Device bearing carrier suitable for semiconductor processing and use method thereof

Abstract

The invention discloses a device bearing carrier suitable for semiconductor processing and a use method of the device bearing carrier, and relates to the technical field of semiconductor processing equipment.The structure of a wafer adsorption device in the prior art is optimized and improved, and a contact pad assembly with a silica gel hose as a main body is additionally arranged on the wafer adsorption device in the prior art; the contact pad assembly is used for wrapping the adsorption pipe which is directly contacted with the wafer, and the air leakage phenomenon is avoided in a manner of separating an air flow channel; the technical effects that the device bearing carrier suitable for semiconductor processing is high in applicability for wafers of different specifications, relatively low in manufacturing and maintenance cost and relatively high in reliability are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a device carrier suitable for semiconductor processing and a method for using the same. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor circuits. When processing a wafer, a wafer carrier adsorption device is used.

[0003] Chinese Patent No. CN117832150B discloses a wafer adsorption device and a wafer processing machine. Through the mutual cooperation of multiple structures, the wafer adsorption device can be applicable to the adsorption of wafers of different models, improving the applicability of the wafer adsorption device, and can reinforce wafers with edge sinking, making the adsorption and fixation effect of the wafer adsorption device on the wafer better.

[0004] Although the solution disclosed in the above invention increases the applicability of the wafer adsorption device to wafers of different specifications to a certain extent and can improve the bearing effect on the wafer through the reinforcement mechanism, due to its limited structure, during processing and manufacturing, strict requirements are needed for the processing precision of the limit air supply pipe, the first adjustable air supply pipe, and the second adjustable air supply pipe, as well as the installation precision among the three, and frequent maintenance is required to ensure that air leakage is not likely to occur or the air leakage volume is small (air leakage will affect the adsorption effect), thereby ensuring the stability when adsorbing and carrying the wafer; the manufacturing and maintenance costs of the entire device are high, and the reliability during long-term operation is poor.

[0005] Therefore, there is a need for a device carrier suitable for semiconductor processing that has strong applicability to wafers of different specifications, relatively low manufacturing and maintenance costs, and relatively high reliability. Summary of the Invention

[0006] By providing a device carrier suitable for semiconductor processing in the embodiments of the present application, the technical problem in the prior art that the manufacturing and maintenance costs of the carrier adsorption device during wafer processing are high and the reliability is poor is solved; the technical effects of the device carrier suitable for semiconductor processing having strong applicability to wafers of different specifications, relatively low manufacturing and maintenance costs, and relatively high reliability are achieved.

[0007] The embodiments of the present application provide a device carrier suitable for semiconductor processing, including a top connection body that is a rigid plate or block, a base barrel, an internal base tube, a contact extrusion tube, a tube displacement driving component, and a contact pad component;

[0008] The base barrel is a rigid circular barrel with an opening downward, the top is positioned at the bottom of the top connection body, and an air extraction component communicated with the internal space of the internal base tube is positioned thereon;

[0009] The built-in base tube is a hard round tube, the top of which is fixed to the inner top of the base barrel and is coaxial with the base barrel;

[0010] The said interference extrusion tube is a hard round tube, which is sleeved on the built-in base tube and slides along the axial direction of the built-in base tube under the drive of the tube displacement drive assembly. There are 1 to 3 of them, which are sleeved together. The bottom opening diameter of the outer interference extrusion tube is larger.

[0011] The contact pad assembly includes a first carrier ring positioned on the inner wall of the built-in base tube, a second carrier ring positioned on the inner wall of the base barrel, and a contact hose; the contact hose is an elastic hose made of silicone material, with both ends tightly attached and fixed to the first carrier ring and the second carrier ring, and is always in a straight state.

[0012] Furthermore, the length of the built-in basic pipe is 1.1 to 1.4 times the length of the basic barrel, and the diameter is 0.3 to 0.5 times the diameter of the basic barrel.

[0013] Furthermore, the tube displacement drive assembly includes a top elastic body, a sliding pin and a built-in guide rail;

[0014] The top elastic body is an elastic rubber strip or a tension spring, which is arranged longitudinally, with the top fixed to the inner top of the base barrel and the bottom fixed to the top of the abutting extrusion tube;

[0015] The built-in guide rail is a straight guide rail arranged longitudinally and positioned on the inner wall of the base barrel;

[0016] The sliding pin is slidably positioned on the built-in guide rail and slides under the coordinated control of the power assembly and the control unit;

[0017] The side wall of the abutting extrusion tube is provided with a side hole matching the sliding pin;

[0018] The sliding pin is an electric pin that is inserted into the side hole when extended;

[0019] When the resisting extrusion tube needs to be controlled to move downward, the sliding pin is first controlled to slide and extend and inserted into the side hole of the resisting extrusion tube to be driven, and then the sliding of the sliding pin is used to drive the resisting extrusion tube to move.

[0020] Preferably, it further includes a reinforcement mechanism;

[0021] The reinforcement assembly includes three reinforcement frames; the three reinforcement frames have the same structure and are evenly distributed around the circumference of the base barrel. The three reinforcement frames work together to ensure the stability of the wafer being sucked up;

[0022] The reinforcement frame includes a sliding support carrier, a bottom sliding rod and an end positioning body;

[0023] The sliding support carrier is a U-shaped hard frame, which is positioned on the outer wall of the basic barrel along the axial sliding direction of the basic barrel, and slides up and down under the coordinated control of the power component and the control unit; the bottom sliding rod is a horizontally arranged hard straight rod, and its own length direction is the same as the radial direction of the basic barrel. Under the coordinated control of the power component and the control unit, it is positioned at the bottom of the sliding support carrier along the radial direction of the basic barrel; the end positioning body is positioned at the end of the bottom sliding rod close to the basic barrel, and is used to squeeze or support the adsorbed wafers.

