Wafer expansion equipment
CN309604183SActive Publication Date: 2025-11-14江苏元夫半导体科技有限公司
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Patent Information
- Application Number
- CN202530141588.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2040-03-21
Smart Images
Figure 000006_ABST
Abstract
1. Name of the product in this design: Wafer Expansion Equipment. 2. Purpose of this design: For chip segmentation. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1. 5. The bottom surface of this product is a part that is not easily seen or cannot be seen during use, so the bottom view is omitted.
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