Blanking and lifting mechanism for microcrystalline thin film silicon wafer

Abstract

The application relates to a blanking jacking mechanism for microcrystalline thin film silicon wafers, which comprises a workbench assembly, a driving assembly, a transmission assembly and a jacking assembly. The workbench assembly comprises a workbench seat structure and a workbench plate, the workbench plate is fixedly installed on the workbench seat structure, and a containing space is arranged between the workbench plate and the bottom plate of the workbench seat structure. The driving assembly and the transmission assembly are arranged in the containing space, the jacking assembly is connected with the driving assembly through the transmission assembly, the jacking assembly penetrates through the workbench plate, and the jacking plane of the jacking assembly is movably arranged on the upper portion of the workbench plate to adjust the distance between the jacking plane and the upper surface of the workbench plate. The technical scheme of the application effectively solves the problem that the silicon wafer fragments are easy to scratch the product in the prior art.

Description

Technical Field

[0001] This application relates to the technical field of heterojunction solar cell conveying equipment, and more specifically, to a feeding and lifting mechanism for microcrystalline thin-film silicon wafers. Background Technology

[0002] The heterojunction process mainly consists of texturing, CVD, PVD, and screen printing. The texturing process removes oil, impurities, and mechanical damage layers from the silicon wafer surface and creates a pyramidal texture on the front and back surfaces. The CVD process deposits microcrystalline thin films on the front and back sides of the silicon wafer through chemical reactions. The PVD process deposits transparent oxide thin films on the front and back sides of the silicon wafer through magnetron sputtering. The screen printing process is for metallization pattern preparation. Pattern metallization involves pressing a conductive paste containing metal through the mesh of the screen onto the transparent oxide thin film to form very fine circuits or electrodes, thereby extracting photogenerated electrons into the cell.

[0003] PVD is the third process in heterojunction fabrication. Its principle involves generating plasma through low-pressure gas discharge. Positive ions in the plasma are accelerated into high-energy particles by an electric field. These particles collide with the target surface, exchanging energy and momentum, and are then sputtered out, depositing onto the substrate material to form a film. The equipment consists of an automated loading station, a main loading station, and an automated unloading station.

[0004] The automated feeding machine uses a gantry suction nozzle to remove the silicon wafers with completed microcrystalline thin films from the wafer track and place them into the pockets of the carrier substrate, before passing them down to the main machine. The main machine completes the deposition of double-sided transparent oxide films through the wafer entry / exit cavity, buffer cavity, transition cavity, and process cavity, before passing them down to the automated unloading machine. The lifting structure of the automated unloading machine pushes the silicon wafers with completed transparent oxide films out of the pockets of the carrier substrate, and then the gantry suction cups remove the silicon wafers and place them on the wafer track. After passing through PL and AOI cameras, defective silicon wafers are removed, and qualified silicon wafers are passed down to the basket, and then transported by AGV carts to the screen printing station.

[0005] In some existing technologies, abnormal height or pressure of the loading gantry suction nozzle, deformation of the carrier plate pocket, and wear of the conveyor wheels can all lead to microcracks inside the silicon wafers entering the automated unloading process. After the unloading lifting mechanism lifts the silicon wafer and it passes through the gantry suction cup, the microcracked silicon wafer will directly shatter. Due to the small height between the lifting mechanism beam and the lifting plane, larger fragments can get stuck between the beam and the lifting rod. When the top of the fragment protrudes above the lifting rod, it can cause continuous scratches on the back of subsequent products, resulting in batch defects. Utility Model Content

[0006] This application provides a feeding and lifting mechanism for microcrystalline thin-film silicon wafers to solve the problem that silicon wafer fragments can easily scratch products in the prior art.

[0007] According to this application, a feeding and lifting mechanism for microcrystalline thin-film silicon wafers includes: a worktable assembly, a drive assembly, a transmission assembly, and a lifting assembly. The worktable assembly includes a worktable base structure and a worktable plate. The worktable plate is fixedly installed on the worktable base structure, and there is an accommodating space between the worktable plate and the base plate of the worktable base structure. The drive assembly and the transmission assembly are both disposed within the accommodating space. The lifting assembly is connected to the drive assembly through the transmission assembly. The lifting assembly passes through the worktable plate, and the lifting plane of the lifting assembly is movably disposed on the upper part of the worktable plate to adjust the distance between the lifting plane and the upper surface of the worktable plate.

