Module power supply shell (three-dimensional heat dissipation fin)

CN309702374SActive Publication Date: 2025-12-26CHONGQING JUTE ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202530351700.4
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-06-18
Publication Date
2025-12-26
Estimated Expiration
2040-06-18

Smart Images

  • Figure 000004_ABST
    Figure 000004_ABST
Patent Text Reader

Abstract

1. The name of the design product: module power shell (three-dimensional heat dissipation fin). 2. The use of the design product: used for installing in the power module shell, playing a protective role. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
Need to check novelty before this filing date? Find Prior Art