Connector integrally molded with the housing
CN309645166SActive Publication Date: 2025-12-02TYCO ELECTRONICS TECHNOLOGY (SIP) CO LTD +1
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Patent Information
- Application Number
- CN202530193805.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-11
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2040-04-11
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Figure 000009_ABST
Abstract
1. Name of the product in this design: Connector integrally molded with the housing. 2. Purpose of this design: The connector in this design is used to electrically connect two components. 3. The key design features of this product are the shape of the connector shown by the solid lines in each view. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design.
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