[0008] Furthermore, the transmission assembly includes a gear transmission structure and a threaded transmission structure. The gear transmission structure is connected to the output end of the drive assembly, and the threaded transmission structure is connected between the gear transmission structure and the lifting assembly.

[0009] Furthermore, the gear transmission structure includes a threaded gear disc and a gear rod. The threaded transmission structure includes a support sleeve and a threaded rod. The support sleeve is set on the base plate of the workbench structure. The threaded gear disc is rotatably set on the support sleeve. The gear rod is connected to the output end of the drive assembly. The threaded gear disc meshes with the gear of the gear rod. The thread of the threaded rod is adapted to the internal gear of the threaded gear disc. The upper end of the threaded rod is engaged with the lifting assembly.

[0010] Furthermore, the gear of the gear rod is a bevel gear, and the gear of the threaded gear disc is a bevel gear disc that is compatible with the bevel gear.

[0011] Furthermore, the lifting assembly includes a movable support plate and multiple lifting rods, with the top of each lifting rod being a flat surface to form a lifting plane. The movable support plate is mounted on the threaded rod, and each lifting rod is mounted on the movable support plate.

[0012] Furthermore, the lifting assembly also includes a crossbeam support structure, which is mounted on the movable bearing plate, and each lifting rod is mounted on the crossbeam support structure.

[0013] Furthermore, the crossbeam support structure includes multiple crossbeams and multiple I-shaped blocks. The multiple crossbeams are arranged at intervals on the movable bearing plate, and multiple I-shaped blocks are arranged along the axial direction of each crossbeam. Multiple lifting rods are arranged on each I-shaped block.

[0014] Furthermore, the workbench structure also includes two side plates, the width of which is adapted to the distance between the two side plates, and the two side plates are positioned between the workbench and the base plate.

[0015] Furthermore, there are limiting slides on both sides of the movable bearing plate and between the two side plates.

[0016] Furthermore, the workbench structure also includes two support plates, both located within the two side plates and between the base plate and the movable support plate, with the drive assembly fixed to the two support plates.

[0017] Using the technical solution of this application, the microcrystalline thin-film silicon wafers are located on the lifting assembly. During use, the drive assembly drives the transmission assembly, which in turn drives the lifting assembly. The distance between the lifting plane of the lifting assembly and the worktable is adjusted according to specific circumstances. For example, if many microcrystalline thin-film silicon wafers are broken, and the height of the broken wafers is 3cm, the distance between the lifting plane of the lifting assembly and the worktable can be adjusted to 4.5cm. This effectively prevents more wafers from being scratched by the breakage of a few broken wafers. The technical solution of this application effectively solves the problem in the prior art where silicon wafer fragments easily scratch the product. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A three-dimensional structural schematic diagram of the unloading and lifting mechanism according to an embodiment of this application is shown; Figure 2 It shows Figure 1 A three-dimensional structural diagram of the material unloading and lifting mechanism from another angle; Figure 3 It shows Figure 1 A top view of the material unloading and lifting mechanism; Figure 4 It shows Figure 1 A partially enlarged schematic diagram of the material unloading and lifting mechanism; Figure 5 It shows Figure 1 A partial schematic diagram of the lifting components of the material unloading lifting mechanism; Figure 6 It shows Figure 1 A three-dimensional structural diagram of the transmission components of the material unloading and lifting mechanism.

