Blank patching mechanism and conveying device for microcrystalline thin-film silicon wafer

Abstract

The application relates to a blanking patch mechanism and conveying device for microcrystalline thin film silicon wafers, wherein the blanking patch mechanism for the microcrystalline thin film silicon wafers comprises a conveying assembly, the width of the silicon wafer is greater than the width of the conveying assembly; a wafer kicking assembly matched with the conveying assembly; a lifting assembly comprising a driving structure, a transmission structure and a lifting plate structure, the lifting assembly is arranged at the side of the conveying assembly, the driving structure is connected with the transmission structure, the transmission structure is connected with the lifting plate structure, and the projection of the silicon wafer located outside the conveying assembly in the vertical direction overlaps with the lifting plate structure. The technical scheme of the application effectively solves the problem of the vacancy caused by the unqualified silicon wafer in the prior art.

Description

Technical Field

[0001] This application relates to the technical field of conveying equipment for microcrystalline thin-film silicon wafers, and more specifically, to a feeding and replenishing mechanism and conveying device for microcrystalline thin-film silicon wafers. Background Technology

[0002] The heterojunction PVD process involves depositing transparent oxide films on both sides of a silicon wafer using magnetron sputtering. The principle is based on generating plasma through low-pressure gas discharge. Positive ions in the plasma are accelerated into high-energy particles by an electric field, which then collide with the target surface, exchanging energy and momentum. The resulting particles are sputtered from the target surface and deposited onto the substrate to form a film. The equipment consists of an automated loading station, a main loading station, and an automated unloading station.

[0003] The automated feeding machine uses a basket track, basket lifting mechanism, alignment mechanism, buffer structure, silicon wafer track, silicon wafer positioning platform, gantry, carrier board conveying track, and carrier board lifting mechanism to take out the silicon wafers that have completed microcrystalline thin films from the silicon wafer track and place them into the Pocket of the carrier board, and then transfer them to the main unit.

[0004] The main unit completes the deposition of double-sided transparent oxide films through the wafer inlet chamber, buffer chamber, transition chamber, front deposition process chamber, back deposition process chamber, wafer exit chamber, bottom return, and carrier plate conveyor track, and then transfers them to the automated unloading machine.

[0005] The automated unloading machine uses a gantry, silicon wafer track, alignment mechanism, PL camera, AOI camera, buffer mechanism, basket track, basket lifting mechanism, carrier board conveying track, and carrier board lifting mechanism to push the silicon wafers with double-sided transparent oxide film out of the carrier board's pocket. After passing through the PL camera and AOI camera, defective silicon wafers are removed. Qualified silicon wafers are passed down to the basket and then transported to the screen printing machine by an AGV trolley.

[0006] In some existing technologies, there are multiple corresponding conveyor lines. After rejecting unqualified silicon wafers, there will be empty slots on that production line. When there are no empty slots on the corresponding conveyor lines, it will cause inconsistencies in the synchronous production lines, which will lead to capacity losses in subsequent processes. Utility Model Content

[0007] This application provides a feeding and replenishing mechanism and conveying device for microcrystalline thin-film silicon wafers to solve the problem of empty spaces caused by defective silicon wafers in the prior art.

[0008] According to the present application, a feeding and replenishing mechanism for microcrystalline thin-film silicon wafers includes: a conveying assembly, wherein the width of the silicon wafer is greater than the width of the conveying assembly; a kicking assembly, which cooperates with the conveying assembly; and a lifting assembly, which includes a driving structure, a transmission structure, and a lifting plate structure. The lifting assembly is disposed on the side of the conveying assembly, the driving structure is connected to the transmission structure, the transmission structure is connected to the lifting plate structure, and the silicon wafer located outside the conveying assembly has its vertical projection overlapping with the lifting plate structure.

