Controller and air conditioner

Abstract

The application relates to the air conditioner technical field, and in particular to a controller and an air conditioner. The controller comprises: a first circuit board, a power circuit is arranged on the first circuit board, the power circuit comprises a power supply circuit and an inverter circuit, and the substrate of the first circuit board is a metal substrate; a second circuit board, electrically connected to the first circuit board, a control circuit is arranged on the second circuit board, the control circuit comprises an MCU circuit, an mofet circuit, a voltage sampling circuit, a current sampling circuit, an indoor fan driving circuit, an outdoor fan driving circuit, a display board communication circuit, an indoor temperature sampling circuit and a compressor driving circuit; a connecting piece, connected to the first circuit board and the second circuit board; and a radiator, the first circuit board is arranged on the radiator and at least partially attached to the radiator. The heat dissipation performance of the metal substrate is utilized to improve the heat dissipation effect of the controller, and the reliability and service life of the controller are improved.

Description

Technical Field

[0001] This application relates to the field of air conditioning technology, and more particularly to a controller and an air conditioner. Background Technology

[0002] A circuit board, which integrates components such as resistors, capacitors, and chips, is used to control the operating status of electronic devices. During operation, the components on the circuit board inevitably generate heat, thus requiring heat dissipation.

[0003] For vehicle parking air conditioners, which use DC low-voltage power supply, a relatively large current is required to achieve a good cooling effect. This causes the components to overheat, reducing their lifespan and reliability. Therefore, improving heat dissipation is a key issue that needs to be considered. Utility Model Content

[0004] To address the aforementioned technical problems, this application provides a controller and an air conditioner that improve the heat dissipation of the circuit board and enhance the lifespan and reliability of the controller.

[0005] In a first aspect, this application provides a controller suitable for an air conditioner, comprising: A first circuit board, on which a power circuit is arranged, the power circuit including a power supply circuit and an inverter circuit, the substrate of the first circuit board being a metal substrate. The second circuit board is electrically connected to the first circuit board and has a control circuit arranged thereon. The control circuit includes an MCU circuit, a MOFET circuit, a voltage sampling circuit, a current sampling circuit, an indoor fan drive circuit, an outdoor fan drive circuit, a display board communication circuit, an indoor temperature sampling circuit, and a compressor drive circuit. A connector that connects the first circuit board and the second circuit board; A heat sink, wherein the first circuit board is disposed on the heat sink and is at least partially attached to the heat sink.

[0006] The controller provided in this embodiment uses a metal substrate as the base of the first circuit board and arranges the power circuit on the first circuit board. This allows the heat dissipation performance of the metal substrate to be utilized, so that the heat generated by the power circuit can be quickly transferred to the heat sink and dissipated outward, thereby improving the heat dissipation effect of the controller. Arranging the control circuit on the second circuit board can reduce the impact of the heat generated by the power circuit on the control circuit. In this way, the heat dissipation problem is improved by utilizing the controller's own structural design, thereby improving the reliability and lifespan of the controller.

[0007] In some embodiments, the control circuit further includes an outdoor temperature sampling circuit, a compressor exhaust temperature sampling circuit, and an indoor coil temperature sampling circuit; And / or, the power circuit further includes a reverse connection protection circuit, a filter circuit, and a surge suppression circuit.

[0008] The outdoor temperature sampling circuit, compressor exhaust temperature sampling circuit, and indoor coil temperature sampling circuit are arranged on the second circuit board. They generate less heat themselves, reducing the impact of heat generated by the power circuit and also helping to reduce the size of the first circuit board. Reverse connection protection circuit, filter circuit, and surge suppression circuit improve the functionality of the first circuit board, and the generated heat can be transferred to the heat sink through the metal substrate.

[0009] In some embodiments, a first connector is provided on the first circuit board, and the first connector is used to connect a power connection line. The first circuit board is also provided with a plurality of second wiring components, which are configured as wiring terminals or sockets.

[0010] Since the substrate of the first circuit board is made of metal, its strength is relatively high. Therefore, placing the first connector on the first circuit board for connecting the power supply cable improves the connection stability between the first circuit board and the power supply cable. Furthermore, placing the second connector on the first circuit board meets the requirements for insertion and removal strength and also improves connection stability.

