Mobile phone semiconductor radiator (magnetic clip type X156-F)
CN309116145SActive Publication Date: 2025-02-14DONGGUAN ZUOSHANHU ELECTRONIC TECH CO LTD
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Patent Information
- Application Number
- CN202430427743.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-09
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2039-07-09
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product under this design: Mobile phone semiconductor heat sink (magnetic clip model X156‑F). 2. Purpose of the product with this appearance design: a heat dissipation product used to cool down mobile phones. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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