Semiconductor Equipment Front End Module
CN309410401SActive Publication Date: 2025-07-29SHENZHEN ARRAYED MATERIALS TECH CO LTD
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Patent Information
- Application Number
- CN202430762822.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2039-12-02
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Figure 000009_ABST
Abstract
1. Name of the Design Product: Front End Module of Semiconductor Equipment. 2. Use of the Design Product: For automatic loading and unloading of semiconductor wafers. 3. Design Key Points of the Design Product: Lies in the shape. 4. Picture or Photograph that Best Illustrates the Design Key Points: Perspective View 1. 5. Other Situations Requiring Explanation Other Explanation: Detail Enlarged Views 1 and 2 are the detail enlarged views of the left and right halves of the front view respectively; Detail Enlarged Views 3 and 4 are the detail enlarged views of the left and right halves of the rear view respectively; Detail Enlarged Views 5 and 6 are the detail enlarged views of the left and right halves of the top view respectively; Detail Enlarged Views 7 and 8 are the detail enlarged views of the left and right halves of the bottom view respectively; Detail Enlarged Views 9 and 10 are the detail enlarged views of the left and right halves of Perspective View 1 respectively; Detail Enlarged Views 11 and 12 are the detail enlarged views of the left and right halves of Perspective View 2 respectively.
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