Double-layer cooling power distribution cabinet

Abstract

The utility model discloses a double -deck cooling power distribution cabinet belongs to power distribution cabinet technical field, and this device includes first box body and second box body. Among them is equipped with first cavity in first box body, and has first air intake pipe and first exhaust pipe. Second box body is fixed in first box body, and second box body is equipped with second cavity, and has second air intake pipe and second exhaust pipe. First air intake pipe, first cavity and first exhaust pipe combination forms first air duct, and second air intake pipe, second cavity, second exhaust pipe and first exhaust pipe combination forms second air duct. The heat that second box body inside electronic component runs and emits can be directly discharged to second air duct, and first air duct surrounds second box body outside, and the heat that second box body conducts outward is taken away through the airflow of high -speed flow. The utility model discloses through two cooperative heat dissipation processes, and further promotes power distribution cabinet heat dissipation efficiency, and guarantees equipment stable operation.

Description

Technical Field

[0001] This utility model relates to the field of power distribution cabinet technology, specifically to a double-layer cooling power distribution cabinet. Background Technology

[0002] Distribution cabinets are core equipment for the installation and fixation of electronic components, circuit protection, and operation control. The relays, frequency converters, circuit breakers, and other components integrated inside them continuously generate heat during operation. Excessive temperature inside the cabinet can directly affect the working performance and lifespan of the components, and may even cause safety hazards such as short circuits and equipment downtime. Therefore, heat dissipation capacity has become a key technical indicator that determines the operational stability of distribution cabinets.

[0003] The current cooling methods used in traditional power distribution cabinets have significant limitations. Mainstream solutions either achieve passive cooling by creating ventilation openings on the cabinet surface or active cooling by adding fans. However, both methods suffer from a lack of design diversity. This single-path cooling method relies solely on airflow for cooling, making its effectiveness heavily dependent on the external ambient temperature. This results in consistently low cooling efficiency, failing to effectively remove accumulated heat from the cabinet and consequently failing to provide a long-term, stable, and suitable operating temperature environment for internal components. Utility Model Content

[0004] To address the aforementioned technical shortcomings, the purpose of this utility model is to provide a double-layer cooling distribution cabinet to solve the problem of low cooling efficiency caused by the single heat dissipation mode in the existing technology.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: The present invention provides a double-layer cooling distribution cabinet, comprising: a first enclosure, wherein the first enclosure has a first cavity and a first air inlet pipe and a first air outlet pipe; a second enclosure fixed to the first enclosure, wherein the second enclosure has a second cavity and a second air inlet pipe and a second air outlet pipe; wherein the first air inlet pipe, the first cavity and the first air outlet pipe are combined to form a first air duct, and the second air inlet pipe, the second cavity, the second air outlet pipe and the first air outlet pipe are combined to form a second air duct.

[0006] Optionally, a first fan assembly is fixed inside the first air inlet duct, and a first filter screen is also fixed inside the first air inlet duct.

[0007] Optionally, a second fan assembly is fixed inside both the second air inlet pipe and the second air outlet pipe, and a second filter screen is also fixed inside both the second air inlet pipe and the second air outlet pipe.

[0008] Optionally, it also includes a return air duct, which is fixed to the first housing and connects the first cavity with the first air inlet duct, forming a third air duct that communicates with the second air duct.

[0009] Optionally, the first housing has a notch, and the second housing is fixed in the notch by a third heat-conducting part.

[0010] Optionally, it also includes a refrigerant box fixed to the first housing, the refrigerant box being filled with refrigerant, and a second heat-conducting part being provided on the side of the refrigerant box near the third heat-conducting part, the second heat-conducting part being attached to the third heat-conducting part and forming a heat-conducting gap.

[0011] Optionally, a first heat-conducting part is provided within the heat-conducting gap.

[0012] Optionally, a refrigerant pipe is provided inside the first air inlet pipe, the refrigerant box has a pumping mechanism, and the refrigerant pipe is connected to the pumping mechanism to form a refrigerant pumping circuit.

