High-heat dissipation chip package (DFN)
CN309603782SActive Publication Date: 2025-11-14TOLL MICROELECTRONIC CO LTD
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Patent Information
- Application Number
- CN202430832047.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2039-12-27
Smart Images
Figure 000002_ABST
Abstract
1. Name of the product in this design: High Heat Dissipation Chip Package (DFN). 2. Purpose of this design: chip packaging and heat dissipation. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key features: the rear view.
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