[0024] Furthermore, the end positioning body includes a V-shaped frame, a winding wheel and a contact belt; the V-shaped frame is a V-shaped hard frame, which is arranged horizontally, fixed to the end of the bottom sliding rod and the opening is facing the axis of the basic barrel; there are two winding wheels, both of which have built-in micro motors, which are used to wind up and release the contact belt respectively, and are positioned at the two ends of the V-shaped frame close to the axis of the basic barrel respectively; the contact belt is an elastic silicone material belt body, and the two ends are respectively wrapped and positioned on the two winding wheels, and are always in a straight state; the winding wheel rotates under the control of the control unit and automatically completes the replacement of the contact belt that contacts the wafer; after the wafer is adsorbed, the reinforcement component runs, adjusts its own spatial position, and then uses the contact belt to clamp the wafer.

[0025] Furthermore, the contact pad assembly further includes a built-in telescopic body and a vertical elastic body;

[0026] The first carrier ring and the second carrier ring are respectively tightly attached to and positioned on the inner wall of the built-in base tube and the inner wall of the base barrel by the sliding rod, and slide along the axial direction of the base barrel;

[0027] The built-in telescopic body is a telescopic rod controlled by a control unit to extend and retract, located inside the built-in base tube, arranged longitudinally, with the top directly or indirectly fixed to the inner wall of the built-in base tube and the bottom fixed to the first carrier ring;

[0028] The vertical elastic body is an elastic rope or a tension spring, which is arranged longitudinally, with one end positioned on the inner top of the base barrel and the other end fixed on the top of the second carrier ring;

[0029] An annular groove is provided on the outer wall of the second carrier ring, and an annular bag is provided on the annular groove; the annular bag is an annular bag body made of elastic rubber material, which is connected to the air pump and expands and contracts under the control of the control unit to timely close the gap between the second carrier ring and the base barrel; the air pump is positioned on the base barrel.

[0030] Preferably, the end positioning body includes a V-shaped frame, a reel and a contact belt;

[0031] The V-shaped frame is a V-shaped hard frame, which is arranged horizontally, fixed to the end of the bottom sliding rod and has an opening facing the axis of the base barrel;

[0032] The number of the winding wheels is two, which are respectively used for winding and releasing the abutting belt, and are respectively positioned at two ends of the V-shaped frame close to the axis of the base barrel;

[0033] The upper winding wheel is internally provided with a rotation limiting component controlled by the control unit;

[0034] The rotation limiting component is an electric pin; the lower winding wheel is internally provided with a torsion spring;

[0035] The abutting belt is an elastic silicone material belt body, and both ends are respectively wound and positioned on the two winding wheels. The existence of the torsion spring makes the lower winding wheel always have a tendency to wind the abutting belt, so that the abutting belt is always in a straightened state.

[0036] Preferably, a cleaning component is further included;

[0037] The cleaning component includes a support arm, a rotating carrier rod, an end plate and a cleaning part;

[0038] The support arm is an L-shaped rod body, which plays a role of bearing and supporting. Its horizontal bar is at the top and the vertical bar is at the bottom. Both the horizontal bar and the vertical bar are telescopic rods controlled by the control unit to expand and contract;

[0039] The rotating carrier rod is a rigid straight rod, one end of which is hinged to the bottom end of the support arm and rotates relative to the support arm under the coordinated control of the power component and the control unit. The axial direction of the rotating shaft is perpendicular to the axial direction of the base barrel; after the rotating carrier rod rotates, the end far away from the support arm will rotate to the bottom of the base barrel;

[0040] The end plate is fixed to the end of the rotating carrier rod far away from the support arm;

[0041] The cleaning part is positioned on the surface of the end plate far away from the rotating carrier rod, and cleans the contact hose by means of brushing, flushing and / or sticking removal;

[0042] The base barrel is rotatably connected to the bottom of the top connecting body around its own axis, and the axis of the rotating shaft coincides with its own axis, and rotates under the coordinated control of the power component and the control unit.

[0043] Preferably, the cleaning part includes a top soft wheel, a first runner, a second runner and a cleaning belt;

[0044] The top soft wheel, the first runner and the second runner are all cylindrical wheel bodies, and the ends are all positioned on the surface of the end plate far away from the rotating carrier rod, and the axial directions are all the same as the length direction of the rotating carrier rod; the top soft wheel is a cylindrical wheel made of rubber material, and the top soft wheel is located above the first runner and the second runner when the rotating carrier rod is horizontally placed at the bottom of the base barrel; both the first runner and the second runner are cylindrical wheel bodies with built-in micro motors;

[0045] The cleaning belt is a belt body with a self-adhesive sticker on one side, with both ends wound around the first rotating wheel and the second rotating wheel respectively, and is always in a straight state and against the top soft wheel;

[0046] When the rotating carrying rod is placed horizontally at the bottom of the base barrel, the end plate thereon is arranged vertically; when the rotating carrying rod is placed horizontally at the bottom of the base barrel, the adhesive surface of the cleaning belt wound on the first and second rotating wheels faces upward and the whole is in an inverted U shape.