[0009] Furthermore, the lifting platform structure includes a pallet mounting frame and lifting pallets. The pallet mounting frame has an inverted U-shaped structure, and the lifting pallets are arranged in pairs on the inner wall of the pallet mounting frame. The transmission structure is connected to the outer wall of the pallet mounting frame.

[0010] Furthermore, there are multiple pairs of lifting pallets, which are arranged on the inner wall of the pallet mounting frame with equal spacing in the vertical direction.

[0011] Furthermore, the drive structure includes a drive motor, and the transmission structure includes a transmission mounting bracket, a transmission lead screw, and a transmission slider. The drive motor is mounted on the transmission mounting bracket, the transmission lead screw is rotatably mounted on the transmission mounting bracket and connected to the output end of the drive motor, and the transmission slider has an internal thread adapted to the transmission lead screw. The transmission lead screw and the transmission slider cooperate with each other, and the transmission slider is connected to the outer wall of the pallet mounting bracket.

[0012] Furthermore, the conveying assembly includes a conveyor frame structure, a conveyor motor structure, and a conveyor belt structure. The conveyor motor structure includes a conveyor motor, a transmission belt, a transmission shaft, and two rollers. The conveyor motor is mounted on the conveyor frame structure. The transmission shaft and the two rollers are rotatably mounted at both ends of the conveyor frame structure, and the two rollers are correspondingly mounted at both ends of the transmission shaft. The transmission belt is sleeved between the output end of the conveyor motor and the transmission shaft. The conveyor belt structure includes two transmission belts, which are respectively sleeved on both ends of the transmission shaft and on the corresponding two rollers.

[0013] Furthermore, the feeding and patching mechanism also includes a kicking assembly, which includes a suction cup moving structure and a suction cup structure. The suction cup moving structure is mounted on the conveyor frame structure, and the suction cup structure is mounted on the suction cup moving structure.

[0014] According to another aspect of this application, a conveying device for microcrystalline thin-film silicon wafers is also provided. The conveying device includes a lifting and unloading mechanism and an unloading and patching mechanism arranged in sequence, wherein the unloading and patching mechanism is the unloading and patching mechanism described above.

[0015] Furthermore, the lifting and unloading mechanism includes a worktable assembly, a lifting drive assembly, a gear transmission assembly, a lead screw transmission assembly, and a lifting assembly. The lifting drive assembly is mounted on the worktable assembly and is connected to the gear transmission assembly. The gear transmission assembly is connected to the lead screw transmission assembly, and the lifting assembly is connected to the lead screw transmission assembly. The lifting surface of the lifting assembly is adjustable in height from the worktable plate of the worktable assembly.

[0016] Furthermore, the lead screw drive assembly includes a movable plate located below the worktable, and a lifting assembly is mounted on the movable plate, with the lifting assembly extending beyond the worktable.

[0017] Furthermore, a robotic arm assembly is provided between the lifting and unloading mechanism and the unloading and patching mechanism, and the suction cup of the robotic arm assembly can move between the lifting and unloading mechanism and the unloading and patching mechanism.

[0018] By applying the technical solution of this application, during the silicon wafer conveying process, the wafer-kicking assembly removes defective silicon wafers from the conveying assembly, creating an empty space. The silicon wafer then continues to move forward, and the empty space moves to the position of the lifting assembly. The drive structure, through the transmission structure, drives the lifting plate structure to descend, placing the silicon wafer on the lifting plate structure into the empty space, ensuring that the corresponding positions on this conveyor line and its synchronous conveyor lines both have silicon wafers. Alternatively, when there is an empty space on the corresponding conveyor line, the drive structure, through the transmission structure, drives the lifting plate structure to rise, picking up the silicon wafer at that position and placing it onto the lifting plate structure, thus creating an empty space on the corresponding production line. The technical solution of this application effectively solves the problem of empty spaces caused by defective silicon wafers in the prior art. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A three-dimensional structural schematic diagram of the feeding patch mechanism according to an embodiment of this application is shown; Figure 2 It shows Figure 1 A partial structural diagram of the feeding and patching mechanism; Figure 3 A three-dimensional structural schematic diagram of the lifting and unloading mechanism of the conveying device of this application is shown; Figure 4 It shows Figure 3 A partial structural diagram of the lifting and unloading mechanism.

