upper end of the cold-end heat pipe 21 contacts the cold end of the thermoelectric cooler chip 10. The hot-end heat pipe 22 is disposed outside the thermal insulation layer 41, located between the thermoelectric cooler chip 10 and the heat dissipation component 30. The lower end of the hot-end heat pipe 22 contacts the hot end of the thermoelectric cooler chip 10, and the upper end of the hot-end heat pipe 22 contacts the heat dissipation component 30.

[0026] The cold-end heat pipe 21 and the hot-end heat pipe 22 can specifically be thermosiphon heat pipes. A thermosiphon heat pipe is a passive, high-efficiency heat transfer device that achieves heat transfer through the phase change (evaporation and condensation) of the working fluid (such as a liquid or gas) and gravity, without requiring external mechanical power. The working process of a thermosiphon heat pipe is based on phase change heat transfer and gravity reflux. The thermosiphon heat pipe is a conventional component, and its specific structure and principle will not be described in detail. The focus of this embodiment is on the application of thermosiphon heat pipes in semiconductor refrigeration chips.

[0027] In one embodiment, when the temperature of the tank 40 is higher than the cold end temperature of the thermoelectric cooler 10, if the thermoelectric cooler 10 is activated, the cold end heat pipe 21 is turned on, and the temperature of the heat dissipation assembly 30 is lower than the hot end temperature of the thermoelectric cooler 10, so the hot end heat pipe 22 is turned on, thereby cooling the liquid inside the tank 40. At this time, the thermoelectric cooler 10 is working to cool the liquid.

[0028] When the thermoelectric cooling chip 10 stops working, that is, when the liquid in the tank 40 reaches the predetermined cooling temperature, the temperature of the tank 40 is lower than the cold end temperature of the thermoelectric cooling chip 10, the cold end heat pipe 21 is cut off, the temperature of the heat dissipation component 30 is higher than the hot end temperature of the thermoelectric cooling chip 10, the hot end heat pipe 22 is cut off, reducing the heat conduction from the hot end side of the thermoelectric cooling chip 10 to the cold end side and preventing heat backflow.

[0029] In one embodiment, the heat dissipation assembly 30 includes a heat sink 31 and a cooling fan 32, which are connected together. The heat sink 31 is located between the hot-end heat pipe 22 and the cooling fan 32. One side of the heat sink 31 is in contact with the upper end of the hot-end heat pipe 22, and the other side is connected to the cooling fan 32. The function of the heat sink 31 is to efficiently receive, conduct, or store heat.

[0030] Specifically, in this embodiment, the thermoelectric cooling chip 10 is sandwiched between two sets of heat pipes (i.e., cold-end heat pipe 21 and hot-end heat pipe 22). The heat pipe located inside the insulation layer 41 is the cold-end heat pipe 21, whose lower end contacts the heat-conducting inner wall of the refrigerator or ice chamber (i.e., the can 40), and the other end contacts the cold end of the thermoelectric cooling chip 10; the heat pipe located outside the insulation layer 41 is the hot-end heat pipe 22, whose lower end contacts the hot end of the thermoelectric cooling chip 10, and the other end contacts the heat sink 31. This type of heat pipe allows for good thermal conductivity when the lower part is hot and the upper part is cold; otherwise, thermal conductivity will be cut off because the internal working fluid vapor-liquid phase cannot circulate. Therefore, when the thermoelectric cooling chip 10 is working, the temperature of the freezing zone (can 40) is higher than the cold end of the thermoelectric cooling chip 10, at which time the cold-end heat pipe 21 is conductive; the temperature of the heat sink 31 is lower than the hot end temperature of the thermoelectric cooling chip, at which time the hot-end heat pipe 22 is conductive, and the thermoelectric cooling chip 10 cools smoothly. When the product in the freezing zone (tank 40) reaches the cooling temperature, and the semiconductor cooling chip 10 and cooling fan 32 stop working, the temperature of the two poles of the cold end heat pipe 21 and the hot end heat pipe 22 reverses, thereby greatly reducing heat conduction and automatically generating a thermal insulation effect.

[0031] In one embodiment, the tank 40 is provided with an inlet pipe 42 and an outlet pipe 43, which connect the interior and exterior of the tank 40. The water temperature at the outlet pipe 43 is lower than the water temperature at the inlet pipe 42. Specifically, one end of the inlet pipe 42 is located outside the tank 40, and the other end is located inside the upper side of the tank 40. One end of the outlet pipe 43 is located outside the tank 40, and the other end is located inside the bottom side of the tank 40. Water enters from the top of the tank 40 and is drawn from the bottom of the tank 40 to ensure that the outlet water temperature remains constant.

