The body of the power semiconductor module
CN309404886SActive Publication Date: 2025-07-25林金锋
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Patent Information
- Application Number
- CN202430699211.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2039-11-05
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Figure 000001_ABST
Abstract
1. Name of the design product: Main body of the power semiconductor module. 2. Use of the design product: The design product is a power semiconductor module that uses copper nut terminals as a large current bridging component for connecting inside and outside. 3. Design key points of the design product: lie in the shape of the solid line part. 4. Picture or photograph that best shows the design key points: perspective view. 5. Other situations that need to be explained: Other explanations: This design requests partial design protection. The part represented by the solid line in the figure is the part for which protection is requested, and the part represented by the dashed line in the figure is the part for which protection is not requested.
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