[0011] In some embodiments, the first circuit board and the second circuit board are stacked in the thickness direction of the first circuit board, and the distance between them is set to be greater than or equal to 5 mm.

[0012] By stacking the first circuit board and the second circuit board, it is beneficial to reduce the space occupied by the controller on the plane where the first circuit board is located. Furthermore, the contact between the first circuit board and the heat sink can reduce the impact of the heat generated by the power circuit on the first circuit board. The distance between the two is set to be greater than 5mm to meet the requirements of electrical clearance and ensure electrical safety.

[0013] In some embodiments, the substrate of the second circuit board is a fiberglass board.

[0014] The substrate of the second circuit board is made of fiberglass board, which allows for double-sided wiring, reducing the size of the second circuit board and reducing costs.

[0015] In some embodiments, the connector is configured as a pin header, and at least one of the pin headers is disposed between the first circuit board and the second circuit board.

[0016] The pin header serves both connecting and fixing functions. It can transmit data signals, thus achieving an electrical connection between the first and second circuit boards, and also serves to fix the first and second circuit boards in place. Alternatively, the connector can be a fixing post, which fixes the first and second circuit boards while the pin header transmits data signals.

[0017] In some embodiments, the heat sink includes a heat sink body and a plurality of heat sink fins, the first circuit board is attached to the heat sink body, and the heat sink fins are located on the side of the heat sink body opposite to the first circuit board.

[0018] The first circuit board is fixed on the heat dissipation body and is at least partially attached to the heat dissipation body. In this way, the heat generated by the components on the first circuit board can not only be dissipated outward through the first circuit board, but also transferred to the heat dissipation body and dissipated outward through multiple heat dissipation fins, which can further improve the heat dissipation effect.

[0019] In some embodiments, the controller further includes a flame-retardant housing connected to the heat sink, and the first circuit board and the second circuit board are located within the space enclosed by the flame-retardant housing and the heat sink body.

[0020] By incorporating a flame-retardant outer shell, which covers both the first and second circuit boards, a flame-retardant effect is achieved, and the shell also provides protection for both boards, preventing damage from impacts with external objects. Furthermore, the heat generated by the first circuit board is directly transferred to the heat sink, preventing it from remaining in the space for an extended period and causing a significant temperature rise, thus reducing the impact of the heat generated by the first circuit board on the second circuit board.

[0021] In some embodiments, the flame-retardant housing includes a lower shell, the lower shell including a base plate and a surrounding plate disposed on the base plate, the two surrounding to form a cavity with one end open, the base plate having a through hole for the first circuit board to pass through, the heat sink being connected to the base plate and covering the through hole, and the surrounding plate having a wire hole for the wire harness to pass through.

[0022] This allows the first circuit board, second circuit board, and heat sink to be assembled and then inserted into the flame-retardant housing through the through-holes, facilitating operation. Furthermore, the heat sink is directly connected to the base plate, ensuring the overall stability of the controller structure. Wiring holes are provided on the enclosure to facilitate the arrangement of the wiring harness for connecting the first circuit board.

[0023] Secondly, this application provides an air conditioner, including the controller provided in the first aspect above.

[0024] The air conditioner features a controller, the technical benefits of which will not be elaborated upon here. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the internal structure of a controller provided in an embodiment of this application; Figure 2 This application provides schematic diagrams of the controller structure for some embodiments. Figure 3 Figure 2 A top view of the controller in the diagram; Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure along the AA direction; Figure 5 for Figure 4 A magnified view of a portion of point B in the middle; Figure 6 for Figure 2 Schematic diagram of the local structure of the controller in the diagram Figure 1 ; Figure 7 for Figure 2 Schematic diagram of the local structure of the controller in the diagram Figure 2 ; Figure 8 for Figure 2 A schematic diagram of the lower casing of the controller; Figure 9 for Figure 2 A schematic diagram of the assembly of the lower housing and heat sink of the controller; Figure 10 for Figure 2 A schematic diagram of the structure of the controller's upper cover.

