Highly integrated inverter for electric vehicles

Abstract

This utility model relates to a highly integrated inverter for electric vehicles, comprising a housing, a housing cover, and a power board, a PCBA board, a thin-film capacitor, an IGBT module, a current sensor, a three-phase bracket, and a filter bracket installed inside the housing. The housing contains module sealing grooves. The power board is located between the IGBT module and the filter bracket. The thin-film capacitor is soldered to the power board. The PCBA board is located between the IGBT module and the housing cover. The current sensor is soldered to the PCBA board. The IGBT module is fixed in the module sealing groove and connected to the PCBA board. A magnetic ring is encapsulated inside the filter bracket. Compared with existing technologies, this utility model has advantages such as the current sensor being integrated onto the PCBA board, saving space, facilitating assembly, eliminating the need for separate bolts to fix a separate current sensor during assembly, and improving system reliability.

Description

Technical Field

[0001] This utility model relates to inverters, and more particularly to a highly integrated inverter for electric vehicles. Background Technology

[0002] Inverters commonly found on the market today, such as Figure 1 As shown, internal components are typically secured with bolts, and the space occupied by copper busbars and bolts increases the inverter's size and cost, hindering its lightweight and integrated design. Furthermore, as... Figure 2 and Figure 3 As shown, current acquisition in three-phase systems mostly adopts a separate IGBT and current sensor design, which occupies more space and is not conducive to high integration and low cost of inverters. Furthermore, modern electric drive systems have strict EMC requirements; the inverter filtering section typically uses an independent magnetic ring and capacitor in series, with a fixed structure, such as... Figure 4 As shown, it is clear that it cannot fully meet the more diverse and integrated needs.

[0003] A search revealed that patent publication number CN 206472039U discloses an inverter power unit, which includes a chassis with a heat dissipation duct. Inside the chassis are power integrated devices, capacitor units, a PCB board, and a heat sink. The PCB board is fixed to the chassis, and the power integrated devices and capacitor units are soldered onto the PCB board. The capacitor units are connected in parallel between the DC+ and DC- terminals of the power integrated devices via a stacked busbar. The heat sink is fixed to the power integrated devices and located within the heat dissipation duct of the chassis. However, this prior art does not disclose the installation method of the current sensor.

[0004] In summary, the technical problem that needs to be solved is how to design an inverter component that can integrate a current sensor and has a flexible structure. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology, such as low integration and insufficient structural flexibility, and to provide a highly integrated inverter for electric vehicles.

[0006] The objective of this utility model can be achieved through the following technical solutions.

[0007] According to one aspect of the present invention, a highly integrated inverter for electric vehicles is provided, comprising a housing, a housing cover, and a power board, a PCBA board, a thin-film capacitor, an IGBT module, a current sensor, a three-phase bracket, and a filter bracket installed inside the housing; the housing is provided with a module sealing groove; The power board is located between the IGBT module and the filter bracket. The thin film capacitor is soldered onto the power board. The PCBA board is located between the IGBT module and the box cover. The current sensor is soldered onto the PCBA board. The IGBT module is fixed on the module sealing groove and connected to the PCBA board. The filter bracket is filled with a magnetic ring.

[0008] As a preferred technical solution, the power board is further soldered with an X capacitor and a Y capacitor, wherein there are one or more X capacitors and Y capacitors.

[0009] As a preferred technical solution, the output terminal of the IGBT module and the three-phase copper busbar are fixed to the three-phase bracket by bolts, and the power board is welded to the input terminal of the IGBT module and the copper busbar of the magnetic ring bracket.

[0010] As a preferred technical solution, the power board is provided with a magnetic ring bracket copper busbar connection point and X capacitor and Y capacitor connection points on one side, an IGBT module connection point on the other side, and a thin film capacitor connection point in the middle.

[0011] As a preferred technical solution, the magnetic ring is located on the side of the power board where the magnetic ring support copper busbar connection point is provided, and one end of the magnetic ring support copper busbar passing through the magnetic ring is welded to the power board.

[0012] As a preferred technical solution, a sealing ring is installed in the module sealing groove, and the IGBT module is fixed to the sealing groove of the housing by bolts, pressing against the sealing ring in the module sealing groove.

[0013] As a preferred technical solution, the current sensor is arranged on one side of the PCBA board and positioned by a positioning pin.