[0022] The above figures include the following reference numerals: 10. Conveying assembly; 11. Conveying frame structure; 12. Conveying motor structure; 13. Conveyor belt structure; 20. Kick plate assembly; 21. Suction cup moving structure; 22. Suction cup structure; 30. Lifting assembly; 31. Drive structure; 32. Transmission structure; 321. Transmission mounting frame; 322. Transmission screw; 323. Transmission slider; 33. Lifting plate structure; 331. Pallet mounting frame; 332. Lifting pallet; 40. Workbench assembly; 41. Workbench plate; 50. Lifting drive assembly; 60. Gear transmission assembly; 70. Screw transmission assembly; 71. Moving plate; 80. Lifting assembly. Detailed Implementation

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0025] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0026] like Figure 1 and Figure 2As shown, the wafer feeding and replenishment mechanism for microcrystalline thin-film silicon wafers in this embodiment includes: a conveying assembly 10, a kicking assembly 20, and a lifting assembly 30. The width of the silicon wafer is greater than the width of the conveying assembly 10. The kicking assembly 20 cooperates with the conveying assembly 10. The lifting assembly 30 includes a driving structure 31, a transmission structure 32, and a lifting plate structure 33. The lifting assembly 30 is disposed on the side of the conveying assembly 10. The driving structure 31 is connected to the transmission structure 32, and the transmission structure 32 is connected to the lifting plate structure 33. The silicon wafer located outside the conveying assembly 10 has its vertical projection overlapping with the lifting plate structure 33.

[0027] Applying the technical solution of this embodiment, during the silicon wafer conveying process, the kicking assembly 20 removes defective silicon wafers from the conveying assembly 10, creating an empty space. The silicon wafer then continues to move forward, and the empty space moves to the position of the lifting assembly 30. The driving structure 31 drives the lifting plate structure 33 to descend via the transmission structure 32, placing the silicon wafer on the lifting plate structure 33 into the empty space, ensuring that the corresponding positions on the conveyor line and the synchronous conveyor lines both have silicon wafers. Alternatively, when there is an empty space on the corresponding conveyor line, the driving structure 31 drives the lifting plate structure 33 to rise via the transmission structure 32, picking up the silicon wafer at the corresponding position and placing it onto the lifting plate structure 33, creating an empty space corresponding to the empty space on the production line. The technical solution of this embodiment effectively solves the problem of empty spaces caused by defective silicon wafers in the prior art.

[0028] It should be noted that "overlap" refers to the position of the silicon wafer when it is conveyed to the lifting plate structure 33. The above only describes the structure of a single conveyor line; in practice, multiple production lines are typically used, such as... Figure 1 As shown, there are four conveyor lines.

[0029] like Figure 2 As shown, in this embodiment, the lifting plate structure 33 includes a pallet mounting frame 331 and lifting pallets 332. The pallet mounting frame 331 has an inverted U-shaped structure, and the lifting pallets 332 are arranged in pairs on the inner wall of the pallet mounting frame 331. The transmission structure 32 is connected to the outer wall of the pallet mounting frame 331. The inverted U-shaped structure of the pallet mounting frame 331 ensures that the movement of the lifting pallets 332 on both sides of the conveying assembly 10 is synchronized, and only one motor is needed for drive. In addition, the lifting plate structure 33 is compact and flexible in operation and easy to control when replenishing or picking up silicon wafers.