[0013] Optionally, the refrigerant pipe is located between the first fan assembly and the first filter.

[0014] Optionally, it also includes a bracket, the first housing is fixed on the bracket, the bracket has a ventilation opening, the second air inlet pipe is located inside the ventilation opening, and the second air outlet pipe is located inside the first air outlet pipe.

[0015] The beneficial effects of this utility model are as follows: This invention constructs a dual heat dissipation mode through a first air duct and a second air duct. The airflow from the second air duct directly enters the inner cavity of the second enclosure, making close contact with the electronic components and quickly removing the sensible heat generated during component operation, preventing heat accumulation on the component surfaces. Meanwhile, the first air duct utilizes the surrounding space of the first cavity to completely envelop the exterior of the second enclosure, achieving heat exchange through full contact with the side walls of the second enclosure, effectively dissipating heat conducted from inside the second enclosure to the outside through the walls. Compared to traditional single ventilation and heat dissipation modes, this dual air duct design covers both the direct heat dissipation needs of the components and the overall heat dissipation of the enclosure, eliminating the heat dissipation dead zones that are prone to occur with single air ducts, and significantly improving heat dissipation efficiency and temperature control uniformity.

[0016] Meanwhile, this invention also includes a return air duct and a refrigerant box. The return air duct connects the first cavity and the first air inlet duct to form a recirculating third air duct, allowing the partially heated airflow in the first air duct to be reused, reducing the direct intake of ambient air and lowering the energy consumption for airflow pretreatment. The refrigerant box, driven by a pumping mechanism, circulates the internal refrigerant within the refrigerant pipe, which is embedded in the first air inlet duct. This allows for pre-cooling of the airflow entering the first air duct, ensuring that the airflow entering the first cavity remains at a low temperature. The cooled airflow, as it circulates around the second housing, creates a more significant temperature difference with the hot air discharged from the second housing through the second air duct, further enhancing heat exchange. This, combined with the dual air duct system, provides active cooling capabilities, significantly improving heat dissipation efficiency.

[0017] Furthermore, this invention constructs an efficient heat conduction path through the close fit between the first, second, and third heat-conducting parts: the third heat-conducting part is directly connected to the second housing, enabling rapid conduction of concentrated heat within the second housing; the second heat-conducting part is attached to the surface of the third heat-conducting part, and the heat conduction gap between them is filled by the first heat-conducting part, effectively eliminating heat loss caused by contact gaps, allowing the refrigerant in the refrigerant box to quickly absorb the heat conducted by the third heat-conducting part through the second and first heat-conducting parts. This design is particularly suitable for localized high-heat areas of high-power components within the second housing, compensating for the shortcomings of simple airflow cooling in localized heat dissipation, and further improving overall heat dissipation efficiency and reliability.

[0018] In summary, this invention fundamentally solves the shortcomings of traditional single-mode heat dissipation technology, such as low heat dissipation efficiency and susceptibility to environmental influences, by adding a dual heat dissipation air duct. Simultaneously, by combining airflow circulation design and refrigerant active cooling technology, it enhances the heat dissipation effect from both convection and conduction dimensions. This not only improves heat dissipation efficiency but also enhances the stability and adaptability of the heat dissipation system. It provides a long-term, stable, and suitable operating temperature environment for electronic components within the distribution cabinet, effectively ensuring equipment operational stability, extending component lifespan, and reducing safety hazards such as circuit short circuits and equipment downtime caused by high temperatures. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This utility model discloses a three-dimensional structure for a double-layer cooling distribution cabinet. Figure 1 .

[0021] Figure 2 This utility model discloses a three-dimensional structure for a double-layer cooling distribution cabinet. Figure 2 .

[0022] Figure 3 This utility model relates to a three-dimensional explosion of a double-layer cooling distribution cabinet. Figure 1 .

