Removable pocket for semiconductor test socket housings
CN309491516SActive Publication Date: 2025-09-12TFE CO LTD
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Patent Information
- Application Number
- CN202430724550.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2024-06-04
- Filing Date
- 2024-11-15
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2039-11-15
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Figure 000007_ABST
Abstract
1. Name of this design product: Removable pocket for semiconductor test socket housing. 2. Purpose of this design product: During the testing process of semiconductor packages, it maintains electrical connection with the socket mounted on the test circuit board by accommodating the semiconductor package. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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