[0014] As a preferred technical solution, the PCBA board is provided with a low-voltage area, and a low-voltage signal plug-in and a resolver thermistor plug-in are inserted in the low-voltage area.

[0015] As a preferred technical solution, the three-phase sealing groove is filled with glue, and the resolver thermistor wire harness connected to the resolver thermistor plug is pressed between the three-phase bracket and the housing through the three-phase bracket.

[0016] As a preferred technical solution, the power board is a four-layer board with the two middle layers covered with copper.

[0017] Compared with the prior art, the present invention has the following beneficial effects.

[0018] 1) The current sensor of this utility model is welded and integrated on the PCBA board, which saves space and facilitates assembly. The assembly process does not require a separate current sensor to be fixed with bolts, which improves the reliability of the system.

[0019] 2) The power board of this utility model is also soldered with X capacitors and Y capacitors, which reduces the current loop and grounding loop, improves the EMC effect, and can also freely expand and combine the number of X / Y capacitors of different specifications according to the usage requirements to meet the usage requirements of different EMC levels.

[0020] 3) The PCBA board of this utility model adopts a 4-layer board design, which can be copper-clad inside to carry large current, replacing the traditional input method of connecting copper busbars and film capacitors; the capacitor output current is also connected to the power board by soldering through the PCBA board, replacing the bolt connection method of the traditional inverter, reducing the inductance between the capacitor and the power board, which helps to improve the performance of the motor controller; it also saves the use of copper busbars and bolts, increases space utilization, reduces costs, increases the degree of automation, enables fast-paced production, and reduces labor costs. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of an inverter structure in the prior art that is connected by bolts.

[0022] Figure 2 This is a schematic diagram of the first structure of a discrete current sensor in the prior art.

[0023] Figure 3 This is a schematic diagram of a second structure of a separate current sensor in the prior art.

[0024] Figure 4 This is a schematic diagram of a non-extendable filter structure in the prior art.

[0025] Figure 5 This is an exploded view of a highly integrated inverter for electric vehicles according to this utility model.

[0026] Figure 6 This is a schematic diagram of the power board structure of this utility model.

[0027] Figure 7 This is a schematic diagram of the structure of the power board after the components are welded.

[0028] Figure 8 This is an exploded view of the power board and the soldered components of this utility model.

[0029] Figure 9 This is a schematic diagram of the PCBA board structure of this utility model.

[0030] Figure 10 This is a schematic diagram showing the connection between the IGBT module and the current sensor of this utility model.

[0031] Figure 11 This is an exploded view showing the connection between the IGBT module, current sensor, and PCBA board of this utility model.

[0032] Figure 12 This is a schematic diagram of the bottom structure of the box body of this utility model.

[0033] Figure 13 This is a schematic diagram of the module sealing groove structure of this utility model.

[0034] The numbers in the diagram are as follows: 1. Enclosure; 10. Module sealing groove; 2. Enclosure cover; 3. Power board; 30. X capacitor; 31. Y capacitor; 32. Magnetic ring bracket copper busbar connection point; 33. IGBT module connection point; 34. X capacitor and Y capacitor connection point; 35. Film capacitor connection point; 4. PCBA board; 40. Low-voltage signal plug-in; 5. Film capacitor; 6. IGBT module; 7. Current sensor; 70. Positioning pin; 71. Current sensor connection point; 8. Three-phase bracket; 9. Filter bracket; 90. Magnetic ring; 91. Magnetic ring bracket copper busbar. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present utility model.

[0036] like Figure 5 As shown, this utility model provides a highly integrated inverter for electric vehicles, including a housing 1, a housing cover 2, and a power board 3, a PCBA board 4, a thin-film capacitor 5, an IGBT module 6, a current sensor 7, a three-phase bracket 8, and a filter bracket 9 installed inside the housing 1. Figure 12 and Figure 13 As shown, a module sealing groove 10 is provided at the bottom of the box.