[0023] Figure 4 This utility model relates to a double-layer cooling distribution cabinet. Figure 3 Enlarged view of point A in the middle.

[0024] Figure 5 This utility model relates to a three-dimensional explosion of a double-layer cooling distribution cabinet. Figure 2 .

[0025] Figure 6 This utility model relates to a double-layer cooling distribution cabinet. Figure 5 Enlarged view of point B in the middle.

[0026] Figure 7 This is a schematic diagram of the airflow direction of a double-layer cooling distribution cabinet according to this utility model.

[0027] Explanation of reference numerals in the attached figures: 1. First housing; 11. First air inlet duct; 12. First exhaust duct; 13. First fan assembly; 14. First filter; 15. Return air duct; 16. Notch; 2. Second housing; 21. Second air inlet duct; 22. Second exhaust duct; 23. Second fan assembly; 24. Second filter; 25. Third heat-conducting part; 3. Refrigerant box; 31. Refrigerant pipe; 32. Second heat-conducting part; 4. First heat-conducting part. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] As mentioned earlier, the current heat dissipation methods used in traditional power distribution cabinets have significant limitations. Mainstream solutions either achieve passive heat dissipation by creating ventilation openings on the cabinet surface or by adding fans for active ventilation. However, both methods suffer from a lack of design diversity. This single-path cooling method relies solely on airflow for cooling, making its effectiveness heavily dependent on the external ambient temperature. This results in consistently low heat dissipation efficiency, making it difficult to effectively remove accumulated heat from the cabinet and consequently failing to provide a long-term, stable, and suitable operating temperature environment for the internal components.

[0030] To address this issue, this utility model provides a double-layer cooling distribution cabinet. Through two coordinated heat dissipation processes, it further improves the heat dissipation efficiency of the distribution cabinet, ensuring stable equipment operation. This effectively improves cooling efficiency, thereby solving the problems in the prior art. This utility model solves the problem in the following way.

[0031] Example 1: Please refer to the instruction manual appendix. Figures 1 to 7 As shown in the figure, this embodiment provides a double-layer cooling distribution cabinet, which includes a first enclosure 1 and a second enclosure 2. The first enclosure 1 is fixed to a bracket and has a first cavity inside. The second enclosure 2 is fixed inside the first enclosure 1, thereby dividing the first cavity into... Figure 7 The diagram shows a U-shaped passageway (i.e., the first air duct). The second enclosure 2 contains a second cavity, within which several electrical components (not shown in the diagram) are housed. These components include, but are not limited to, circuit breakers, residual current devices (RCDs), disconnect switches, fuses, contactors, thermal overload relays, voltage and current transformers, protectors, and terminal blocks—components required for the operation of the existing distribution cabinet. These electrical components generate a significant amount of heat during operation. Airflow carrying away this heat as it passes through these components achieves cooling.

[0032] In this first embodiment, as Figures 1 to 3 , Figure 5 , Figure 7 As shown. A first air inlet pipe 11 is fixed and connected to the bottom right side of the first housing 1 (for ease of description, the side where the door of the first housing 1 is located is defined as the front, and the side of the first housing 1 closest to the support is defined as the bottom; correspondingly, the first housing 1 has a rear, top, and left and right sides, and the same applies below. However, these directions are only for illustrative purposes and are not intended to limit the present invention). A first fan assembly 13 consisting of two fans is fixed at the junction of the first air inlet pipe 11 and the first cavity (i.e., the left side of the first air inlet pipe 11). A first filter screen 14 is fixed on the side of the first air inlet pipe 11 away from the first fan assembly 13 (i.e., the right side). In use, the first fan assembly 13 generates wind pressure, causing the airflow from the external environment to pass through the first filter screen 14 into the first air inlet pipe 11, then through the first fan assembly 13, and finally into the first cavity. Under the continuous drive of the first fan assembly 13, the airflow flows in a U-shaped passage, forming a... Figure 7 The airflow is shown in the direction of the dashed arrow a.

