A front-end circuit, electronic device and chip

Abstract

Embodiments of the present application provide a front-end circuit, an electronic device and a chip, and relate to the technical field of communication. The front-end circuit comprises a first power amplifier, a second power amplifier and a first switch circuit. An input end of the first power amplifier is used for being coupled to a first radio frequency circuit, and an input end of the second power amplifier is used for being coupled to a second radio frequency circuit. An output end of the first power amplifier is coupled to the first switch circuit, and an output end of the second power amplifier is coupled to the first switch circuit. The first switch circuit is further used for being coupled to at least one antenna. A first communication mode supported by the first radio frequency circuit comprises wireless network communication, and a second communication mode supported by the second radio frequency circuit comprises network-free communication. The power amplifier of the network-free communication device is integrated into the front-end circuit of the wireless network communication, so that the network-free communication system is integrated into the terminal electronic device commonly used by consumers.

Description

Technical Field

[0001] This application relates to the field of communication technology, and more particularly to a front-end circuit, electronic device, and chip. Background Technology

[0002] As wireless communication becomes increasingly popular, the demand for wireless communication on the ground (such as hiking in uninhabited areas, wireless garages, and caves) is growing. Typically, wireless communication products are specialized devices like walkie-talkies, which are not convenient for consumers to use. Therefore, integrating wireless communication systems into commonly used consumer electronic devices is a problem that needs to be solved. Utility Model Content

[0003] Embodiments of this application provide a front-end circuit, electronic device, and chip that integrate a network-free communication system into commonly used consumer terminal electronic devices.

[0004] In a first aspect, a front-end circuit is provided, including a first power amplifier, a second power amplifier, and a first switching circuit. The input terminal of the first power amplifier is used to couple to a first radio frequency (RF) circuit, and the input terminal of the second power amplifier is used to couple to a second RF circuit. The output terminal of the first power amplifier is coupled to the first switching circuit, and the output terminal of the second power amplifier is coupled to the first switching circuit. The first switching circuit is also used to couple to at least one antenna. The first RF circuit supports a first communication standard, and the second RF circuit supports a second communication standard. The first communication standard includes at least the following wireless network communication: cellular communication; the second communication standard includes at least the following wireless communication: walkie-talkie communication. The operating frequency band of the cellular communication includes a low-frequency band (LB), and the maximum frequency of the operating frequency band of the walkie-talkie communication is less than or equal to the maximum frequency of the low-frequency band.

[0005] This allows for the formation of two separate RF transmission channels for transmitting RF signals. One RF transmission channel includes a first power amplifier, and the other includes a second power amplifier. The first switching circuit can be a multi-pole multi-throw (XPXT) switch. This allows for the selective conduction of the two RF transmission channels with antennas to transmit RF signals for both cellular and walkie-talkie communication. For example, when the first switching circuit is coupled to only one antenna, walkie-talkie and cellular communication can time-division multiplex that single antenna to transmit RF signals. Alternatively, when the first switching circuit is coupled to two or more antennas, walkie-talkie and cellular communication can each select one antenna for each RF transmission channel to transmit RF signals for both communication standards. The cellular communication operates in a low-band (LB) frequency band, while the maximum frequency of the walkie-talkie communication operating band is less than or equal to the maximum frequency of the LB band. In the above example, the walkie-talkie power amplifier is integrated into the cellular communication front-end circuit, thus integrating the walkie-talkie into commonly used consumer terminal electronic devices.

[0006] In one possible implementation, the front-end circuit further includes: a first filter and a second filter; the first filter is coupled between the output of the first power amplifier and the first switching circuit; the second filter is coupled between the output of the second power amplifier and the first switching circuit; the passband of the first filter includes the bandwidth of the first communication standard, and the passband of the second filter includes the bandwidth of the second communication standard. The two filters can respectively filter the bandwidth of the RF transmission channel applicable to two different communication standards.

[0007] In one possible implementation, the front-end circuit further includes a first low-noise amplifier; the input of the first low-noise amplifier is coupled to a first switching circuit; and the output of the first low-noise amplifier is coupled to a first radio frequency circuit.

[0008] In one possible implementation, the front-end circuit further includes: a second low-noise amplifier, the input of which is coupled to the first switching circuit; and the output of which is coupled to the second radio frequency circuit.

[0009] This allows for the formation of two separate radio frequency (RF) receiving channels, one including a first low-noise amplifier and the other including a second low-noise amplifier. The first switching circuit can selectively activate the two RF receiving channels with antennas to receive RF signals for both wireless and wireless communication. For example, when the first switching circuit is coupled to only one antenna, it can be a single-pole double-throw (SPDT) switch, allowing both wireless and wireless communication to share the same antenna for RF signal reception. Alternatively, when the first switching circuit is coupled to two or more antennas, it can be a double-pole double-throw (DPDT) switch, allowing for the selection of one antenna for each of the two RF receiving channels to receive RF signals for both communication standards.

[0010] In one possible implementation, the front-end circuit further includes a third filter; the third filter is coupled between the first switching circuit and the first low-noise amplifier; the passband of the third filter includes the bandwidth of the first communication standard. The third filter can filter the bandwidth of the RF receiving channel applicable to the first communication standard.

[0011] In one possible implementation, the front-end circuit further includes a fourth filter; the fourth filter is coupled between the first switching circuit and the input of the second low-noise amplifier; the passband of the fourth filter includes the bandwidth of the second communication standard. The fourth filter can filter the bandwidth of the RF receiving channel suitable for the second communication standard.

[0012] In one possible implementation, the front-end circuit further includes: a second switching circuit; the second switching circuit is coupled to the first filter, the second filter, the first power amplifier, and the second power amplifier. The second switching circuit can connect the first power amplifier and the first filter to form a radio frequency transmission channel for wireless network communication, and connect the second power amplifier and the second filter to form another radio frequency transmission channel for wireless communication.

[0013] In one possible implementation, the front-end circuit further includes a first low-noise amplifier, a third switching circuit, and a fourth switching circuit. The input terminal of the first low-noise amplifier is coupled to the fourth switching circuit. The fourth switching circuit is coupled to both the first and second switching circuits. The output terminal of the first low-noise amplifier is coupled to the third switching circuit. The third switching circuit is also used to couple to both the first and second radio frequency (RF) circuits. Thus, in some scenarios, the first low-noise amplifier and the first RF chip can be connected via the fourth switching circuit, the first low-noise amplifier, and the third switching circuit to form an RF receiving channel for wireless network communication. Alternatively, in another scenario, the first low-noise amplifier and the second RF chip can be connected via the fourth switching circuit, the second switching circuit, the first low-noise amplifier, and the third switching circuit to form an RF receiving channel for wireless communication.

[0014] In one possible implementation, the front-end circuit further includes a third filter; the third filter is coupled between the first switching circuit and the fourth switching circuit; the passband of the third filter includes the bandwidth of the first communication standard.