[0047] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0048] By optimizing and improving the structure of the wafer adsorption device in the prior art, a contact pad assembly whose main body is a silicone hose is added to the wafer adsorption device in the prior art, and the contact pad assembly is used to cover the adsorption tube that is in direct contact with the wafer, so as to avoid the occurrence of air leakage by blocking the air flow channel; the technical problems of high manufacturing and maintenance costs and poor reliability of the supporting adsorption device in the wafer processing process in the prior art are effectively solved; and the technical effect of strong applicability of the device supporting carrier suitable for semiconductor processing to wafers of different specifications, relatively low manufacturing and maintenance costs and relatively high reliability is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 This is a simplified diagram of the internal structure of a device carrier suitable for semiconductor processing in this application;

[0050] Figure 2 This is a schematic diagram of the appearance structure of a device carrier suitable for semiconductor processing in this application;

[0051] Figure 3 This is a schematic diagram of the appearance structure of the basic rotating cylinder;

[0052] Figure 4 This is a schematic diagram of the appearance and structure of the contact pad replacement component;

[0053] Figure 5 A simplified structural diagram of the contact pad replacement assembly;

[0054] Figure 6 A schematic diagram showing the positional relationship between the extrusion tube and the built-in base tube;

[0055] Figure 7 Schematic diagram of the positional relationship between the bottom sliding rod and the end wheel;

[0056] Figure 8 Schematic diagram of the positional relationship between the V-shaped frame and the bottom sliding rod;

[0057] Figure 9 Schematic diagram of the positional relationship between the end positioning body and the wafer;

[0058] Figure 10 It is a structural schematic diagram of the end positioning body including the winding wheel;

[0059] Figure 11 It is a schematic diagram of the structure of the cleaning component; Figure 12 This is a simplified structural diagram of the cleaning component.

[0060] In the picture:

[0061] Top connector 100, vacuum assembly 101, sliding support carrier 210, bottom sliding rod 220, end wheel 221, V-shaped frame 222, contact belt 223, reeling wheel 224, base barrel 300, built-in base tube 400, bottom ring 401, contact extrusion tube 500, side hole 501, top elastic body 510, sliding pin 520, built-in guide rail 530, built-in telescopic body 610, first carrier ring 620, second carrier ring 630, annular bag 631, air pump 632, contact hose 640, vertical elastic body 650, support arm 710, rotating carrier rod 720, end plate 730, top soft wheel 740, first rotating wheel 750, second rotating wheel 760, cleaning belt 770. DETAILED DESCRIPTION

[0062] To facilitate understanding of the present invention, the present application will be described more comprehensively below with reference to the relevant drawings; the drawings show preferred embodiments of the present invention, but the present invention can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, the purpose of providing these embodiments is to enable a more thorough and comprehensive understanding of the disclosed content of the present invention.

[0063] It should be noted that the terms “vertical”, “horizontal”, “up”, “down”, “left”, “right” and similar expressions used in this document are for illustrative purposes only and do not represent the only implementation method.

[0064] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains; the terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0065] Example 1

[0066] like Figures 1 to 6 As shown, the device carrier suitable for semiconductor processing of the present application includes a top connector 100, a base barrel 300, a reinforcement mechanism, an internal base tube 400, an abutting extrusion tube 500, a tube shifting drive assembly, a contact pad assembly, a power assembly and a control unit.

[0067] The top connector 100 is a hard plate or a hard block, the top of which is fixed to the end of the multi-degree-of-freedom robotic arm, playing the role of load-bearing connection; the multi-degree-of-freedom robotic arm is used to carry and move the carrier of the device of this application and thereby assist it in completing the actions of sucking, moving and placing the wafer.

[0068] The base barrel 300 is a hard round barrel with an opening facing downward, and the top thereof is positioned at the bottom of the top connector 100 to play a bearing and supporting role.

[0069] The base barrel 300 is fixed with an air extraction assembly 101. The main structure of the air extraction assembly 101 is a pump, which is connected to the space inside the built-in base tube 400 through a pipeline, and creates a negative pressure space in the built-in base tube 400 by extracting air.

[0070] The reinforcement mechanism is positioned on the outer wall of the base barrel 300, and the main body is a clamp structure, which is used to clamp and / or support the sucked wafer to prevent the wafer from falling and causing damage.

[0071] The built-in base tube 400 is a hard circular tube, arranged longitudinally, with its top fixed to the inner top of the base barrel 300 and coaxial with the base barrel 300; the length of the built-in base tube 400 is 1.1 to 1.4 times the length of the base barrel 300, and its diameter is 0.3 to 0.5 times the diameter of the base barrel 300;

[0072] The said interference extrusion tube 500 is a longitudinally arranged hard circular tube, which is sleeved on the built-in base tube 400 and slides along the axial direction of the built-in base tube 400 under the drive of the tube displacement drive assembly. The length is 0.4 to 0.6 times the length of the built-in base tube 400. The number of said interference extrusion tubes 500 is 1 to 3, which are sleeved together. The bottom opening diameter of the outer interference extrusion tube 500 is larger than the bottom opening diameter of the interference extrusion tube 500 it sleeves.

[0073] Further, such as Figure 5 and Figure 6 As shown, the interference extrusion tube 500 consists of a base section, a connecting section and a bottom section; the base section, the connecting section and the bottom section are spliced and fixed together, with the base section located at the top and the bottom section located at the bottom; the base section and the bottom section are both in the shape of a circular tube; the connecting section serves as a connection, and is an annular sheet, with the inner ring and the outer ring fixed to the bottom of the base section and the top of the bottom section respectively; the inner wall of the base section is in close contact with the outer wall of the built-in base tube 400 or the outer wall of the other interference extrusion tube 500 located inside it.