[0028] Wherein, 1. First circuit board; 11. First connector; 12. Second connector; 2. Second circuit board; 3. Connectors; 4. Radiator; 41. Radiator body; 42. Radiator fins; 5. Flame-retardant outer shell; 51. Lower shell; 511. Base plate; 5111. Through hole; 5112. Slot; 512. Enclosure; 5121. Wiring hole; 52. Top cover; 521. Clearance notch; 6. Power cord; 7. Wiring harness. Detailed Implementation

[0029] To better understand the above-mentioned objectives, features, and advantages of this application, the solution of this application will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0030] Many specific details are set forth in the following description in order to provide a full understanding of this application, but this application may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of this application, and not all embodiments.

[0031] In related technologies, parking air conditioners are powered by DC low voltage (24Vdc). For heavy trucks to achieve good cooling effects, the cooling capacity must be at least 2000W, corresponding to a maximum current of about 40A. The large current causes the power devices (resistors, capacitors, etc.) to overheat severely.

[0032] To achieve effective heat dissipation, heat dissipation methods can be broadly categorized as follows: The first category uses aluminum profile casings or metal radiators, typically employing air cooling, such as indoor or outdoor return air cooling. However, indoor return air cooling results in a loss of cooling capacity, while outdoor return air cooling is less effective due to high outdoor ambient temperatures. The second category involves mounting the controller to the compressor, utilizing the compressor's cooling capacity to dissipate heat. However, this results in some energy loss for the compressor, and the compressor's thermal expansion and contraction can cause the controller's seals to fail. The third category uses refrigerant cooling, but this involves complex piping, which is susceptible to damage from vibrations in the vehicle environment.

[0033] Therefore, improving heat dissipation through the controller's own structural design without affecting the rest of the structure is an issue that needs to be emphasized.

[0034] Based on this, this application provides a controller that utilizes the heat dissipation performance of a metal substrate to arrange the power circuit on a first circuit board and the control circuit on a second circuit board. This allows the heat generated by the power circuit to be transferred to and dissipated by the heat sink through the metal substrate, thereby improving the heat dissipation effect, alleviating the high heat generation problem caused by the high current of the parking air conditioner, and improving the lifespan and reliability of the controller.

[0035] The following reference Figures 1 to 10 The controller provided in the embodiments of this application will be described in detail.

[0036] Reference Figures 1 to 5 As shown, some embodiments of this application provide a controller, including a first circuit board 1 and a second circuit board 2. A power circuit is arranged on the first circuit board 1, which includes a power supply circuit and an inverter circuit. The substrate of the first circuit board 1 is a metal substrate.

[0037] The second circuit board 2 is electrically connected to the first circuit board 1. The second circuit board 2 is equipped with a control circuit, which includes an MCU circuit, a MOFET circuit, a voltage sampling circuit, a current sampling circuit, an indoor fan drive circuit, an outdoor fan drive circuit, a display board communication circuit, an indoor temperature sampling circuit, and a compressor drive circuit.

[0038] Thus, the power circuit draws a relatively large current during operation, generating a significant amount of heat. By placing the power circuit on the first circuit board 1, the good heat dissipation performance of the metal substrate is utilized to improve the controller's heat dissipation effect. Conversely, the control circuit draws a relatively small current during operation, generating less heat. Therefore, placing the control circuit on the second circuit board 2 not only helps reduce the area of ​​the first circuit board 1 but also prevents the heat generated by the power circuit from affecting the normal operation of the control circuit.

[0039] The metal substrate can be selected as an aluminum substrate, while the substrate of the second circuit board 2 can be selected as a fiberglass board, such as an FR-4 board. The thermal conductivity of the aluminum substrate is 160-200W / (Mk), which is 500-600 times that of the FR-4 board. In addition, the aluminum substrate has high rigidity and its bending strength can reach 150MPa.

[0040] Furthermore, the aluminum substrate is designed for single-sided wiring, allowing the circuit layer to be directly bonded to the insulating layer, which in turn is directly bonded to the aluminum substrate. This enables rapid heat transfer, leveraging the heat dissipation advantages of the aluminum substrate. Moreover, under the same temperature rise conditions, the aluminum substrate has a high power density, facilitating miniaturized controller design and saving installation space. The fiberglass board can be designed for double-sided wiring or single-sided wiring, meaning components can be placed on the top layer or on both the top and bottom layers. Double-sided wiring helps reduce the size of the second circuit board 2.