[0037] Power board 3 is located between IGBT module 6 and filter bracket 9, and PCBA board 4 is located between IGBT module 6 and enclosure cover 2. The three-phase sealing groove is filled with adhesive. The resolver thermistor wiring harness connected to the resolver thermistor plug-in is pressed between the three-phase bracket 8, which is bolted to the enclosure 1, and the resolver thermistor 8 and the enclosure. A sealing ring is installed in module sealing groove 10. IGBT module 6 is bolted to the sealing groove of enclosure 1, pressing against the sealing ring located in the sealing groove and connecting to PCBA board 4. Filter bracket 9 is filled with magnetic ring 90. Magnetic ring 90 is located on the side of power board 3 where magnetic ring bracket copper busbar connection point 32 is located. Magnetic ring bracket copper busbar 91 passes through one end of magnetic ring 90 and is welded to power board 3. The purpose of setting the three-phase sealing groove is to prevent oil and gas from inside the motor from entering the inverter during assembly operation. The purpose of setting the module sealing groove 10 is to prevent coolant from flowing into the inverter during assembly operation, allowing the cooling system to dissipate heat from the module.

[0038] like Figures 6-8 As shown, the power board 3 has a magnetic ring bracket copper busbar connection point 32 and X capacitor and Y capacitor connection points 34 on one side, an IGBT module connection point 33 on the other side, and a film capacitor connection point 35 in the middle. The film capacitor 5 is soldered to the power board 3 through the film capacitor connection point 35. The X capacitor 30 and Y capacitor 31 are soldered to the power board 3 through the X capacitor and Y capacitor connection point 34, and there are one or more X capacitors 30 and Y capacitors 31. The magnetic ring bracket copper busbar 91 is soldered to the power board 3 through the magnetic ring bracket copper busbar connection point 32. The IGBT module 6 is soldered to the power board 3 through the IGBT module connection point 33. The power board 3 is a four-layer board with copper-clad layers in the middle. The internal copper clad layer can carry large currents, replacing the traditional input method of connecting copper busbars and capacitors.

[0039] like Figure 9 As shown, the current sensor 7 is small in size and is soldered onto the PCBA board 4, landing at the reserved current sensor connection point 71 and positioned by the locating pin 70. This solution has high space utilization, reduces the use of bolts, lowers costs, and increases integration. The PCBA board 4 has a low-voltage area, in which a low-voltage signal plug-in 40 and a resolver thermistor plug-in are inserted.

[0040] like Figure 10 and Figure 11 As shown, the output terminal of IGBT module 6 and the three-phase copper busbar are fixed to the three-phase bracket 8 by bolts. The three-phase copper busbar refers to the copper busbar that converts DC current into AC output after being inverted by IGBT module 6. It is connected to the IGBT output terminal and has three copper busbars: U, V, and W.

[0041] The filter components, X capacitor 30, Y capacitor 31, film capacitor 5, and IGBT input terminals are integrated onto the power board 3 and soldered to the PCBA board 4 via terminals. Current is transmitted through the copper-clad power board 3. This design saves on copper busbars and bolts, resulting in a smaller inverter size and higher integration. Simultaneously, the soldering process can be automated, replacing manual steps, reducing potential errors, and increasing reliability. By soldering the magnetic ring 90 (Busbar adapter), X capacitor 30, and Y capacitor 31 to the copper-clad power board 3, modularization is achieved. Furthermore, the topology can be modified by increasing / decreasing the size of the power board 3 and adjusting the type, quantity, and position of the magnetic ring 90, X capacitor 30, and Y capacitor 31 to meet different generator structures and EMC rating requirements.

[0042] The installation process of this utility model is as follows: First, place X capacitor 30, Y capacitor 31, and film capacitor 5 in the fixture and weld them onto power board 3 using welding equipment to form power board 3 assembly. Then, fix low-voltage signal plug-in 40 to the reserved position in enclosure 1. Then, the filter bracket 9 with the encapsulated magnetic ring 90 is fixed inside the enclosure 1 with bolts; glue is poured into the three-phase sealing groove, and the resolver thermistor wire harness is pressed under the three-phase bracket 8 and fixed on the three-phase sealing groove with bolts; then, a suitable sealing ring is placed in the module sealing groove 10, and the IGBT module 6 is fixed above the sealing ring with bolts for sealing. Then, the output end of the IGBT module 6 and the three-phase copper busbar are fixed to the three-phase bracket 8 with bolts; the power board 3 assembly is placed between the IGBT and the filter bracket 9, and the power board 3 assembly is fixed with suitable bolts. Then, the PCBA board 4 is placed on top of the IGBT module 6 and fixed with suitable bolts; then, the power board 3 is welded to the magnetic ring bracket copper busbar 91 and the IGBT input copper busbar using welding equipment, and the PCBA board 4 is welded to the IGBT module 6; then, the signal plug-in and resolver thermistor plug-in are inserted into the low-voltage area of ​​the PCBA board 4; finally, the enclosure cover 2 is fixed on the enclosure 1 and the nylon sump is tightened; after the airtightness is tested, the breather valve is installed in the corresponding position. The copper busbar 91 of the magnetic ring bracket is the copper busbar through which the DC power input from the vehicle battery enters the inverter.