[0033] Meanwhile, the top of the first housing 1 is fixed and connected to a first exhaust duct 12, the opening of the first exhaust duct 12 faces left, and an outlet is opened on the top of the first housing 1, which extends into the interior of the first exhaust duct 12 for exhaust (e.g. Figure 7 As shown, the airflow in direction a exits from the outlet, forming the dashed arrow airflow, and then enters the first exhaust duct 12.

[0034] In this first embodiment, as Figures 1 to 3 , Figure 5 , Figure 7 As shown, the bottom and top of the second housing 2 are respectively fixed and connected to a second air inlet pipe 21 and a second air outlet pipe 22. Simultaneously, a ventilation opening is provided on the support frame, into which the second air inlet pipe 21 extends, and into the first air outlet pipe 12, thus forming a second air duct. At the same time, both the second air inlet pipe 21 and the second air outlet pipe 22 are equipped with a second fan assembly 23 consisting of three fans. A second filter screen 24 is fixed at the intersection of the second air inlet pipe 21 and the ventilation opening of the support frame, and a second filter screen 24 is also fixed at the intersection of the second air outlet pipe 22 and the first air outlet pipe 12.

[0035] Therefore, during use, the second fan assembly 23 is powered on and driven to generate airflow. External airflow enters the second cavity through the vents of the bracket, passes through the second filter 24, and flows through the second air inlet duct 21, carrying away the heat dissipated by the electronic components. Subsequently, it passes through the second exhaust duct 22 and the second filter 24, entering the first exhaust duct 12, and is finally discharged from the external environment. This forms a... Figure 7 The dashed arrow b indicates the airflow direction. Airflows a and b converge in the first exhaust duct 12, forming a... Figure 7 The airflow, indicated by the dashed arrow 'e', ​​eventually exits, achieving cooling and heat dissipation.

[0036] In this first embodiment, as Figures 1 to 3 , Figure 5 , Figure 7 As shown. A return air duct 15 is also fixed and connected to the first housing 1. One end of the return air duct 15 is connected to the first cavity inside the first housing 1 (i.e., connected to the first air duct), and the other end is connected to the first air inlet duct 11 to form a third air duct. The intersection of the return air duct 15 and the first air inlet duct 11 is located between the first fan group 13 and the first filter screen 14.

[0037] When using, such as Figure 7 As shown, some of the airflow 'a' enters the return air duct 15 when it passes through the inlet of the return air duct 15 and flows along the return air duct 15. This forms the airflow indicated by the dashed arrow 'c'. The airflow 'c' enters the first air inlet duct 11, converges, and reforms into airflow 'a'. This initiates the next cycle.

[0038] Example 2: Based on the above embodiments, in order to further clarify and completely explain the technical solutions therein, this utility model also provides an embodiment two. For example... Figure 3 or Figure 5 As shown, in this second embodiment, a notch 16 is provided at the rear of the first box 1, and a third heat-conducting part 25 (the third heat-conducting part 25 acts as the rear wall of the second box 2) is provided at the rear of the second box 2. The third heat-conducting part 25 is fixed in the notch 16, thereby realizing the fixation of the first box 1 and the second box 2.

[0039] Simultaneously, a refrigerant box 3 is fixed at the rear of the first housing 1. The front end of the refrigerant box 3 has a second heat-conducting part 32 (which acts as the front wall of the refrigerant box 3). The second heat-conducting part 32 is close to the third heat-conducting part 25, forming a heat-conducting gap. A first heat-conducting part 4 is also fixed in this heat-conducting gap. The first heat-conducting part 4, the second heat-conducting part 32, and the third heat-conducting part 25 combine to form a heat-conducting structure (the first heat-conducting part 4, the second heat-conducting part 32, and the third heat-conducting part 25 are all made of materials with low thermal resistance and good adhesion, such as copper alloy and aluminum alloy). The refrigerant box 3 is filled with a refrigerant (e.g., cooling water, fluorinated ketone, perfluoropolyether, high-insulation mineral oil / synthetic hydrocarbon), which directly contacts the second heat-conducting part 32. The hot air in the second cavity directly contacts the third heat-conducting part 25.

