Chip package lead frame (SOP8-13R-A60X60)

Abstract

1. The name of the design product: chip package lead frame (SOP8-13R-A60X60). 2. The use of the design product: for the packaging of semiconductor integrated circuit chips. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: front view. 5. The design product is a thin product, and the left view is omitted; the design product is a thin product, and the top view is omitted; the design product is a thin product, and the bottom view is omitted; the design product is a thin product, and the right view is omitted; the rear view is symmetrical with the front view, and the rear view is omitted.

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