[0030] like Figure 1 and Figure 2As shown, in this embodiment, the lifting pallets 332 are arranged in multiple pairs, with equal spacing in the vertical direction on the inner wall of the pallet mounting frame 331. Multiple pairs of lifting pallets 332 ensure that the conveyor line can operate for extended periods without a shortage of silicon wafers for replenishment. It should be noted that each conveyor line has a lifting plate structure 33, which consists of multiple pairs of lifting pallets 332.

[0031] like Figure 2 As shown, in this embodiment, the driving structure 31 includes a drive motor, and the transmission structure 32 includes a transmission mounting bracket 321, a transmission lead screw 322, and a transmission slider 323. The drive motor is mounted on the transmission mounting bracket 321, the transmission lead screw 322 is rotatably mounted on the transmission mounting bracket 321 and connected to the output end of the drive motor, and the transmission slider 323 has an internal thread adapted to the transmission lead screw 322. The transmission lead screw 322 and the transmission slider 323 cooperate with each other, and the transmission slider 323 is connected to the outer wall of the support plate mounting bracket 331. The above structure is compact, operates precisely, and has good controllability. The rotation of the drive motor is converted into the up-and-down movement of the transmission slider 323. It should be noted that the transmission slider 323 also has a light hole, and the transmission structure 32 also has a light rod, which passes through the light hole of the transmission slider 323 to limit the movement of the transmission slider 323.

[0032] like Figure 1 and Figure 2 As shown, in this embodiment, the conveying assembly 10 includes a conveyor frame structure 11, a conveyor motor structure 12, and a conveyor belt structure 13. The conveyor motor structure 12 includes a conveyor motor, a transmission belt, a drive shaft, and two rollers. The conveyor motor is mounted on the conveyor frame structure 11. The drive shaft and the two rollers are rotatably mounted at both ends of the conveyor frame structure 11, with the two rollers corresponding to the two ends of the drive shaft. The transmission belt is fitted between the output end of the conveyor motor and the middle of the drive shaft. The conveyor belt structure 13 includes two transmission belts, which are respectively fitted onto the two ends of the drive shaft and the corresponding two rollers. The above-described transmission belt structure saves costs and avoids obstructing the middle position of the drive shaft. The structure of the drive shaft and the two rollers allows one motor to control two transmission belts, resulting in better synchronization between the two transmission belts.

[0033] like Figure 1As shown in the technical solution of this embodiment, the wafer feeding and patching mechanism further includes a wafer kicking assembly 20. The wafer kicking assembly 20 includes a suction cup moving structure 21 and a suction cup structure 22. The suction cup moving structure 21 is disposed on the conveyor frame structure 11, and the suction cup structure 22 is disposed on the suction cup moving structure 21. The suction cup structure 22 is the conventional suction cup structure 22 used in the solar cell manufacturing process. The suction cup structure 22 uses negative pressure to adsorb and pick up the silicon wafer. The suction cup moving structure 21 can be a chain structure or an electric push rod structure. It should be noted that a waste collection box is provided on one side of the conveyor line, and the conveyor assembly 10 is divided into multiple segments, with the wafer kicking assembly 20 located in the middle of the conveyor assembly 10.

[0034] According to another aspect of this application, a conveying device for microcrystalline thin-film silicon wafers is also provided. The conveying device includes a lifting and unloading mechanism and a wafer-complementing mechanism arranged sequentially, wherein the wafer-complementing mechanism is the aforementioned wafer-complementing mechanism. The lifting and unloading mechanism can well adapt to long conveying distances of silicon wafers.

[0035] like Figure 3 and Figure 4 As shown, in some embodiments of the conveying device, the lifting and unloading mechanism includes a worktable assembly 40, a lifting drive assembly 50, a gear transmission assembly 60, a lead screw transmission assembly 70, and a lifting assembly 80. The lifting drive assembly 50 is mounted on the worktable assembly 40 and is connected to the gear transmission assembly 60, which is connected to the lead screw transmission assembly 70. The lifting assembly 80 is also connected to the lead screw transmission assembly 70. The height of the lifting surface of the lifting assembly 80 relative to the worktable plate of the worktable assembly 40 is adjustable. The gear transmission assembly 60 allows for steering and flexible arrangement. The lead screw transmission assembly 70 has high transmission accuracy, which allows for higher movement accuracy of the lifting assembly 80. The adjustable height of the lifting surface of the lifting assembly 80 relative to the worktable plate of the worktable assembly 40 prevents broken silicon wafers from scratching the entire batch of silicon wafers.