[0074] The contact pad assembly includes a first carrier ring 620, a second carrier ring 630, and a contact hose 640; both the first carrier ring 620 and the second carrier ring 630 are rigid ring bodies, both are horizontally arranged, and are respectively closely attached to and positioned on the inner wall of the built-in base tube 400 and the inner wall of the base barrel 300 for carrying the contact hose 640; the contact hose 640 is a silicone material elastic hose, and both ends are respectively closely attached to and fixed on the first carrier ring 620 and the second carrier ring 630, and is always in a straightened state.

[0075] Further, the first carrier ring 620 and the second carrier ring 630 are respectively closely attached to and fixed on the inner wall of the built-in base tube 400 and the inner wall of the base barrel 300.

[0076] Preferably, in order to reduce the wear of the contact hose 640 and ensure the smooth running of the carrier, the bottom edges of the contact extrusion tubes 500 of the built-in base tube 400 are all rounded.

[0077] Further, smooth-bottom rings 401 are fixed at the bottoms of the contact extrusion tubes 500 of the built-in base tube 400; the smooth-bottom rings 401 are annular and are made of metal, plastic, or rubber.

[0078] The power assembly is used to provide power for the operation of each component of the device carrier applicable to semiconductor processing in this application, such as a motor, a telescopic rod, etc.; the control unit plays a role in controlling the coordinated operation of each component of the device carrier applicable to semiconductor processing in this application, and they are all prior arts and will not be elaborated here.

[0079] Preferably, the control unit is a combination of a programmable logic controller and control buttons.

[0080] When it is necessary to adsorb a wafer, the tube displacement drive assembly is controlled according to the wafer specifications to drive the contact extrusion tube 500 to move up or down, so that the bottom of the built-in base tube 400 is lower than all the contact extrusion tubes 500 or the bottom of a certain contact extrusion tube 500 is lower than the built-in base tube 400 and other contact extrusion tubes 500; then the device carrier of this application is controlled to move to the top of the wafer and close to the wafer and then adsorb and position the wafer; finally, the entire carrier is driven by a multi-degree-of-freedom robotic arm to move, thereby realizing the transfer of the wafer.

[0081] Preferably, the tube displacement drive assembly is a telescopic rod structure, which is a combination of multiple telescopic rods, is longitudinally arranged, the top is positioned on the inner top of the base barrel 300, and the bottom is positioned on the contact extrusion tube 500, and is a telescopic cylinder, a telescopic oil cylinder, or an electric telescopic rod, and drives the contact extrusion tube 500 to lift independently under the control of the control unit.

[0082] Preferably, as Figures 4 to 6As shown, the tube displacement drive assembly includes a top elastic body 510, a sliding pin 520 and a built-in guide rail 530; the top elastic body 510 is an elastic rubber strip or a tension spring, which is arranged longitudinally, with the top fixed to the inner top of the base barrel 300 and the bottom fixed to the top of the abutting extrusion tube 500; the built-in guide rail 530 is a longitudinally arranged straight guide rail, which is positioned on the inner wall of the base barrel 300 and is used to guide the movement of the sliding pin 520; the sliding pin 520 is slidably positioned on the built-in guide rail 530 And it slides under the coordinated control of the power component and the control unit; a side hole 501 matching the sliding pin 520 is provided on the side wall of the resistance extrusion tube 500; the sliding pin 520 is an electric pin, which is inserted into the side hole 501 when extended; when it is necessary to control the resistance extrusion tube 500 to move downward, first control the sliding pin 520 to slide and extend and insert it into the side hole 501 of the resistance extrusion tube 500 to be driven, and then use the sliding of the sliding pin 520 to drive the resistance extrusion tube 500 to move.

[0083] Further, such as Figure 1 and Figure 2 As shown, the reinforcement assembly includes three reinforcement frames; the three reinforcement frames have the same structure and are evenly distributed around the base barrel 300. The three frames work together to ensure the stability of the sucked-up wafers; the reinforcement frame includes a sliding support carrier 210, a bottom sliding rod 220 and an end positioning body; the sliding support carrier 210 is a U-shaped hard frame, which is positioned on the outer wall of the base barrel 300 along the axial sliding direction of the base barrel 300 and slides up and down under the coordinated control of the power assembly and the control unit; the bottom sliding rod 220 is a horizontally arranged hard straight rod, and its own length direction is the same as the radial direction of the base barrel 300. Under the coordinated control of the power assembly and the control unit, it is positioned at the bottom of the sliding support carrier 210 along the radial direction of the base barrel 300; the end positioning body is positioned at the end of the bottom sliding rod 220 close to the base barrel 300, and is used to squeeze or support the adsorbed wafers.

[0084] Preferably, Figure 7 As shown, the end positioning body is an end wheel 221; the end wheel 221 is a rubber wheel body, which is arranged horizontally, with the axial direction being the same as the radial direction of the base barrel 300, and is positioned at the top or end of the bottom sliding rod 220, with its own top being higher than the top of the bottom sliding rod 220; after the wafer is adsorbed, the reinforcement assembly runs, and after adjusting its own spatial position, the bottom sliding rod 220 is inserted into the bottom of the wafer.

[0085] Preferably, the end positioning body includes a V-shaped frame 222 and a resistance band 223; the V-shaped frame 222 is a V-shaped hard frame, which is arranged horizontally, fixed at the end of the bottom sliding rod 220 and the opening is facing the axis of the basic barrel 300; the resistance band 223 is an elastic silicone material belt body, which is arranged longitudinally, and the two ends are respectively positioned at the two ends of the V-shaped frame 222 close to the axis of the basic barrel 300, and are always in a straight state; after the wafer is adsorbed, the reinforcement component is operated, and after adjusting its own spatial position, the resistance band 223 is used to clamp the wafer stably.