[0040] Therefore, when in use, the electronic components in the second cavity generate heat. This heat is exchanged with the cold medium in the refrigerant box 3 through the heat-conducting structure, thereby reducing the temperature of the hot air in the second cavity to assist in heat dissipation and improve cooling efficiency.

[0041] Example 3: Based on the above embodiments, in order to further clarify and completely explain the technical solutions therein, this utility model also provides Embodiment Three. For example... Figures 1 to 3 or Figure 5 As shown, in this second embodiment, a refrigerant pipe 31 is also included. The refrigerant pipe 31 comprises two parts. The first part is S-shaped and is fixed to the first fan assembly 13 and the first filter 14 within the first air inlet pipe 11 by a fixing bracket. The second part extends out of the first air inlet pipe 11 and connects to the pumping mechanism (e.g., a micro water pump) of the refrigerant tank 3. The pumping mechanism connects to the refrigerant tank 3 and draws refrigerant into it, circulating it into the refrigerant pipe 31. This allows the airflow in the first air duct to have its temperature reduced when it passes through the first part of the refrigerant pipe 31, thus allowing it to better enter the first cavity for heat exchange. This improves the cooling and heat dissipation efficiency. The return air in the third air duct is also cooled when it comes into contact with the first part of the refrigerant pipe 31 and returns to the first cavity.

[0042] Therefore, in summary, compared with the prior art, this utility model has the following advantages, including but not limited to: This invention employs a dual heat dissipation mode through a first and a second air duct. The airflow from the second duct directly enters the inner cavity of the second housing 2, making close contact with the electronic components and quickly removing the sensible heat generated during component operation, preventing heat buildup on the component surfaces. Meanwhile, the first duct utilizes the surrounding space of the first cavity to completely envelop the exterior of the second housing 2, achieving heat exchange through full contact with the side walls of the second housing 2, effectively channeling heat from inside the second housing 2 that is conducted to the outside through the walls. Compared to traditional single-ventilation heat dissipation modes, this dual-air duct design covers both the direct heat dissipation needs of the components and the overall heat dissipation of the housing, eliminating the heat dissipation dead zones that are easily created by a single air duct, and significantly improving heat dissipation efficiency and temperature control uniformity.

[0043] Meanwhile, this utility model also includes a return air duct 15 and a refrigerant box 3. The return air duct 15 connects the first cavity and the first air inlet duct 11 to form a recirculating third air duct, allowing the airflow that has not been fully heated in the first air duct to be reused, reducing the direct intake of ambient air and lowering the energy consumption for airflow pretreatment. The refrigerant box 3 is driven by a pumping mechanism to circulate the internal refrigerant in the refrigerant pipe 31, which is embedded in the first air inlet duct 11. This allows for pre-cooling of the airflow entering the first air duct, ensuring that the airflow entering the first cavity remains at a low temperature. When the cooled airflow surrounds the second housing 2, it creates a more significant temperature difference with the hot air discharged from the second housing 2 through the second air duct, further enhancing the heat exchange effect. This superimposes active cooling capability on top of the dual air ducts, significantly improving heat dissipation efficiency.

[0044] Furthermore, this invention utilizes the close fit between the first heat-conducting part 4, the second heat-conducting part 32, and the third heat-conducting part 25 to construct an efficient heat conduction path: the third heat-conducting part 25 is directly connected to the second housing 2, enabling rapid conduction of concentrated heat within the second housing 2; the second heat-conducting part 32 is attached to the surface of the third heat-conducting part 25, and the heat conduction gap between them is filled by the first heat-conducting part 4, effectively eliminating heat loss caused by contact gaps, allowing the refrigerant in the refrigerant box 3 to quickly absorb the heat conducted by the third heat-conducting part 25 through the second heat-conducting part 32 and the first heat-conducting part 4. This design is particularly suitable for localized high-heat areas of high-power components within the second housing 2, compensating for the shortcomings of simple airflow cooling in localized heat dissipation, and further improving overall heat dissipation efficiency and reliability.