[0043] This utility model utilizes soldering to connect the internal filter and capacitors, as well as the capacitors and power modules, within the inverter. This connection method not only reduces the use of copper busbars and bolts but also increases the degree of automation during assembly, lowers labor costs, and improves production line efficiency. Furthermore, the integrated design of the power module and current sensor 7 reduces size and weight while also being more cost-effective, achieving both lightweight and economical operation of the inverter. Moreover, the scalable filter structure better meets the various EMC (Electromagnetic Compatibility) requirements of range-extended inverters, allowing for the flexible addition of magnetic rings 90 and X / Y capacitors 31, ensuring design versatility.

[0044] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A highly integrated inverter for electric vehicles, characterized in that, Includes a housing (1), a housing cover (2), and power boards (3), PCBA boards (4), thin film capacitors (5), IGBT modules (6), current sensors (7), three-phase brackets (8), and filter brackets (9) installed inside the housing (1); the housing is provided with module sealing grooves (10); The power board (3) is located between the IGBT module (6) and the filter bracket (9). The thin film capacitor (5) is welded to the power board (3). The PCBA board (4) is located between the IGBT module (6) and the box cover (2). The current sensor (7) is welded to the PCBA board (4). The IGBT module (6) is fixed on the module sealing groove (10) and connected to the PCBA board (4). The filter bracket (9) is filled with a magnetic ring (90).

2. The highly integrated inverter for electric vehicles according to claim 1, characterized in that, The power board (3) is also welded with an X capacitor (30) and a Y capacitor (31), one or more of the X capacitor (30) and the Y capacitor (31).

3. The highly integrated inverter for electric vehicles according to claim 1, characterized in that, The output terminal of the IGBT module (6) and the three-phase copper busbar are fixed to the three-phase bracket (8) by bolts, and the power board (3) is welded to the input terminal of the IGBT module (6) and the copper busbar (91) of the magnetic ring bracket.

4. A highly integrated inverter for electric vehicles according to claim 3, characterized in that, The power board (3) is provided with a magnetic ring bracket copper busbar connection point (32) and X capacitor and Y capacitor connection point (34) on one side, an IGBT module connection point (33) on the other side, and a thin film capacitor connection point (35) in the middle.

5. A highly integrated inverter for electric vehicles according to claim 4, characterized in that, The magnetic ring (90) is located on the side of the power board (3) where the magnetic ring bracket copper busbar connection point (32) is provided. The magnetic ring bracket copper busbar (91) passes through one end of the magnetic ring (90) and is welded to the power board (3).

6. A highly integrated inverter for electric vehicles according to claim 1, characterized in that, A sealing ring is installed in the module sealing groove (10), and the IGBT module (6) is fixed to the sealing groove of the housing by bolts, pressing on the sealing ring in the module sealing groove (10).

7. A highly integrated inverter for electric vehicles according to claim 1, characterized in that, The current sensor (7) is arranged on one side of the PCBA board (4) and positioned by a positioning pin (70).

8. A highly integrated inverter for electric vehicles according to claim 1, characterized in that, The PCBA board (4) is provided with a low-voltage area, and a low-voltage signal plug-in (40) and a resolver thermistor plug-in are inserted in the low-voltage area.

9. A highly integrated inverter for electric vehicles according to claim 8, characterized in that, The three-phase sealing groove is filled with glue, and the resolver thermistor wire harness connected to the resolver thermistor plug is pressed between the three-phase bracket (8) and the box (1) through the three-phase bracket (8).

10. A highly integrated inverter for electric vehicles according to claim 1, characterized in that, The power board (3) is a four-layer board with two copper-clad layers in the middle.

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