[0086] Preferably, Figure 8 and Figure 9 As shown, in order to ensure the stability of the contact belt 223 clamping the wafer and reduce the replacement frequency of the contact belt 223; the end positioning body includes a V-shaped frame 222, a winding wheel 224 and a contact belt 223; the V-shaped frame 222 is a V-shaped hard frame, which is arranged horizontally, fixed to the end of the bottom sliding rod 220 and the opening is facing the axis of the base barrel 300; the number of the winding wheels 224 is two, both of which have built-in micro motors, which are used to wind up and release the contact belt 223 respectively, and are respectively positioned at the two ends of the V-shaped frame 222 close to the axis of the base barrel 300; the contact belt 223 is an elastic silicone material belt body, and its two ends are respectively wrapped and positioned on the two winding wheels 224, and are always in a straight state; the winding wheel 224 rotates under the control of the control unit and automatically completes the replacement of the contact belt 223 that contacts the wafer; after the wafer is adsorbed, the reinforcement component runs, adjusts its own spatial position, and then uses the contact belt 223 to clamp the wafer.

[0087] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages:

[0088] The invention solves the technical problems of high manufacturing and maintenance costs and poor reliability of the supporting adsorption device in the wafer processing process in the prior art; and achieves the technical effect that the device supporting carrier suitable for semiconductor processing has strong applicability to wafers of different specifications, relatively low manufacturing and maintenance costs and relatively high reliability.

[0089] Example 2

[0090] Considering that the contact hose 640 may be locally damaged due to dirt and wear after long-term use, which will affect the adsorption stability (the first elastic adsorption tube, the second elastic adsorption tube, and the third second elastic adsorption tube of a wafer adsorption device and a wafer processing machine disclosed in the authorized publication number CN117832150B will also encounter the same problem), relatively frequent regular maintenance and replacement are required. To address the above problems, the present application optimizes and improves the structure of the contact pad assembly on the basis of the above embodiments. By timely moving the contact hose 640, the contact surface between the contact hose 640 and the wafer is changed, thereby extending the service life of the contact hose 640 and effectively reducing the maintenance frequency. Specifically:

[0091] As Figures 4 to 6 shown, the contact pad assembly includes a first carrier ring 620, a second carrier ring 630, and a contact hose 640, and further includes a built-in telescopic body 610 and a vertically disposed elastic body 650;

[0092] Both the first carrier ring 620 and the second carrier ring 630 are rigid ring bodies, both are horizontally disposed, and are respectively closely attached to and slidably positioned on the inner wall of the built-in base tube 400 and the inner wall of the base barrel 300, and slide along the axis of the base barrel 300; the contact hose 640 is a silicone material elastic hose, and both ends are respectively closely attached to and fixed on the first carrier ring 620 and the second carrier ring 630, and are always in a straight state;

[0093] The built-in telescopic body 610 is a telescopic rod controlled by a control unit to expand and contract, is located inside the built-in base tube 400, is a cylinder, an oil cylinder or an electric telescopic rod, is vertically disposed, the top is directly or indirectly fixed on the inner wall of the built-in base tube 400, and the bottom is fixed on the first carrier ring 620;

[0094] The vertically disposed elastic body 650 is an elastic cord or a tension spring, is vertically disposed, one end is positioned at the inner top of the base barrel 300, and the other end is fixed on the top of the second carrier ring 630;

[0095] An annular groove is provided on the outer side wall of the second carrier ring 630, and an annular bladder 631 is sleeved on the annular groove; the annular bladder 631 is an elastic rubber material annular bladder body, is communicated with an air pump 632, and expands and contracts under the control of the control unit to timely seal the gap between the second carrier ring 630 and the base barrel 300; the air pump 632 is positioned on the base barrel 300 and is controlled by the control unit to operate;

[0096] After the device carrier of the present application is used for a period of time, the built-in telescopic body 610 is controlled to extend or contract, changing the spatial position of the contact hose 640, thereby changing the position where it contacts the bottom of the built-in base tube 400 and the bottom of the contact extrusion tube 500.

[0097] Preferably, in order to reduce cost and weight, as Figure 10 As shown, the end positioning body includes a V-shaped frame 222, a winding wheel 224 and a contact belt 223; the winding wheel 224 does not need a built-in motor; the V-shaped frame 222 is a V-shaped hard frame, which is arranged horizontally, fixed to the end of the bottom sliding rod 220 and opened toward the axis of the base barrel 300; the number of the winding wheels 224 is two, which are used to wind up and release the contact belt 223, respectively, and are positioned at the two ends of the V-shaped frame 222 close to the axis of the base barrel 300; the upper winding wheel 224 has a built-in rotation limiting component controlled by the control unit; the rotation limiting component is an electric pin; the lower winding wheel 224 has a built-in torsion spring; the contact belt 223 is an elastic silicone material belt body, and the two ends are respectively wrapped Positioned on the two reeling wheels 224, the presence of the torsion spring makes the lower reeling wheel 224 always have the tendency to reel in the resistance belt 223, so that the resistance belt 223 is always in a straight state; when the resistance belt 223 that contacts the wafer needs to be replaced, the reinforcement mechanism is first controlled to operate so that the upper reeling wheel 224 contacts the contact hose 640; then the rotation limiting component is controlled to cancel the restriction on the rotation of the upper reeling wheel 224; thereafter, the built-in telescopic body 610 is controlled to extend and retract, driving the contact hose 640 to move and then driving the upper reeling wheel 224 to rotate to complete the replacement of the resistance belt 223 that contacts the wafer; finally, the rotation limiting component is controlled to operate to re-limit the rotation of the upper reeling wheel 224.