[0041] The components of the power circuit and control circuit mentioned above include capacitors, resistors, inductors, MCUs (Microcontroller Units), operational amplifiers, MOSFETs (Insulated Gate Field Effect Transistors), and TVS diodes (Transient Voltage Suppressors).

[0042] It should be noted that the components on the aluminum substrate are surface mount devices, which helps to reduce the size of the first circuit board 1, improves reliability, and increases production efficiency.

[0043] In some embodiments, the control circuit further includes an outdoor temperature sampling circuit, a compressor exhaust temperature sampling circuit, and an indoor coil temperature sampling circuit.

[0044] Understandably, the air conditioner includes an indoor fan, an outdoor fan, a compressor, a motor, an indoor temperature sensor, an outdoor temperature sensor, an indoor coil temperature sensor, and a compressor exhaust temperature sensor. The indoor fan drive circuit, the outdoor fan drive circuit, the display board communication circuit, the indoor temperature sampling circuit, the outdoor temperature sampling circuit, the compressor exhaust temperature sampling circuit, the indoor coil temperature sampling circuit, and the compressor drive circuit are arranged on the second circuit board 2. It generates less heat, which can reduce the influence of heat generated by the power circuit and also helps to reduce the size of the first circuit board 1.

[0045] In some embodiments, the power circuit described above further includes a reverse connection protection circuit, a filter circuit, and a surge suppression circuit.

[0046] The reverse connection protection circuit, filter circuit, and surge suppression circuit can improve the functionality of the first circuit board 1, and the generated heat can be transferred to the heat sink through the metal substrate.

[0047] The core function of the reverse connection protection circuit is to cut off the circuit or limit the reverse current when the power supply polarity is incorrect, preventing components from being burned out due to reverse high voltage / high current. The filter circuit is a key circuit in electronic systems used to process electrical signals or power supplies; its core function is to separate useful signals from mixed signals and filter out useless interference signals. The surge suppression circuit (also known as a surge protection circuit) is a protection design in electronic systems against transient overvoltage / overcurrent surges; its core function is to transfer, absorb, or block surge energy in a very short time, preventing downstream sensitive circuits from being damaged by transient high voltage / high current.

[0048] The controller also includes a connector 3, which is connected to the first circuit board 1 and the second circuit board 2. That is, the first circuit board 1 and the second circuit board 2 are not only electrically connected and can transmit data signals to each other, but are also relatively fixed through the connector 3.

[0049] Reference Figure 5 In one specific implementation, the connector 3 can be selected as a pin header, with at least one pin header positioned between the first circuit board 1 and the second circuit board 2. The pin header serves both connecting and fixing functions, transmitting data signals (i.e., establishing an electrical connection between the first circuit board 1 and the second circuit board 2) and fixing the first circuit board 1 and the second circuit board 2. Alternatively, the connector 3 can be selected as a fixing post, which fixes the first circuit board 1 and the second circuit board 2, while the first circuit board 1 and the second circuit board 2 can transmit data signals through the pin header.

[0050] Specifically, the first circuit board 1 and the second circuit board 2 can be arranged in a stacked configuration, that is, the first circuit board 1 and the second circuit board 2 are arranged in parallel, and the connector 3 is arranged between the first circuit board 1 and the second circuit board 2, so as to reduce the space occupied by the controller on the plane perpendicular to the stacking direction of the two circuit boards.

[0051] The controller provided in this embodiment uses a metal substrate as the base of the first circuit board 1 and arranges the power circuit on the first circuit board 1. This allows the heat dissipation performance of the metal substrate to be utilized, so that the heat generated by the power circuit can be quickly transferred to the heat sink and dissipated outward, thus improving the heat dissipation effect of the controller. Arranging the control circuit on the second circuit board 2 can reduce the impact of the heat generated by the power circuit on the control circuit. In this way, by using the controller's own structural design to improve the heat dissipation problem, the reliability and lifespan of the controller can be improved.

[0052] For parking air conditioners using this controller, it can effectively reduce the controller's temperature rise, improve the high heat generation problem caused by high current, and enhance the controller's reliability and lifespan. Furthermore, for the entire unit, it can eliminate the problem of poor cooling performance under high-temperature regulation caused by temperature zone frequency reduction and high-temperature protection.

