Main body of a processing cup cleaning member for a semiconductor manufacturing apparatus
CN309613339SActive Publication Date: 2025-11-18TOKYO ELECTRON LTD
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Patent Information
- Application Number
- CN202530065983.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2024-08-22
- Filing Date
- 2025-02-14
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2040-02-14
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Figure 000007_ABST
Abstract
1. Name of the designed product: main body of a processing cup cleaning member for a semiconductor manufacturing apparatus 2. Use of the designed product: the overall use of the product is a member for removing processing liquid adhered to the inner side of a processing cup in a substrate processing apparatus in a cleaning process of semiconductor manufacturing, and the partial use is the main body of a processing cup cleaning member for a semiconductor manufacturing apparatus. 3. Design points of the designed product: the shape of the claimed partial design. 4. Picture or photograph best indicating the design points: perspective view 1. 5. Other circumstances needing explanation Other explanation: the present design claims partial design protection, the part represented by solid lines is the claimed part, and the part represented by dashed lines is the unclaimed part. As shown in the use state reference views 1 and 2, cleaning liquid is supplied from the cleaning nozzle to the bottom opening of the product, and is sprayed to the inner side of the processing cup from the outer peripheral opening of the product through the flow path in the product.
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