[0015] In one possible implementation, both the first and second power amplifiers employ gallium arsenide (GaAs) devices or gallium nitride (GaN) devices. Compared to the larger area LDMOS used in dedicated wireless communication devices, the use of gallium arsenide (GaAs) or gallium nitride (GaN) devices as the second power amplifier in the embodiments of this application significantly reduces the area of ​​the power amplifier, facilitating device miniaturization and integration.

[0016] In a second aspect, an electronic device is provided, including at least one antenna and front-end circuitry as described in the first aspect and any possible implementation thereof.

[0017] In one possible implementation, at least one tuning circuit is also included, wherein the antenna is connected to the tuning circuit.

[0018] In one possible implementation, a processing circuit is further included, coupled to the front-end circuit, and configured to send at least one of the following control signals to the front-end circuit: a control signal for a first power amplifier, a second power amplifier, or a first switching circuit. The control signal output by the processing circuit to the power amplifier can be an enable signal, which controls the power amplifier to be in an operational state; the control signal output by the processing circuit to the switching circuit can be a gating control signal, which controls the switching circuit to turn on different connected devices.

[0019] In one possible implementation, the housing of the electronic device includes a frame and a back cover connected to the frame; at least one antenna is disposed on the frame and / or the back cover. In this solution, by using the antenna of a wireless network communication device (the frame antenna or the antenna of the back cover) instead of the antenna of the wireless communication device, the antenna of the wireless communication device becomes an invisible antenna, thereby integrating the wireless communication system into commonly used consumer terminal electronic devices.

[0020] In one possible implementation, the electronic device further includes a first radio frequency (RF) circuit and a second RF circuit disposed on the same chip. This allows the RF circuits of the wireless communication device to be integrated within the RF circuit chip of the wireless network communication device; of course, in some examples, the baseband integrated circuit (BBIC) of the wireless communication device can also be integrated within the baseband integrated circuit (BBIC) chip of the wireless network communication device.

[0021] Thirdly, a chip is provided, including a substrate and a front-end circuit packaged on the substrate, the front-end circuit including the front-end circuit described in the first aspect and any possible implementation thereof. Attached Figure Description

[0022] Figure 1 A schematic diagram of a communication scenario of an electronic device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 3 A schematic diagram of the structure of the frame of an electronic device provided in an embodiment of this application; Figure 4 A schematic diagram illustrating an antenna mounted on the back cover of an electronic device, as provided in an embodiment of this application. Figure 5 A schematic diagram of multiple antennas disposed on the housing of an electronic device according to an embodiment of this application; Figure 6 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application; Figure 7 A schematic diagram of the structure of a point-to-point communication device provided in an embodiment of this application; Figure 8 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application; Figure 10 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application; Figure 11 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application; Figure 12 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application; Figure 13 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application; Figure 14 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0024] In the following description, the terms "first," "second," etc., are used for descriptive convenience only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0025] The term "coupled connection" should be interpreted broadly. For example, "coupled connection" can be a direct electrical connection, such as physical contact and electrical conduction between two components. It can also be understood as the electrical connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB), to transmit electrical signals. Alternatively, "coupled connection" can be an indirect electrical connection between two components through an intermediate medium. Or, "coupled connection" can be an electrical connection between two components in a non-contact manner, such as the electrical connection between two components using capacitive coupling to transmit electrical signals.

[0026] In this embodiment of the application, "and / or" describes the relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following associated objects have an "or" relationship.

[0027] Radiator: In an antenna, this is the device used to receive / transmit electromagnetic wave radiation. In some cases, the term "antenna" is narrowly defined as a radiator, which converts guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, for radiating and receiving radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via a feed line, where it is converted into electromagnetic wave energy of a certain polarization and radiated in the desired direction. The receiving radiator converts the electromagnetic wave energy of a certain polarization from a specific direction in space back into modulated high-frequency current energy, which is then transmitted to the receiver input via a feed line. In the following embodiments, the term "antenna" generally refers to a radiator.

[0028] Radio frequency integrated circuit (RFIC): also known as RF chip, is a combination of all components of an antenna used for receiving and transmitting radio frequency waves (or radio frequency signals, typically in the frequency range of 3 kHz to 300 GHz). RF chips play a core role in wireless communication, radar, satellite communication, the Internet of Things, and other fields, responsible for key functions of wireless communication such as signal transmission, reception, modulation, and demodulation.

[0029] Front-end modules (FEMs): Also known as front-end modules, they typically consist of amplifiers (e.g., power amplifiers (PAs), low-noise amplifiers (LNAs), filters (or duplexers), and switches. Based on the hardware in these front-end modules, they provide the necessary (amplification, filtering) and RF channel selection functions for each RF channel (including the receive channel RX and the transmit channel TX) under different communication standards. In the embodiments of this application, the RF channels mainly include a receive channel for receiving RF signals and a transmit channel for transmitting RF signals. In some examples, the receive channel typically includes an LNA and a filter, and the transmit channel typically includes a PA and a filter. In the embodiments of this application, the radio frequency front-end (RFFE) circuit typically includes one or more front-end modules (FEMs).

[0030] Modem (modulation and demodulation): Includes modules such as baseband processing and modulation / demodulation.

[0031] Tuner: Antenna design should consider the maximum power transfer capability and efficiency. To this end, the antenna feed impedance must be matched to the load resistance. The antenna feed impedance is a combination of resistance, capacitance, and inductance. To ensure maximum power transfer, the two impedances (load resistance and feed impedance) should be matched. Matching can be achieved by considering frequency requirements and antenna design parameters such as gain, directivity, and radiation efficiency. A tuner is a device used to adjust the antenna input impedance to match the radio transmitter output impedance and to adjust the antenna frequency. It can adjust the antenna input impedance and frequency by changing the values ​​of inductance, capacitance, and resistance to maximize radio signal transmission. Tuner circuits are commonly used in radio communications, broadcasting, and radar. Typically, a tuner circuit can be used to adjust the resonant mode of a radiator. A tuner circuit may include multiple branches, each corresponding to a state (also called a tuning state). In some examples, different branches may contain one or more components (tuning devices) such as resistors, capacitors, inductors, and short circuits. Different branches may contain different components or the same component with different parameters. For example, in one example, the tuning circuit consists of switches and tuning devices, such as an SP4T (single-pole four-throw) switch and four tuning devices forming four branches (where the four tuning devices are connected to the four selection terminals of the SP4T respectively). Thus, when the SP4T is in four throwing positions, there can be four tuning states. Alternatively, a 4SPST (four single-pole single-throw) switch can be used to form a tuning circuit in series with the four tuning devices, resulting in 16 tuning states. In another example, each branch of the tuning circuit can include an adjustable tuning device, such as an adjustable capacitor, an adjustable resistor, or an adjustable inductor.

[0032] Figure 1 This is a schematic diagram of a communication scenario for an electronic device provided in an embodiment of this application.