[0053] In some embodiments, the first circuit board 1 and the second circuit board 2 are stacked in the thickness direction of the first circuit board 1, and the distance between them is set to be greater than 5 mm.

[0054] By stacking the first circuit board 1 and the second circuit board 2, it is beneficial to reduce the space occupied by the controller on the plane where the first circuit board 1 is located. Furthermore, the contact between the first circuit board 1 and the heat sink 4 can reduce the impact of the heat generated by the power circuit on the second circuit board 2. The distance between the two is set to be greater than 5mm to meet the requirements of electrical clearance and ensure electrical safety.

[0055] It should be noted that the spacing between the first circuit board 1 and the second circuit board 2 should take into account not only the requirements for electrical clearance, but also the limitations of the controller's installation space. In other words, the maximum value of the spacing between the first circuit board 1 and the second circuit board 2 is constrained by the installation space and can be set according to actual needs. No specific restrictions are imposed here.

[0056] In some embodiments, refer to Figure 1 The first circuit board 1 is provided with a first connector 11, which is used to connect the power connection line 6.

[0057] Understandably, since the substrate of the first circuit board 1 is made of a metal substrate, such as an aluminum substrate, its strength is relatively high. Thus, by placing the first connector 11 on the first circuit board 1 to connect the power connection line 6, the connection stability between the first circuit board 1 and the power connection line 6 can be improved.

[0058] For example, the first connector 11 can be selected as a terminal block, and the power connection line 6 is fixed to the terminal block by screws to realize the electrical connection between the power connection line 6 and the first circuit board 1.

[0059] In some embodiments, refer to Figure 1 The first circuit board 1 is provided with a plurality of second connectors 12, which are configured as terminals or sockets.

[0060] Understandably, since the substrate of the first circuit board 1 is a metal substrate, such as an aluminum substrate, its strength is relatively high. Thus, placing the second connector 12 on the first circuit board 1 can meet the requirements for insertion and removal strength and improve the stability of the connection.

[0061] For example, the controller described above is applicable to an air conditioner. In this case, the air conditioner's compressor, motor, indoor temperature sensor, outdoor temperature sensor, indoor coil sensor, indoor fan, outdoor fan, display panel interface, and compressor exhaust sensor are connected to the second wiring component 12 to achieve electrical connection with the first circuit board 1.

[0062] In some embodiments, refer to Figure 2 and Figure 6 The heat sink 4 includes a heat sink body 41 and multiple heat sink fins 42. The first circuit board 1 is attached to the heat sink body 41, and the heat sink fins 42 are located on the side of the heat sink body 41 away from the first circuit board 1.

[0063] The first circuit board 1 is fixed on the heat dissipation body 41 and is at least partially attached to the heat sink 4. In this way, the heat generated by the components on the first circuit board 1 is dissipated to the outside through the first circuit board 1, and at the same time, the heat is transferred to the heat dissipation body 41 and dissipated to the outside through multiple heat dissipation fins 42, which can further improve the heat dissipation effect.

[0064] The first circuit board 1 and the second circuit board 2 are stacked, with the second circuit board 2 located on the side of the first circuit board 1 away from the heat sink 4, which reduces the area of ​​the entire controller on the plane where the first circuit board 1 is located.

[0065] The aforementioned radiator 4 has fins, which can increase the heat dissipation area and further improve the heat dissipation effect.

[0066] For example, the first circuit board 1 is fixed to the heat sink 4 by screws, so that the first circuit board 1 and the heat sink 4 are detachably connected, which facilitates the assembly and disassembly of the first circuit board 1 and the heat sink 4.

[0067] In some embodiments, refer to Figure 2 , Figure 4 and Figure 7The controller also includes a flame-retardant housing 5, which is connected to the radiator 4, and the first circuit board 1 and the second circuit board 2 are located in the space enclosed by the flame-retardant housing 5 and the radiator 4.

[0068] Understandably, by setting a flame-retardant shell 5, which covers the first circuit board 1 and the second circuit board 2, a flame-retardant effect is achieved, and the first circuit board 1 and the second circuit board 2 are protected to prevent damage caused by collisions with external objects.

[0069] For example, refer to Figure 4 The flame-retardant outer shell 5 includes a lower shell 51 and an upper cover 52.