[0098] Example 3

[0099] In order to further extend the service life of the contact hose 640, reduce its maintenance frequency, and maintain the adsorption effect of the device carrier on the wafer (adsorption stability, etc.) for a long time, the embodiment of the present application is additionally provided with a cleaning component on the basis of the above embodiment; the cleaning component is used to frequently clean the contact hose 640; specifically:

[0100] like Figure 2 and Figure 12 As shown, the cleaning assembly includes a support arm 710, a rotating carrier rod 720, an end plate 730 and a cleaning component;

[0101] The support arm 710 is an L-shaped rod that plays a role of load bearing and support. Its horizontal rod is located at the top and the vertical rod is located at the bottom. Both the horizontal rod and the vertical rod are telescopic rods controlled by the control unit to extend and retract. The length direction of the vertical rod is the same as the axial direction of the base barrel 300. The end of the horizontal rod of the support arm 710 away from the vertical rod is fixed to the side wall of the top connector 100.

[0102] The rotating carrier rod 720 is a rigid straight rod, one end of which is hinged to the bottom end of the support arm 710 and rotates relative to the support arm 710 under the coordinated control of the power assembly and the control unit. The axial direction of the rotation axis is perpendicular to the axial direction of the base barrel 300; after the rotating carrier rod 720 rotates, the end far from the support arm 710 will rotate to the bottom of the base barrel 300;

[0103] The end plate 730 is fixed to the end of the rotating carrier rod 720 far from the support arm 710 and is a rigid plate body, which plays a role in bearing and supporting;

[0104] The cleaning component is positioned on the surface of the end plate 730 far from the rotating carrier rod 720 and includes a fine brush, a gas spray head and / or a water spray head; the gas spray head and the water spray head are respectively communicated with an air pump and a water pump;

[0105] The base barrel 300 is rotatably connected to the bottom of the top connecting body 100 around its own axis, and the axis of the rotation axis coincides with its own axis, and rotates under the coordinated control of the power assembly and the control unit;

[0106] When cleaning is required, first control the end plate 730 to approach and contact the hose 640, and then control the telescopic movement of the built-in telescopic body 610 while controlling the rotation of the base barrel 300, and use the fine brush, the gas spray head and / or the water spray head to clean the contact hose 640.

[0107] Embodiment 4

[0108] In order to further extend the service life of the contact hose 640, reduce its maintenance frequency, and maintain the adsorption effect (such as adsorption stability) of the device carrier of the present application on the wafer for a long time, the cleaning component is added in the embodiment of the present application on the basis of the above embodiment; the contact hose 640 is frequently cleaned by using the cleaning component; specifically:

[0109] As Figure 11 shown, the cleaning component includes a support arm 710, a rotating carrier rod 720, an end plate 730 and a cleaning component; the cleaning component includes a top soft wheel 740, a first rotating wheel 750, a second rotating wheel 760 and a cleaning belt 770;

[0110] The support arm 710 is an L-shaped rod body, which plays a role in bearing and supporting. Its cross bar is at the top and the vertical bar is at the bottom. Both the cross bar and the vertical bar are telescopic rods controlled by the control unit to expand and contract; the length direction of the vertical bar is the same as the axial direction of the base barrel 300; the end of the cross bar of the support arm 710 far from the vertical bar is fixed on the side wall of the top connecting body 100;

[0111] The rotating carrier rod 720 is a rigid straight rod, one end of which is hinged to the bottom end of the support arm 710. It rotates relative to the support arm 710 under the coordinated control of the power assembly and the control unit. The axial direction of the rotating shaft is perpendicular to the axial direction of the base barrel 300. After the rotating carrier rod 720 rotates, the end thereof away from the support arm 710 rotates to the bottom of the base barrel 300.

[0112] The end plate 730 is fixed to the end of the rotating carrying rod 720 away from the support arm 710 and is a hard plate body, which plays the role of bearing support;

[0113] The base barrel 300 is connected to the bottom of the top connector 100 by rotating around its own axis, with the axis of the rotating shaft coinciding with its own axis, and rotates under the coordinated control of the power assembly and the control unit;

[0114] When the rotating carrier rod 720 is placed horizontally on the bottom of the base barrel 300, the end plate 730 thereon is arranged vertically;

[0115] The top soft wheel 740, the first rotating wheel 750, and the second rotating wheel 760 are all cylindrical wheels, with their ends positioned on the surface of the end plate 730 away from the rotating carrier rod 720, and their axial directions are in the same direction as the length of the rotating carrier rod 720; the top soft wheel 740 is a cylindrical wheel made of rubber material. When the rotating carrier rod 720 is placed horizontally at the bottom of the base barrel 300, the top soft wheel 740 is located above the first rotating wheel 750 and the second rotating wheel 760; the top soft wheel 740 plays a role in guiding the moving direction of the cleaning belt 770; the first rotating wheel 750 and the second rotating wheel 760 are both cylindrical wheels with built-in micro motors, and are controlled by the control unit to rotate;

[0116] The cleaning belt 770 is a belt body with a self-adhesive sticker on one side, with both ends respectively wound around the first rotating wheel 750 and the second rotating wheel 760, and is always in a straight state and against the top soft wheel 740;

[0117] When the rotating carrier rod 720 is placed horizontally at the bottom of the base barrel 300, the cleaning belt 770 wound around the first rotating wheel 750 and the second rotating wheel 760 has its adhesive surface facing upward and forms an inverted U shape as a whole;

[0118] When cleaning is required, first control the top soft wheel 740 to contact the downward protruding part of the contact hose 640 through the cleaning belt 770, and then control the base barrel 300 to rotate, and at the same time control the first rotating wheel 750 and the second rotating wheel 760 to rotate synchronously to remove and clean the debris on the contact hose 640 (after one round of cleaning, the built-in telescopic body 610 can be controlled to extend and retract to clean other parts of the contact hose 640).