[0033] This application provides an electronic device that can provide users with wireless communication functions based on different communication standards. For example... Figure 1 As shown, depending on the usage scenario, the following examples divide this wireless communication function into two categories: wireless network communication and offline communication.

[0034] Specifically, wireless network communication is a type of communication between devices that relies on an external network (such as cellular networks or Wi-Fi); network-free communication is a point-to-point communication method where devices transmit information directly without relying on an external network. In the examples below, devices used for network-free communication are also called point-to-point communication devices or network-free communication devices. Based on different communication standards, electronic devices can communicate with base stations via cellular networks, with communication satellites via satellite, or with routers, headsets, walkie-talkies, or other electronic devices at close range via non-cellular (NC) communication to meet the needs of different scenarios.

[0035] Cellular communication is a type of terrestrial communication, and includes technologies such as 2G, 3G, 4G, 5G, 5.5G, and future communication technologies. Non-cellular (NC) communication also falls under the category of terrestrial communication, and includes technologies such as Wireless Fidelity (WiFi), Bluetooth (BT), Bluetooth Low Energy (BLE), Near Link, SparkLink Low Energy (SLE), Location Based Services (LBS), Global Positioning System (GPS), Near-Field Communication (NFC), Radio Frequency Identification (RFID), and walkie-talkie communication. Satellite communication falls under the category of non-terrestrial network (NTN) communication, which includes geostationary earth orbit (GEO) satellite communication (also known as geostationary orbit communication satellites), medium earth orbit (MEO) satellite communication, and low earth orbit (LEO) satellite communication. Wireless network communication primarily includes cellular and WiFi communication, while network-free communication mainly includes BitTorrent (BT) communication and walkie-talkie communication.

[0036] The electronic devices in this application embodiment can be mobile phones, tablets, laptops, smart home devices, smart bracelets, smartwatches, smart helmets, smart glasses, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, positioning devices, etc. Electronic devices can also be handheld devices with wireless communication capabilities, computing devices or other processing devices connected to a wireless modem, in-vehicle devices, terminal devices in 5G networks, or electronic devices in future evolved public land mobile networks (PLMNs), etc.

[0037] Figure 2 An electronic device provided in an embodiment of this application is illustrated, with a mobile phone as an example. The mobile phone can be a candybar phone, a folding phone (e.g., bi-folding, tri-folding, and small-folding phones), or other common devices.

[0038] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0039] This application provides an electronic device, such as... Figure 2 As shown, the electronic device includes a cover 10, a display / module 11, a printed circuit board (PCB) 12, a middle frame 13, and a rear cover 14. In one embodiment, the cover 10, the middle frame 13, and the rear cover 14 can all be considered as a housing.

[0040] In some embodiments, the cover plate 10 can be a glass cover plate, or it can be replaced with a cover plate made of other materials, such as an ultra-thin glass cover plate, a polyethylene terephthalate (PET) cover plate, etc. The cover plate 10 can be installed close to the display screen 11 and can be mainly used to protect the display screen 11 from dust.

[0041] In one embodiment, the display screen 11 may include a liquid crystal display (LCD), a light emitting diode (LED) display panel, or an organic light-emitting diode (OLED) display panel, etc. In addition, the display screen 11 may also integrate a touch screen, but the embodiments of this application do not limit this.

[0042] The middle frame 13 mainly serves to support the entire machine. Figure 2 The diagram shows PCB 12 positioned between the middle frame 13 and the back cover 14. It should be understood that in one embodiment, PCB 12 may also be positioned between the middle frame 13 and the display screen 11; this application does not limit the embodiments to this. PCB 12 may be made of flame-retardant material (FR-4) dielectric substrate, Rogers dielectric substrate, or a hybrid dielectric substrate of Rogers and FR-4, etc. Here, FR-4 is a designation for a flame-retardant material grade, and Rogers dielectric substrate is a high-frequency board. Electronic components, such as radio frequency integrated circuits (RFICs) or radio frequency circuits, are carried on PCB 12.

[0043] In one embodiment, a metal layer may be disposed on PCB 12. This metal layer can be used to ground electronic components carried on PCB 12, or to ground other components such as bracket antennas, frame antennas, etc. This metal layer may be referred to as a ground plane, grounding plate, or grounding layer. In one embodiment, this metal layer can be formed by etching metal onto the surface of any dielectric substrate in PCB 12. In one embodiment, the grounding metal layer may be disposed on the side of PCB 12 near the middle frame 13. In one embodiment, the edge of the printed circuit board PCB 12 can be considered as the edge of its grounding layer. In one embodiment, the metal middle frame 13 can also be used to ground the aforementioned components. Electronic devices may also have other ground planes / grounding plates, which will not be elaborated here.

[0044] Electronic devices may also include batteries ( Figure 2 (Not shown in the image). The battery may be located between the middle frame 13 and the back cover 14, or between the middle frame 13 and the display screen 11. The embodiments of this application do not limit this. In some embodiments, the PCB 12 is divided into a motherboard and a daughterboard, and the battery may be located between the motherboard and the daughterboard. The motherboard may be located between the middle frame 13 and the upper edge of the battery, and the daughterboard may be located between the middle frame 13 and the lower edge of the battery.

[0045] The electronic device may also include a bezel 15, which may be formed of a conductive material such as metal. The bezel 15 may be disposed between the display screen 11 and the back cover 14 and extend circumferentially around the periphery of the electronic device. The bezel 15 may have four sides surrounding the display screen 11 to help secure the display screen 11. In one implementation, the bezel 15 made of a metallic material can be directly used as the metal bezel of the electronic device, forming a metallic bezel appearance, suitable for industrial design (ID). In another implementation, the outer surface of the bezel 15 may also be a non-metallic material, such as a plastic bezel, forming a non-metallic bezel appearance, suitable for non-metallic ID.

[0046] The middle frame 13 may include a border 15. The middle frame 13, including the border 15, is a single unit that supports the electronic components in the device. The cover plate 10 and the rear cover 14 respectively cover the upper and lower edges of the border 15 to form the housing of the electronic device. Alternatively, the border 15 may not be considered part of the middle frame 13. In one embodiment, the border 15 may be connected to and integrally formed with the middle frame 13. In another embodiment, the border 15 may include an inwardly extending protrusion to connect with the middle frame 13, for example, by means of spring clips, screws, welding, etc. In one embodiment, the cover plate 10, the rear cover 14, the border 15, and the middle frame 13 may be collectively referred to as the housing of the electronic device. It should be understood that "housing" can be used to refer to part or all of any one of the cover plate 10, the rear cover 14, the border 15, or the middle frame 13, or to any combination of the cover plate 10, the rear cover 14, the border 15, or the middle frame 13.

[0047] The back cover 14 can be made of metal; it can also be made of non-conductive material, such as glass or plastic; or it can be made of both conductive and non-conductive materials.