[0070] Reference Figures 7 to 9 The lower shell 51 of the flame-retardant shell 5 includes a base plate 511 and a surrounding plate 512 disposed on the base plate 511. The base plate 511 and the surrounding plate 512 form a cavity with one end open. A through hole 5111 is provided on the base plate 511 for the first circuit board 1 to pass through. The heat sink 4 is connected to the base plate 511 and covers the through hole 5111.

[0071] This allows the first circuit board 1, the second circuit board 2, and the heat sink 4 to be assembled and then installed into the flame-retardant housing 5 through the through hole 5111, which facilitates operation. Furthermore, the heat sink 4 is directly connected to the base plate 511, making the overall structure of the controller stable.

[0072] Furthermore, since the first circuit board 1 and the second circuit board 2 are stacked, with the second circuit board 2 located on the side of the first circuit board 1 away from the heat sink 4, the heat generated by the first circuit board 1 is directly transferred to the heat sink 4, avoiding the heat generated by the first circuit board 1 from staying in the space for a long time and causing a large temperature rise in the space. This reduces the impact of the heat generated by the first circuit board 1 on the second circuit board 2.

[0073] In addition, a recessed groove 5112 is provided on the base plate 511, and the heat sink 4 is disposed in the recessed groove 5112, which helps to reduce the overall size of the controller in the thickness direction of the first circuit board 1. A wire through hole 5121 is provided on the surrounding plate 512 to allow the wire harness 7 connected to the first circuit board 1 to pass through.

[0074] Reference Figure 10 The upper cover 52 is connected to the bottom plate 511 and covers the cavity, thus forming a space between the upper cover 52, the lower shell 51 and the heat sink 4 to accommodate the first circuit board 1 and the second circuit board 2. Correspondingly, the upper cover 52 is provided with a clearance notch 521 to avoid the wire harness 7.

[0075] The lower shell 51 and the upper cover 52 can be connected by screws, which makes the lower shell 51 and the upper cover 52 detachable, facilitating the assembly and disassembly of the lower shell 51 and the upper cover 52.

[0076] This application also provides an air conditioner, which includes the controller described above.

[0077] Among them, the air conditioner can be selected as a parking air conditioner. Compared with the controllers in related technologies, the temperature rise of this controller is less than 15°C under the conditions of heat dissipation through outdoor return air, ambient temperature of 60°C, and current of 40A. This effectively solves the problem of high heat generation caused by high current in parking air conditioners and improves the reliability and lifespan of the controller.

[0078] Of course, this controller can also be used in household air conditioners and other household appliances, not limited to air conditioners, such as washing machines, refrigerators, water heaters, etc., which will not be listed here.

[0079] For example, refer to Figures 1 to 10 This application provides a controller suitable for air conditioners, such as vehicle air conditioners.

[0080] The controller includes a first circuit board 1 and a second circuit board 2. The first circuit board 1 has a power circuit, which includes a reverse connection protection circuit, a filter circuit, a surge suppression circuit, a power supply circuit, and an inverter circuit. The substrate of the first circuit board 1 is a metal substrate, such as an aluminum substrate. The power supply circuit is a DC / DC power supply circuit. The second circuit board 2 has a control circuit and is electrically connected to the first circuit board 1. The substrate of the second circuit board 2 is a fiberglass board.

[0081] The controller also includes a connector 3, which is connected to the first circuit board 1 and the second circuit board 2. The connector 3 is configured as a pin header, which has both connection and fixing functions. It can transmit data signals, that is, realize the electrical connection between the first circuit board 1 and the second circuit board 2, and also serve to fix the first circuit board 1 and the second circuit board 2.

[0082] The aforementioned control circuit includes an MCU circuit, a MOFET circuit, a voltage sampling circuit, and a current sampling circuit. It also includes an indoor fan drive circuit, an outdoor fan drive circuit, a display board communication circuit, an indoor temperature sampling circuit, an outdoor temperature sampling circuit, a compressor exhaust temperature sampling circuit, an indoor coil temperature sampling circuit, and a compressor drive circuit.

[0083] Understandably, an air conditioner includes an indoor fan, an outdoor fan, a motor, a display panel, an indoor temperature sensor, an outdoor temperature sensor, a compressor exhaust temperature sensor, and an indoor coil temperature sensor.