[0036] like Figure 3 and Figure 4 As shown, in this embodiment, the lead screw drive assembly 70 includes a movable plate 71 located at the lower part of the worktable 41. A lifting assembly 80 is mounted on the movable plate 71, with a portion of the lifting assembly 80 extending beyond the worktable 41. The movable plate 71 allows the multiple lifting rods of the lifting assembly 80 to be raised synchronously by the same distance, and also to descend synchronously, resulting in good synchronization.

[0037] In this embodiment, a robotic arm assembly is provided between the lifting and unloading mechanism and the wafer replacement mechanism. The suction cup of the robotic arm assembly can move between the lifting and unloading mechanism and the wafer replacement mechanism. The robotic arm assembly facilitates the movement of silicon wafers between the lifting and unloading mechanism and the wafer replacement mechanism.

[0038] It should be noted that the conveying device also includes a control module, the aforementioned motor, and PL and AOI cameras for the detection components. All are electrically connected to the control module, and the program set in the control module enables actions such as detection feedback, conveying, and picking. When the silicon wafer with double-sided transparent oxide film deposition is passed through the automated double silicon wafer track by the PL and AOI cameras, if a defective silicon wafer is detected on one of the tracks, the kicking assembly 20 will pick up the silicon wafer and transfer it to the waste collection box, leaving an empty space on the track. At this time, the lifting motor (drive structure 31) on the column (transmission mounting frame 321) of the other track starts and drives the transmission screw 322 in the transmission component (transmission structure 32) to rotate, thereby driving the threaded sleeve (transmission slider 323) on the transmission screw to slide upward along the inner wall of the column, thereby driving the U-shaped frame (pallet mounting frame 331) on the mounting plate on the outer side of the threaded sleeve to rise, thereby lifting the silicon wafer on the other conveying track through the lifting plate (lifting pallet 332) on the inner wall of the U-shaped frame, so that there are no silicon wafers on the two conveying tracks at this position, achieving balance. When a defective wafer is detected and rejected on one of the conveyor tracks, if the corresponding lifting module (lifting assembly 30) already contains silicon wafers, then when that conveyor track reaches below the U-shaped frame, the lifting motor is reversed, causing the U-shaped frame to move downwards and lower the silicon wafers from the lifting plate onto the corresponding conveyor track. This maintains the balance of silicon wafers on both conveyor tracks. The technical solution of this application ensures that the number of silicon wafers on both wafer tracks is the same, thus achieving full basket filling, increasing the screen printing capacity of subsequent processes, reducing manpower waste during silicon wafer quantity confirmation, and eliminating the risk of discrepancies between inventory and materials caused by manual counting.

[0039] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0040] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0041] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A feeding and patching mechanism for microcrystalline thin-film silicon wafers, characterized in that, include: The width of the silicon wafer is greater than the width of the conveying assembly (10); Kick plate assembly (20), which cooperates with the conveying assembly (10); The lifting assembly (30) includes a drive structure (31), a transmission structure (32), and a lifting plate structure (33). The lifting assembly (30) is disposed on the side of the conveying assembly (10). The drive structure (31) is connected to the transmission structure (32), and the transmission structure (32) is connected to the lifting plate structure (33). The silicon wafer located outside the conveying assembly (10) has its projection in the vertical direction overlapping with the lifting plate structure (33).

