Wafer film spreading device and wafer loading and unloading machine

Abstract

The utility model provides a kind of wafer film spreading device and wafer feeding and discharging machine, it is related to wafer testing technical field.The utility model each lifting assembly includes screw rod, nut seat and rotating wheel, nut seat is sleeved on screw rod, rotating wheel is fixed on the outer periphery of nut seat, and with first bearing platform rotation is connected, screw rod is fixedly connected with second bearing platform, and with first bearing platform rotation is connected, screw rod is fixedly connected with second bearing platform, and its top is flush with the upper surface of second bearing platform or below the upper surface of second bearing platform.Under the driving of driving part, transmission belt transmission thus drives multiple rotating wheels to rotate, so that screw rod moves along vertical direction, to drive second bearing platform to move along vertical direction, to adjust the height of wafer.The above-mentioned technical scheme fixes screw rod with second bearing platform, can move up and down with second bearing platform, avoid screw rod protruding the upper surface of second bearing platform, avoid interference with handling mechanism, affect the normal operation of wafer film spreading device.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, and in particular to a wafer expansion device and a wafer loading and unloading machine. Background Technology

[0002] In automated wafer testing, automatic wafer loading and wafer expansion are typically required. During expansion, the wafer height needs to be adjusted via a lifting mechanism. In existing technology, the lead screw of the lifting mechanism protrudes from the upper surface of the wafer-bearing platform, interfering with the transport mechanism and affecting normal wafer handling. Therefore, there is an urgent need to design a wafer expansion device that avoids interference with the transport mechanism. Utility Model Content

[0003] One objective of this invention is to provide a wafer expansion device that solves the technical problem of interference between the lifting mechanism and the transport mechanism in the prior art.

[0004] A further objective of this invention is to prevent the wafer expansion device from damaging the wafer.

[0005] Another objective of this invention is to provide a wafer loading and unloading machine having the aforementioned wafer expansion device.

[0006] Specifically, this utility model provides a wafer expansion device, comprising: First support platform; The second support platform is arranged vertically at intervals above the first support platform and is used to support the wafer; Multiple lifting components, each of the lifting components includes a lead screw, a nut seat and a rotating wheel, the nut seat is sleeved on the lead screw, the rotating wheel is fixed to the outer periphery of the nut seat and rotatably connected to the first support platform, the lead screw is fixedly connected to the second support platform, and its top is flush with or lower than the upper surface of the second support platform. The driving mechanism includes a driving component and a transmission belt. The driving component is mounted on the first support platform and connected to the transmission belt. The transmission belt is sleeved on the outside of the plurality of rotating wheels. Under the drive of the driving component, the transmission belt drives the plurality of rotating wheels to rotate, causing the lead screw to move vertically, thereby driving the second support platform to move vertically to adjust the height of the wafer.

[0007] Optionally, the nut seat, the rotating wheel, and the transmission belt are located between the first support platform and the second support platform.

[0008] Optionally, it also includes: A connector is sleeved on the top of the lead screw and connected to the lead screw and the second support platform; A bearing is connected to the rotating wheel and the first support platform, so that the rotating wheel rotates relative to the first support platform.

[0009] Optionally, both the first support platform and the second support platform are square. Multiple lifting components are evenly arranged at the four corners of the second support platform.

[0010] Optionally, it also includes: A limiting component is installed on the second support platform to limit the position of the wafer.

[0011] Optionally, the wafer is held by a metal ring, the metal ring being in contact with the limiting component, and the wafer expansion device further includes: At least one electrostatic discharge (ESD) protection component is mounted on the second support platform and grounded. The ESD protection component is in contact with the limiting component, thereby conducting with the metal ring.

[0012] Optionally, the limiting component includes an arc-shaped pressure plate that presses against the metal ring; The electrostatic protection component includes a metal wheel that contacts the side wall of the pressure plate.

[0013] Optionally, the number of electrostatic protection components is multiple, and the multiple electrostatic protection components are evenly arranged around the periphery of the pressure plate.

