Center portion of an adhesive sheet for semiconductor device manufacturing

Abstract

1. Name of the designed product: middle part of an adhesive sheet for semiconductor device manufacturing 2. Use of the designed product: as an adhesive sheet used in the process of semiconductor device manufacturing, the partial design is used to provide a bar code on the surface of the substrate near the bonding layer which cannot be used due to foreign matter, as a marker, so that the purchaser of the product can detect the bonding layer with foreign matter by a sensor when using the product, and exclude the bonding layer. 3. Design points of the designed product: in shape. 4. Picture or photograph best illustrating the design points: design 1, perspective view. 5. Design 1 is designated as the basic design. 6. Other matters: in design 1 and design 2, the numbers 1-5 in Fig. 1 represent the substrate, the adhesive layer, the bonding layer, the PET release film, and the cutting tape, respectively; Fig. 2 is a reference view of the separated parts, in which the numbers 1-4 represent the cutting tape, the bar code, the PET release film, and the bonding layer, respectively; the dotted line indicates the boundary between the claimed part and the unclaimed part; the bar code part in each view is hatched; the cutting tape in each view is transparent, and the part visible through the transparent area is indicated by a thin line.

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