2. The feeding and patching mechanism for microcrystalline thin-film silicon wafers according to claim 1, characterized in that, The lifting plate structure (33) includes a pallet mounting frame (331) and a lifting pallet (332). The pallet mounting frame (331) is an inverted U-shaped structure. The lifting pallets (332) are arranged in pairs on the inner wall of the pallet mounting frame (331). The transmission structure (32) is connected to the outer wall of the pallet mounting frame (331).

3. The feeding and patching mechanism for microcrystalline thin-film silicon wafers according to claim 2, characterized in that, The lifting pallets (332) are in multiple pairs, and the multiple pairs of lifting pallets (332) are arranged on the inner wall of the pallet mounting frame (331) with equal spacing in the vertical direction.

4. The feeding and patching mechanism for microcrystalline thin-film silicon wafers according to claim 2, characterized in that, The drive structure (31) includes a drive motor, and the transmission structure (32) includes a transmission mounting bracket (321), a transmission lead screw (322), and a transmission slider (323). The drive motor is mounted on the transmission mounting bracket (321), the transmission lead screw (322) is rotatably mounted on the transmission mounting bracket (321) and connected to the output end of the drive motor, the transmission slider (323) has an internal thread that is adapted to the transmission lead screw (322), the transmission lead screw (322) cooperates with the transmission slider (323), and the transmission slider (323) is connected to the outer wall of the pallet mounting bracket (331).

5. The feeding and patching mechanism for microcrystalline thin-film silicon wafers according to claim 1, characterized in that, The conveying assembly (10) includes a conveying frame structure (11), a conveying motor structure (12), and a conveyor belt structure (13). The conveying motor structure (12) includes a conveying motor, a transmission belt, a transmission shaft, and two rollers. The conveying motor is mounted on the conveying frame structure (11). The transmission shaft and the two rollers are rotatably mounted at both ends of the conveying frame structure (11), and the two rollers are correspondingly mounted at both ends of the transmission shaft. The transmission belt is sleeved between the output end of the conveying motor and the transmission shaft. The conveyor belt structure (13) includes two transmission belts, which are respectively mounted on both ends of the transmission shaft and the corresponding two rollers.

6. The feeding and patching mechanism for microcrystalline thin-film silicon wafers according to claim 5, characterized in that, The feeding and patching mechanism also includes a kicking assembly (20), which includes a suction cup moving structure (21) and a suction cup structure (22). The suction cup moving structure (21) is disposed on the conveying frame structure (11), and the suction cup structure (22) is disposed on the suction cup moving structure (21).

7. A conveying device for microcrystalline thin-film silicon wafers, characterized in that, The conveying device includes a lifting and unloading mechanism and a unloading patching mechanism arranged in sequence, wherein the unloading patching mechanism is the unloading patching mechanism according to any one of claims 1 to 6.

8. The conveying device according to claim 7, characterized in that, The lifting and unloading mechanism includes a worktable assembly (40), a lifting drive assembly (50), a gear transmission assembly (60), a lead screw transmission assembly (70), and a lifting assembly (80). The lifting drive assembly (50) is mounted on the worktable assembly (40). The lifting drive assembly (50) is connected to the gear transmission assembly (60). The gear transmission assembly (60) is connected to the lead screw transmission assembly (70). The lifting assembly (80) is connected to the lead screw transmission assembly (70). The height of the lifting surface of the lifting assembly (80) relative to the worktable plate of the worktable assembly (40) is adjustable.

9. The conveying device according to claim 8, characterized in that, The lead screw drive assembly (70) includes a movable plate (71) located at the lower part of the worktable (41), and a lifting assembly (80) is disposed on the movable plate (71), with the lifting assembly (80) partially extending out of the worktable (41).

10. The conveying device according to claim 8, characterized in that, A robotic arm assembly is also provided between the lifting and unloading mechanism and the unloading patching mechanism, and the suction cup of the robotic arm assembly can move between the lifting and unloading mechanism and the unloading patching mechanism.

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