[0021] The above figures include the following reference numerals: 10. Workbench assembly; 11. Workbench base structure; 12. Workbench plate; 20. Drive assembly; 30. Transmission assembly; 31. Gear transmission structure; 311. Threaded gear disc; 312. Gear rod; 32. Threaded transmission structure; 321. Support sleeve; 322. Threaded rod; 40. Lifting assembly; 41. Moving support plate; 42. Lifting rod; 43. Crossbeam support structure; 431. Crossbeam; 432. I-shaped block. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0024] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0025] like Figures 1 to 6 As shown, the unloading and lifting mechanism for microcrystalline thin-film silicon wafers in this embodiment includes: a worktable assembly 10, a drive assembly 20, a transmission assembly 30, and a lifting assembly 40. The worktable assembly 10 includes a worktable base structure 11 and a worktable plate 12. The worktable plate 12 is fixedly mounted on the worktable base structure 11, and there is a receiving space between the worktable plate 12 and the base plate of the worktable base structure 11. The drive assembly 20 and the transmission assembly 30 are both disposed within the receiving space. The lifting assembly 40 is connected to the drive assembly 20 via the transmission assembly 30. The lifting assembly 40 passes through the worktable plate 12, and its lifting plane is movably disposed on the upper part of the worktable plate 12 to adjust the distance between the lifting plane and the upper surface of the worktable plate 12.

[0026] Applying the technical solution of this embodiment, the microcrystalline thin-film silicon wafer is located on the lifting assembly 40. During use, the driving assembly 20 drives the transmission assembly 30, and the transmission assembly 30 drives the lifting assembly 40. Depending on the specific situation, the distance between the lifting plane of the lifting assembly 40 and the worktable 12 can be adjusted. For example, if many microcrystalline thin-film silicon wafers are broken, and the height of the broken wafers is 3cm, the distance between the lifting plane of the lifting assembly 40 and the worktable 12 can be adjusted to 4.5cm. This effectively prevents more wafers from being scratched by the breakage of some microcrystalline thin-film silicon wafers. The technical solution of this embodiment effectively solves the problem in the prior art where silicon wafer fragments easily scratch products.

[0027] like Figure 4 and Figure 6 As shown, in the technical solution of Embodiment 1, the transmission component 30 includes a gear transmission structure 31 and a threaded transmission structure 32. The gear transmission structure 31 is connected to the output end of the drive component 20, and the threaded transmission structure 32 is connected between the gear transmission structure 31 and the lifting component 40. The gear transmission structure 31 has high energy efficiency, stable transmission, and flexible design, enabling functions such as steering, and is easy to integrate with other mechanical structures. The threaded transmission structure 32 can achieve high-precision transmission, has a simple structure, fewer parts, and a compact space. The combination of the gear structure and the threaded structure can satisfy both long-distance and large-angle conversions, and achieve precise distance transmission.

[0028] like Figure 4 and Figure 6As shown, in the technical solution of Embodiment 1, the gear transmission structure 31 includes a threaded gear disk 311 and a gear rod 312, and the threaded transmission structure 32 includes a support sleeve 321 and a threaded rod 322. The support sleeve 321 is set on the base plate of the workbench structure 11, the threaded gear disk 311 is rotatably set on the support sleeve 321, the gear rod 312 is connected to the output end of the drive assembly 20, the threaded gear disk 311 meshes with the gear of the gear rod 312, the thread of the thread rod 322 is adapted to the internal gear of the threaded gear disk 311, and the upper end of the thread rod 322 is engaged with the lifting assembly 40. The gear rod 312 can be an integral structure or a structure in which the gear and rod are separately combined. Through the structural cooperation of the gear rod 312 and the threaded gear disk 311, the rotation of the motor can be changed in direction. The setting of the threaded gear disk 311 makes the structure compact. The specific structure of the threaded gear disk 311 is that the upper part of the disk body is a ring gear, the inner wall of the ring is threaded, and the lower surface of the disk body is a plane. The support sleeve 321 provides spatial support for the vertical movement of the threaded rod 322. It should be noted that a planar bearing can be present between the threaded gear disc 311 and the support sleeve 321. The lower surface of the planar bearing is welded to the support sleeve 321, and the upper surface of the planar bearing is welded to the threaded gear disc 311. In this embodiment, there are multiple gear transmission structures 31 and multiple threaded transmission structures 32, which makes the movement of the lifting assembly 40 more stable.

[0029] In this embodiment, the gear of the gear rod 312 is a bevel gear, and the gear of the threaded gear disk 311 is a bevel gear disk adapted to the bevel gear. This structure facilitates changing the transmission direction and makes axial force easy to control. Figure 4 As shown, the axial direction of the motor and gear is horizontal in the first direction, and the axial direction of the threaded gear disk 311 is vertical in the first direction.

