Wafer packaging tray
CN309122413SActive Publication Date: 2025-02-18HEFEI YINGTUO PHOTOELECTRIC TECH CO LTD
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Patent Information
- Application Number
- CN202430408372.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-01
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2039-07-01
Smart Images
Figure 000001_ABST
Abstract
1. The name of the product of this design: wafer packaging tray. 2. Purpose of this design product: This design product is used for packaging and protection of wafers to achieve stable clamping and fixation of the wafers and provide buffer protection. 3. The design key point of this appearance design product lies in the overall shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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