Wave soldering furnace through-jig buckle
CN309396450SActive Publication Date: 2025-07-22ANDROID ELECTRONICS (HUIZHOU) CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202530005866.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-06
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2040-01-06
Smart Images
Figure 000007_ABST
Abstract
1. Name of the Design Product: Clip for Wave Soldering Furnace Fixture. 2. Use of the Design Product: Used to fix the PCB board during wave soldering. 3. Design Key Points of the Design Product: Lies in the shape. 4. Picture or Photograph that Best Illustrates the Design Key Points: Perspective view. 5. Other Situations Requiring Explanation Other Explanation: The black part of this product has an indefinite length.
Need to check novelty before this filing date? Find Prior Art