[0048] In one embodiment, the frame 15 can at least partially serve as a radiator for transmitting / receiving radio frequency signals. This portion of the frame serving as the radiator may have gaps between itself and other parts of the middle frame 13, or between itself and the middle frame 13, to ensure a good radiation environment for the radiator. In one embodiment, an aperture may be provided near this portion of the frame serving as the radiator. In one embodiment, the aperture may include an aperture disposed inside the electronic device, for example, an aperture not visible from the external surface of the electronic device. In one embodiment, the internal aperture may be formed by any one or multiple of the middle frame 13, battery, PCB 12, back cover 14, display screen 11, and other internal conductive components. For example, the internal aperture may be formed by a structural component of the middle frame 13. In one embodiment, the aperture may also include a slot / slit / opening on the frame 15. In one embodiment, the slot / slit / opening on the frame 15 may be a slit formed on the frame 15, at which the frame 15 is divided into two parts without a direct connection. In one embodiment, the aperture may also include a slot / slit / opening on the back cover 14 or the display screen 11. In one embodiment, the back cover 14 includes a conductive material, and the apertures provided in the conductive material can communicate with the slots or gaps in the frame to form a continuous aperture on the surface of the electronic device.

[0049] Reference Figure 3 As shown, the frame 15 can be divided into four parts, which can be named according to their respective positions in the electronic device: upper frame 15-1 (top frame), lower frame 15-2 (bottom frame), first side frame 15-3 (left frame), and second side frame 15-4 (right frame). The upper frame 15-1 and lower frame 15-2 are positioned opposite each other at the top and bottom of the electronic device, respectively. The first side frame 15-3 and second side frame 15-4 connect the upper frame 15-1 and lower frame 15-2 and are positioned on either side of the electronic device. The top of the electronic device is actually the end closest to the front-facing camera, earpiece (receiver, RCV), proximity sensor, and other devices; the bottom of the electronic device is the end containing the USB charging port, microphone, and other devices. The sides of the electronic device also have volume control buttons and a power button, which can be located on the first side frame 15-3 and / or the second side frame 15-4.

[0050] In one embodiment, the radiator of the electronic device may also be disposed within the frame 15. The frame 15 comprises a non-conductive material, and the radiator of the antenna may be located within the electronic device and disposed along the frame 15, or the radiator may be at least partially embedded within the non-conductive material of the frame. In one embodiment, the radiator is disposed close to the non-conductive material of the frame 15 to minimize the volume occupied by the radiator and to be closer to the outside of the electronic device, thereby achieving better signal transmission performance. It should be noted that "disposed close to the frame 15" means that the radiator can be disposed tightly against the frame 15, or it can be disposed close to the frame 15, for example, there may be a small gap between the radiator and the frame 15.

[0051] In one embodiment, the radiator of the electronic device may also be disposed within a housing, such as a bracket antenna mounted on a circuit board, see reference. Figure 4 As shown, the PCB12 in the electronic device has an insulating support on the side facing the back cover 14. The insulating support is coated with a metal layer so that the metal layer is attached to the insulating support and serves as the radiator of the antenna. Figure 4 This is a cross-sectional view of the electronic device provided in the embodiment of this application in the thickness direction. A gap may exist between the radiator disposed within the housing and other conductive components inside the housing, thereby ensuring a good radiation environment for the radiator. In one embodiment, an aperture may be provided near the radiator. In one embodiment, the aperture may include an aperture disposed inside the electronic device, for example, an aperture not visible from the external surface of the electronic device. In one embodiment, the internal aperture may be formed by any one or multiple of the frame 15, middle frame 13, battery, PCB 12, back cover 14, display screen 11, and other internal conductive components; for example, the internal aperture may be formed by a structural component of the middle frame 13. In one embodiment, the aperture may also include a slot / slit / opening on the frame 15. In one embodiment, the slot / slit / opening on the frame 15 may be a slit formed on the frame, at which the frame 15 is divided into two parts without a direct connection. In one embodiment, the aperture may also include a slot / slit / opening on the back cover 14 or the display screen 11. In one embodiment, the back cover 14 includes a conductive material, and the apertures formed in the conductive material can communicate with the slots or breaks in the frame to form continuous apertures on the surface of the electronic device. In one embodiment, the apertures on the back cover 14 or the display screen can also be used to house other devices, such as cameras, and / or sensors, and / or microphones, and / or speakers, etc.

[0052] In one embodiment, the antenna can be based on a flexible printed circuit (FPC), a laser-direct-structuring (LDS) antenna, or a microstrip disk antenna (MDA), among other forms. In another embodiment, the antenna can be a transparent or semi-transparent structure embedded within the screen of the electronic device, making it a transparent antenna element embedded within the screen of the electronic device.

[0053] The antenna ANT of this electronic device may include multiple antenna ANTs corresponding to one or more communication frequency bands under different communication standards or protocols. For example, these multiple antennas may be multiple antennas under the n77 frequency band of cellular communication, multiple antennas under the n78 frequency band, or multiple antenna ANTs under the n79 frequency band. (See reference...) Figure 5 As shown, an antenna layout for the n78 band is provided. Multiple antennas (ANTs) are mounted on the casing of the electronic device, including antennas n78-1, n78-2, n78-3, n78-4, n78-5, and n78-6. Antennas n78-1 and n78-3 are located on the upper frame 15-1, antenna n78-4 is located on the second side frame 15-4 on the left, and antenna n78-2 is located on the first side frame 15-3 on the right. Additionally, two antennas, n78-5 and n78-6, are also shown mounted on the rear cover 14. Antennas n78-5 and n78-6 can be arranged as follows: Figure 4 The diagram illustrates the arrangement of the radiators. In other examples, the multiple antennas (ANTs) can also be non-cellular communication antennas, such as antennas for WiFi communication or walkie-talkie communication.

[0054] An antenna can consist of a single radiator or be composed of portions of one or more radiators. In some examples, refer to... Figure 5As shown, antenna ANT1 includes the portion of the radiator at the upper right corner of the upper frame, and therefore can also be considered as an antenna stub. In the embodiments of this application, the multiple antennas disposed on the housing can be understood as multiple radiators disposed on the housing; that is, the antennas here can be understood as radiators. For each of these multiple radiators, when the corresponding feed source is coupled to the feed position on the radiator, and the feed source provides power to the radiator, the feed source and the radiator form a working antenna. More broadly, the antenna can also be considered to include a tuning device coupled to the radiator. In some examples, the feed source can be a communication standard (e.g., mid-high band (MHB) FEM and RFIC of cellular communication). Furthermore, the effective radiation area of ​​the antenna stub can be defined by the grounding location design; for example, the radiator mainly radiates radio frequency signals through the antenna stub between the feed source and the ground. These multiple antennas can be antennas for cellular communication (antennas for different frequencies of radio frequency signals used in cellular communication, such as mid and high band (MHB) and low band (LB)), or antennas for non-cellular communication, such as antennas for WiFi communication, Bluetooth communication, satellite communication, ultra-wide band (UWB) communication, satellite communication, GPS communication, near field communication (NFC) communication, and point-to-point wireless communication antennas such as walkie-talkies, etc. This application does not impose specific limitations on these.