[0014] Optionally, it also includes: At least one photoelectric detection mechanism, each of the photoelectric detection mechanisms including a slotted photoelectric sensor and a photoelectric mounting plate, wherein the slotted photoelectric sensor is mounted on the first support platform, and the photoelectric mounting plate is mounted on the second support platform and cooperates with the corresponding slotted photoelectric sensor.

[0015] In particular, this utility model also provides a wafer loading and unloading machine, including the above-mentioned wafer expansion device.

[0016] In this invention, each lifting component includes a lead screw, a nut seat, and a rotating wheel. The nut seat is sleeved on the lead screw, and the rotating wheel is fixed to the outer periphery of the nut seat and rotatably connected to the first support platform. The lead screw is fixedly connected to the second support platform and rotatably connected to the first support platform. The top of the lead screw is flush with or lower than the upper surface of the second support platform. Driven by the driving component, the transmission belt drives multiple rotating wheels to rotate, causing the lead screw to move vertically, thereby moving the second support platform vertically to adjust the height of the wafer. This technical solution fixes the lead screw to the second support platform, allowing it to move up and down with the second support platform, thus preventing the lead screw from protruding from the upper surface of the second support platform, avoiding interference with the handling mechanism, and preventing disruption to the normal operation of the wafer expansion device.

[0017] Furthermore, in this invention, the wafer is held by a metal ring, which contacts the limiting component. The wafer expansion device also includes at least one electrostatic discharge (ESD) protection component, which is mounted on the second support platform and grounded. The ESD protection component contacts the limiting component, thereby establishing electrical conductivity with the metal ring. The above technical solution, through the design of the ESD protection component, can release static electricity and prevent electrostatic damage to the wafer.

[0018] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0019] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings: Figure 1 This is a schematic structural diagram of a wafer expansion apparatus according to an embodiment of the present invention; Figure 2 This is a schematic partial view of a wafer expansion apparatus according to an embodiment of the present invention; Figure 3 This is a schematic structural diagram of a limiting component and an electrostatic protection component according to an embodiment of the present invention.

[0020] Figure label: 100-Wafer expansion device, 200-Wafer, 210-Metal ring, 10-First support platform, 20-Second support platform, 30-Lifting assembly, 31-Screw rod, 32-Connector, 33-Nut seat, 34-Rotating wheel, 35-Bearing, 41-Transmission belt, 42-Drive component, 43-Driving wheel, 50-Limiting assembly, 51-Pressure plate, 60-Electrostatic protection assembly, 61-Metal wheel, 70-Photoelectric detection mechanism, 71-Photoelectric mounting plate, 72-Groove type photoelectric sensor. Detailed Implementation

[0021] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0022] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0024] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0026] Figure 1 This is a schematic structural diagram of a wafer expansion apparatus 100 according to an embodiment of the present invention. Figure 2 This is a schematic partial view of a wafer expansion apparatus 100 according to an embodiment of the present invention.

[0027] like Figure 1 and Figure 2 As shown, in a specific embodiment, the wafer expansion apparatus 100 includes a first support stage 10, a second support stage 20, a plurality of lifting components 30, and a drive mechanism. The second support stage 20 is arranged vertically at intervals above the first support stage 10 for supporting wafers 200. Each lifting component 30 includes a lead screw 31, a nut seat 33, and a rotating wheel 34. The nut seat 33 is sleeved on the lead screw 31, and the rotating wheel 34 is fixed to the outer periphery of the nut seat 33 and rotatably connected to the first support stage 10. The lead screw 31 is fixedly connected to the second support stage 20, and its top is flush with or lower than the upper surface of the second support stage 20. The drive mechanism includes a drive member 42 and a transmission belt 41. The drive member 42 is mounted on the first support stage 10 and connected to the transmission belt 41, which is sleeved on the outside of the plurality of rotating wheels 34. Driven by the drive unit 42, the transmission belt 41 drives multiple rotating wheels 34 to rotate, causing the lead screw 31 to move vertically, thereby moving the second support platform 20 vertically to adjust the height of the wafer 200. Here, it can be understood that the first support platform 10 is fixed, while the second support platform 20 can move up and down relative to the first support platform 10. The rotating wheels 34 are fixedly installed with the nut seat 33. The wafer expansion device 100 of this embodiment is suitable for 12-inch wafers.