[0030] like Figures 1 to 5 As shown, in the technical solution of Embodiment 1, the lifting assembly 40 includes a movable support plate 41 and multiple lifting rods 42. The top of each lifting rod 42 is a flat surface forming a lifting plane. The movable support plate 41 is mounted on the threaded rod 322, and each lifting rod 42 is mounted on the movable support plate 41. All lifting rods 42 are mounted on one movable support plate 41, thus eliminating the need for multiple movable support plates 41 and facilitating synchronized movement of each lifting rod 42. In other words, the movable support plate 41 ensures coordinated and consistent movement of the components on it. It should be noted that the lifting rods 42 pass through multiple holes, the diameter of which is slightly larger than the diameter of the lifting rod 42. A brush or flexible rubber can be placed between the inner wall of the hole and the outer wall of the lifting rod 42. The top of each lifting rod 42 is circular, with a diameter larger than the lower lifting rod 42 body, providing more stable support for the silicon wafer.

[0031] like Figures 1 to 3 As shown, in the technical solution of Embodiment 1, the lifting assembly 40 further includes a crossbeam support structure 43, which is mounted on the movable bearing plate 41, and each lifting rod 42 is mounted on the crossbeam support structure 43. The extension direction of each crossbeam support structure 43 is consistent with the first horizontal direction mentioned above. The above structure facilitates the row arrangement of silicon wafers (cells).

[0032] like Figures 1 to 3 As shown, in the technical solution of Embodiment 1, the beam support structure 43 includes multiple beams 431 and multiple I-beams 432. The multiple beams 431 are arranged at intervals on the movable support plate 41. Multiple I-beams 432 are arranged along the axial direction of each beam 431, and multiple lifting rods 42 are arranged on each I-beam 432. Each beam 431 extends along a first horizontal direction, and the silicon wafers on each beam are grouped together. One I-beam 432 corresponds to four lifting rods 42, and four lifting rods 42 correspond to one silicon wafer. The above structure facilitates the differentiation and management of silicon wafers.

[0033] like Figures 1 to 3 As shown, in the technical solution of Embodiment 1, the workbench structure 11 further includes two side plates. The width of the workbench 12 is adapted to the distance between the two side plates, and the two side plates are disposed between the workbench 12 and the base plate. The two side plates are located on both sides of the second horizontal direction, while the two sides of the first horizontal direction are not open. The above structure not only makes the workbench structure 11 more robust, but also achieves the limitation of the movable support plate 41.

[0034] In the technical solution of Embodiment 1, limiting slides are provided on both sides of the movable support plate 41 and between the two side plates. This structure makes the movable support plate 41 move more smoothly. The limiting slides can be flanges extending vertically on both sides of the side plates, and this structure is easy to manufacture.

[0035] like Figures 1 to 3As shown, in the technical solution of Embodiment 1, the workbench structure 11 also includes two support plates, both located within the two side plates and between the base plate and the movable support plate 41. The drive assembly 20 is fixed to the two support plates. The support plates limit the downward movement limit of the movable support plate 41, providing support for it. Furthermore, the support plates can also be used to fix the drive motor. Each support plate extends along a horizontal first direction, with a discontinuous space in the middle, meaning each support plate consists of two vertical plates. This facilitates the installation of the gear transmission structure 31. It should be noted that the drive assembly 20 is a drive motor, which can be four motors located near the four corners of the movable support plate 41. The control described above can be observed by the operator. For example, if the operator sees a broken silicon wafer that might scratch subsequent silicon wafers, they can manually control the drive motor's switch to rotate it forward, raising the height of the lifting rod 42. When lowering is required, the operator reverses the operation of the drive motor, causing it to rotate in the opposite direction and lower the height of the lifting rod 42.

[0036] The difference between the technical solution of Embodiment 2 and Embodiment 1 is that the driving component 20 consists of four electric actuators connected to the movable support plate 41. The simultaneous upward or downward movement of the four electric actuators drives the movable support plate 41 to rise or fall. The transmission component 30 can be four force-balancing plates, with a cross-sectional area larger than that of the electric actuators, thus ensuring a more balanced force distribution on the movable support plate 41. It should be noted that the above connection method can be achieved using fasteners or screws.

