Liquid-proof contact type electrical connection structure

Abstract

The utility model provides a kind of liquid-proof contact type electric property connection structure, it includes a joint, a liquid-tight piece and a positioning structure.Joint includes a base material and multiple terminals, base material has a first surface, a second surface and multiple through holes, each terminal has a contact part, a welding part and an electric connection part, welding part is set on the first surface, contact part is set on the second surface, electric connection part is set in through hole and is connected contact part and welding part, contact part is arc curved spring arm, liquid-tight piece sets second surface face and surrounds terminal.Positioning structure is set on the outer circumferential surface.Second surface of base material is abutted on a circuit board by positioning structure, the contact part of terminal and the multiple contact pads of circuit board are contacted correspondingly, and liquid-tight piece is abutted circuit board so that the contact of terminal and contact pad forms liquid-tight.

Description

Technical Field

[0001] This utility model relates to the technical field of electrical connection structures, and particularly to a liquid-resistant contact-type electrical connection structure. Background Technology

[0002] As the processing speed of electronic devices increases significantly, the operating speed of each electronic component also increases, leading to an increase in the heat generated by each component. Therefore, heat dissipation of electronic components has become an important issue affecting the performance of electronic devices.

[0003] Most electronic devices currently use airflow cooling, but for high-speed electronic components or modules, water cooling or oil cooling is used to achieve better heat dissipation.

[0004] Since water-cooling or oil-cooling heat dissipation relies on the flow of water or oil within electronic devices, water or oil may seep into the electronic modules, causing electronic components to malfunction. Therefore, designing waterproof or oil-proof structures for each electronic component or module is a crucial issue for water-cooled or oil-cooled electronic devices. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a liquid-proof contact electrical connection structure that provides waterproof or oil-proof functions for contact electrical connection modules.

[0006] This utility model provides a liquid-resistant contact-type electrical connection structure, including a connector, a liquid-tight element, and a positioning structure. The connector includes a substrate and a plurality of terminals. The substrate has a first surface, a second surface, an outer peripheral surface, and a plurality of through holes. The first and second surfaces are opposite to each other, and the outer peripheral surface connects the first and second surfaces. The through holes penetrate the substrate and open onto the first and second surfaces. Each terminal has a contact portion, a welding portion, and an electrical connection portion. The welding portion is located on the first surface, the contact portion is located on the second surface, and the electrical connection portion is located within the through holes and connects the contact portion and the welding portion. The contact portion is an arc-shaped, curved spring arm. The liquid-tight element is located on the second surface and surrounds the terminal. The positioning structure is located on the outer peripheral surface. The second surface of the substrate abuts against a circuit board via the positioning structure. The contact portion of the terminal contacts abuts against a plurality of contact pads on the circuit board. The liquid-tight element abuts against the circuit board, forming a liquid seal at the contact point between the terminal and the contact pads.

[0007] In another embodiment, the liquid-tight element is an O-ring.

[0008] In another embodiment, the substrate further includes a first circuit layer and a second circuit layer, the first circuit layer being bonded to a first surface and the second circuit layer being bonded to a second surface. The first circuit layer has a plurality of first welding structures and the second circuit layer has a plurality of second welding structures. The wall of each through hole has a metal plating layer, the metal plating layer being an electrical connection portion, the second welding structure being a welding portion, and the contact portion being welded to the first welding structure.

[0009] In another embodiment, each first weld structure and the corresponding second weld structure are located on the same side or opposite side of the corresponding through hole.

[0010] In another embodiment, the substrate further includes a first protective layer and a second protective layer, the first protective layer covering the first circuit layer and exposing the first solder structure from the first protective layer, and the second protective layer covering the second circuit layer and exposing the second solder structure from the second protective layer.

[0011] In another embodiment, the electrical connection portion of each terminal extends through the through hole, and the contact portion, electrical connection portion and solder portion of each terminal are connected to form an integrated structure.

[0012] In another embodiment, the electrical connection portion forms an interference fit with the wall of the through hole.

[0013] In another embodiment, the terminals on the second surface are arranged in a row, a matrix, or an irregular geometry; the welded portions are arranged in a row, a matrix, or an irregular geometry.

[0014] In another embodiment, the positioning structure includes a plurality of lugs and a plurality of bolts, the lugs extending laterally from the outer peripheral surface, and the bolts correspondingly passing through the lugs and locking to the circuit board.

[0015] In another embodiment, the liquid-tight element is disposed at the edge near the outer peripheral surface.

[0016] The liquid-proof contact electrical connection structure of this utility model provides a liquid-tight element on the second surface of the connector substrate. When the connector is locked to the circuit board, the liquid-tight element abuts against the circuit board, so that a liquid seal is formed between the second surface of the connector substrate and the surface of the circuit board. This can prevent coolant from seeping into the structure where the terminal and the contact pad are in contact through the gap between the second surface of the substrate and the surface of the circuit board, achieving the effect of waterproofing and oil resistance, and preventing electronic components from failing due to liquid infiltration. Attached Figure Description

[0017] Figure 1 This is a cross-sectional view of the first embodiment of the liquid-resistant contact-type electrical connection structure of this utility model.