[0055] Figure 2 The electronic device is shown only schematically, and the actual shape, size, and construction of these components are not subject to change. Figure 2 Limitations. In the embodiments of this application, the surface where the electronic device's display screen is located can be considered the front, the surface where the back cover is located the back, and the surface where the bezel is located the side. In the embodiments of this application, when a user holds (usually vertically and facing the screen) the electronic device, the electronic device is considered to be positioned at the top, bottom, and side. The electronic device in the embodiments of this application can have various specific options, such as including any electronic device like a candybar phone, a foldable phone, a multi-folding phone, a tablet computer, a smart screen, a smartwatch, or smart glasses.

[0056] Reference Figure 6As shown, a schematic diagram of an electronic device architecture is also provided, which includes: a processor (or processing circuit) 20, a memory 21, an RF chip 22, a front-end circuit (FEM) 23, a sensor 24, a display screen 11, and an antenna ANT, etc. Of course, the devices listed here are not all the devices in the electronic device, and other devices may be included in some examples. Typically, the aforementioned processor 20, memory 21, RF chip 22, sensor 24, and display screen 11 are connected together via a bus 25. The RF chip 22 also supplies power to the radiator of the antenna ANT by connecting to the feed point of the radiator through the front-end circuit 23.

[0057] Processor 20 may include one or more processing cores. Processor 20 connects to various parts of the electronic device via various interfaces and lines (e.g., bus 25), and performs various functions and processes data by running or executing instructions, programs, code sets, or instruction sets stored in memory 21, and by calling data stored in memory 21. For example, processor 20 may be implemented using at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), or programmable logic array (PLA). Processor 20 may integrate one or more of the following: central processing unit (CPU), graphics processing unit (GPU), neural network processing unit (NPU), application processor (AP), and modem. The CPU primarily handles the operating system, user interface, and applications. The GPU is responsible for rendering and drawing the content to be displayed on display screen 11. The NPU is used to implement artificial intelligence (AI) functions. The modem is used for wireless communication. It is understood that the aforementioned modem may not be integrated into the processor 20, but may be implemented as a separate chip. In some examples, the modem may also be integrated into the baseband integrated circuit (BBIC or baseband chip). Furthermore, the aforementioned radio frequency (RFIC) chip may also be integrated into the processor 20, or implemented as a separate chip. The processor can execute programs stored in the memory to implement the corresponding communication methods of the electronic device.

[0058] The memory 21 may include random access memory (RAM) or read-only memory (ROM). Exemplarily, the memory 21 includes a non-transitory computer-readable storage medium, and the memory 21 can be used to store instructions, programs, code, code sets, or instruction sets. The memory 21 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as touch functionality, sound playback functionality, image playback functionality, etc.), instructions for implementing the various method embodiments of this application, etc. The data storage area may store data created based on the use of the electronic device (such as audio data, phonebook, etc.).

[0059] The display screen 11 is a display component used for displaying images, and is typically located on the light-emitting side of an electronic device. The display screen 11 can be designed as a full-screen, curved screen, irregularly shaped screen, dual-sided screen, or foldable screen, etc. The display screen 11 can also be designed as a combination of a full-screen and a curved screen, or a combination of an irregularly shaped screen and a curved screen, etc., and the embodiments of this application do not limit this.

[0060] The functions of the RF chip 22 and the front-end circuit 23 are as described above and will not be repeated here. Furthermore, those skilled in the art will understand that the above... Figure 6 The structure of the electronic device shown does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements. For example, the electronic device may also include components such as a microphone, earpiece, speaker, input unit, audio circuit, wireless fidelity (WiFi) module, power supply, and Bluetooth module, which will not be described in detail here.

[0061] As wireless communication becomes increasingly widespread, the demand for ground-based wireless communication (such as hiking in uninhabited areas, wireless garages, and caves) is growing. Achieving long-distance, stable, and cost-effective wireless communication has been a key area of ​​our research. One of the most common point-to-point communication products in wireless communication is the walkie-talkie. As a specialized device with limited functionality, and based on electromagnetic field transmission theory, low-frequency (LB) electromagnetic waves have a longer transmission distance. Wireless communication equipment tends to use low-frequency bands. However, professional equipment using low-frequency technology requires large antennas; typically, professional equipment uses external braided antennas, which are also large. Furthermore, conventional walkie-talkies use discrete solutions, as seen in... Figure 7As shown, the components include BBIC, RFIC, front-end circuit FEM (such as power amplifier PA, which typically uses a large lateral double-diffused MOS in point-to-point communication devices such as walkie-talkies), and antennas. Each discrete component has a large area. Due to the above, such devices are bulky, have poor sound quality, and are expensive, resulting in poor adoption by ordinary consumers.

[0062] To solve the above problems, refer to Figure 8 As shown, the embodiments of this application mainly achieve area and cost minimization by integrating the functional modules (devices) on the wireless communication device (i.e., professional equipment for point-to-point communication such as walkie-talkies) with the functional modules on the wireless network communication device (i.e., mass consumer devices such as mobile phones). In the following embodiments, the power amplifier PA of the wireless communication device is miniaturized and integrated into the front-end circuit FEM of the wireless network communication (e.g., the low-frequency LB module of cellular communication), and the LNA in the front-end circuit FEM of the wireless network communication (e.g., the LNA in the low-frequency LB module of cellular communication) is directly reused. Of course, in some examples, the BBIC and RFIC of the wireless communication device can also be integrated into the MODEM and RFIC chips of the wireless network communication device (cellular communication device), respectively. At the same time, the antenna of the wireless communication device uses the antenna (frame antenna or back cover antenna) of the wireless network communication device to become an invisible antenna and reuses the low-frequency LB antenna aperture. After integrating the functional modules (devices) of the wireless communication device with the functional modules of the wireless communication device, logic control can be used to determine the PA, switch, LNA, etc. in the FEM module for use in wireless or wireless communication scenarios; the antenna switches different matching states according to the scenario to achieve the performance of wireless or wireless communication.

[0063] Specifically, refer to Figure 9 As shown, an embodiment of this application provides an electronic device including at least one antenna ANT (wherein, Figure 9 The image shows antennas ANT1 and ANT2, as well as the front-end circuit FEM.

[0064] The front-end circuit FEM includes a first power amplifier PA1, a second power amplifier PA2, and a first switching circuit K1.

[0065] The input terminal of the first power amplifier PA1 is used to couple to the first radio frequency circuit RFIC1, and the input terminal of the second power amplifier PA2 is used to couple to the second radio frequency circuit RFIC2. The output terminal of the first power amplifier PA1 is used to couple to the first switching circuit K1, and the output terminal of the second power amplifier PA2 is used to couple to the first switching circuit K1. The first switching circuit K1 is also used to couple to at least one antenna ANT. The first radio frequency circuit RFIC1 supports a first communication standard, and the second radio frequency circuit RFIC2 supports a second communication standard. The first communication standard includes wireless network communication, and the second communication standard includes wireless communication. Specifically, the first communication standard includes at least the following wireless network communication: cellular communication, and the second communication standard includes at least the following wireless communication: walkie-talkie communication. The operating frequency band of cellular communication includes the low-frequency band LB, and the maximum frequency of the operating frequency band of walkie-talkie communication is less than or equal to the maximum frequency of the low-frequency band. The low-frequency band LB refers to 300MHz-700MHz corresponding to cellular communication, or an extended 300MHz-900MHz band.