[0045] In summary, this invention fundamentally solves the shortcomings of traditional single-mode heat dissipation technology, such as low heat dissipation efficiency and susceptibility to environmental influences, by adding a dual heat dissipation air duct. Simultaneously, by combining airflow circulation design and refrigerant active cooling technology, it enhances the heat dissipation effect from both convection and conduction dimensions. This not only improves heat dissipation efficiency but also enhances the stability and adaptability of the heat dissipation system. It provides a long-term, stable, and suitable operating temperature environment for electronic components within the distribution cabinet, effectively ensuring equipment operational stability, extending component lifespan, and reducing safety hazards such as circuit short circuits and equipment downtime caused by high temperatures.

[0046] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of this utility model and its equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A double-layer cooling distribution cabinet, characterized in that, include: The first housing (1) has a first cavity inside and has a first air inlet pipe (11) and a first air outlet pipe (12). A second box (2) is fixed inside the first box (1). The second box (2) has a second cavity and a second air inlet pipe (21) and a second air outlet pipe (22). The first air inlet pipe (11), the first cavity and the first exhaust pipe (12) are combined to form the first air duct, and the second air inlet pipe (21), the second cavity, the second exhaust pipe (22) and the first exhaust pipe (12) are combined to form the second air duct.

2. The double-layer cooling distribution cabinet as described in claim 1, characterized in that, The first air inlet pipe (11) is fixed with a first fan assembly (13) and a first filter screen (14) is also fixed inside the first air inlet pipe (11).

3. A double-layer cooling distribution cabinet as described in claim 1, characterized in that, A second fan assembly (23) is fixed inside the second air inlet pipe (21) and the second air outlet pipe (22), and a second filter screen (24) is also fixed inside the second air inlet pipe (21) and the second air outlet pipe (22).

4. A double-layer cooling distribution cabinet as described in claim 1, characterized in that, It also includes a return air duct (15), which is fixed to the first housing (1). The return air duct (15) connects the first cavity and the first air inlet duct (11) and forms a third air duct that connects to the second air duct.

5. A double-layer cooling distribution cabinet as described in claim 2, characterized in that, The first box (1) has a notch (16) and the second box (2) is fixed in the notch (16) by a third heat-conducting part (25).

6. A double-layer cooling distribution cabinet as described in claim 5, characterized in that, It also includes a refrigerant box (3) fixed on the first box (1), the refrigerant box (3) is filled with refrigerant, and a second heat-conducting part (32) is provided on the side of the refrigerant box (3) near the third heat-conducting part (25), the second heat-conducting part (32) is attached to the third heat-conducting part (25) and forms a heat-conducting gap.

7. A double-layer cooling distribution cabinet as described in claim 6, characterized in that, The thermally conductive gap is provided with a first thermally conductive part (4).

8. A double-layer cooling distribution cabinet as described in claim 6, characterized in that, The first air inlet pipe (11) is provided with a refrigerant pipe (31), the refrigerant box (3) has a pumping mechanism, the refrigerant pipe (31) is connected to the pumping mechanism, and a refrigerant pumping circuit is formed.

9. A double-layer cooling distribution cabinet as described in claim 8, characterized in that, The refrigerant pipe (31) is located between the first fan assembly (13) and the first filter (14).

10. A double-layer cooling distribution cabinet as described in claim 1, characterized in that, It also includes a support frame, the first housing (1) is fixed on the support frame, the support frame has a ventilation opening, the second air inlet pipe (21) is located inside the ventilation opening, and the second exhaust pipe (22) is located inside the first exhaust pipe (12).

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