[0119] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, various modifications and variations can be made to the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A device carrier applicable to semiconductor processing, characterized in that: It comprises a top connector (100) which is a hard plate or block, a base barrel (300), a built-in base pipe (400), a resisting extrusion pipe (500), a pipe displacement drive assembly, and a contact pad assembly; The base barrel (300) is a hard round barrel with an opening facing downward, the top of which is positioned at the bottom of the top connector (100), and a suction assembly (101) communicating with the space inside the built-in base pipe (400) is positioned on the base barrel; The built-in base tube (400) is a hard round tube, the top of which is fixed to the inner top of the base barrel (300) and is coaxial with the base barrel (300); the interference extrusion tube (500) is a hard round tube, which is sleeved on the built-in base tube (400) and slides along the axial direction of the built-in base tube (400) under the drive of the tube displacement drive component. There are 1 to 3 of the built-in base tubes, which are sleeved together. The bottom opening diameter of the outer interference extrusion tube (500) is larger. The contact pad assembly comprises a first carrier ring (620) positioned on the inner wall of the built-in base tube (400), a second carrier ring (630) positioned on the inner wall of the base barrel (300), and a contact hose (640); the contact hose (640) is an elastic hose made of silicone material, with both ends respectively tightly attached to and fixed on the first carrier ring (620) and the second carrier ring (630), and is always in a straight state.

2. The device carrier applicable to semiconductor processing as described in claim 1, characterized in that: The length of the built-in basic pipe (400) is 1.1 to 1.4 times the length of the basic barrel (300), and the diameter is 0.3 to 0.5 times the diameter of the basic barrel (300).

3. The device carrier applicable to semiconductor processing according to claim 1, characterized in that: The tube displacement drive assembly includes a top elastic body (510), a sliding pin (520) and a built-in guide rail (530); The top elastic body (510) is an elastic rubber strip or a tension spring, which is arranged longitudinally, with the top fixed to the inner top of the base barrel (300) and the bottom fixed to the top of the abutting extrusion tube (500); The built-in guide rail (530) is a straight guide rail arranged longitudinally and positioned on the inner wall of the base barrel (300); The sliding pin (520) is slidably positioned on the built-in guide rail (530) and slides under the coordinated control of the power assembly and the control unit; A side hole (501) matching the sliding pin (520) is provided on the side wall of the abutting extrusion tube (500); The sliding pin (520) is an electric pin that is inserted into the side hole (501) when extended; When the contact extrusion tube (500) needs to be controlled to move downward, the sliding pin (520) is first controlled to slide and extend to be inserted into the side hole (501) of the contact extrusion tube (500) to be driven, and then the sliding of the sliding pin (520) is used to drive the contact extrusion tube (500) to move.

4. The device carrier applicable to semiconductor processing according to claim 1, wherein: It also includes a reinforcement mechanism; The reinforcement assembly includes three reinforcement frames; the three reinforcement frames have the same structure and are evenly distributed around the circumference of the base barrel (300); the three reinforcement frames work together to ensure the stability of the sucked wafer; The reinforcement frame comprises a sliding support carrier (210), a bottom sliding rod (220) and an end positioning body; The sliding support carrier (210) is a U-shaped hard frame, which is positioned on the outer wall of the basic barrel (300) by sliding along the axial direction of the basic barrel (300), and slides up and down under the coordinated control of the power component and the control unit; the bottom sliding rod (220) is a horizontally arranged hard straight rod, and its own length direction is the same as the radial direction of the basic barrel (300), and is positioned at the bottom of the sliding support carrier (210) by sliding along the radial direction of the basic barrel (300) under the coordinated control of the power component and the control unit; the end positioning body is positioned at the end of the bottom sliding rod (220) close to the basic barrel (300), and is used to squeeze or support the adsorbed wafers.

5. The device carrier applicable to semiconductor processing according to claim 4, characterized in that: The end positioning body comprises a V-shaped frame (222), a winding wheel (224) and a contact belt (223); the V-shaped frame (222) is a V-shaped hard frame, arranged horizontally, fixed to the end of the bottom sliding rod (220) and with its opening facing the axis of the base barrel (300); there are two winding wheels (224), both of which are equipped with a micro motor, respectively used for winding and releasing the contact belt (223), and respectively positioned at the two ends of the V-shaped frame (222) close to the axis of the base barrel (300); the contact belt (223) is a belt body made of elastic silicone material, with both ends respectively wound and positioned on the two winding wheels (224), and is always in a straight state; the winding wheel (224) rotates under the control of the control unit to automatically complete the replacement of the contact belt (223) that contacts the wafer; after the wafer is adsorbed, the reinforcement component operates, adjusts its own spatial position, and then clamps the wafer using the contact belt (223).

