Side grooves of heat insulation unit covers for semiconductor manufacturing equipment
CN309519565SActive Publication Date: 2025-09-26KOKUSAI DENKI KK
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Patent Information
- Application Number
- CN202130803501.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2021-06-28
- Filing Date
- 2021-12-06
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2036-12-06
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Figure 000007_ABST
Abstract
1. Name of the product of this design: Side groove of a heat insulation unit cover for semiconductor manufacturing equipment. 2. Purpose of the product of this design: The overall purpose of the product is to cover the insulation unit located at the furnace mouth of a reaction tube for processing substrates such as semiconductor chips; the local purpose to be protected is to allow pillars supporting the substrate to pass through. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. Other circumstances requiring clarification Other clarifications: The portion indicated by the solid line is the portion for which protection is sought, and the dashed line indicates the boundary between the portion for which protection is sought and other portions.
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