[0018] Figure 2 This is a cross-sectional view of the second embodiment of the liquid-resistant contact-type electrical connection structure of this utility model.

[0019] Figure 3 This is a perspective view of the liquid-resistant contact-type electrical connection structure of this utility model.

[0020] Explanation of reference numerals in the attached drawings: 1-Liquid-resistant contact-type electrical connection structure; 10-Connector; 11-Substrate; 12-Terminal; 20-Liquid-tight component; 30-Positioning structure; 31-Lumber; 111-First surface; 112-Second surface; 113-Outer peripheral surface; 114-Through hole; 114a-Metal plating; 115-First circuit layer; 115a-First welding structure; 116-Second circuit layer; 116a-Second welding structure; 117-First protective layer; 118-Second protective layer; 119-Insulating material; 119a-Groove; 121-Contact portion; 122-Welding portion; 123-Electrical connection portion; 123'-Electrical connection portion; C-Cable; D-Wire; P-Circuit board; P1-Contact pad. Detailed Implementation

[0021] Please see Figure 1 and Figure 3 As shown, this represents a first embodiment of the liquid-resistant contact-type electrical connection structure of this utility model. This utility model embodiment provides a liquid-resistant contact-type electrical connection structure 1, including a connector 10, a liquid-tight component 20, and a positioning structure 30.

[0022] The substrate 11 has a first surface 111, a second surface 112, an outer peripheral surface 113, and a plurality of through holes 114. The first surface 111 and the second surface 112 are disposed opposite to each other. The outer peripheral surface 113 connects the first surface 111 and the second surface 112. The through holes 114 penetrate the substrate 11 and open at the first surface 111 and the second surface 112. In this embodiment, the substrate 11 is a circuit board. The substrate 11 further includes a first circuit layer 115 and a second circuit layer 116. The first circuit layer 115 is bonded to the first surface 111, and the second circuit layer 116 is bonded to the second surface 112. The first circuit layer 115 has a plurality of first solder structures 115a, and the second circuit layer 116 has a plurality of second solder structures 116a. The wall of each through hole 114 has a metal plating layer 114a, and the metal plating layer 114a is correspondingly connected to the first solder structure 115a and the second solder structure 116a. Each first weld structure 115a and its corresponding second weld structure 116a are located on the same side of the corresponding through hole 114. However, the present invention is not limited thereto; in other embodiments, each first weld structure 115a and its corresponding second weld structure 116a are located on different sides of the corresponding through hole 114. The substrate 11 further includes a first protective layer 117 and a second protective layer 118. The first protective layer 117 covers the first circuit layer 115 and exposes the first weld structure 115a from the first protective layer 117, and the second protective layer 118 covers the second circuit layer 116 and exposes the second weld structure 116a from the second protective layer 118.

[0023] In addition, the second surface 112 and the outer peripheral surface 113 of the substrate are covered with an insulating material 119.

[0024] Each terminal 12 has a contact portion 121, a welding portion 122, and an electrical connection portion 123. The welding portion 122 is disposed on the first surface 111, the contact portion 121 is disposed on the second surface 112, and the electrical connection portion 123 is disposed within the through hole 114 and connects the contact portion 121 and the welding portion 122. In this embodiment, the contact portion 121 is an arc-shaped, curved spring arm. In this embodiment, the second welding structure 116a is used as the welding portion 122, and the metal plating layer 114a of the through hole 114 wall is used as the electrical connection portion 123. The contact portion 121 and the welding portion 122 are connected by the electrical connection portion 123, so that the contact portion 121 and the welding portion 122 form an electrical connection. A plurality of conductors D of a cable C are welded to the welding portion 122. The conductors D of the cable C are also covered with insulating material 119 by an injection molding process, so that the conductors D of the cable C are positioned in the welding portion 122. The contact portions 121 of the terminal 12 can be arranged in a row, a matrix, or an irregular geometric shape on the second surface 112 as required by design. The solder portions 122 of the terminal 12 can be arranged in a row, a matrix, or an irregular geometric shape on the first surface 111 as required by design.

[0025] The liquid seal 20 is disposed on the second surface 112 of the substrate 11 and surrounds the terminal 12. Specifically, the liquid seal 20 is positioned within a groove 119a of the insulating material 119. In this embodiment, the liquid seal 20 is an O-ring.

[0026] like Figure 3 As shown, the positioning structure 30 includes a plurality of lugs 31 and a plurality of bolts (not shown). The lugs 31 extend laterally from the outer peripheral surface 113 of the substrate 11, and the bolts pass through the lugs 31 to lock onto the circuit board P. The positioning structure 30 causes the second surface 112 of the substrate 11 of the connector 10 to abut against a circuit board P, and the contact portion 121 of the terminal 12 contacts the plurality of contact pads P1 of the circuit board P accordingly. At the same time, the locking pressure of the positioning structure 30 causes the liquid seal member 20 to abut against the circuit board P, thereby forming a liquid seal at the contact point between the terminal 12 and the contact pads P1.