[0032] This utility model also provides an embodiment of a home appliance, including the aforementioned semiconductor refrigeration device embodiment, wherein the refrigeration environment of the home appliance is generated by the semiconductor refrigeration device. Specifically, the home appliance can be a refrigerator, a beverage machine, a coffee machine, or other similar appliances.

[0033] In summary, the semiconductor cooling device embodiment provided by this utility model cools the can body using a semiconductor cooling chip, dissipates heat from the semiconductor cooling chip using a heat dissipation component, and uses a unidirectional heat insulation component to prevent heat backflow when the semiconductor cooling chip stops working. This maintains the cooling effect and reduces the energy consumption of the semiconductor cooling chip. By establishing a unidirectional heat conduction mechanism, it ensures that heat will not flow back when the product reaches a low temperature and the semiconductor cooling chip stops working.

[0034] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Under the concept of this utility model, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this utility model as described above. For the sake of brevity, they are not provided in detail. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A semiconductor cooling device, characterized in that, The device includes a thermoelectric cooling chip, a one-way heat insulation component, a heat dissipation component, and a container. The cold end of the thermoelectric cooling chip is in contact with the container through the one-way heat insulation component, and the hot end of the thermoelectric cooling chip is in contact with the heat dissipation component through the one-way heat insulation component. The one-way heat insulation component reduces the heat transfer from the hot end of the thermoelectric cooling chip to the cold end of the thermoelectric cooling chip. The heat dissipation component is used to dissipate heat from the hot end of the thermoelectric cooling chip, and the container is used to store liquid.

2. The semiconductor cooling device according to claim 1, characterized in that, The outer side of the tank is wrapped with an insulation layer, and the semiconductor cooling chip is embedded in the insulation layer.

3. The semiconductor cooling device according to claim 2, characterized in that, The unidirectional insulation component includes a cold-end heat pipe and a hot-end heat pipe; the cold-end heat pipe is disposed within the insulation layer, located between the tank and the thermoelectric cooling chip, with its lower end in contact with the tank and its upper end in contact with the cold end of the thermoelectric cooling chip; the hot-end heat pipe is disposed outside the insulation layer, located between the thermoelectric cooling chip and the heat dissipation component, with its lower end in contact with the hot end of the thermoelectric cooling chip and its upper end in contact with the heat dissipation component.

4. The semiconductor cooling device according to claim 3, characterized in that, When the temperature of the tank is higher than the cold end temperature of the semiconductor refrigeration chip, the cold end heat pipe is turned on; when the temperature of the heat dissipation component is lower than the hot end temperature of the semiconductor refrigeration chip, the hot end heat pipe is turned on, thus cooling the liquid inside the tank.

5. The semiconductor cooling device according to claim 4, characterized in that, When the liquid in the tank reaches the predetermined cooling temperature, the temperature of the tank is lower than the cold end temperature of the semiconductor refrigeration chip, and the cold end heat pipe is cut off. When the temperature of the heat dissipation component is higher than the hot end temperature of the semiconductor refrigeration chip, the hot end heat pipe is cut off, thereby reducing the conduction of heat from the hot end side of the semiconductor refrigeration chip to the cold end side.

6. The semiconductor cooling device according to claim 3, characterized in that, The heat dissipation assembly includes a heat sink and a cooling fan, which are connected together. The heat sink is located between the hot-end heat pipe and the cooling fan. One side of the heat sink is in contact with the upper end of the hot-end heat pipe, and the other side is connected to the cooling fan.

7. The semiconductor cooling device according to claim 1, characterized in that, The tank is equipped with an inlet pipe and an outlet pipe, which connect the inside and outside of the tank. The water temperature at the outlet pipe is lower than the water temperature at the inlet pipe.

8. The semiconductor cooling device according to claim 7, characterized in that, One end of the inlet pipe is located outside the tank, and the other end is located inside the upper side of the tank. One end of the outlet pipe is located outside the tank, and the other end is located inside the bottom side of the tank.

9. A household appliance, characterized in that, Includes the semiconductor refrigeration device as described in any one of claims 1-8, wherein the refrigeration environment of the household appliance is generated by the semiconductor refrigeration device.

Images