[0037] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0038] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0039] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A feeding and lifting mechanism for microcrystalline thin-film silicon wafers, characterized in that, include: The table assembly (10), drive assembly (20), transmission assembly (30) and lifting assembly (40). The workbench assembly (10) includes a workbench base structure (11) and a workbench plate (12), the workbench plate (12) being fixedly mounted on the workbench base structure (11), and there is an accommodating space between the workbench plate (12) and the base plate of the workbench base structure (11); Both the drive assembly (20) and the transmission assembly (30) are disposed within the accommodating space. The lifting assembly (40) is connected to the drive assembly (20) through the transmission assembly (30). The lifting assembly (40) passes through the worktable (12). The lifting plane of the lifting assembly (40) is movably disposed on the upper part of the worktable (12) to adjust the distance between the lifting plane and the upper surface of the worktable (12).

2. The feeding and lifting mechanism for microcrystalline thin-film silicon wafers according to claim 1, characterized in that, The transmission assembly (30) includes a gear transmission structure (31) and a threaded transmission structure (32). The gear transmission structure (31) is connected to the output end of the drive assembly (20), and the threaded transmission structure (32) is connected between the gear transmission structure (31) and the lifting assembly (40).

3. The feeding and lifting mechanism for microcrystalline thin-film silicon wafers according to claim 2, characterized in that, The gear transmission structure (31) includes a threaded gear disk (311) and a gear rod (312). The threaded transmission structure (32) includes a support sleeve (321) and a threaded rod (322). The support sleeve (321) is disposed on the base plate of the workbench structure (11). The threaded gear disk (311) is rotatably disposed on the support sleeve (321). The gear rod (312) is connected to the output end of the drive assembly (20). The threaded gear disk (311) meshes with the gear of the gear rod (312). The thread of the threaded rod (322) is adapted to the internal gear of the threaded gear disk (311). The upper end of the threaded rod (322) is engaged with the lifting assembly (40).

4. The feeding and lifting mechanism for microcrystalline thin-film silicon wafers according to claim 3, characterized in that, The gear of the gear rod (312) is a bevel gear, and the gear of the threaded gear disk (311) is a bevel gear disk that is adapted to the bevel gear.

5. The feeding and lifting mechanism for microcrystalline thin-film silicon wafers according to claim 3, characterized in that, The lifting assembly (40) includes a movable support plate (41) and a plurality of lifting rods (42). The top of each lifting rod (42) is a plane forming the lifting plane. The movable support plate (41) is disposed on the threaded rod (322), and each lifting rod (42) is disposed on the movable support plate (41).

6. The feeding and lifting mechanism for microcrystalline thin-film silicon wafers according to claim 5, characterized in that, The lifting assembly (40) also includes a crossbeam support structure (43), which is disposed on the movable bearing plate (41), and each of the lifting rods (42) is disposed on the crossbeam support structure (43).

7. The feeding and lifting mechanism for microcrystalline thin-film silicon wafers according to claim 6, characterized in that, The beam support structure (43) includes multiple beams (431) and multiple I-shaped blocks (432). The multiple beams (431) are arranged at intervals on the movable bearing plate (41). Multiple I-shaped blocks (432) are arranged on each beam (431) along the axial direction of the beam (431). Multiple lifting rods (42) are arranged on each I-shaped block (432).

8. The feeding and lifting mechanism for microcrystalline thin-film silicon wafers according to claim 5, characterized in that, The workbench structure (11) also includes two side plates, the width of the workbench (12) is adapted to the distance between the two side plates, and the two side plates are disposed between the workbench (12) and the base plate.

9. The feeding and lifting mechanism for microcrystalline thin-film silicon wafers according to claim 8, characterized in that, The movable support plate (41) has limiting slides on both sides and between the two side plates.

10. The feeding and lifting mechanism for microcrystalline thin-film silicon wafers according to claim 8, characterized in that, The workbench structure (11) also includes two support plates, both of which are located within the two side plates and between the base plate and the movable support plate (41). The drive assembly (20) is fixed on the two support plates.

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