[0027] Please see Figure 2 The diagram illustrates a second embodiment of the liquid-resistant contact-type electrical connection structure of this invention. This embodiment shares some structural similarities with the first embodiment; therefore, identical components are given the same reference numerals and their descriptions are omitted. The difference between this embodiment and the first embodiment lies in that the substrate 11 of the connector 10 in this embodiment does not have a first circuit layer, a second circuit layer, a first protective layer, and a second protective layer. In this embodiment, the terminal 12 is formed by bending a metal sheet to create a contact portion 121, a welding portion 122, and an electrical connection portion 123', thus forming an integrated structure. The electrical connection portion 123' extends through the through hole 114, and the electrical connection portion 123' forms an interference fit with the wall of the through hole 114, thereby positioning the terminal 12 within the through hole 114 of the substrate 11.

[0028] The liquid-proof contact electrical connection structure of this utility model provides a liquid-tight element on the second surface of the connector substrate. When the connector is locked to the circuit board, the liquid-tight element abuts against the circuit board, so that a liquid seal is formed between the second surface of the connector substrate and the surface of the circuit board. This can prevent coolant from seeping into the structure where the terminal and the contact pad are in contact through the gap between the second surface of the substrate and the surface of the circuit board, achieving the effect of waterproofing and oil resistance, and preventing electronic components from failing due to liquid infiltration.

[0029] The above description is merely a preferred embodiment of this utility model and should not be construed as limiting the scope of this utility model. Any simple equivalent changes and modifications made based on the content of this utility model are still within the scope of this utility model patent. Furthermore, no embodiment of this utility model needs to achieve all the objectives, advantages, or features disclosed in this utility model. In addition, the abstract and headings are only used to assist in patent document searching and are not intended to limit the scope of this utility model. Furthermore, the terms "first," "second," etc., mentioned in this utility model are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

Claims

1. A liquid-resistant contact-type electrical connection structure, characterized in that, include: A connector includes a substrate and a plurality of terminals. The substrate has a first surface, a second surface, an outer peripheral surface, and a plurality of through holes. The first surface and the second surface are disposed opposite each other. The outer peripheral surface connects the first surface and the second surface. The plurality of through holes penetrate the substrate and open into the first surface and the second surface. Each terminal has a contact portion, a welding portion, and an electrical connection portion. The welding portion is disposed on the first surface, the contact portion is disposed on the second surface, and the electrical connection portion is disposed in the through hole and connects the contact portion and the welding portion. The contact portion is in the shape of an arc-shaped, curved spring arm. A liquid-tight element, the liquid-tight element being disposed on the second surface and surrounding the plurality of terminals; and A positioning structure is disposed on the outer peripheral surface; The second surface of the substrate of the connector abuts against a circuit board by the positioning structure, so that the plurality of contacts of the plurality of terminals make corresponding contact with the plurality of contact pads of the circuit board, and the liquid seal abuts against the circuit board so that the contact points of the plurality of terminals and the plurality of contact pads form a liquid seal.

2. The liquid-resistant contact-type electrical connection structure as described in claim 1, characterized in that: The liquid-tight component is an O-ring.

3. The liquid-resistant contact-type electrical connection structure as described in claim 1, characterized in that: The substrate further includes a first circuit layer and a second circuit layer. The first circuit layer is bonded to the first surface, and the second circuit layer is bonded to the second surface. The first circuit layer has a plurality of first welding structures, and the second circuit layer has a plurality of second welding structures. The wall of each through hole has a metal plating layer, which is the electrical connection portion. The first welding structure is the welding portion, and the contact portion is welded to the second welding structure.

4. The liquid-resistant contact-type electrical connection structure as described in claim 3, characterized in that: Each of the first welded structures and the corresponding second welded structure is located on the same side or opposite side of the corresponding through hole.

5. The liquid-resistant contact-type electrical connection structure as described in claim 4, characterized in that: The substrate also includes a first protective layer and a second protective layer, the first protective layer covering the first circuit layer and exposing the first solder structure from the first protective layer, and the second protective layer covering the second circuit layer and exposing the second solder structure from the second protective layer.

6. The liquid-resistant contact-type electrical connection structure as described in claim 1, characterized in that: The electrical connection portion of each terminal extends through the through hole, and the contact portion, electrical connection portion and solder portion of each terminal are connected to form an integrated structure.

7. The liquid-resistant contact-type electrical connection structure as described in claim 6, characterized in that: The electrical connection part forms an interference fit with the wall of the through hole.

8. The liquid-resistant contact-type electrical connection structure as described in claim 1, characterized in that: The plurality of the contact portions on the second surface are arranged in a row, a matrix, or an irregular geometric shape; the plurality of the weld portions on the first surface are arranged in a row, a matrix, or an irregular geometric shape.

9. The liquid-resistant contact-type electrical connection structure as described in claim 1, characterized in that: The positioning structure includes multiple lugs and multiple bolts, the multiple lugs extending laterally from the outer peripheral surface, and the multiple bolts correspondingly passing through the multiple lugs to lock onto the circuit board.

10. The liquid-resistant contact-type electrical connection structure as described in claim 1, characterized in that: The liquid-tight component is located at the edge near the outer peripheral surface.

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