6. The device carrier applicable to semiconductor processing according to claim 4, wherein: The contact pad assembly further includes a built-in telescopic body (610) and a vertical elastic body (650); The first carrier ring (620) and the second carrier ring (630) are respectively tightly attached to and positioned on the inner wall of the built-in base tube (400) and the inner wall of the base barrel (300) by means of a sliding rod, and slide along the axial direction of the base barrel (300); The built-in telescopic body (610) is a telescopic rod that is controlled by a control unit to be telescopic, is located inside the built-in base tube (400), is arranged longitudinally, and has its top directly or indirectly fixed to the inner wall of the built-in base tube (400), and its bottom fixed to the first carrier ring (620); the vertical elastic body (650) is an elastic rope or a tension spring, is arranged longitudinally, has one end positioned on the inner top of the base barrel (300), and the other end fixed to the top of the second carrier ring (630); The outer wall of the second carrier ring (630) is provided with an annular groove, and an annular bag (631) is sleeved on the annular groove; the annular bag (631) is an annular bag body made of elastic rubber material, which is connected to the air pump (632) and expands and contracts under the control of the control unit to timely close the gap between the second carrier ring (630) and the base barrel (300); the air pump (632) is positioned on the base barrel (300).

7. The device carrier applicable to semiconductor processing according to claim 6, characterized in that: The end positioning body comprises a V-shaped frame (222), a winding wheel (224) and a contact belt (223); The V-shaped frame (222) is a V-shaped hard frame, which is arranged horizontally, fixed to the end of the bottom sliding rod (220) and has an opening facing the axis of the base barrel (300); There are two reeling wheels (224), which are used to reel in and release the interference belt (223), and are respectively positioned at two ends of the V-shaped frame (222) close to the axis of the base barrel (300); The upper reel (224) has a built-in rotation limiting assembly controlled by a control unit; The rotation limiting component is an electric pin; the lower reel (224) has a built-in torsion spring; The resistance belt (223) is a belt body made of elastic silicone material, and its two ends are respectively wound and positioned on two reeling wheels (224). The presence of the torsion spring makes the lower reeling wheel (224) always have the tendency to reel in the resistance belt (223), thereby making the resistance belt (223) always in a straight state.

8. The device carrier applicable to semiconductor processing according to claim 6 or 7, characterized in that: Also includes cleaning components; The cleaning assembly comprises a support arm (710), a rotating carrier rod (720), an end plate (730) and a cleaning component; The support arm (710) is an L-shaped rod body, which plays a role of bearing support, with a horizontal rod at the top and a vertical rod at the bottom, and both the horizontal rod and the vertical rod are telescopic rods controlled by a control unit to extend and retract; The rotating carrying rod (720) is a hard straight rod, one end of which is hinged to the bottom end of the support arm (710). Under the coordinated control of the power assembly and the control unit, the rotating carrying rod (720) rotates relative to the support arm (710), and the axial direction of the rotating shaft is perpendicular to the axial direction of the base barrel (300). After the rotating carrying rod (720) rotates, the end thereof away from the support arm (710) rotates to the bottom of the base barrel (300). The end plate (730) is fixed to the end of the rotating carrier rod (720) away from the support arm (710); The cleaning component is positioned on the surface of the end plate (730) away from the rotating carrier rod (720) and cleans the contact hose (640) by brushing, flushing and / or sticking; The base barrel (300) is connected to the bottom of the top connector (100) by rotating around its own axis, with the axis of the rotating shaft coinciding with its own axis, and rotates under the coordinated control of the power assembly and the control unit.

9. The device carrier applicable to semiconductor processing according to claim 8, characterized in that: The cleaning component comprises a top soft wheel (740), a first rotating wheel (750), a second rotating wheel (760) and a cleaning belt (770); The top soft wheel (740), the first rotating wheel (750) and the second rotating wheel (760) are all cylindrical wheel bodies, and their ends are all positioned on the surface of the end plate (730) away from the rotating carrier rod (720), and their axial directions are in the same direction as the length of the rotating carrier rod (720); the top soft wheel (740) is a cylindrical wheel made of rubber, and when the rotating carrier rod (720) is placed horizontally on the bottom of the base barrel (300), the top soft wheel (740) is located above the first rotating wheel (750) and the second rotating wheel (760); the first rotating wheel (750) and the second rotating wheel (760) are both cylindrical wheel bodies with built-in micro motors; The cleaning belt (770) is a belt body with adhesive on one side. Its two ends are respectively wound and positioned on the first runner (750) and the second runner (760), always in a straightened state and in contact with the top soft wheel (740). When the rotating carrier rod (720) is horizontally placed at the bottom of the base barrel (300), the end plate (730) on it is vertically arranged; when the rotating carrier rod (720) is horizontally placed at the bottom of the base barrel (300), the adhesive side of the cleaning belt (770) wound around the first runner (750) and the second runner (760) faces upward and is in an inverted U shape as a whole.

10. A method for using a device carrier suitable for semiconductor processing, characterized in that: A device carrying carrier suitable for semiconductor processing as claimed in claim 7; the steps are as follows: when it is necessary to adsorb a wafer, control the tube displacement drive assembly according to the wafer specification to drive the contact extrusion tube (500) to move up or down, so that the bottom of the built-in base tube (400) is lower than all the contact extrusion tubes (500) or the bottom of a certain contact extrusion tube (500) is lower than the built-in base tube (400) and other contact extrusion tubes (500); then control the device carrying carrier of the present application to move to the top of the wafer and close to the wafer and then adsorb and position the wafer. After using for a period of time, control the built-in telescopic body (610) to extend or contract, change the spatial position of the contact hose (640) and then change the position where it contacts the bottom of the built-in base tube (400) and the bottom of the contact extrusion tube (500).

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