[0084] The first circuit board 1 is provided with a first connector 11, which is used to connect the power connection line 6.

[0085] The first circuit board 1 is provided with a plurality of second wiring components 12, which are configured as terminals or sockets. The compressor, motor, indoor temperature sensor, outdoor temperature sensor, indoor coil sensor, indoor fan, outdoor fan, display board interface, and compressor exhaust sensor of the parking air conditioner are connected to the second wiring components 12 to achieve electrical connection with the first circuit board 1.

[0086] The controller also includes a heat sink 4, on which a first circuit board 1 is disposed and at least partially attached. Specifically, the heat sink 4 includes a heat sink body 41 and a plurality of heat sink fins 42, with the first circuit board 1 attached to the heat sink body 41 and the heat sink fins 42 located on the side of the heat sink body 41 opposite to the first circuit board 1.

[0087] The controller also includes a flame-retardant housing 5, which is connected to the radiator 4. The first circuit board 1 and the second circuit board 2 are located within the space enclosed by the flame-retardant housing 5 and the heat dissipation body 41 of the radiator 4.

[0088] The first circuit board 1 and the second circuit board 2 are stacked together, with the second circuit board 2 located on the side of the first circuit board 1 away from the heat sink 4. In this way, the heat generated by the first circuit board 1 is directly transferred to the heat sink 4, avoiding the heat generated by the first circuit board 1 from staying in the space for a long time and causing a large temperature rise in the space. This reduces the impact of the heat generated by the first circuit board 1 on the second circuit board 2.

[0089] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0090] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A controller suitable for air conditioners, characterized in that, include: A first circuit board, on which a power circuit is arranged, the power circuit including a power supply circuit and an inverter circuit, the substrate of the first circuit board being a metal substrate. The second circuit board is electrically connected to the first circuit board and has a control circuit arranged thereon. The control circuit includes an MCU circuit, a MOFET circuit, a voltage sampling circuit, a current sampling circuit, an indoor fan drive circuit, an outdoor fan drive circuit, a display board communication circuit, an indoor temperature sampling circuit, and a compressor drive circuit. A connector that connects the first circuit board and the second circuit board; A heat sink, wherein the first circuit board is disposed on the heat sink and is at least partially attached to the heat sink.

2. The controller according to claim 1, characterized in that, The control circuit also includes an outdoor temperature sampling circuit, a compressor exhaust temperature sampling circuit, and an indoor coil temperature sampling circuit. And / or, the power circuit further includes a reverse connection protection circuit, a filter circuit, and a surge suppression circuit.

3. The controller according to claim 1, characterized in that, The first circuit board is provided with a first connector, which is used to connect a power supply connection line; The first circuit board is also provided with a plurality of second wiring components, which are configured as wiring terminals or sockets.

4. The controller according to claim 1, characterized in that, The first circuit board and the second circuit board are stacked in the thickness direction of the first circuit board, and the distance between them is set to be greater than or equal to 5mm.

5. The controller according to any one of claims 1-4, characterized in that, The substrate of the second circuit board is a fiberglass board.

6. The controller according to any one of claims 1-4, characterized in that, The connector is configured as a pin header, and at least one of the pin headers is disposed between the first circuit board and the second circuit board.

7. The controller according to any one of claims 1-4, characterized in that, The heat sink includes a heat sink body and multiple heat sink fins. The first circuit board is attached to the heat sink body, and the heat sink fins are located on the side of the heat sink body opposite to the first circuit board.

8. The controller according to claim 7, characterized in that, The controller also includes a flame-retardant housing connected to the heat sink, and the first circuit board and the second circuit board are located within the space enclosed by the flame-retardant housing and the heat sink body.

9. The controller according to claim 8, characterized in that, The flame-retardant housing includes a lower shell, which includes a base plate and a surrounding plate disposed on the base plate. The two together form a cavity with one end open. The base plate has a through hole for the first circuit board to pass through. The heat sink is connected to the base plate and covers the through hole. The surrounding plate has a wire hole for the wire harness to pass through.

10. An air conditioner, characterized in that, Includes the controller as described in any one of claims 1-9.

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