[0066] In this example, the first power amplifier PA1 and the second power amplifier PA2 employ gallium arsenide (GaAs) devices or gallium nitride (GaN) devices. Compared to dedicated devices for network-less communication that use larger LDMOS devices for their power amplifier PAs, this embodiment of the application significantly reduces the area of ​​the power amplifier PA by using GaAs or GaN devices for the second power amplifier PA2, which is beneficial for device miniaturization and integration. In some examples, the first communication standard includes cellular communication or WiFi communication; the second communication standard includes Bluetooth (BT) communication or walkie-talkie communication.

[0067] In some examples, continue to refer to Figure 9 As shown, the front-end circuit FEM further includes: a first filter F1 and a second filter F2; the first filter F1 is coupled between the output terminal of the first power amplifier PA1 and the first switching circuit K1; the second filter F2 is coupled between the output terminal of the second power amplifier PA2 and the first switching circuit K1; the passband of the first filter F1 includes the bandwidth of the first communication standard, and the passband of the second filter F2 includes the bandwidth of the second communication standard. The two filters can respectively filter the bandwidth of the RF transmission channel applicable to the two different communication standards. The third filter can filter the bandwidth of the RF receiving channel applicable to the first communication standard; and the fourth filter can filter the bandwidth of the RF receiving channel applicable to the second communication standard.

[0068] Specifically, refer to Figure 9As shown, the first RF circuit RFIC1 includes a first RF port TX1-LB0 for outputting RF signals, and the second RF circuit RFIC2 includes a second RF port TX1-LB1 for outputting RF signals. Specifically, the input terminal of the first power amplifier PA1 can be connected to the first RF port TX1-LB0, and the input terminal of the second power amplifier PA2 can be connected to the second RF port TX1-LB1. The output terminal of the first power amplifier PA1 is coupled to the first switching circuit K1 through a first filter F1, and the output terminal of the second power amplifier PA2 is coupled to the first switching circuit K1 through a second filter F2. This forms two RF transmission channels for transmitting RF signals, one of which includes the first power amplifier PA1 and the first filter F1, and the other includes the second power amplifier PA2 and the second filter F2. The first switching circuit K1 can selectively connect the two radio frequency transmission channels to the antenna to transmit radio frequency signals for both wireless network communication and offline communication. For example, when the first switching circuit K1 is coupled to only one antenna, it can be a single-pole double-throw (SPDT) switch, allowing wireless network communication and offline communication to time-division multiplex the antenna to transmit radio frequency signals. Alternatively, as... Figure 9 As shown, when the first switching circuit K1 is coupled to two antennas (ANT1 and ANT2) or multiple antennas, the first switching circuit can be a double-pole double-throw (DPDT) switch, which can select one antenna to conduct for each of the two RF transmission channels, thereby enabling the transmission of RF signals for two communication standards. For example, in... Figure 9 The image also shows a modem MODEM1 coupled to the first radio frequency chip RFIC1 and a modem MODEM2 coupled to the second radio frequency chip RFIC2.

[0069] In the above example, the main method is to integrate the power amplifier PA of the wireless communication device into the front-end circuit FEM of the wireless network communication (such as the low-frequency LB module of cellular communication), thereby integrating the wireless communication system into commonly used consumer terminal electronic devices.

[0070] In some examples, continue to refer to Figure 10 As shown, the front-end circuit FEM also includes a first low-noise amplifier LNA1; the input terminal of the first low-noise amplifier LNA is coupled to the first switching circuit K1; the output terminal of the first low-noise amplifier LNA is coupled to the first radio frequency circuit RFIC1. In some examples, refer to... Figure 10As shown, the front-end circuit FEM also includes: a second low-noise amplifier LNA2, the input terminal of which is coupled to the first switching circuit K1; and the output terminal of which is coupled to the second radio frequency circuit RFIC2.

[0071] In some examples, continue to refer to Figure 10 As shown, the front-end circuit FEM also includes a third filter F3; the third filter F3 is coupled between the first switching circuit K1 and the first low-noise amplifier LNA1; the passband of the third filter F3 includes the bandwidth of the first communication standard. In some examples, continue to refer to... Figure 10 As shown, the front-end circuit FEM also includes a fourth filter F4; the fourth filter F4 is coupled between the input terminal of the first switching circuit K1 and the second low-noise amplifier LNA2; the passband of the fourth filter F4 includes the bandwidth of the second communication standard.

[0072] Specifically, refer to Figure 10 As shown, the first RF circuit RFIC1 includes a third RF port RX1A for receiving RF signals, and the second RF circuit RFIC2 includes a fourth RF port RX1B for receiving RF signals. Specifically, the output of the first low-noise amplifier LNA1 can be connected to the third RF port RX1A, and the output of the second low-noise amplifier LNA2 can be connected to the fourth RF port RX1B. The input of the first low-noise amplifier LNA1 is coupled to the first switching circuit K1 through a third filter F3, and the input of the second low-noise amplifier LNA2 is coupled to the first switching circuit K1 through a fourth filter F4. This forms two RF receiving channels for receiving RF signals, one of which includes the first low-noise amplifier LNA1 and the third filter F3, and the other includes the second low-noise amplifier LNA2 and the fourth filter F4. The first switching circuit K1 can be a multi-pole multi-throw (XPXT) switch. This allows the selective conduction of the two RF receiving channels with the antenna to receive RF signals for both wireless network communication and offline communication. For example, when the first switching circuit K1 is coupled to only one antenna, wireless network communication and offline communication can time-division multiplex that single antenna to receive RF signals, or, as... Figure 10 As shown, when the first switching circuit K1 is coupled to two antennas (ANT1 and ANT2) or multiple antennas, it can select one antenna to conduct for each of the two RF receiving channels, thereby realizing the reception of RF signals of two communication standards.

[0073] Additionally, refer to Figure 11As shown, in some examples, a second switching circuit K2 can also be provided between the power amplifier and the filter, wherein the front-end circuit FEM further includes: the second switching circuit K2; the second switching circuit K2 is coupled to the first filter F1, the second filter F2, the first power amplifier PA1, and the second power amplifier PA2. Specifically, the second switching circuit K2 can connect the first power amplifier PA1 and the first filter F1 to form an RF transmission channel for wireless network communication, and connect the second power amplifier PA2 and the second filter F2 to form another RF transmission channel for wireless communication.