[0028] In this embodiment, the lead screw 31 is fixedly connected to the second support platform 20, allowing it to move up and down together with the second support platform 20. This prevents the lead screw 31 from protruding from the upper surface of the second support platform 20, avoiding interference with the transport mechanism and affecting the normal operation of the wafer expansion apparatus 100. The transport mechanism here can be understood as the mechanism that transports the wafer 200 from the basket frame to the wafer expansion apparatus 100.

[0029] In some embodiments, the driving component 42 is a motor, and a drive pulley 43 is sleeved on the output shaft of the motor, with a transmission belt 41 sleeved on the drive pulley 43. When the output shaft of the motor rotates, the drive pulley 43 follows the transmission, thereby driving the transmission belt 41 to move.

[0030] In some embodiments, the rotating wheel 34 is a pulley and the transmission belt 41 is a belt.

[0031] In some embodiments, the nut seat 33, the rotating wheel 34, and the transmission belt 41 are located between the first support platform 10 and the second support platform 20. In other embodiments, the positions of the nut seat 33, the rotating wheel 34, and the transmission belt 41 can be determined according to specific design requirements.

[0032] In some embodiments, the wafer expansion apparatus 100 further includes a connector 32 and a bearing 35. The connector 32 is sleeved on the top of the lead screw 31 and connected to the lead screw 31 and the second support platform 20. The bearing 35 is connected to the rotating wheel 34 and the first support platform 10, allowing the rotating wheel 34 to rotate relative to the first support platform 10. Here, it can be understood that the lead screw 31 is fixedly connected to the second support platform 20 via the connector 32, the lead screw 31 is drively connected to the nut seat 33, the nut seat 33 is fixedly connected to the rotating wheel 34, and the rotating wheel 34 is rotatably connected to the first support platform 10 via the bearing 35, thereby enabling the second support platform 20 to move up and down relative to the first support platform 10.

[0033] In some embodiments, both the first support platform 10 and the second support platform 20 are square. Multiple lifting components 30 are evenly arranged at the four corners of the second support platform 20. Here, the number of lifting components 30 is four, with one lifting component 30 at each corner of the second support platform 20, thereby better supporting the second support platform 20 and improving its stability during lifting. In other embodiments, the number of lifting components 30 can be determined according to specific design requirements.

[0034] Figure 3 This is a schematic structural diagram of the limiting component 50 and the electrostatic protection component 60 according to an embodiment of the present invention. Figure 3 As shown, and see Figure 1 In some embodiments, the wafer expansion apparatus 100 further includes a limiting component 50, which is mounted on the second support stage 20 and used to limit the wafer 200. This can be understood as follows: when the wafer 200 is moved onto the second support stage 20 by the transport mechanism, the limiting component 50 will limit the wafer 200, preventing it from moving during the expansion process.

[0035] In some embodiments, the wafer 200 is held by a metal ring 210, which contacts the limiting component 50. The wafer expansion device 100 also includes at least one electrostatic discharge (ESD) protection component 60, which is mounted on the second support platform 20 and grounded. The ESD protection component 60 contacts the limiting component 50, thereby conducting with the metal ring 210 to release static electricity.

[0036] This embodiment, through the design of the electrostatic discharge protection component 60, can release static electricity and prevent electrostatic damage to the wafer 200.

[0037] In some embodiments, the limiting component 50 includes an arc-shaped pressure plate 51 that presses against the metal ring 210. The electrostatic discharge protection component 60 includes a metal wheel 61 that contacts the sidewall of the pressure plate 51.

[0038] In some embodiments, the number of electrostatic discharge (ESD) protection components 60 is multiple, and the multiple ESD protection components 60 are evenly arranged around the periphery of the pressure plate 51. Here, the number of ESD protection components 60 is four. In other embodiments, the number of ESD protection components 60 can also be determined according to specific design requirements, for example, it can be five, six, etc.