[0074] In addition, refer to Figure 11 As shown, the two RF receive channels can also reuse the same low-noise amplifier. For details, please refer to [link / reference]. Figure 11 As shown, the front-end circuit FEM further includes a first low-noise amplifier LNA1, a third switching circuit K3, and a fourth switching circuit K4; the input terminal of the first low-noise amplifier LNA1 is coupled to the fourth switching circuit K4; the fourth switching circuit K4 is coupled to the first switching circuit K1 and the second switching circuit K2; the output terminal of the first low-noise amplifier LNA1 is coupled to the third switching circuit K3; the third switching circuit K3 is also used to couple to the first radio frequency circuit RFIC1 and the second radio frequency circuit RFIC2. In some examples, continue to refer to... Figure 11 As shown, the front-end circuit FEM also includes a third filter F3; the third filter F3 is coupled between the first switching circuit K1 and the fourth switching circuit K4; the passband of the third filter includes the bandwidth of the first communication standard. Thus, in some scenarios, the third filter F3 can be connected to the first low-noise amplifier LNA1 via the fourth switching circuit K4, and the first low-noise amplifier LNA1 can be connected to the first radio frequency chip RFIC1 via the third switching circuit K3, forming a radio frequency receiving channel for wireless network communication. Alternatively, in another scenario, the second filter F2 can be connected to the first low-noise amplifier LNA1 via the fourth switching circuit K4 and the second switching circuit K2, and the first low-noise amplifier LNA2 can be connected to the second radio frequency chip RFIC2 via the third switching circuit K3, forming a radio frequency receiving channel for wireless communication; in this case, the second filter F2 is used to filter the radio frequency signal received by the antenna; the second filter F2 can be multiplexed for the reception and transmission of radio frequency signals for wireless communication.

[0075] Furthermore, in the above Figure 10 as well as Figure 11 Based on this, when combining the two, embodiments of this application also provide a 1T2R (one transmitter, two receivers) front-end circuit FEM architecture, referring to... Figure 12 As shown, in Figure 11Based on this, the front-end circuit FEM further includes a fourth filter F4 and a fifth switching circuit K5, wherein the fourth filter F4 is coupled between the first switching circuit K1 and the fifth switching circuit K5; the passband of the fourth filter includes the bandwidth of the second communication standard. The front-end circuit FEM also includes a second low-noise amplifier LNA2, the input of which is coupled to the fifth switching circuit K5; the output of which is coupled to the third switching circuit K3. Furthermore, to realize the 1T2R (one transmit, two receive) front-end circuit FEM architecture for wireless network communication, embodiments of this application also provide an LB diversity circuit, which is connected to the first switching circuit K1. Typically, this LB diversity circuit includes at least one set of low-noise amplifiers and filters to form a radio frequency receiving channel for wireless network communication. Thus, when the first RF chip RFIC1 is used to implement wireless network communication, an RF transmission channel for transmitting RF signals can be formed through the first power amplifier PA1 and the first filter F1, and the first switching circuit K1 selects an antenna for this RF transmission channel to transmit RF signals. In addition, an RF transmission channel for receiving RF signals can be formed through the first low noise amplifier LNA1 and the third filter F3, and the first switching circuit K1 selects an antenna (e.g., ANT1) for this RF reception channel to receive RF signals. Another RF transmission channel for receiving RF signals can be formed through the LB diversity circuit, and the first switching circuit K1 selects an antenna (e.g., ANT2) for this RF reception channel to receive RF signals.

[0076] To realize the architecture of the 1T2R (one transmit, two receive) front-end circuit FEM for wireless communication, when the second RF chip RFIC2 is used to implement wireless communication, a RF transmission channel for RF signal transmission can be formed through the second power amplifier PA2 and the second filter F2. The first switching circuit K1 selects an antenna for this RF transmission channel to transmit RF signals. In addition, a RF transmission channel for RF signal reception can be formed through the first low-noise amplifier LNA1 and the second filter F2. The first switching circuit K1 selects an antenna (e.g., ANT1) for this RF reception channel to receive RF signals. Another RF transmission channel for RF signal reception can be formed through the second low-noise amplifier LNA2 and the fourth filter F4. The first switching circuit K1 selects an antenna (e.g., ANT2) for this RF reception channel to receive RF signals.

[0077] Furthermore, since the reception and transmission of the first RF chip RFIC1 can be performed in a time-division multiplexing manner, the first filter F1 and the third filter F3 can be connected to the same port of the first switching circuit K1 through the same line. And, in Figure 12 The system also provides a sixth switch circuit K6 located at the input terminal of the first power amplifier PA1. The sixth switch circuit K6 is coupled between the input terminal of the first power amplifier PA1 and the first radio frequency circuit RFIC1. Of course, the sixth switch circuit K6 can also provide a connection port for connecting other radio frequency circuits, so as to realize the multiplexing of the first power amplifier PA1 by multiple radio frequency circuits RFIC.

[0078] Of course, the above solutions are merely examples based on the idea of ​​miniaturizing the power amplifier (PA) of a wireless communication device and integrating it into the front-end circuit (FEM) of a wireless network communication device, and directly reusing the LNA in the FEM of the wireless network communication front-end circuit. It is understood that those skilled in the art can also obtain other FEMs based on the above ideas by simply adding, reducing, or adjusting the connection relationships of the switching circuit, PA, filter, and LNA. These simple modifications should all fall within the protection scope of the embodiments of this application. For example, in some examples, referring to... Figure 13 As shown, the above can also be... Figure 12 The second low-noise amplifier LNA2, the fifth switching circuit K5, and the fourth filter F4 in the front-end circuit FEM shown are housed in a single front-end circuit. For example, in Figure 13 In the circuit, the front-end circuit FEM1 includes a first power amplifier PA1, a second power amplifier PA2, a first filter F1, a second filter F2, a third filter F3, a first switching circuit K1, a second switching circuit K2, a third switching circuit K3, a fourth switching circuit K4, and a sixth switching circuit K6. Their connection relationships are as follows: Figure 12 The description shows that a 1T1R (one transmit, one receive) main set for wireless network communication and wireless communication is formed in the front-end circuit FEM1. The front-end circuit FEM2 includes a 1R (one receive) diversity consisting of the second low-noise amplifier LNA2, the fifth switching circuit K5, the fourth filter F4, and the fifth filter F5. The connection relationships of the second low-noise amplifier LNA2, the fifth switching circuit K5, and the fourth filter F4 can be referred to... Figure 12 The main difference lies in that the second low-noise amplifier LNA2, the fifth switching circuit K5, and the fourth filter F4 are placed on a single module. Furthermore, the passband of the newly added fifth filter F5 includes the bandwidth of the first communication standard, i.e., filtering of the radio frequency signal received for wireless network communication. The input terminal of the fifth filter F5 is coupled to the first switching circuit K1, and the output terminal of the fifth filter F5 is coupled to the fifth switching circuit K5. Figure 13In the provided example, since the diversity formed by the front-end circuit FEM2 can be multiplexed for wireless network communication and offline communication, the fourth filter F4 and the fifth filter F5 can be coupled to the first switching circuit K1 through the same line, or the fourth filter F4 and the fifth filter F5 can be coupled to the first switching circuit K1 through two lines respectively.

[0079] In addition, refer to Figures 9 to 14 As shown, the electronic device further includes a processing circuit; the processing circuit is coupled to a front-end circuit FEM (or FEM1 and FEM2 as described above), and is configured to send at least one of the following control signals to the front-end circuit FEM: a control signal for a first power amplifier, a second power amplifier, or a first switching circuit. The control signal output by the processing circuit to the PA can be an enable signal, which controls the PA to be in an operating state; the control signal output by the processing circuit to the switching circuit can be a gating control signal, which controls the switching circuit to turn on different connected devices. Figure 14 The example shown only includes one PA, one LNA, and one switching circuit K. It can be understood that the front-end circuit FEM can be the one described above. Figure 9 , Figure 10 , Figure 11 , Figure 12 as well as Figure 13 The FEM circuit shown can be configured such that the processing circuit controls the FEM circuit by enabling any PA or LNA in the FEM and selecting the switching circuit K.

[0080] The processing circuit may include a modem MODEM2 for wireless communication and a modem MODEM1 for wireless network communication. In some examples, it may also include a first radio frequency circuit RFIC1 and a second radio frequency circuit RFIC2. For example, the modem MODEM2 for wireless communication, the modem MODEM1 for wireless network communication, the first radio frequency circuit RFIC1, and the second radio frequency circuit RFIC2 may be integrated into different chips, or at least two may be integrated into the same chip as required. For example, the modem MODEM2 for wireless communication and the modem MODEM1 for wireless network communication may be integrated into one chip, and the first radio frequency circuit RFIC1 and the second radio frequency circuit RFIC2 may be integrated into one chip. Alternatively, the modem MODEM2 for wireless communication and the second radio frequency circuit RFIC2 may be integrated into the same chip, and the modem MODEM1 for wireless network communication may be integrated into the same chip. Or, the modem MODEM2 for wireless communication, the modem MODEM1 for wireless network communication, the first radio frequency circuit RFIC1, and the second radio frequency circuit RFIC2 may all be integrated into the same chip.

[0081] Reference Figure 14 As shown, it also includes at least one tuning circuit, wherein the antenna is connected to the tuning circuit. In some examples, the tuning circuit can also control the tuning circuit to change the state of the antenna by outputting a control signal to the tuning circuit; the tuning circuit may include, but is not limited to, a switch, wherein the specific structure and function of the tuning circuit are as described above.

[0082] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A front-end circuit, characterized in that, It includes a first power amplifier, a second power amplifier, and a first switching circuit; The input terminal of the first power amplifier is used to couple to the first radio frequency circuit, and the input terminal of the second power amplifier is used to couple to the second radio frequency circuit. The output terminal of the first power amplifier is coupled to the first switching circuit, the output terminal of the second power amplifier is coupled to the first switching circuit, and the first switching circuit is also used to couple to at least one antenna. The first radio frequency circuit supports a first communication standard, and the second radio frequency circuit supports a second communication standard. The first communication standard includes at least the following wireless network communication: cellular communication, and the second communication standard includes at least the following offline communication: walkie-talkie communication. The cellular communication operates in a frequency band including a low-frequency band (LB), and the maximum frequency of the walkie-talkie communication operates in a frequency band that is less than or equal to the maximum frequency of the low-frequency band.

2. The front-end circuit according to claim 1, characterized in that, The front-end circuit further includes: a first filter and a second filter; The first filter is coupled between the output terminal of the first power amplifier and the first switching circuit; The second filter is coupled between the output of the second power amplifier and the first switching circuit; The passband of the first filter includes the bandwidth of the first communication standard, and the passband of the second filter includes the bandwidth of the second communication standard.

3. The front-end circuit according to claim 1, characterized in that, The front-end circuit also includes a first low-noise amplifier; The input terminal of the first low-noise amplifier is coupled to the first switching circuit; The output terminal of the first low-noise amplifier is coupled to the first radio frequency circuit.

4. The front-end circuit according to claim 3, characterized in that, The front-end circuit also includes: A second low-noise amplifier, the input of which is coupled to the first switching circuit; The output of the second low-noise amplifier is coupled to the second radio frequency circuit.

5. The front-end circuit according to claim 3, characterized in that, The front-end circuit also includes a third filter; The third filter is coupled between the first switching circuit and the input terminal of the first low-noise amplifier; The passband of the third filter includes the bandwidth of the first communication standard.

6. The front-end circuit according to claim 4, characterized in that, The front-end circuit also includes a fourth filter; The fourth filter is coupled between the first switching circuit and the input terminal of the second low-noise amplifier; The passband of the fourth filter includes the bandwidth of the second communication standard.

7. The front-end circuit according to claim 2, characterized in that, The front-end circuit further includes: a second switching circuit; The second switching circuit is coupled to the first filter, the second filter, the output terminal of the first power amplifier, and the output terminal of the second power amplifier.

8. The front-end circuit according to claim 7, characterized in that, The front-end circuit also includes a first low-noise amplifier, a third switching circuit, and a fourth switching circuit. The input terminal of the first low-noise amplifier is coupled to the fourth switching circuit; The fourth switching circuit is coupled to the first switching circuit and the second switching circuit; The output terminal of the first low-noise amplifier is coupled to the third switching circuit. The third switching circuit is also used to couple the first radio frequency circuit and the second radio frequency circuit.

9. The front-end circuit according to claim 8, characterized in that, The front-end circuit also includes a third filter; The third filter is coupled between the first switching circuit and the fourth switching circuit; The passband of the third filter includes the bandwidth of the first communication standard.

10. The front-end circuit according to any one of claims 1-9, characterized in that, The first power amplifier and the second power amplifier use gallium arsenide (GaAs) devices or gallium nitride (GaN) devices.

11. An electronic device, characterized in that, It includes at least one antenna and a front-end circuit as described in any one of claims 1-10.

12. The electronic device according to claim 11, characterized in that, It also includes at least one tuning circuit, wherein the antenna is connected to the tuning circuit.

13. The electronic device according to claim 11 or 12, characterized in that, It also includes a processing circuit coupled to the front-end circuit and configured to send at least one of the following control signals to the front-end circuit: a control signal for the first power amplifier, the second power amplifier, or the first switching circuit.

14. The electronic device according to claim 11 or 12, characterized in that, The housing of the electronic device includes a frame and a back cover connected to the frame; The at least one antenna is disposed on the frame and / or the back cover.

15. The electronic device according to claim 11 or 12, characterized in that, The electronic device also includes a first radio frequency circuit and a second radio frequency circuit disposed on the same chip.

16. A chip, characterized in that, It includes a substrate and a front-end circuit packaged on the substrate, the front-end circuit including the front-end circuit as described in any one of claims 1-10.

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