[0039] In some embodiments, the wafer expansion apparatus 100 further includes at least one photoelectric detection mechanism 70. Each photoelectric detection mechanism 70 includes a slotted photoelectric sensor 72 and a photoelectric mounting plate 71. The slotted photoelectric sensor 72 is mounted on a first support stage 10, and the photoelectric mounting plate 71 is mounted on a second support stage 20 and cooperates with the corresponding slotted photoelectric sensor 72.

[0040] This embodiment, through the design of the photoelectric detection mechanism 70, can detect the vertical displacement of the second support platform 20, thereby improving the accuracy of the movement of the second support platform 20.

[0041] In some embodiments, the optoelectronic mounting plate 71 is formed from aluminum, which provides a more stable structure compared to the thin metal sheets previously used.

[0042] This embodiment also provides a wafer loading and unloading machine, which includes the wafer expansion apparatus 100 of any of the above embodiments. Details regarding the wafer expansion apparatus 100 are not provided here.

[0043] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A wafer expansion apparatus, characterized in that, include: First support platform; The second support platform is arranged vertically at intervals above the first support platform and is used to support the wafer; Multiple lifting components, each of the lifting components includes a lead screw, a nut seat and a rotating wheel, the nut seat is sleeved on the lead screw, the rotating wheel is fixed to the outer periphery of the nut seat and rotatably connected to the first support platform, the lead screw is fixedly connected to the second support platform, and its top is flush with or lower than the upper surface of the second support platform. The driving mechanism includes a driving component and a transmission belt. The driving component is mounted on the first support platform and connected to the transmission belt. The transmission belt is sleeved on the outside of the plurality of rotating wheels. Under the drive of the driving component, the transmission belt drives the plurality of rotating wheels to rotate, causing the lead screw to move vertically, thereby driving the second support platform to move vertically to adjust the height of the wafer.

2. The wafer expansion apparatus according to claim 1, characterized in that, The nut seat, the rotating wheel, and the transmission belt are located between the first support platform and the second support platform.

3. The wafer expansion apparatus according to claim 2, characterized in that, Also includes: A connector is sleeved on the top of the lead screw and connected to the lead screw and the second support platform; A bearing is connected to the rotating wheel and the first support platform, so that the rotating wheel rotates relative to the first support platform.

4. The wafer expansion apparatus according to any one of claims 1-3, characterized in that, Both the first support platform and the second support platform are square. Multiple lifting components are evenly arranged at the four corners of the second support platform.

5. The wafer expansion apparatus according to any one of claims 1-3, characterized in that, Also includes: A limiting component is installed on the second support platform to limit the position of the wafer.

6. The wafer expansion apparatus according to claim 5, characterized in that, The wafer is held by a metal ring, which is in contact with the limiting component. The wafer expansion device further includes: At least one electrostatic discharge (ESD) protection component is mounted on the second support platform and grounded. The ESD protection component is in contact with the limiting component, thereby conducting with the metal ring.

7. The wafer expansion apparatus according to claim 6, characterized in that, The limiting component includes an arc-shaped pressure plate that presses against the metal ring; The electrostatic protection component includes a metal wheel that contacts the side wall of the pressure plate.

8. The wafer expansion apparatus according to claim 7, characterized in that, The number of electrostatic protection components is multiple, and the multiple electrostatic protection components are evenly arranged around the periphery of the pressure plate.

9. The wafer expansion apparatus according to claim 8, characterized in that, Also includes: At least one photoelectric detection mechanism, each of the photoelectric detection mechanisms including a slotted photoelectric sensor and a photoelectric mounting plate, wherein the slotted photoelectric sensor is mounted on the first support platform, and the photoelectric mounting plate is mounted on the second support platform and cooperates with the corresponding slotted photoelectric sensor.

10. A wafer loading and unloading machine, characterized in that, Includes the wafer expansion apparatus as described in any one of claims 1-9.

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